CN113442099A - Substrate processing carrying platform - Google Patents
Substrate processing carrying platform Download PDFInfo
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- CN113442099A CN113442099A CN202110726355.9A CN202110726355A CN113442099A CN 113442099 A CN113442099 A CN 113442099A CN 202110726355 A CN202110726355 A CN 202110726355A CN 113442099 A CN113442099 A CN 113442099A
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- bearing plate
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- lifting mechanism
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- 230000007246 mechanism Effects 0.000 claims abstract description 64
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 230000005489 elastic deformation Effects 0.000 abstract description 3
- 238000002360 preparation method Methods 0.000 abstract description 3
- 230000006872 improvement Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 18
- 230000008569 process Effects 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000011521 glass Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
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- 239000000463 material Substances 0.000 description 3
- 229910000677 High-carbon steel Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 208000033999 Device damage Diseases 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
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- 239000007787 solid Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
- B25H1/00—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby
- B25H1/02—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby of table type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
- B25H1/00—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby
- B25H1/08—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby with provision for attachment of work holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
- B25H1/00—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby
- B25H1/14—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby with provision for adjusting the bench top
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application provides a base plate processing microscope carrier includes: the base is provided with a through hole penetrating through the base; the bearing plate is used for placing a substrate to be processed, the bearing plate is arranged on the base, the edge of the bearing plate is fixed with the base, and the bearing plate is an elastic bearing plate; one end of the lifting mechanism is arranged in the through hole and movably connected with the inner wall of the through hole, the other end of the lifting mechanism is abutted against the bearing plate, and the lifting mechanism is lifted to enable the bearing plate to be elastically deformed. This application has the base of through-hole and is fixed in the loading board on the base through the setting, set up the loading board into the elastic loading board, and arrange in the through-hole through the one end that sets up elevating system, other end butt in the elevating system of loading board, will be used for placing treating the processing base plate and place on the loading board during the use, go up and down through adjusting elevating system so that the loading board takes place elastic deformation, thereby it takes place deformation to drive the treating processing base plate on the loading board, in order to offset the warpage, treat the roughness of processing base plate with this improvement, and then improve the preparation yields of product.
Description
Technical Field
The application relates to the technical field of display devices, in particular to a substrate processing carrying platform.
Background
In the manufacturing process of a display panel, including a liquid crystal display panel or a flexible display panel, for example, in the manufacturing process of an array substrate of an OLED (Organic Light-Emitting Diode), stress films, such as a GI isolation layer, a Buffer (Buffer) hole-digging layer, an Organic planarization layer, a flexible substrate layer, etc., are inevitably used, and are still left on the substrate after a patterning process due to the influence of high temperature and other factors, and due to the difference of thermal expansion coefficients of these films and glass, after the high temperature process, the substrate is warped due to the stress of the Organic film, such as the situation of warping around or arching in the middle, and the warping degree is also not increased with the increase of the substrate size.
The uneven substrate surface will destroy the uniformity of the photo process and the film forming process, and directly affect the quality of the display panel. In addition, if the substrate is not flat, the warped position of the substrate may collide during the manufacturing or transporting process, resulting in substrate cracking and even device damage, and thus, the yield of the subsequent processing and manufacturing of the product is not high.
In order to ensure the flatness of the stage and the stability of the fixed glass, an adsorption stage is usually used in the prior art, and the purpose of fixing the glass substrate is achieved by forming vacuum between the glass substrate and the rigid stage. The existing adsorption type carrying platform has a complex structure, so that vacuum of a carrying platform area corresponding to the tilting position of the glass can not be easily established, and the carrying platform can fail to adsorb and fix a substrate.
Disclosure of Invention
The application provides a base plate processing microscope carrier to the warpage's problem appears easily in solving the base plate course of working.
The application provides a base plate processing microscope carrier includes:
the base is provided with a through hole penetrating through the base;
the bearing plate is arranged on the base, the edge of the bearing plate is fixed with the base, and the bearing plate is an elastic bearing plate;
one end of the lifting mechanism is arranged in the through hole and movably connected with the inner wall of the through hole, the other end of the lifting mechanism is abutted against the bearing plate, and the lifting mechanism is lifted to enable the bearing plate to be elastically deformed.
In one possible implementation manner of the present application, an accommodating space is provided between the base and the bearing plate, and one end of the lifting mechanism abutting against the bearing plate is located in the accommodating space;
the bearing plate has a state of curved surface deformation towards a direction close to the base or a state of curved surface deformation towards a direction far away from the base.
