CN112782812B

CN112782812B - Optical module

Info

Publication number: CN112782812B
Application number: CN201911080962.1A
Authority: CN
Inventors: 郑龙; 杨思更
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2019-11-07
Filing date: 2019-11-07
Publication date: 2023-08-04
Anticipated expiration: 2039-11-07
Also published as: CN117148517A; CN112782812A

Abstract

The invention discloses an optical module, which comprises a circuit board, a silicon optical chip, a light source and a control chip, wherein the silicon optical chip, the light source and the control chip are arranged on the circuit board, and emergent light generated by the light source is transmitted into the silicon optical chip through a third optical fiber. An exit optical waveguide in the silicon optical chip is used for transmitting an exit optical signal modulated by the exit light from the third optical fiber; the optical power monitoring unit is connected with the emergent optical waveguide through the monitoring optical waveguide and is used for receiving emergent optical signals transmitted by the emergent optical waveguide and monitoring the optical power; the optical power monitoring unit is connected with the control chip, and the control chip is used for receiving the monitoring data of the optical power monitoring unit so as to determine whether the coupling connection of the silicon optical chip and the optical fiber ribbon meets the requirement. Therefore, the optical module provided by the invention is characterized in that the optical power monitoring unit is additionally arranged in the silicon optical chip, the optical power monitoring unit is used for monitoring the power of the emergent optical signal, and the coupling effect of the silicon optical chip and the third optical fiber can be accurately determined according to the monitoring data, so that the detection process of the optical module is simplified.

Description

Optical module

Technical Field

The invention relates to the technical field of optical fiber communication, in particular to an optical module.

Background

Optical modules are an important product in the optical communications industry, which implement the interconversion between optical signals and telecommunications, provide optical signals transmitted in optical fibers, and provide electrical signals transmitted in electronic devices.

Existing light modules may generally include: the optical fiber band can input optical signals to the silicon optical chip and can also receive optical signals output by the silicon optical chip. However, because the diameter of the optical fiber ribbon is too small, when the optical fiber ribbon is in butt joint with the silicon optical chip, the coupling effect of the optical module is very easy to be poor because the optical fiber ribbon cannot be in accurate butt joint.

Therefore, the coupling connection of the silicon optical chip and the optical fiber ribbon directly determines whether the optical module can be normally used. Therefore, at present, before the optical module is prepared and shipped, the optical module needs to be detected to determine whether the coupling connection between the silicon optical chip and the optical fiber ribbon in the optical module meets the requirement.

At present, a detection method is generally adopted, namely, an optical module is applied to an actual working scene, whether the coupling connection between a silicon optical chip and an optical fiber ribbon in the optical module meets the requirement is determined by detecting whether the optical module can work normally or not, and the detection process of the detection method is complex.

Disclosure of Invention

The invention provides an optical module to solve the problem that the existing method is complex in detection process of the optical module.

The invention provides an optical module, comprising:

the circuit board is provided with a power supply circuit and a signal circuit and is used for power supply and signal electric connection;

the light source is arranged on the circuit board, is connected with a power supply circuit of the circuit board and is used for generating emergent light transmitted by the third optical fiber;

one end of the third optical fiber is coupled with the silicon optical chip, and the other end of the third optical fiber is connected with a light source and is used for transmitting emergent light generated by the light source into the silicon optical chip;

the control chip is arranged on the circuit board, connected with the optical power monitoring unit of the silicon optical chip and used for receiving monitoring data of the optical power monitoring unit;

the silicon optical chip is arranged on the circuit board, one end of the silicon optical chip is connected with a signal circuit of the circuit board, and the other end of the silicon optical chip is connected with the third optical fiber and is used for receiving emergent light generated by the light source through the third optical fiber;

the silicon optical chip includes:

the light inlet of the incident light waveguide is connected with the third optical fiber and is used for receiving emergent light generated by the light source through the third optical fiber;

the optical power modulation unit is connected with the light outlet of the incident optical waveguide at one end and is used for carrying out optical power modulation on emergent light propagating in the incident optical waveguide to obtain an emergent light signal;

The emergent light waveguide is connected with the optical power modulation unit and is used for receiving the emergent light signal and emitting the emergent light signal;

one end of the monitoring optical waveguide is connected with the emergent optical waveguide and is used for receiving emergent light which is split by the emergent optical waveguide according to the light splitting proportion;

and one end of the optical power monitoring unit is connected with the control chip, and the other end of the optical power monitoring unit is connected with the monitoring optical waveguide and is used for carrying out optical power monitoring on the emergent optical signal transmitted by the monitoring optical waveguide.

