CN113366649A

CN113366649A - Method for preparing elastic substrate

Info

Publication number: CN113366649A
Application number: CN201980090089.6A
Authority: CN
Inventors: 雷晓华
Original assignee: Shenzhen Royole Technologies Co Ltd
Current assignee: Shenzhen Royole Technologies Co Ltd
Priority date: 2019-07-09
Filing date: 2019-07-09
Publication date: 2021-09-07
Also published as: WO2021003668A1

Abstract

The embodiment of the invention provides a preparation method of an elastic substrate (10). The method of making the elastic substrate (10) includes S100 and S200, S100: providing a base material (100), wherein the base material (100) comprises a first base (200), a second base (300) and a third base (400) which are sequentially stacked along a preset direction, the stretching ratio of the first base (200) is greater than that of the second base (300), and the stretching ratio of the third base (400) is greater than that of the second base (300); s200: cutting the base material (100) along the preset direction to obtain an elastic base (10) with preset dimensions, wherein the elastic base (10) comprises the first base (200), the second base (300) and the third base (400). The elastomeric substrate (10) prepared by the method of the present application has good surface flatness, which facilitates obtaining elastomeric substrates (10) with high consistency on a large scale.

Description

Method for preparing elastic substrate

Technical Field

The invention relates to the technical field of electronics, in particular to a preparation method of an elastic substrate.

Background

Stretchable electronic components are generally disposed on substrates having different stretch ratios, and due to the large difference in stretch ratio between the regions where the functional elements and the conductive wires are disposed, the substrate may have a large discontinuity at the stretch interface of the regions, which may easily cause the elastic stretchable conductive wires to break or increase the risk of failure. In the related art, in order to reduce the large step difference of the stretching interface of the base material, a multi-stage splicing mode is usually adopted, and the surface of the elastic base has an uneven problem, so that a large-batch product with high consistency is difficult to obtain.

Disclosure of Invention

The embodiment of the invention provides a preparation method of an elastic substrate. The preparation method of the elastic substrate comprises the following steps:

providing a base material, wherein the base material comprises a first base, a second base and a third base which are sequentially stacked along a preset direction, the stretching rate of the first base is greater than that of the second base, and the stretching rate of the third base is greater than that of the second base;

and cutting the base material along the preset direction to obtain an elastic base with a preset size, wherein the elastic base comprises the first base, the second base and the third base.

The preparation method of the elastic base provided by the embodiment of the invention comprises the steps of firstly, providing a base material, wherein the base material comprises a first base, a second base and a third base which are sequentially stacked along a preset direction, the stretching ratio of the first base is greater than that of the second base, the stretching ratio of the third base is greater than that of the second base, and then, cutting the base material along the preset direction to obtain the elastic base with a preset size, wherein the elastic base comprises the first base, the second base and the third base. Because the elastic substrate is obtained by cutting the base material, compared with a method for forming the elastic substrate in a multi-section splicing mode, the elastic substrate provided by the embodiment of the application has better surface flatness and is beneficial to obtaining the elastic substrates with higher mass consistency.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a flow chart of a method of making a first elastomeric substrate provided in an embodiment of the present application.

Fig. 2 is a schematic structural diagram corresponding to S100 in fig. 1.

Fig. 3 is a schematic structural diagram corresponding to S200 in fig. 1.

Fig. 4 is a partial flow diagram of a method of making an elastic substrate provided in an embodiment of the present application.

Fig. 5 is a schematic structural diagram corresponding to S110 in fig. 4.

Fig. 6 is a schematic structural diagram corresponding to S120 in fig. 4.

Fig. 7 is a schematic structural diagram corresponding to S130 in fig. 4.

Fig. 8 is a partial flow diagram of a method of making an elastic substrate provided in an embodiment of the present application.

Fig. 9 is a schematic structural diagram corresponding to S111 in fig. 8.

Fig. 10 is a schematic structural diagram corresponding to S112 in fig. 8.

Fig. 11 is a partial flow diagram of a method of making an elastic substrate provided in an embodiment of the present application.

Fig. 12 is a schematic structural diagram corresponding to S121 in fig. 11.

Fig. 13 is a schematic structural diagram of an elastic substrate provided in an embodiment of the present application.

Fig. 14 is a schematic structural diagram of an elastic substrate provided in an embodiment of the present application.

Fig. 15 is a partial flow diagram of a method of making an elastic substrate provided in an embodiment of the present application.

Fig. 16 is a schematic structural diagram corresponding to S140 in fig. 15.

Fig. 17 is a schematic structural diagram corresponding to S150 in fig. 15.

Fig. 18 is a schematic structural diagram corresponding to S160 in fig. 15.