In a possible implementation manner of the present application, the lifting mechanism faces one side of the bearing plate and is fixedly connected to the bearing plate.
In one possible implementation manner of the present application, the number of the through holes is at least three, and two adjacent through holes are arranged in the base at intervals;
the number of the lifting mechanisms is at least three, each lifting mechanism is respectively positioned in one through hole, and the lifting height of the middle lifting mechanism is larger than or smaller than that of the lifting mechanisms positioned at two sides.
In one possible implementation manner of the present application, the lifting mechanism includes:
the pushing piece is fixedly connected with the bearing plate;
one end of the lifting rod is connected with the pushing piece, the other end of the lifting rod is arranged in the through hole and extends out of the base, and the lifting rod is movably connected with the inner wall of the through hole.
In this application a possible implementation, be provided with the external screw thread on the lifter, the through-hole inner wall is provided with the internal thread, the lifter with through-hole inner wall threaded connection.
In this application a possible implementation, the ejector piece orientation one side of lifter is provided with the recess, elevating system still includes:
the bearing is arranged on the inner wall of the groove, and the end part of the lifting rod is sleeved with the bearing.
In this application, in a possible implementation manner, the pushing member and the one side of the bearing plate connected are cambered surfaces, and the pushing member is an elastic pushing member.
In one possible implementation manner of the present application, the pushing member is a strip-shaped pushing member, a sheet-shaped pushing member, or a block-shaped pushing member.
In a possible implementation manner of the present application, the lifting mechanism and the through hole inner wall are connected in a sliding manner, and the lifting mechanism further includes:
the fastener is arranged on one surface, back to the bearing substrate, of the base and used for fixing one end, far away from the bearing plate, of the lifting mechanism.
The application provides a base plate processing microscope carrier has the base of through-hole and is fixed in the loading board on the base through the setting, will the loading board sets up to the elastic loading board to through setting up elevating system, arrange elevating system's one end in the through-hole, the other end butt in the elevating system of loading board will be used for placing the base plate of treating processing during the use and place on the loading board, through adjusting elevating system goes up and down so that elastic deformation takes place for the loading board to the deformation takes place for the base plate of treating processing on the drive loading board, in order to offset the warpage, with this improvement treat the roughness of processing base plate, and then improve the preparation yields of product.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic cross-sectional structure diagram of a substrate processing stage according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a base according to an embodiment of the present application.
Fig. 3 is a schematic structural view of a bearing surface subjected to surface deformation according to an embodiment of the present disclosure.
Fig. 4 is a schematic structural view illustrating a bearing surface subjected to surface deformation according to another embodiment of the present application.
Fig. 5 is a schematic cross-sectional structure diagram of a lifting mechanism according to an embodiment of the present application.
Fig. 6 is a schematic structural diagram of a substrate processing stage according to yet another embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
Referring to fig. 1-5, an embodiment of the present application provides a substrate processing stage, which includes a base 10, a carrier plate 20, and a lifting mechanism 30.
Referring to fig. 1 and 2, a through hole 102 penetrating through the base 10 is formed in the base 10, the bearing plate 20 is disposed on the base 10, an edge of the bearing plate 20 is fixed to the base 10, the bearing plate 20 is an elastic bearing plate 20, specifically, the edge of the bearing plate 20 can be connected to a substrate through a connector such as an iron nail, an iron wire or a screw, or can be integrally formed, and no specific limitation is made herein, so that the bearing plate 20 can be bent and deformed by fixing the edge of the bearing plate 20 to the base 10.
The bearing plate 20 may be made of a metal material, an alloy material, or a material with a micro-deformation characteristic, such as quartz glass, wherein the thickness of the bearing plate 20 may be 2-20 mm. Illustratively, the carrier plate 20 may be made of any one of copper, aluminum alloy, high carbon steel, or quartz glass. Accordingly, the base 10 may be made of marble or high carbon steel, and the thickness of the base 10 may be 20m to 1m, so that the thickness of the base 10 is much greater than that of the loading plate 20, thereby ensuring that the base 10 does not deform, and the base 10 provides high strength support.
One end of the lifting mechanism 30 is disposed in the through hole 102, the end is movably connected to the inner wall of the through hole 102, the other end of the lifting mechanism 30 abuts against the bearing plate 20, and the lifting mechanism 30 lifts and lowers the bearing plate 20 to elastically deform.
