CN113394149B - Silicon wafer transmission fork with position detection function, manipulator and transmission method - Google Patents
Silicon wafer transmission fork with position detection function, manipulator and transmission method Download PDFInfo
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- CN113394149B CN113394149B CN202110736413.6A CN202110736413A CN113394149B CN 113394149 B CN113394149 B CN 113394149B CN 202110736413 A CN202110736413 A CN 202110736413A CN 113394149 B CN113394149 B CN 113394149B
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 174
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 174
- 239000010703 silicon Substances 0.000 title claims abstract description 174
- 238000001514 detection method Methods 0.000 title claims abstract description 129
- 230000005540 biological transmission Effects 0.000 title claims abstract description 63
- 238000000034 method Methods 0.000 title claims abstract description 24
- 230000008569 process Effects 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000012546 transfer Methods 0.000 claims description 5
- 210000000707 wrist Anatomy 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 185
- 230000009471 action Effects 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 1
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- 238000013461 design Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
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Abstract
The invention provides a silicon wafer transmission fork with a position detection function, wherein the fork is provided with a bearing area for bearing a silicon wafer, N detection points are arranged in the bearing area, N is more than or equal to 3, and a connecting line of the positions of any two detection points is not parallel to the direction of the fork moving towards the silicon wafer to be taken; the wafer fork is provided with a laser position detection module, the laser position detection module comprises a light source, a light transmission assembly and an energy detector, when the wafer fork moves to a position where a detection point is located below a silicon wafer to be taken, incident light emitted by the light source is transmitted by the light transmission assembly and then is incident to the silicon wafer to be taken from the detection point, and reflected light is transmitted to the energy detector by the light transmission assembly after being reflected to the detection point by the silicon wafer to be taken. The silicon wafer transmission manipulator with the position detection function and the transmission method are also provided. The scheme provided by the invention can acquire the edge position of the silicon wafer to be taken so as to identify the center position of the silicon wafer for correction, does not occupy the space of a wafer fork, and reduces the cost.
Description
Technical Field
The invention relates to the technical field of semiconductor processing equipment, in particular to a silicon wafer transmission fork with a position detection function, a manipulator and a transmission method.
Background
Currently, in a silicon wafer front end transmission device (EFEM), position parameters of a silicon wafer transmission link are generally acquired in an offline teaching mode and stored in a controller, a manipulator performs a picking and placing operation on a silicon wafer placed on a bearing mechanism according to stored offline teaching data, a silicon wafer bearing table can cause position deviation of the silicon wafer due to temperature, load change, mechanical deformation, bearing table mechanism failure and other reasons, when the deviation position is large, the manipulator transmits wafers according to teaching data, accidents such as wafer dropping and wafer bumping can possibly occur when the silicon wafer is placed at a cache table, a prealignment position and even a wafer box, and irreparable loss is caused.
In the prior art, 3 image sensors are placed on a mechanical arm fork, and when the fork takes a piece, the 3 image sensors acquire the edge information of a silicon wafer so as to obtain the central position of the silicon wafer, thereby correcting the deviation. In this way, when the wafer fork reaches below the silicon wafer to be taken and contacts with the silicon wafer, the image sensor recognizes and feeds back the edge data information of the silicon wafer, and the following problems exist:
1. the thickness of the commercial image sensor is thicker, the thickness of the sheet fork is 2-5 mm, and the image sensor is difficult to install;
2. The edge information is required to be acquired after the wafer fork reaches the lower part of the silicon wafer to be taken, and the image sensor is required to be placed at the position of the wafer fork corresponding to the edge of the silicon wafer, so that the size of the wafer fork is increased, and the design difficulty of the bearing mechanism is improved;
3. The image sensor is generally high in price, and at least 3 sensors are required to be configured on one piece of fork, so that the cost is greatly increased.