Fig. 19 is a schematic structural diagram corresponding to S170 in fig. 15.

Fig. 20 is a schematic structural diagram corresponding to S180 in fig. 15.

Fig. 21 is a partial flow diagram of a method of making an elastic substrate provided in an embodiment of the present application.

Fig. 22 is a schematic structural diagram corresponding to S101 in fig. 21.

Fig. 23 is a schematic structural diagram corresponding to S102 in fig. 21.

Fig. 24 is a schematic structural diagram corresponding to S103 in fig. 21.

Fig. 25 is a schematic structural diagram corresponding to S104 in fig. 21.

Fig. 26 is a schematic structural diagram corresponding to S105 in fig. 21.

Fig. 27 is a schematic structural diagram corresponding to S106 in fig. 21.

Fig. 28 is a schematic structural diagram corresponding to S107 in fig. 21.

Fig. 29 is a schematic structural diagram corresponding to S108 in fig. 21.

Fig. 30 is a schematic structural view corresponding to S109 in fig. 21.

Fig. 31 is a schematic structural diagram of an elastic substrate provided in an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, fig. 1 is a flowchart illustrating a method for manufacturing a first elastic substrate 10 according to an embodiment of the present disclosure. In the present embodiment, the preparation method of the elastic substrate 10 includes, but is not limited to, S100 and S200, which are described below with respect to S100 and S200.

S100: providing a base material 100, wherein the base material 100 comprises a first base 200, a second base 300 and a third base 400 which are sequentially stacked along a preset direction A, the stretch ratio of the first base 200 is greater than that of the second base 300, and the stretch ratio of the third base 400 is greater than that of the second base 300. Please refer to fig. 2.

The first substrate 200, the second substrate 300, and the third substrate 400 may be elastomers and rubbers such as silicone rubber, polyurethane elastomers (TPU), styrene Thermoplastic Block Copolymers (SBS), TPO, Thermoplastic vulcanizates (TPV), Polydimethylsiloxane (PDMS), and the like. The stretching ratio of the first substrate 200 is greater than that of the second substrate 300, and the stretching ratio of the third substrate 400 is greater than that of the second substrate 300. That is, under the same tensile force, the deformation of the first substrate 200 is greater than that of the second substrate 300, and the deformation of the third substrate 400 is greater than that of the second substrate 300.

It should be noted that, when the elastic electronic component is prepared by using the elastic substrate 10, the functional elements of the elastic electronic component are correspondingly disposed on the second substrate 300, and the wire layers of the elastic electronic component are correspondingly disposed on the first substrate 200 and the third substrate 400, because the functional elements are usually hard materials, the wire layers usually have stretchability, so that the functional elements, the wire layers and the elastic substrate 10 can be well matched, which is helpful for improving the problem of electrical connection failure of the elastic electronic component, and further can prolong the service life of the elastic electronic component.

In one embodiment, the first substrate 200 and the third substrate 400 are the same material. Specifically, the first substrate 200 and the third substrate 400 are made of the same material, and at this time, the first substrate 200 and the third substrate 400 can have the same stretching ratio, so that the stretching ratio of the elastic substrate 10 is more uniform when the elastic substrate is subjected to a stretching force, which is beneficial to improving the stretching bearing capacity of the elastic substrate 10 and prolonging the service life of the elastic substrate 10.

Further, the first substrate 200 and the third substrate 400 are symmetrically disposed with respect to the second substrate 300. And because the stretch ratio of the first substrate 200 is greater than that of the second substrate 300, and the stretch ratio of the third substrate 400 is greater than that of the second substrate 300, when the first substrate 200 and the third substrate 400 of the elastic substrate 10 are under the tensile force in opposite directions, the first substrate 200 and the third substrate 400 exhibit the same deformation amount, and at this time, the stress on the elastic substrate 10 is more uniform, which is helpful for prolonging the service life of the elastic substrate 10.

In another embodiment, the stretch ratio of the first substrate 200, the stretch ratio of the second substrate 300, and the stretch ratio of the third substrate 400 are all constant values.

Specifically, in the present embodiment, the stretch ratio of the first substrate 200 is a constant value, that is, when the first substrate 200 is subjected to a tensile force, the amount of deformation occurring at each portion of the first substrate 200 is the same. The stretching ratio of the second substrate 300 is also constant, the stretching ratio of the third substrate 400 is also constant, the stretching ratio of the first substrate 200 is greater than that of the second substrate 300, and the stretching ratio of the third substrate 400 is greater than that of the second substrate 300. Since the stretch ratios of the first substrate 200, the second substrate 300, and the third substrate 400 are all constant values, the preparation of the first substrate 200, the second substrate 300, and the third substrate 400 is more convenient, and when the elastic substrate 10 is prepared by using the first substrate 200, the second substrate 300, and the third substrate 400, the complexity of the preparation process of the elastic substrate 10 may be reduced, which is helpful for realizing mass production of the elastic substrate 10.