As can be seen from the above technical solutions, the optical module provided by the embodiments of the present invention includes a circuit board, and a silicon optical chip, a light source and a control chip that are disposed on the circuit board, where the light source is connected with a signal circuit of the circuit board and is used for generating emergent light; the silicon optical chip is coupled with one end of the third optical fiber, the other end of the third optical fiber is connected with a light source, and emergent light generated by the light source propagates into the silicon optical chip through the third optical fiber. The silicon optical chip comprises an incident optical waveguide, an optical power modulation unit, an emergent optical waveguide and an optical power monitoring unit, wherein the incident optical waveguide receives emergent light from the third optical fiber, and the emergent light propagates into the optical power modulation unit to carry out optical power modulation so as to obtain an emergent optical signal. The emergent light waveguide is used for receiving and emitting emergent light signals; the optical power monitoring unit is connected with the emergent optical waveguide through the monitoring optical waveguide and is used for receiving emergent optical signals which are separated by the emergent optical waveguide according to the light splitting proportion and carrying out optical power monitoring on the emergent optical signals; the optical power monitoring unit is connected with the control chip, and the control chip is used for receiving the monitoring data of the optical power monitoring unit so as to determine whether the coupling connection of the silicon optical chip and the optical fiber ribbon meets the requirement. Therefore, the optical module provided by the invention can detect the coupling effect of the silicon optical chip and the third optical fiber in the light emission process, namely, the optical power monitoring unit is additionally arranged in the silicon optical chip, the optical power monitoring unit is used for monitoring the power of the emergent optical signal, and the coupling effect of the silicon optical chip and the third optical fiber can be accurately determined according to the monitoring data, so that the detection process of the optical module is simplified.

Drawings

In order to more clearly illustrate the technical solution of the present invention, the drawings that are needed in the embodiments will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.

FIG. 1 is a schematic diagram of the connection relationship of an optical communication terminal;

fig. 2 is a schematic diagram of an optical network unit structure;

fig. 3 is a schematic diagram of an overall structure of an optical module according to an embodiment of the present invention;

fig. 4 is an exploded view of an optical module according to an embodiment of the present invention;

fig. 5 is a schematic diagram of an internal structure of an optical module according to an embodiment of the present invention;

FIG. 6 is an overall optical path diagram of a silicon optical chip according to an embodiment of the present invention;

FIG. 7 is a modulated light path diagram of a silicon optical chip according to an embodiment of the present invention;

FIG. 8 is a circuit diagram of a connection between a control chip and an optical power monitoring unit according to an embodiment of the present invention;

FIG. 9 is a schematic diagram of a silicon optical chip according to an embodiment of the present invention;

FIG. 10 is a schematic diagram of a control chip connected to a plurality of optical power monitoring units according to an embodiment of the present invention;

FIG. 11 is another circuit diagram of a connection between a control chip and an optical power monitoring unit according to an embodiment of the present invention;

Fig. 12 is another optical path diagram of a control chip connected to a plurality of optical power monitoring units according to an embodiment of the present invention.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

One of the key links of optical fiber communication is the mutual conversion of optical signals and electric signals. The optical fiber communication uses the optical signal carrying information to transmit in the information transmission equipment such as optical fiber/optical waveguide, and the information transmission with low cost and low loss can be realized by utilizing the passive transmission characteristic of the light in the optical fiber/optical waveguide; in order to establish an information connection between an information transmission device such as an optical fiber and an information processing device such as a computer, it is necessary to perform interconversion between an electric signal and an optical signal.

The optical module realizes the function of the mutual conversion of the optical signal and the electric signal in the technical field of optical fiber communication, and the mutual conversion of the optical signal and the electric signal is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the golden finger has become the mainstream connection mode of the optical module industry, and on the basis of the main connection mode, the definition of pins on the golden finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes interconnection among the optical network unit 100, the optical module 200, the optical fiber 101 and the network cable 103;

one end of the optical fiber 101 is connected with a remote server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network unit 100 with the optical module 200.

The optical port of the optical module 200 is externally connected to the optical fiber 101, and bidirectional optical signal connection is established with the optical fiber 101; the electric port of the optical module 200 is externally connected into the optical network unit 100, and bidirectional electric signal connection is established with the optical network unit 100; the method comprises the steps that the mutual conversion of optical signals and electric signals is realized inside an optical module, so that information connection is established between an optical fiber and an optical network unit; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input to the optical fiber. The optical module 200 is a tool for realizing photoelectric signal conversion, and has no function of processing data, and in the photoelectric conversion process, only the transmission carrier changes the information, and the information does not change.