The base plate processing microscope carrier of this application embodiment has through-hole 102's base 10 and is fixed in the loading board 20 on the base 10 through the setting, will loading board 20 sets up to elasticity loading board 20 to through setting up elevating system 30, arrange elevating system 30's one end in through-hole 102, the other end butt in the elevating system 30 of loading board 20 will be used for placing treating to process base plate 40 and place on loading board 20 during the use, through adjusting elevating system 30 goes up and down so that loading board 20 takes place elastic deformation to it takes place deformation to drive treating to process base plate 40 on the loading board 20, in order to offset the warpage, with this roughness that improves treating to process base plate 40, and then improves the preparation yields of product.
In some embodiments, as described with reference to fig. 3 and 4, an accommodating space 101 is provided between the base 10 and the bearing plate 20, and one end of the lifting mechanism 30 abutting against the bearing plate 20 is located in the accommodating space 101. The carrier plate 20 has a state of being curved toward a direction approaching the base 10 or a state of being curved toward a direction away from the base 10.
In actual production, the substrate may have two defect forms of upward warping or downward warping, so that in the process of processing the stress film, the accommodating space 101 is arranged on the substrate processing carrier of the embodiment, so that the bearing plate 20 has upward bending deformation, that is, by adjusting the height of the lifting mechanism 30, a proper tensile stress can be applied to the substrate 40 to be processed in advance to offset the compressive stress generated after the process; or the carrier plate 20 is in a downward bending deformation state, that is, a suitable compressive stress can be applied to the substrate 40 to be processed in advance by adjusting the height of the lifting mechanism 30, so as to offset the tensile stress generated after the processing, thereby facilitating the substrate processing carrier to be suitable for substrates with different defect forms.
In some embodiments, a surface of the lifting mechanism 30 facing the bearing plate 20 is fixedly connected to the bearing plate 20, wherein the fixing may be achieved by welding, bonding, or integrally forming, and is not limited in this respect. The lifting mechanism 30 is fixedly connected to ensure that the bearing plate 20 is curved downwards during the descending process. In addition, through with elevating system 30 and loading board 20 fixed connection, also be favorable to preventing that elevating system 30 from taking place the friction with loading board 20 in the motion process, lead to loading board 20 to take place wearing and tearing to be favorable to improving the life of loading board 20.
In some embodiments, the number of the through holes 102 is at least three, and two adjacent through holes 102 are spaced apart in the base 10. Specifically, the plurality of through holes 102 are arranged at intervals laterally, the number of the through holes 102 may be an odd number or an even number, for example, 3, 5, 6, or 7, and the like, and may be set according to the size of the substrate, which is not limited herein.
As shown in fig. 3 and 4, the number of the lifting mechanisms 30 corresponds to the number of the through holes 102, so that when the number of the through holes 102 is at least three, the number of the lifting mechanisms 30 is at least three, and each lifting mechanism 30 is located in one through hole 102. In order to bend and deform the elastic carrier plate 20, the rising height of the middle lifter 30 may be greater or less than the rising height of the lifters 30 at both sides. When the number of the elevating mechanisms 30 is more than 3, for example, 5, the height of the elevating mechanisms 30 is sequentially lowered or sequentially raised from the middle to both sides.
Because each lifting mechanism 30 is adjusted according to the correction requirements of different degrees of warpage, after the distance that the lifting mechanism 30 needs to be adjusted is confirmed through the magnitude of the film stress, each lifting mechanism 30 is adjusted to different height corresponding positions, so that a plurality of lifting mechanisms 30 can adapt to the substrates 40 to be processed with different warpage degrees.
In order to prevent the substrate 40 to be processed from warping downward, the carrier plate 20 needs to be adjusted to be deformed to bend upward during processing, i.e., the carrier plate 20 is deformed to curve in a direction away from the base 10, and at this time, the height H1 of the middle lifting mechanism 30 is greater than the height H2 of the two lifting mechanisms 30. In order to prevent the substrate 40 to be processed from warping upward, the carrier plate 20 needs to be adjusted to be deformed to bend downward during processing, i.e., the carrier plate 20 is deformed to be curved toward the base 10, and at this time, the height H1 of the middle lifting mechanism 30 is smaller than the height H2 of the two lifting mechanisms 30.
In some embodiments, as shown in fig. 5, the lifting mechanism 30 includes an ejector 31 and a lifting rod 32.