In yet another embodiment, in a direction from the first substrate 200 toward the third substrate 400: the stretch ratio of the first substrate 200 is gradually decreased, the stretch ratio of the second substrate 300 is decreased first and then increased, and the stretch ratio of the third substrate 400 is gradually increased.

That is, the stretching ratio of the first substrate 200 is a variation value, that is, when the first substrate 200 is subjected to the tensile force, the deformation amount of each portion of the first substrate 200 is different, the stretching ratio of the second substrate 300 is a variation value, and the stretching ratio of the third substrate 400 is a variation value. In a direction from the first substrate 200 toward the second substrate 300, the stretch ratio of the first substrate 200 gradually decreases, and the stretch ratio of the second substrate 300 increases after decreasing. The stretching ratio of the third substrate 400 gradually increases in a direction from the second substrate 300 toward the third substrate 400.

S200: cutting the base material 100 along the preset direction a to obtain an elastic base 10 with a preset size, where the elastic base 10 includes the first base 200, the second base 300, and the third base 400. Please refer to fig. 3.

In one embodiment, the predetermined direction a is a stacking direction of the substrates 100. It is understood that in other embodiments, the preset direction a may be other directions. The dicing of the base material 100 along the preset direction a may be equal-spaced dicing or non-equal-spaced dicing.

Specifically, the base material 100 is cut along the stacking direction of the base material 100, so that the elastic base 10 with a preset size is obtained, and the elastic base 10 simultaneously comprises a first base 200, a second base 300 and a third base 400. Because the elastic base 10 is obtained by cutting the base material 100, compared with the elastic base 10 formed by a sectional splicing manner, the elastic base 10 in the embodiment has better surface flatness, that is, when the elastic base 10 is under the action of a tensile force, the elastic base is stressed more uniformly, which is helpful for prolonging the service life of the elastic base 10.

The preparation method of the elastic base 10 provided in the embodiment of the present invention includes firstly, providing a base material 100, where the base material 100 includes a first base 200, a second base 300, and a third base 400 that are sequentially stacked along a preset direction a, a stretch ratio of the first base 200 is greater than a stretch ratio of the second base 300, and a stretch ratio of the third base 400 is greater than a stretch ratio of the second base 300, and then cutting the base material 100 along the preset direction a to obtain the elastic base 10 having a preset size, where the elastic base 10 includes the first base 200, the second base 300, and the third base 400. Because the elastic base 10 is obtained by cutting the base material 100, compared with a method for forming the elastic base 10 in a multi-section splicing manner, the elastic base 10 provided by the embodiment of the application is prepared in a manner of integrating first and then partially, has better surface flatness, and is beneficial to obtaining the elastic base 10 with higher batch consistency.

Continuing to refer to fig. 4, in one embodiment, the "S100: a base material 100 is provided, the base material 100 includes a first base 200, a second base 300, and a third base 400 ″ sequentially stacked, including but not limited to S110, S120, and S130, and the following description is provided with respect to S110, S120, and S130.

S110: a first substrate 200 is provided. Please refer to fig. 5.

The first substrate 200 may be silicone rubber, polyurethane elastomers (TPU), styrene Thermoplastic Block Copolymers (SBS), TPO, Thermoplastic vulcanizates (TPV), Polydimethylsiloxanes (PDMS), and other elastomers and rubbers. The first substrate 200 may be formed by casting, coating, injection molding, hot pressing, calendering, extrusion, etc. to form a substrate block of a set thickness.

S120: a second substrate 300 is formed to cover the first substrate 200. Please refer to fig. 6.

The second substrate 300 may be silicone rubber, polyurethane elastomers (TPU), styrene Thermoplastic Block Copolymers (SBS), TPO, Thermoplastic vulcanizates (TPV), Polydimethylsiloxanes (PDMS), and other elastomers and rubbers. The second substrate 300 may be formed by casting, coating, injection molding, hot pressing, calendering, extrusion, etc. to form a substrate block having a set thickness. Preferably, the first substrate 200 is solidified and integrated into a whole through liquid pouring and coating; or bonded integrally with the first substrate 200 by heat and pressure.

S130: a third substrate 400 is formed to cover the second substrate 300. Please refer to fig. 7.