Therefore, improvements to the silicon wafer transfer robot are needed to facilitate the acquisition of the wafer edge position and to reduce cost.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a silicon wafer transmission fork, a manipulator, a transmission method and semiconductor equipment with a position detection function.
In order to achieve the above object, the present invention is realized by the following technical scheme:
The wafer fork is provided with a bearing area for bearing the silicon wafer, N detection points are arranged in the bearing area, N is more than or equal to 3, and the connecting line of the positions of any two detection points is not parallel to the direction of the wafer fork moving towards the silicon wafer to be taken;
The wafer fork is provided with a laser position detection module, the laser position detection module comprises a light source, a light transmission assembly and an energy detector, when the wafer fork moves to the position that the detection point is positioned below the silicon wafer to be taken, incident light rays emitted by the light source are transmitted by the light transmission assembly and then are incident to the silicon wafer to be taken from the detection point, and reflected light rays are transmitted to the energy detector by the light transmission assembly after being reflected to the detection point by the silicon wafer to be taken.
Further, the number of the laser position detection modules is N, and one detection point corresponds to one laser position detection module.
Further, the light transmission assembly comprises a first beam splitting prism, a first reflecting mirror and a second reflecting mirror which are arranged along a light transmission path, and the second reflecting mirror is arranged at the detection point;
The incident light emitted by the light source is transmitted by the first light splitting prism and then continuously transmitted to the first reflecting mirror along the incident direction, the incident light is reflected by the first reflecting mirror and then is incident to the second reflecting mirror, and the second reflecting mirror reflects the incident light to the silicon wafer to be taken;
The reflected light reflected by the silicon wafer to be taken is reflected by the second reflecting mirror and then enters the first reflecting mirror, the reflected light reflected by the first reflecting mirror enters the first beam splitting prism, and the reflected light reflected by the first beam splitting prism enters the energy detector.
Further, the detection points share one laser position detection module.
Further, the light transmission assembly comprises a first beam splitting prism, a first reflecting mirror, n-1 second beam splitting prisms and a second reflecting mirror, wherein the first beam splitting prism, the first reflecting mirror, the n-1 second beam splitting prisms and the second reflecting mirror are arranged along a light transmission path, the n-1 second beam splitting prisms are arranged at n-1 detection points close to the light source, and the second reflecting mirror is arranged at the detection point farthest from the light source; wherein N is more than or equal to 2 and less than or equal to N;
The incident light emitted by the light source is transmitted by the first light splitting prism and then continuously transmitted to the first reflecting mirror along the incident direction, the incident light is reflected by the first reflecting mirror and then sequentially incident to n-1 second light splitting prisms, the last second light splitting prism is transmitted to the second reflecting mirror, and the n-1 second light splitting prisms and the second reflecting mirror reflect the incident light to the silicon wafer to be taken;
the reflected light reflected by the silicon wafer to be taken is reflected by the corresponding second beam splitting prism and the second reflecting mirror and finally enters the first reflecting mirror, the reflected light is reflected by the first reflecting mirror and enters the first beam splitting prism, and the reflected light is reflected by the first beam splitting prism and enters the energy detector.
Further, the sheet fork is Y-shaped and comprises two interdigital fingers, and N detection points are arranged on the two interdigital fingers.
Further, N is equal to 4.
A silicon wafer transmission manipulator with an automatic centering function, wherein the tail end of the silicon wafer transmission manipulator is provided with the silicon wafer transmission fork with the position detection function.