The optical network unit 100 has an optical module interface 102 for accessing the optical module 200 and establishing bidirectional electrical signal connection with the optical module 200; the optical network unit 100 has a network cable interface 104 for accessing the network cable 103 and establishing bidirectional electrical signal connection with the network cable 103; the optical module 200 and the network cable 103 are connected through the optical network unit 100, specifically, the optical network unit 100 transmits a signal from the optical module 200 to the network cable 103, and transmits a signal from the network cable 103 to the optical module 200, and the optical network unit 100 monitors the operation of the optical module as an upper computer of the optical module 200. Unlike optical modules, the optical network unit 100 has a certain information processing capability.

To this end, the remote server establishes a bidirectional signal transmission channel with the local information processing device through the optical fiber 101, the optical module 200, the optical network unit 100 and the network cable 103.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network unit 100 is an upper computer of an optical module, which provides data signals to the optical module and receives data signals from the optical module, and an optical line terminal and the like are common to the upper computer of the optical module.

Fig. 2 is a schematic diagram of an optical network unit structure. As shown in fig. 2, there is a circuit board 105 in the optical network unit 100, and a cage 106 is provided on the surface of the circuit board 105; an electrical connector is arranged in the cage 106 and is used for accessing an optical module electrical port such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as fins that increase a heat dissipation area.

The optical module 200 is inserted into the optical network unit 100, specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106, and the optical port of the optical module 200 is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board 105, and the electrical connector on the circuit board 105 is wrapped in the cage 106, so that the cage 106 is internally provided with the electrical connector; the light module 200 is inserted into the cage 106, the light module 200 is fixed by the cage 106, and heat generated by the light module 200 is conducted to the cage 106 and then diffused through the heat sink 107 on the cage 106.

Fig. 3 is a schematic diagram of an overall structure of an optical module according to an embodiment of the present invention; fig. 4 is an exploded view of an optical module according to an embodiment of the present invention; fig. 5 is a schematic diagram of an internal structure of an optical module according to an embodiment of the present invention.

Referring to fig. 3 and 4, an optical module according to an embodiment of the present invention is different from the optical module structure according to the foregoing embodiment in that in this embodiment, the silicon optical chip 400 replaces the optical transceiver to implement the photoelectric conversion of the optical module. Specifically, the optical module provided in this embodiment includes: the upper case 201, the lower case 202, the unlocking handle 203, the circuit board 300, the silicon optical chip 400, the optical fiber ribbon 500, the light source 600, the control chip 700, and the third optical fiber 503, wherein the upper case 201 and the lower case 202 form a package cavity having two openings (204, 205), and the circuit board 300, the silicon optical chip 400, and the optical fiber ribbon 500 are all located in the package cavity.

The outer contour of the wrapping cavity generally presents a square shape, specifically, the lower housing 202 includes a main board and two side boards located at two sides of the main board and arranged perpendicular to the main board; the upper shell 201 comprises a cover plate which is covered on two side plates of the upper shell 201 to form a wrapping cavity; the upper case 201 may further include two sidewalls disposed at both sides of the cover plate and perpendicular to the cover plate, and the two sidewalls are combined with the two side plates to realize the covering of the upper case 201 on the lower case 202.

The two openings can be two ends openings (204, 205) in the same direction or two openings in different directions; one of the openings is an electric port 204, and a golden finger of the circuit board 300 extends out of the electric port 204 and is inserted into an upper computer such as an optical network unit; the other opening is an optical port 205 (optical interface 205) for the optical fiber ribbon 500 to access for connection to the silicon optical chip 400 inside the optical module.

The assembly mode of combining the upper shell 201 and the lower shell 202 is adopted, so that devices such as a circuit board 300, a silicon optical chip 400 and the like can be conveniently installed in the shell, and the upper shell 201 and the lower shell 202 form an encapsulation protection shell of the outermost layer of the optical module; the upper shell 201 and the lower shell 202 are generally made of metal materials, so that electromagnetic shielding and heat dissipation are facilitated; the housing of the optical module is not generally made into an integral structure, so that the positioning component, the heat dissipation and the electromagnetic shielding structure cannot be installed when devices such as a circuit board are assembled, and the production automation is not facilitated.

The circuit board 300 has a power supply circuit and a signal circuit for power supply and signal electrical connection. An optical interface 205 is disposed at one end of the circuit board 300, the optical interface 205 is used as an optical port of the optical module, and one end of the circuit board 300 is used as an electrical port 204 of the optical module, where the optical port is opposite to the electrical port 204. The optical interface 205 is configured to receive an optical signal converted from an electrical signal of the circuit board 300, and transmit the optical signal, and send the electrical signal converted to the circuit board 300. One end of the optical interface 205 is provided with an optical port plug 206, and the optical port plug 206 is connected with the optical interface 205 in an embedded way and is used for playing a sealing role when the optical module is not used, so that dust pollution caused by long-time exposure is avoided. The optical plug 206 can be made of rubber, has flexibility and can achieve a good sealing effect.