The third substrate 400 may be an elastomer and rubber such as silicone rubber, polyurethane elastomer rubber (TPU), styrene Thermoplastic elastomer (SBS), TPO, Thermoplastic Vulcanizate (TPV), Polydimethylsiloxane (PDMS), etc. The third substrate 400 may be formed by casting, coating, injection molding, hot pressing, calendering, extrusion, etc. to form a substrate block having a set thickness.

Specifically, in this embodiment, a first substrate 200 is formed, a second substrate 300 is formed to cover the first substrate 200, and a third substrate 400 is formed to cover the second substrate 300, wherein the first substrate 200, the second substrate 300, and the third substrate 400 together form the base material 100. It is understood that in other embodiments, the formation order of the first substrate 200, the second substrate 300, and the third substrate 400 may be changed, and the order of the formation of the first substrate 200, the second substrate 300, and the third substrate 400 is not limited in this application.

With continued reference to fig. 8, 9, 10, 11, and 12, in one embodiment, the first substrate 200 includes a first sub-substrate 210 and a second sub-substrate 220, and the "S110: the first substrate 200 ″ is provided including, but not limited to, S111 and S112, which are described below with respect to S111 and S112.

S111: a first sub-substrate 210 is provided. Please refer to fig. 9.

S112: a second sub-substrate 220 is formed to cover the first sub-substrate 210. Please refer to fig. 10.

The "S120: forming the second substrate 300 ″ covering the first substrate 200 includes, but is not limited to, S121, which is described below with respect to S121. Please refer to fig. 11.

S121: a second substrate 300 is formed to cover the second sub-substrate 220. Please refer to fig. 12.

In particular, for thicker substrate sizes, it can be made by multiple bonding into one piece. In the present embodiment, the first substrate 200 includes a first sub-substrate 210 and a second sub-substrate 220, that is, the first substrate 200 is formed by stacking the first sub-substrate 210 and the second sub-substrate 220, thereby obtaining a larger-sized first substrate 200. The first sub-substrates 210 may be made of the same material or different materials. When the first sub-substrate 210 and the second sub-substrate 220 are made of different materials, the stretch ratio of the first sub-substrate 210 is greater than that of the second sub-substrate 220.

With continued reference to fig. 13 and 14, it is understood that in other embodiments, the second substrate 300 may be formed by bonding a plurality of sub-substrates together, and the third substrate 400 may be formed by bonding a plurality of sub-substrates together. The second substrate 300 includes a third sub-substrate 310 and a fourth sub-substrate 320, and the third substrate 400 includes a fifth sub-substrate 410 and a sixth sub-substrate 420. The second substrate 300 and the third substrate 400 having a larger size may be obtained by bonding a plurality of sub-substrates together, and finally, a dicing process may be performed in a thickness direction. Since the substrate with a larger size is formed by bonding a plurality of sub-substrates into a whole, and the plurality of sub-substrates have similar tensile properties, the regions of the substrate with a larger size formed by bonding also have similar tensile properties, so that the difference of the tensile rates among the substrates can be reduced, and at the same time, the sizes of the first substrate 200, the second substrate 300 and the third substrate 400 can be flexibly adjusted in this way, thereby expanding the application range of the elastic substrate 10.

With continued reference to fig. 15, 16, 17, 18, 19, and 20, in one embodiment, the substrate 100 further includes a fourth base 500 and a fifth base 600, and the "S100: substrate 100 "is provided including, but not limited to, S140, S150, S160, S170, and S180, as described below with respect to S140, S150, S160, S170, and S180.

S140: a first substrate 200 is provided. Please refer to fig. 16.

S150: a fourth substrate 500 is formed to cover the first substrate 200. Please refer to fig. 17.

The fourth substrate 500 may be an elastomer and rubber such as silicone rubber, polyurethane elastomers (TPU), styrene Thermoplastic Block Copolymers (SBS), TPO, Thermoplastic Vulcanizate (TPV), Polydimethylsiloxane (PDMS), etc. The fourth substrate 500 may be formed by casting, coating, injection molding, hot pressing, calendaring, extruding, etc. to form a substrate block with a set thickness.

S160: a second substrate 300 is formed to cover the fourth substrate 500. Please refer to fig. 18.

The second substrate 300 may be silicone rubber, polyurethane elastomers (TPU), styrene Thermoplastic Block Copolymers (SBS), TPO, Thermoplastic vulcanizates (TPV), Polydimethylsiloxanes (PDMS), and other elastomers and rubbers. The second substrate 300 may be formed by casting, coating, injection molding, hot pressing, calendering, extrusion, etc. to form a substrate block having a set thickness.

S170: a fifth substrate 600 covering the second substrate 300 is formed. Please refer to fig. 19.