A silicon wafer transmission method, which adopts the silicon wafer transmission manipulator with the automatic centering function, as described above, the method comprises the following steps;
step S01, taking a wafer in a station 1, and triggering the energy detector when N detection points are sequentially positioned right below the edge of the silicon wafer after the wafer fork stretches into the lower part of the silicon wafer to be taken;
Step S02, acquiring edge position data of the silicon wafer according to the positions of the wafer fork when N detection points trigger the energy detector;
S03, calculating the identification center position of the silicon wafer according to the edge position data of the silicon wafer;
Step S04, calculating an offset vector of the center of the silicon wafer according to the identification center position and the theoretical center position of the silicon wafer;
S05, judging whether the actual eccentricity of the silicon wafer is in a safety range according to the offset vector; if yes, go to step S06A;
Step S06A, the wafer fork obtains the silicon wafer of the station 1;
s07, adjusting the position of the wafer fork according to the eccentric vector, and aligning the identification center position of the silicon wafer with the theoretical center position of the station 2 when the wafer fork reaches the station 2;
And step S08, the sheet fork normally places sheets on the station 2, and a round of sheet taking and placing process is completed.
Further, in step S05, if not, step S06B is executed, and the fork stops picking the sheet, and the machine stops checking.
A semiconductor device comprising a silicon wafer transport fork having a position detection function as described above.
Compared with the prior art, the invention has the following advantages:
1. Accidents such as wafer collision and wafer falling caused by larger deviation of positions of wafers to be taken can be avoided, and particularly in a subsequent machine table, the value of each wafer is not good, so that considerable economic loss can be recovered;
2. If the scheme of placing the sensor at the front end of the bearing tables is used, the sensor needs to be placed in front of each bearing table, and when the number of the bearing tables is large, the cost is high;
3. because the end customer has higher requirement on the productivity, the manipulator can replace the pre-alignment function in some occasions without the need of orienting the silicon wafer, and can reduce the cost of pre-alignment monomers while improving the productivity.
Drawings
For a clearer description of the technical solutions of the present invention, the drawings that are needed in the description will be briefly introduced below, it being obvious that the drawings in the following description are one embodiment of the present invention, and that, without inventive effort, other drawings can be obtained by those skilled in the art from these drawings:
FIG. 1 is a schematic diagram of a silicon wafer transporting fork with position detecting function according to an embodiment of the present invention;
FIG. 2 is a light path diagram of the detection point in FIG. 1;
fig. 3 is a flowchart of a silicon wafer transmission method according to an embodiment of the present invention.
Detailed Description
The following provides a further detailed description of the proposed solution of the invention with reference to the accompanying drawings and detailed description. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for the purpose of facilitating and clearly aiding in the description of embodiments of the invention. For a better understanding of the invention with objects, features and advantages, refer to the drawings. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the invention to the extent that any modifications, changes in the proportions, or adjustments of the sizes of structures, proportions, or otherwise, used in the practice of the invention, are included in the spirit and scope of the invention which is otherwise, without departing from the spirit or essential characteristics thereof.
The invention provides a wafer fork with a position detection function, which is arranged at the tail end of a silicon wafer transmission manipulator, automatically detects the edge of a silicon wafer in the silicon wafer transmission process so as to determine the identification center of the silicon wafer and judge whether the identification center of the silicon wafer is aligned with a theoretical center. The wafer fork is provided with a bearing area for bearing the silicon wafer, N detection points are arranged in the bearing area, N is more than or equal to 3, and the connecting line of the positions of any two detection points is not parallel to the moving direction of the wafer fork towards the silicon wafer to be taken; the wafer fork is provided with a laser position detection module, the laser position detection module comprises a light source, a light transmission assembly and an energy detector, when the wafer fork moves to the position that the detection point is positioned below the silicon wafer to be taken, incident light rays emitted by the light source are transmitted by the light transmission assembly and then are incident to the silicon wafer to be taken from the detection point, and reflected light rays are transmitted to the energy detector by the light transmission assembly after being reflected to the detection point by the silicon wafer to be taken. In the present invention, the light source may be a laser diode or other suitable type of light source.