The pushing member 31 is disposed in the accommodating space 101, and the pushing member 31 is fixedly connected to the bearing plate 20. One end of the lifting rod 32 is connected with the pushing piece 31, the other end of the lifting rod is arranged in the through hole 102 and extends out of the base 10, and the lifting rod 32 is movably connected with the inner wall of the through hole 102. The lifting rod 32 drives the pushing member 31 to move upwards or downwards in the accommodating space 101, so that the bearing plate 20 is deformed in a curved surface, and the adjustment of the substrate 40 to be processed is realized.
In some embodiments, the lifting rod 32 is provided with an external thread 33, the inner wall of the through hole 102 is provided with an internal thread 11, the lifting rod 32 is in threaded connection with the inner wall of the through hole 102, and the lifting rod 32 and the inner wall of the through hole 102 are in threaded connection through the arrangement of the internal thread 11 and the external thread 33, so that the bearing plate 20 can be adjusted. The position of the lifting rod 32 can be fixed in a threaded connection mode, and the deformation degree of the bearing plate 20 is guaranteed not to change, so that the flatness of the substrate 40 to be processed after final processing is achieved, and a plurality of substrates can be processed conveniently in the same process. Under the condition that the manufacturing process is not changed, after the height of the lifting mechanism 30 is adjusted and fixed, the height can be adjusted in a short time, and the use is convenient.
In addition, the threaded connection is more beneficial to manual fine adjustment of the bearing plate 20. Compare in the machine adjustment, adopt actuating mechanism such as motor to connect elevating system 30 promptly and realize electronic adjustment, because the motor can produce return journey poor at the rotation in-process, along with the live time becomes long, the machine adjustment produces the return journey error bigger, and the error also can the grow, consequently adopts artifical adjustment can effectively avoid the poor problem of return journey, more is favorable to guaranteeing the accuracy of adjustment.
In some embodiments, a handle 35 may be further connected to an end of the lifting rod 32 extending out of the base 10, so that when performing manual adjustment, an operator rotates the rotating handle 35 to implement the lifting or lowering movement of the lifting rod 32, which is more labor-saving.
In some embodiments, as shown in fig. 6, the lifting mechanism 30 is slidably connected to the inner wall of the through hole 102, and the lifting mechanism 30 further comprises a fastener 36. Specifically, the lifting rod 32 is slidably connected to the inner wall of the through hole 102, a fastening member 36 is disposed on a surface of the base 10 facing away from the bearing plate 20, and the fastening member 36 is used to fix an end of the lifting mechanism 30 away from the bearing plate 20. The fastening member 36 may be, for example, a band, a fastening nut, or a sleeve, and is not particularly limited herein.
The lifting mechanism 30 is adjusted to ascend or descend in a sliding manner, and after the lifting mechanism 30 is adjusted to a certain height, the lifting rod 32 of the lifting mechanism 30 is fixed on the platform base 10 through the fastener 36, so that the lifting rod 32 can be fixed after the position of the lifting rod is adjusted, and the change is avoided, and therefore the deformation degree of the bearing plate 20 is ensured not to change, the flatness of the substrate 40 to be processed after final processing and forming is ensured, and a plurality of substrates can be processed in the same process conveniently. Under the condition that the manufacturing process is not changed, after the height of the lifting mechanism 30 is adjusted and fixed, the height can be adjusted in a short time, and the use is convenient.
In some embodiments, the surface of the pushing member 31 connected to the carrier plate 20 is an arc surface, and by setting the contact surface between the pushing member 31 and the carrier plate 20 to be an arc surface, it can be ensured that the dispersion area of the acting force generated by the substrate 40 to be processed by the carrier plate 20 is large enough, so as to ensure that the substrate 40 to be processed generates a curved deformation smoothly and consistently, thereby avoiding generation of production defects such as Mura, imprint, and the like.
In some embodiments, as shown in fig. 5, a surface of the pushing member 31 facing the lifting rod 32 is provided with a groove 301, and the lifting mechanism 30 further includes a bearing 34.
The bearing 34 abuts against the inner wall of the groove 301, and the bearing 34 is sleeved on the end of the lifting rod 32. Specifically, the bearing 34 may be a rolling bearing 34, such as a ball bearing, a cylindrical roller bearing, or the like. Through the arrangement of the bearing 34, during the process of rotating up or rotating down the lifting rod 32, the pushing element 31 only moves along the axial direction of the lifting rod 32, i.e. moves along a straight line or downwards, and does not rotate along with the lifting rod 32, thereby further ensuring that the pushing element 31 does not generate friction with the bearing plate 20 to cause abrasion.