The fifth substrate 600 may be an elastomer and rubber such as silicone rubber, polyurethane elastomers (TPU), styrene Thermoplastic Block Copolymers (SBS), TPO, Thermoplastic Vulcanizate (TPV), Polydimethylsiloxane (PDMS), etc. The fifth substrate 600 may be formed by casting, coating, injection molding, hot pressing, calendaring, extruding, etc. to form a substrate block with a set thickness.

S180: a third substrate 400 is formed to cover the fifth substrate 600. Please refer to fig. 20.

Specifically, in this embodiment, the base material 100 includes a fourth base 500 and a fifth base 600 in addition to the first base 200, the second base 300 and the third base 400, and the first base 200, the fourth base 500, the second base 300, the fifth base 600 and the third base 400 are sequentially stacked.

In one embodiment, the stretching ratio of the first substrate 200 is greater than that of the fourth substrate 500, the stretching ratio of the fourth substrate 500 is greater than that of the second substrate 300, the stretching ratio of the second substrate 300 is less than that of the fifth substrate 600, and the stretching ratio of the fifth substrate 600 is less than that of the third substrate 400.

Specifically, in a direction from the first substrate 200 toward the second substrate 300, the stretch ratio of the first substrate 200 is gradually decreased, the stretch ratio of the fourth substrate 500 is gradually decreased, the stretch ratio of the second substrate 300 is decreased first and then increased, the stretch ratio of the fifth substrate 600 is gradually increased, and the stretch ratio of the third substrate 400 is gradually increased.

In one embodiment, the elongation percentage distribution of the first substrate 200 and the third substrate 400 is symmetrical with respect to the second substrate 300, and the elongation percentage distribution of the fourth substrate 500 and the fifth substrate 600 is symmetrical with respect to the second substrate 300, when the elastic substrate 10 is subjected to a tensile force, the elastic substrate 10 is stressed more uniformly, which helps to improve the stress distribution of the elastic substrate 10, avoid the problem of failure of the elastic substrate 10, and prolong the service life of the elastic substrate 10.

Further, the stretching ratio of the fourth substrate 500 is less than half of the stretching ratio of the first substrate 200, and the stretching ratio of the fifth substrate 600 is less than half of the stretching ratio of the third substrate 400.

In particular, the stretch ratio of the elastic base 10 exhibits a non-linear change. The variation amount of the stretch rate of the first, fourth and

third substrates

200, 500 and 300 is gradually increased in a direction from the first substrate 200 toward the second substrate 300, and the variation amount of the stretch rate of the second, fifth and

third substrates

300, 600 and 400 is gradually decreased in a direction from the second substrate 300 toward the third substrate 400. At this time, the elastic substrate 10 is convenient to be applied to complex stress conditions, and the application range of the elastic substrate 10 is expanded.

In another embodiment, the first substrate 200, the fourth substrate 500, the second substrate 300, the fifth substrate 600, and the third substrate 400 are homologs. Wherein, the homologous compounds refer to similar structures and different molecular compositions by a plurality of' CH₂"radical organic compound. Since the first substrate 200, the fourth substrate 500, the second substrate 300, the fifth substrate 600 and the third substrate 400 are homologous and have similar molecular structures, the first substrate 200, the fourth substrate 500, the second substrate 300, the fifth substrate 600 and the third substrate 400 also exhibit similar changes in the elongation when being subjected to the tensile force. When the first substrate 200, the fourth substrate 500, the second substrate 300, the fifth substrate 600 and the third substrate 400 are used to prepare the elastic substrate 10, the stretching rates of the first substrate 200, the fourth substrate 500, the second substrate 300, the fifth substrate 600 and the third substrate 400 can be well coordinated, that is, when the first substrate 200, the fourth substrate 500, the second substrate 300, the fifth substrate 600 and the third substrate 400 are subjected to a tensile force, the tensile force is distributed more uniformly, which helps to improve the stress distribution of the elastic substrate 10, avoid the problem of failure of the elastic substrate 10 and prolong the service life of the elastic substrate 10.

In yet another embodiment, the first substrate 200 and the third substrate 400 are the same material, and the fourth substrate 500 and the fifth substrate 600 are the same material.

Specifically, since the fourth substrate 500 and the fifth substrate 600 are respectively located at two ends of the second substrate 300, the first substrate 200 is located at one end of the fourth substrate 500 away from the second substrate 300, and the third substrate 400 is located at one end of the fifth substrate 600 away from the second substrate 300, when the first substrate 200 and the third substrate 400 are made of the same material, and the fourth substrate 500 and the fifth substrate 600 are made of the same material, the stress distribution inside the elastic substrate 10 can be optimized, which is helpful for avoiding the problem of failure of the elastic substrate 10, and can prolong the service life of the elastic substrate 10.