When the silicon wafer conveying manipulator is used for taking the silicon wafer, the wafer fork stretches into the lower part of the silicon wafer to be taken and is not contacted with the silicon wafer, and N detection points are respectively blocked by the edge of the silicon wafer. Before the first detection point is blocked, the incident light emitted by the light source is transmitted to the first detection point and then is not reflected back to the energy detector, and after the first detection point is blocked by the edge of the silicon wafer, the edge of the silicon wafer reflects the incident light and finally reflects back to the energy detector, and when the energy detector receives a reflected signal, the real-time position of the manipulator can be recorded at the same time, so that the first edge position information of the silicon wafer can be obtained. When the second detection point is blocked, the incident light emitted by the light source is reflected to the second edge position of the silicon wafer through the second detection point, the reflected light is finally received by the energy detector, and at the moment, the real-time position of the mechanical arm fork can be recorded, so that the second edge position information of the silicon wafer can be obtained. And the like, until all detection points detect the edge of the silicon wafer, thereby obtaining N pieces of edge position information of the silicon wafer to be taken. Furthermore, the identification center position of the silicon wafer to be taken can be obtained through calculation according to the N pieces of edge position information, so that when the silicon wafer is placed, the silicon wafer transmission manipulator can compensate according to the actual position deviation of the silicon wafer, and accidents such as a striker are avoided. The calculation principle of the identification center position is that an N-sided polygon can be obtained according to the N edge position information, and the circle center (namely the centroid) of the circumscribed circle of the N-sided polygon is the identification center position of the silicon wafer to be taken.
Preferably, the value of N is 4, that is, 4 detection points are set on the fork to obtain 4 edge position information on the silicon wafer to be fetched. It will be appreciated that there will be a notch, i.e., a notch, in the wafer for orienting the wafer. According to the invention, by setting 4 detection points, even if one detection point detects the edge position information of the notch, the edge position information detected by the other three detection points can be ensured to belong to the circumference of the silicon wafer to be taken, the three edge position information detected by the other three detection points can obtain a triangle, and the position of the circumcircle center of the triangle is the identification center position of the silicon wafer.
The laser position detection module is described in detail below in conjunction with fig. 1 and 2. As shown in fig. 1, the region on the fork 100 overlapping with the silicon wafer 200 is a carrying region on the fork 100 for carrying the silicon wafer 200, and N detection points are all disposed in the carrying region.
In a first implementation manner, the number of the laser position detection modules is N, and one detection point corresponds to one laser position detection module. As a laser position detection module shown in the upper part of fig. 1, in one laser position detection module, the light transmission assembly includes a first beam splitter prism 302, a first mirror 303, and a second mirror 305 disposed along a light transmission path, the second mirror 305 being disposed at the detection point;
The incident light emitted by the light source 301 is transmitted by the first beam splitter prism 302 and then is continuously transmitted to the first reflecting mirror 303 along the incident direction, the incident light is reflected by the first reflecting mirror 303 and then is incident to the second reflecting mirror 305, and the second reflecting mirror 305 reflects the incident light to the silicon wafer 200 to be fetched;
The reflected light reflected by the silicon wafer 200 to be taken is reflected by the second reflecting mirror 305 and then enters the first reflecting mirror 303, reflected by the first reflecting mirror 303 and then enters the first beam splitter prism 302, and reflected by the first beam splitter prism 302 and then enters the energy detector 306.
In a second implementation, a plurality of detection points may share one of the laser position detection modules. As a laser position detection module shown in the lower part of fig. 1, in one laser position detection module, the light transmission assembly includes a first beam splitter prism 302, a first reflecting mirror 303, n-1 second beam splitter prisms 304, a second reflecting mirror 305, n-1 second beam splitter prisms 304 are disposed near n-1 detection points of the light source 301, and the second reflecting mirror 305 is disposed at the detection point farthest from the light source; wherein N is more than or equal to 2 and N is more than or equal to N. It should be noted that "near the light source" and "farthest from the light source" as used herein refer to a distance from the light source in a light transmission path, not a distance from the light source in a real spatial position.