In addition, the pushing member 31 may be an elastic pushing member 31, and the deformation amount of the elastic pushing member 31 is greater than that of the carrier plate 20. The pushing member 31 may be made of stainless steel or rubber, and the elastic pushing member 31 may fully contact the contact surface of the pushing member 31 and the bearing plate 20 to ensure the contact surface of the pushing member 31 and the bearing plate 20 to be attached to each other, which is beneficial to further ensure that the to-be-processed substrate 40 is smoothly and consistently deformed to avoid production defects such as Mura and impression.
Specifically, the pushing member 31 is a strip-shaped pushing member 31, a sheet-shaped pushing member 31, a block-shaped pushing member 31, or the like, and the shape of the pushing member 31 is not particularly limited herein. Illustratively, when the pushing member 31 is a block-shaped pushing member 31, the shape of the pushing member 31 may be a sphere, an ellipsoid, a cube, a cylinder, etc., and is not particularly limited herein. Specifically, the pushing member 31 may be a hollow pushing member or a solid pushing member.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The substrate processing stage provided in the embodiments of the present application is described in detail above, and the principles and embodiments of the present application are explained in the present application by applying specific examples, and the description of the embodiments above is only used to help understand the technical solutions and core ideas of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
1. A substrate processing stage, comprising:
the base is provided with a through hole penetrating through the base;
the bearing plate is used for placing a substrate to be processed, the bearing plate is arranged on the base, the edge of the bearing plate is fixed with the base, and the bearing plate is an elastic bearing plate;
one end of the lifting mechanism is arranged in the through hole and movably connected with the inner wall of the through hole, the other end of the lifting mechanism is abutted against the bearing plate, and the lifting mechanism is lifted to enable the bearing plate to be elastically deformed.
2. The substrate processing stage of claim 1,
an accommodating space is formed between the base and the bearing plate, and one end of the lifting mechanism, which is abutted against the bearing plate, is located in the accommodating space;
the bearing plate has a state of curved surface deformation towards a direction close to the base or a state of curved surface deformation towards a direction far away from the base.
3. The substrate processing stage of claim 1 or 2, wherein a side of the lift mechanism facing the carrier plate is fixedly attached to the carrier plate.
4. The substrate processing stage as recited in claim 1, wherein the number of the through holes is at least three, and two adjacent through holes are spaced apart in the base;
the number of the lifting mechanisms is at least three, each lifting mechanism is respectively positioned in one through hole, and the lifting height of the middle lifting mechanism is larger than or smaller than that of the lifting mechanisms positioned at two sides.
5. The substrate processing stage of claim 1, wherein the lift mechanism comprises:
the pushing piece is fixedly connected with the bearing plate;
one end of the lifting rod is connected with the pushing piece, the other end of the lifting rod is arranged in the through hole and extends out of the base, and the lifting rod is movably connected with the inner wall of the through hole.
6. The substrate processing carrier as recited in claim 5, wherein the surface of the pushing member connected to the carrier plate is a curved surface, and the pushing member is an elastic pushing member.
7. The substrate processing stage of claim 5, wherein a surface of the ejector facing the lift pins is provided with a groove, and the lift mechanism further comprises:
the bearing is arranged on the inner wall of the groove, and the end part of the lifting rod is sleeved with the bearing.
8. The substrate processing stage according to claim 5 or 7, wherein the lift lever is provided with an external thread, the inner wall of the through hole is provided with an internal thread, and the lift lever is screwed with the inner wall of the through hole.
9. The substrate processing stage of claim 1, wherein the elevating mechanism is slidably connected to the inner wall of the through hole, and the elevating mechanism further comprises:
the fastener is arranged on one surface, back to the bearing plate, of the base and used for fixing one end, far away from the bearing plate, of the lifting mechanism.
10. The substrate processing stage of claim 1, wherein the carrier plate is made of a metal material, an alloy material, or quartz glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110726355.9A CN113442099A (en) | 2021-06-29 | 2021-06-29 | Substrate processing carrying platform |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110726355.9A CN113442099A (en) | 2021-06-29 | 2021-06-29 | Substrate processing carrying platform |
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| CN113442099A true CN113442099A (en) | 2021-09-28 |
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| CN202110726355.9A Pending CN113442099A (en) | 2021-06-29 | 2021-06-29 | Substrate processing carrying platform |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115072369A (en) * | 2022-06-28 | 2022-09-20 | 深圳市华星光电半导体显示技术有限公司 | Transport module and film forming apparatus |
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