In another embodiment, the fourth substrate 500 is formed by mixing the material of the first substrate 200 and the material of the second substrate 300, and the fifth substrate 600 is formed by mixing the material of the first substrate 200 and the material of the second substrate 300.

Further, the fourth substrate 500 is formed by mixing a material of the first substrate 200 and a material of the second substrate 300 in a mass ratio of one to one, and the fifth substrate 600 is formed by mixing a material of the first substrate 200 and a material of the second substrate 300 in a mass ratio of one to one.

Specifically, since the fourth substrate 500 and the fifth substrate 600 are formed by mixing the first substrate 200 and the second substrate 300 according to a certain mass ratio, when the elastic substrate 10 is prepared, the elastic substrate 10 has a gradually changing tensile modulus, and the breaking difference is gentle during stretching, which is beneficial to protecting the elastic substrate 10 and can improve the tensile property of the elastic substrate 10.

With continuing reference to fig. 21, 22, 23, 24, 25, 26, 27, 28 and 29, in one embodiment, the base material 100 further includes a first substrate 110, a second substrate 120, a third substrate 130, a fourth substrate 140, a fifth substrate 150 and a sixth substrate 160, where the "S100: the substrate 100 "is provided including, but not limited to, S101, S102, S103, S104, S105, S106, S107, and S108, as described below with respect to S101, S102, S103, S104, S105, S106, S107, and S108.

S101: a first substrate 200 is provided. Please refer to fig. 22.

S102: a first substrate 110 is formed to cover the first base 200. Please refer to fig. 23.

S103: a second substrate 120 is formed overlying the first substrate 110. Please refer to fig. 24.

S104: a third substrate 130 is formed overlying the second substrate 120. Please refer to fig. 25.

S105: a second base 300 is formed covering the third substrate 130. Please refer to fig. 26.

S106: a fourth substrate 140 covering the second base 300 is formed. Please refer to fig. 27.

S107: a fifth substrate 150 is formed overlying the fourth substrate 140. Please refer to fig. 28.

S108: a sixth substrate 160 is formed overlying the fifth substrate 150. Please refer to fig. 29.

Referring to fig. 29 again, in one embodiment, the first substrate 110, the second substrate 120, the third substrate 130, the fourth substrate 140, the fifth substrate 150, and the sixth substrate 160 are formed by mixing the material of the first base 200 and the material of the second base 300. The base material 100 includes a first base 200, a first substrate 110, a second substrate 120, a third substrate 130, a second base 300, a fourth substrate 140, a fifth substrate 150, and a sixth substrate 160, which are sequentially stacked.

Further, the first substrate 110 is formed by mixing the material of the first base 200 and the material of the second base 300 in a mass ratio of two to one, the second substrate 120 is formed by mixing the material of the first base 200 and the material of the second base 300 in a mass ratio of one to one, the third substrate 130 is formed by mixing a material of the first base 200 and a material of the second base 300 in a mass ratio of one to two, the fourth substrate 140 is formed by mixing the material of the first base 200 and the material of the second base 300 in a two-to-one mass ratio, the fifth substrate 150 is formed by mixing the material of the first base 200 and the material of the second base 300 in a mass ratio of one to one, the sixth substrate 160 is formed by mixing a material of the first base 200 and a material of the second base 300 in a mass ratio of one to two.

Specifically, since the first substrate 110, the second substrate 120, the third substrate 130, the fourth substrate 140, the fifth substrate 150, and the sixth substrate 160 are formed by mixing the first base 200 and the second base 300 according to a certain mass ratio, when the elastic base 10 is prepared, the elastic base 10 has a gradually changing tensile modulus, and a break is gentle during stretching, which is helpful for protecting the elastic base 10 and improving the stretching performance of the elastic base 10.

In one embodiment, the method further includes step S109: a third base 400 is formed overlying the sixth substrate 160. Referring to fig. 30, the base material 100 includes a first base 200, a first substrate 110, a second substrate 120, a third substrate 130, a second base 300, a fourth substrate 140, a fifth substrate 150, a sixth substrate 160, and a third base 400, which are sequentially stacked. The stretch ratio of the first base 200 is greater than that of the first substrate 110, the stretch ratio of the first substrate 110 is greater than that of the second substrate 120, the stretch ratio of the second substrate 120 is greater than that of the third substrate 130, the stretch ratio of the third substrate 130 is greater than that of the second base 300, the stretch ratio of the second base 300 is less than that of the fourth substrate 140, the stretch ratio of the fourth substrate 140 is less than that of the fifth substrate 150, the stretch ratio of the fifth substrate 150 is less than that of the sixth substrate 160, and the stretch ratio of the sixth substrate 160 is less than that of the third base 400. In a preferred embodiment, the stretching ratio of the first base 200 is consistent with that of the third base 400, so that the stretching ratio of the base material 100 is more uniform.