Referring to fig. 2, the incident light emitted by the light source 301 is transmitted by the first beam splitter prism 302 and then continuously transmitted to the first reflecting mirror 303 along the incident direction, reflected by the first reflecting mirror 303, sequentially enters n-1 second beam splitter prisms 304, is transmitted by the last second beam splitter prism 304 to the second reflecting mirror 305, and the n-1 second beam splitter prisms 304 and the second reflecting mirror 305 reflect the incident light to the silicon wafer 200 to be extracted;
the reflected light reflected by the silicon wafer 200 to be taken is reflected by the corresponding second beam splitter prism 304 and the second reflecting mirror 305 and finally enters the first reflecting mirror 303, reflected by the first reflecting mirror 303 and enters the first beam splitter prism 302, and reflected by the first beam splitter prism 302 and enters the energy detector 306.
In practical application, the laser position detection modules in the two implementations may be separately disposed on the sheet fork 100, or may be disposed in a mixed manner, which is the arrangement condition in the embodiment shown in fig. 1, and the invention is not limited thereto. Preferably, 4 detection points may be disposed on the fork, the positions of the 4 detection points are shown in fig. 1, and two laser position detection modules according to a second implementation manner are disposed, where the upper two detection points share one laser position detection module, and the lower two detection points share one laser position detection module.
It should be noted that, for the second implementation manner, after the first detection point detects the edge of the silicon wafer, the first detection point will continue to transmit the reflected light reflected by the silicon wafer to the energy detector 306, and when the second detection point detects the edge of the silicon wafer, the second detection point transmits the reflected light reflected by the silicon wafer to the energy detector 306, and the energy received by the energy detector 306 increases, so the system can determine whether the second detection point has detected the edge of the silicon wafer according to whether the energy received by the energy detector 306 increases.
Preferably, the sheet fork 100 is in a Y shape, and includes two fingers and a connecting arm, and N detection points are disposed on the two fingers. As shown in fig. 1, 4 detection points are symmetrically distributed on two fingers, the connection arm is used for connecting a wafer transmission manipulator, and the light source 301 and the energy detector 306 in the laser position detection module can be arranged in the wrist space of the wafer transmission manipulator.
In summary, the silicon wafer transmission fork with the position detection function provided by the invention has the following advantages:
1. the light source and the energy detector can be arranged in the wrist space of the manipulator, so that the space of the sheet fork is not occupied;
2. Because the detection points are the independent micro-mirror prism and the beam-splitting prism, the size of the detection points can be up to 2mm, and the detection points can be independently replaced if damaged, so that the cost is low;
3. At least 4 detection points can be arranged, so that at least 3 pieces of edge position information can be ensured to be effective, and the influence of notch is avoided.
Based on the same inventive concept, the invention also provides a silicon wafer transmission manipulator with an automatic centering function, wherein the tail end of the silicon wafer transmission manipulator is provided with the silicon wafer transmission fork with the position detection function. Meanwhile, the invention also provides semiconductor equipment comprising the silicon wafer transmission manipulator with the position detection function.
The silicon wafer transmission fork with the position detection function is arranged at the tail end of the silicon wafer transmission manipulator and is used for transmitting silicon wafers among a plurality of stations in semiconductor equipment. The semiconductor device further comprises a plurality of stations for placing silicon wafers, such as a bearing device for the silicon wafers, and a control device for controlling the mechanical arm to perform various actions, the bearing device is provided with a supporting component for bearing the silicon wafers, the control device is provided with a judging device, at least 3 detection points are arranged on the fork, when the fork stretches into the lower part of the silicon wafers to be taken, the at least 3 detection points are respectively blocked by the edges of the silicon wafers, emergent rays emitted by the light source at the moment reach the back of the silicon wafers and are reflected by the beam splitter prism, the reflecting mirror or the beam splitter prism at the detection points and then follow the original path to the energy detector, the energy detector receives reflected signals and records the real-time position of the mechanical arm, the judging device in the controller can calculate the identification center position of the silicon wafers according to the real-time position of the mechanical arm when triggering the detection points, compares the identification center position with the theoretical center position, when the fork is within a safety range, the fork normally takes the wafers, automatic centering is performed when the wafers are placed at the next station, and if the safety range is exceeded, the judging device alarms, the wafer taking is stopped, and the machine station is checked. The identification center position and the theoretical center position refer to the relative positions of the silicon wafers on the wafer fork.