In another embodiment, the stretch ratios of the first substrate 110, the second substrate 120, the third substrate 130, the fourth substrate 140, the fifth substrate 150, and the sixth substrate 160 are all constant values, the stretch ratio of the first substrate 110 is greater than the stretch ratio of the second substrate 120, the stretch ratio of the second substrate 120 is greater than the stretch ratio of the third substrate 130, the stretch ratio of the third substrate 130 is equal to the stretch ratio of the fourth substrate 140, the stretch ratio of the fourth substrate 140 is less than the stretch ratio of the fifth substrate 150, and the stretch ratio of the fifth substrate 150 is less than the stretch ratio of the sixth substrate 160.

Specifically, the stretch ratios of the first substrate 110, the second substrate 120, the third substrate 130, the fourth substrate 140, the fifth substrate 150, and the sixth substrate 160 are each a constant value, the stretch ratios of the first substrate 110, the second substrate 120, and the third substrate 130 gradually decrease, and the stretch ratios of the fourth substrate 140, the fifth substrate 150, and the sixth substrate 160 gradually increase. The elastic base 10 is prepared by using the first substrate 110, the second substrate 120, the third substrate 130, the fourth substrate 140, the fifth substrate 150 and the sixth substrate 160 with a constant stretch ratio, so that the preparation process of the elastic base 10 can be simplified, the stress distribution of the elastic base 10 can be optimized, and the service life of the elastic base 10 can be prolonged.

In still another embodiment, the stretch ratios of the first substrate 110, the second substrate 120, and the third substrate 130 are gradually decreased, and the stretch ratios of the fourth substrate 140, the fifth substrate 150, and the sixth substrate 160 are gradually increased from the first base 200 toward the third base 400.

Specifically, the stretch ratios of the first substrate 110, the second substrate 120, the third substrate 130, the fourth substrate 140, the fifth substrate 150, and the sixth substrate 160 are changed values. In a direction from the first base 200 toward the third base 400, the stretch ratios of the first substrate 110, the second substrate 120, and the third substrate 130 gradually decrease, and the stretch ratios of the fourth substrate 140, the fifth substrate 150, and the sixth substrate 160 gradually increase.

Further, the stretch ratios of the first substrate 110, the second substrate 120, the third substrate 130, the fourth substrate 140, the fifth substrate 150, and the sixth substrate 160 show a linear change, and at this time, when the elastic base 10 is prepared by using the first substrate 110, the second substrate 120, the third substrate 130, the fourth substrate 140, the fifth substrate 150, and the sixth substrate 160, the stretch break generated by the elastic base 10 is smaller, which is helpful for protecting the elastic base 10 and improving the stretch performance of the elastic base 10.

In yet another embodiment, the first substrate 110 and the sixth substrate 160 are symmetrically disposed about the second base 300, the second substrate 120 and the fifth substrate 150 are symmetrically disposed about the second base 300, and the third substrate 130 and the fourth substrate 140 are symmetrically disposed about the second base 300. At this time, when the elastic substrate 10 is under the action of the tensile force, the elastic substrate 10 is stressed more uniformly, which is helpful to improve the stress distribution of the elastic substrate 10, avoid the problem of failure of the elastic substrate 10, and prolong the service life of the elastic substrate 10.

With continued reference to fig. 31, the substrate 10 is cut in the thickness direction to obtain the independent elastic base 100.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily made by those skilled in the art within the technical scope of the present invention will be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

A method of making an elastic substrate, comprising:

providing a base material, wherein the base material comprises a first base, a second base and a third base which are sequentially stacked along a preset direction, the stretching rate of the first base is greater than that of the second base, and the stretching rate of the third base is greater than that of the second base;

and cutting the base material along the preset direction to obtain an elastic base with a preset size, wherein the elastic base comprises the first base, the second base and the third base.
The method of making an elastic base according to claim 1, wherein the predetermined direction is a lamination direction of the base material.
The method of claim 1, wherein providing a base material comprising a first base, a second base, and a third base in a stacked arrangement in that order comprises:

providing a first substrate;

forming a second substrate covering the first substrate;

and forming a third substrate covering the second substrate.
The method of making an elastic substrate according to claim 3, wherein the first substrate comprises a first sub-substrate and a second sub-substrate,

the "providing a first substrate" comprises:

providing a first sub-substrate;

forming a second sub-substrate covering the first sub-substrate;

the "forming a second substrate covering the first substrate" includes:

and forming a second substrate covering the second sub-substrate.
The method of making an elastic substrate according to claim 1, wherein the first substrate and the third substrate are the same material.
The method of making an elastic substrate according to claim 5, wherein the elongation profiles of the first substrate and the third substrate are symmetrically disposed about the second substrate.
The method of claim 1, wherein the elongation of the first substrate, the elongation of the second substrate, and the elongation of the third substrate are all constant values.
A method of making an elastic substrate according to claim 1, wherein from the first substrate in a direction toward the third substrate: the stretching ratio of the first substrate is gradually reduced, the stretching ratio of the second substrate is reduced and then increased, and the stretching ratio of the third substrate is gradually increased.
The method of making an elastic base of claim 1, wherein the base material further comprises a fourth base and a fifth base, and wherein providing the base material comprises:

providing a first substrate;

forming a fourth substrate covering the first substrate;

forming a second substrate covering the fourth substrate;

forming a fifth substrate covering the second substrate;

and forming a third substrate covering the fifth substrate.
The method of claim 9, wherein the elongation of the first substrate is greater than the elongation of the fourth substrate, the elongation of the fourth substrate is greater than the elongation of the second substrate, the elongation of the second substrate is less than the elongation of the fifth substrate, and the elongation of the fifth substrate is less than the elongation of the third substrate.
The method of making an elastic substrate according to claim 10, wherein the fourth substrate has a stretch ratio that is less than half of the stretch ratio of the first substrate.
The method of making an elastic substrate according to claim 9, wherein the first substrate, the fourth substrate, the second substrate, the fifth substrate, and the third substrate are homologs.
The method of making an elastic substrate according to claim 9, wherein the first substrate and the third substrate are the same material and the fourth substrate and the fifth substrate are the same material.
The method of claim 9, wherein the fourth substrate is formed by mixing the material of the first substrate and the material of the second substrate, and the fifth substrate is formed by mixing the material of the first substrate and the material of the second substrate.
The method of claim 14, wherein the fourth substrate is formed by mixing a material of the first substrate and a material of the second substrate in a mass ratio of one to one, and the fifth substrate is formed by mixing a material of the first substrate and a material of the second substrate in a mass ratio of one to one.
The method of making an elastic base according to claim 1, wherein the base further comprises a first substrate, a second substrate, a third substrate, a fourth substrate, a fifth substrate, and a sixth substrate, and wherein providing the base comprises:

providing a first substrate;

forming a first substrate covering the first base;

forming a second substrate covering the first substrate;

forming a third substrate covering the second substrate;

forming a second base covering the third substrate;

forming a fourth substrate covering the second base;

forming a fifth substrate covering the fourth substrate;

and forming a sixth substrate covering the fifth substrate.
The method of claim 16, wherein the first substrate, the second substrate, the third substrate, the fourth substrate, the fifth substrate, and the sixth substrate are formed by mixing a material of the first substrate and a material of the second substrate.
The method of manufacturing an elastic base according to claim 17, wherein the first substrate is formed by mixing a material of the first base and a material of the second base at a mass ratio of two to one, the second substrate is formed by mixing the material of the first substrate and the material of the second substrate according to a mass ratio of one to one, the third substrate is formed by mixing the material of the first substrate and the material of the second substrate according to a mass ratio of one to two, the fourth substrate is formed by mixing the material of the first substrate and the material of the second substrate according to a mass ratio of two to one, the fifth substrate is formed by mixing the material of the first substrate and the material of the second substrate according to a mass ratio of one to one, the sixth substrate is formed by mixing the material of the first substrate and the material of the second substrate according to a mass ratio of one to two.
The method of claim 16, wherein the stretch ratios of the first substrate, the second substrate, the third substrate, the fourth substrate, the fifth substrate, and the sixth substrate are all constant values, wherein the stretch ratio of the first substrate is greater than the stretch ratio of the second substrate, wherein the stretch ratio of the second substrate is greater than the stretch ratio of the third substrate, wherein the stretch ratio of the third substrate is equal to the stretch ratio of the fourth substrate, wherein the stretch ratio of the fourth substrate is less than the stretch ratio of the fifth substrate, and wherein the stretch ratio of the fifth substrate is less than the stretch ratio of the sixth substrate.
The method of manufacturing an elastic base according to claim 16, wherein the stretch ratios of the first substrate, the second substrate, and the third substrate are gradually decreased, and the stretch ratios of the fourth substrate, the fifth substrate, and the sixth substrate are gradually increased, in a direction from the first base toward the third base.