In the invention, the silicon wafer bearing device can be a supporting structure in the processing cavity, and can also be a device such as a wafer box, a prealignment platform, a cache platform and the like. The wafer removal process of the present invention may thus include, but is not limited to, a process of removing a wafer from a processing chamber, and a process of picking up a wafer from a cassette.
As shown in fig. 3, the silicon wafer transmission method provided by the invention adopts the silicon wafer transmission manipulator with the automatic centering function, and specifically includes:
step S01, taking a wafer in a station 1, and triggering the energy detector when N detection points are sequentially positioned right below the edge of the silicon wafer after the wafer fork stretches into the lower part of the silicon wafer to be taken;
specifically, the fork extends below the silicon wafer to be fetched at the height of the wafer to be fetched, and before the wafer is lifted for fetching, N (hereinafter, n=4 is introduced) detection points are respectively blocked by the edge of the silicon wafer, at this time, the incident light emitted by the light source reaches the back of the silicon wafer to be reflected by the spectroscope, the reflecting mirror, the beam splitting prism or the reflecting mirror and then reaches the energy detector along the original path, so as to trigger the energy detector.
Step S02, acquiring edge position data of the silicon wafer according to the positions of the wafer fork when N detection points trigger the energy detector;
Specifically, when the manipulator stretches into the lower part of the silicon wafer to be taken, the controller reads the position of the manipulator fork in real time, and when the trigger signal of the energy detector is obtained, the position of the manipulator fork at the moment is recorded respectively, so that the position data (X1, Y1), (X2, Y2), (X3, Y3), (X4, Y4) of the edge of the silicon wafer are obtained. It can be understood that the recorded position of the fork of the manipulator can be regarded as the position of the center of the fork of the manipulator, and the relative position relation between each detection point and the center position of the fork is known because the position of each detection point on the fork is fixed, so that the position data of the detection point can be obtained according to the position of the fork and the relative position relation between the center of the fork and the detection point when the position of the fork is recorded, and the position data of the detection point is the position data of the edge of the silicon wafer.
S03, calculating the identification center position of the silicon wafer according to the edge position data of the silicon wafer;
Specifically, according to 4 position data, any three position data can form a triangle, namely four triangles are obtained, the diameters of 4 circumscribed circles corresponding to the four triangles are respectively D1, D2, D3 and D4, the controller compares the diameters with the theoretical diameter D of the silicon wafer, and the data with the diameter difference larger than a threshold value C are removed, so that the influence of a notch of the silicon wafer is avoided, and then the identification center position P1 of the silicon wafer to be obtained is obtained according to the residual effective position data. That is, if a certain position data is the position data at the notch of the silicon wafer, the difference value between the diameter of the circumscribed circle of the three triangles formed by the position data and the theoretical diameter D of the silicon wafer is larger than the threshold value C, so that the position data needs to be removed, and the center of the circumscribed circle of the triangle formed by the remaining three position data is the identification center position P1 of the silicon wafer to be taken. If the difference between the diameters of the four circumscribed circles and the theoretical diameter D of the silicon wafer is smaller than the threshold value C, the center of any circumscribed circle can be calculated as the identification center position P1 of the silicon wafer to be taken, or the centers of the four circumscribed circles can be calculated respectively, and then the identification center position P1 of the silicon wafer to be taken is calculated according to the four centers (for example, the average value is taken).
Step S04, calculating an offset vector of the center of the silicon wafer according to the identification center position and the theoretical center position of the silicon wafer;
specifically, the identification center position P1 and the theoretical position center P0 are compared, and the offset vector P2 is calculated.
S05, judging whether the actual eccentricity of the silicon wafer is in a safety range according to the offset vector; if yes, step S06A is executed, and if no, step S06B is executed;
Specifically, the controller evaluates the actual offset vector, if the actual offset vector is within the safety range, step S06A is performed, if the actual offset vector is greater than the safety range, and step S06B is performed.
Step S06A, the wafer fork obtains the silicon wafer of the station 1;
specifically, the manipulator fork is lifted at the station 1 to obtain the silicon wafer.
S07, adjusting the position of the wafer fork according to the eccentric vector, and aligning the identification center position of the silicon wafer with the theoretical center position of the station 2 when the wafer fork reaches the station 2;
specifically, when the manipulator fork is at the slice placing height of the station 2, the original teaching position of the manipulator fork on the station 2 is compensated according to the actual offset vector P2, so that the silicon slice identification center is aligned with the theoretical center.
And step S08, the sheet fork normally places sheets on the station 2, and a round of sheet taking and placing process is completed.
And S06B, stopping taking the sheet by the sheet fork, and stopping checking the machine.
In summary, the invention can avoid the accidents such as wafer bumping and wafer dropping caused by larger deviation of the positions of the wafers to be taken, especially in the subsequent machine, the value of each wafer is not good, and the corresponding economic loss can be recovered; if the scheme of placing the sensor at the front end of the bearing tables is used, the sensor needs to be placed in front of each bearing table, and when the number of the bearing tables is large, the cost is high; because the end customer has higher requirement on the productivity, the manipulator can replace the pre-alignment function in some occasions without the need of orienting the silicon wafer, and can reduce the cost of pre-alignment monomers while improving the productivity.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
While the present invention has been described in detail through the foregoing description of the preferred embodiment, it should be understood that the foregoing description is not to be considered as limiting the invention. Many modifications and substitutions of the present invention will become apparent to those of ordinary skill in the art upon reading the foregoing. Accordingly, the scope of the invention should be limited only by the attached claims.
Claims (11)
1. The silicon wafer transmission fork with the position detection function is characterized in that the fork is provided with a bearing area for bearing a silicon wafer, N detection points are arranged in the bearing area, N is more than or equal to 3, and a connecting line of the positions of any two detection points is not parallel to the direction of the fork moving towards the silicon wafer to be taken;
The wafer fork is provided with a laser position detection module, the laser position detection module comprises a light source, a light transmission component and an energy detector, the light source and the energy detector are arranged in a wrist space of the wafer transmission manipulator, the light transmission component is arranged in the wafer fork, the wafer fork moves along a wafer taking path, when the wafer fork moves to the position that a detection point is positioned below a silicon wafer to be taken, incident light emitted by the light source is transmitted by the light transmission component and then enters the silicon wafer to be taken from the detection point, and reflected light is transmitted to the energy detector from the light transmission component after being reflected to the detection point by the silicon wafer to be taken.
2. The silicon wafer transport fork with a position detection function according to claim 1, wherein the number of the laser position detection modules is N, and one detection point corresponds to one laser position detection module.
3. The silicon wafer transmission fork with the position detection function according to claim 2, wherein the light transmission assembly comprises a first beam splitter prism, a first reflecting mirror and a second reflecting mirror which are arranged along a light transmission path, and the second reflecting mirror is arranged at the detection point;
The incident light emitted by the light source is transmitted by the first light splitting prism and then continuously transmitted to the first reflecting mirror along the incident direction, the incident light is reflected by the first reflecting mirror and then is incident to the second reflecting mirror, and the second reflecting mirror reflects the incident light to the silicon wafer to be taken;
The reflected light reflected by the silicon wafer to be taken is reflected by the second reflecting mirror and then enters the first reflecting mirror, the reflected light reflected by the first reflecting mirror enters the first beam splitting prism, and the reflected light reflected by the first beam splitting prism enters the energy detector.
4. The silicon wafer transport fork with position detection function according to claim 1, wherein a plurality of the detection points share one laser position detection module.
5. The silicon wafer transmission fork with position detection function according to claim 4, wherein the optical transmission assembly comprises a first beam splitter prism, a first reflector, n-1 second beam splitter prisms and a second reflector, wherein the first beam splitter prism, the first reflector, the n-1 second beam splitter prisms are arranged at n-1 detection points close to the light source, and the second reflector is arranged at the detection point farthest from the light source; wherein N is more than or equal to 2 and less than or equal to N;
The incident light emitted by the light source is transmitted by the first light splitting prism and then continuously transmitted to the first reflecting mirror along the incident direction, the incident light is reflected by the first reflecting mirror and then sequentially incident to n-1 second light splitting prisms, the last second light splitting prism is transmitted to the second reflecting mirror, and the n-1 second light splitting prisms and the second reflecting mirror reflect the incident light to the silicon wafer to be taken;
the reflected light reflected by the silicon wafer to be taken is reflected by the corresponding second beam splitting prism and the second reflecting mirror and finally enters the first reflecting mirror, the reflected light is reflected by the first reflecting mirror and enters the first beam splitting prism, and the reflected light is reflected by the first beam splitting prism and enters the energy detector.
6. The wafer transport fork with position detection function according to claim 1, wherein the fork is Y-shaped and comprises two fingers, and N detection points are disposed on the two fingers.
7. The silicon wafer transport fork with a position detecting function according to any one of claims 1 to 6, wherein N is equal to 4.
8. A silicon wafer transfer manipulator with an automatic centering function, characterized in that a silicon wafer transfer fork with a position detection function as set forth in any one of claims 1 to 7 is mounted at the end of the silicon wafer transfer manipulator.
9. A silicon wafer transmission method, characterized in that the silicon wafer transmission manipulator with the automatic centering function as claimed in claim 8 is adopted, and the method comprises the following steps;
step S01, taking a wafer in a station 1, and triggering the energy detector when N detection points are sequentially positioned right below the edge of the silicon wafer after the wafer fork stretches into the lower part of the silicon wafer to be taken;
Step S02, acquiring edge position data of the silicon wafer according to the positions of the wafer fork when N detection points trigger the energy detector;
S03, calculating the identification center position of the silicon wafer according to the edge position data of the silicon wafer;
Step S04, calculating an offset vector of the center of the silicon wafer according to the identification center position and the theoretical center position of the silicon wafer;
S05, judging whether the actual eccentricity of the silicon wafer is in a safety range according to the offset vector; if yes, go to step S06A;
Step S06A, the wafer fork obtains the silicon wafer of the station 1;
S07, adjusting the position of the wafer fork according to the offset vector, and aligning the identification center position of the silicon wafer with the theoretical center position of the station 2 when the wafer fork reaches the station 2;
And step S08, the sheet fork normally places sheets on the station 2, and a round of sheet taking and placing process is completed.
10. The method of claim 9, wherein in step S05, if not, step S06B is performed, the fork stops picking up the wafer, and the machine stops checking.
11. A semiconductor device comprising the silicon wafer transfer robot having an automatic centering function according to claim 8.
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| CN105632997B (en) * | 2015-12-31 | 2018-08-10 | 北京北方华创微电子装备有限公司 | The safe pick-up method and system of silicon chip in silicon wafer carrying device |
| CN105514010B (en) * | 2015-12-31 | 2018-06-22 | 北京北方华创微电子装备有限公司 | A kind of silicon chip transports method safely |
| CN208744824U (en) * | 2018-09-11 | 2019-04-16 | 德淮半导体有限公司 | Mechanical arm |
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| CN101911276A (en) * | 2007-12-27 | 2010-12-08 | 朗姆研究公司 | Systems and methods for calibrating end effector alignment using at least a light source |
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