The unlocking handle 203 is located on the outer wall of the packaging cavity/lower housing 202, and is used for realizing the fixed connection between the optical module and the upper computer, or releasing the fixed connection between the optical module and the upper computer.

The unlocking handle 203 is provided with a clamping structure matched with the upper computer cage; pulling the end of the unlocking handle can relatively move the unlocking handle on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping structure of the unlocking handle; by pulling the unlocking handle, the clamping structure of the unlocking handle moves along with the unlocking handle, so that the connection relation between the clamping structure and the upper computer is changed, the clamping relation between the optical module and the upper computer is relieved, and the optical module can be pulled out of the cage of the upper computer.

The circuit board 300 is provided with circuit wiring, electronic components (such as capacitor, resistor, triode, MOS tube) and chips (such as MCU, laser driving chip, limiting amplifying chip, clock data recovery CDR, power management chip, data processing chip DSP), etc.

The circuit board connects the electric devices in the optical module together according to the circuit design through the circuit wiring so as to realize the electric functions of power supply, electric signal transmission, grounding and the like.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear chips; when the optical transceiver is positioned on the circuit board, the hard circuit board can provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, specifically, a metal pin/golden finger is formed on the surface of one side tail end of the hard circuit board and is used for being connected with the electric connector; these are all inconvenient to implement with flexible circuit boards.

A flexible circuit board is also used in part of the optical modules and is used as a supplement of the hard circuit board; the flexible circuit board is generally used in cooperation with the hard circuit board, for example, the hard circuit board and the optical transceiver can be connected by using the flexible circuit board.

The optical transceiver comprises an optical transmitting component and an optical receiving component, which are respectively used for realizing the transmission of optical signals and the reception of the optical signals. The light emitting member and the light receiving member may be combined together or may be independent of each other. The light emitting component and the light receiving component provided by the embodiment of the application are combined together to form an optical transceiver integrated structure.

In order to realize photoelectric conversion of the optical module, a silicon optical chip 400 is disposed on the circuit board 300, and the silicon optical chip 400 can modulate the light source 600 according to the emergent light generated by the power supply circuit and the signal circuit of the circuit board 300 to obtain an emergent light signal meeting the requirement and send the emergent light signal to the optical interface 205, and modulate the optical signal from the optical interface 205 to obtain an electrical signal and send the electrical signal to the circuit board 300, so that the optical module can be used as an optical transceiver integrated piece to realize conversion of the photoelectric signal. One end of the silicon optical chip 400 is connected to the signal circuit of the circuit board 300, and the other end of the silicon optical chip 400 is connected to the optical interface 205 through the optical fiber ribbon 500. In performing photoelectric conversion, the silicon optical chip 400 is used to transmit optical signals to the optical interface 205 through the optical fiber ribbon 500 and to receive optical signals from the optical interface 205 through the optical fiber ribbon 500.

One end of the optical fiber ribbon 500 is coupled to the silicon optical chip 400, and the other end of the optical fiber ribbon 500 is connected to the optical interface 205 for transmitting and receiving optical signals. To this end, the optical fiber ribbon 500 may include two sets of optical fibers, i.e., a first optical fiber 501 and a second optical fiber 502, where the first optical fiber 501 enables the optical signal modulated by the silicon optical chip 400 to propagate to the optical interface 205, and the second optical fiber 502 enables the optical signal from the optical interface 205 to propagate to the silicon optical chip 400, where the optical signal is modulated to form an electrical signal and sent to the circuit board 300.

Specifically, as shown in FIG. 5, the optical fiber ribbon 500 includes: the first optical fiber 501 and the second optical fiber 502 are arranged in parallel, one end of the first optical fiber 501 is coupled with the light outlet 405 of the silicon optical chip 400, the other end of the first optical fiber 501 is connected with the optical interface 205, and the first optical fiber 501 is used for receiving the emergent light signal modulated by the silicon optical chip 400 and transmitting into the optical interface 205. One end of the second optical fiber 502 is coupled to the light receiving port 406 of the silicon optical chip 400, the other end of the second optical fiber 502 is connected to the optical interface 205, the second optical fiber 502 is configured to receive a received optical signal sent by the optical interface 205, and the received optical signal is modulated by the silicon optical chip 400 to obtain an electrical signal and sent to the circuit board 300.

The silicon optical chip 400 is used for realizing light modulation so that the power of an optical signal meets the use requirement of an optical module, but the silicon optical chip 400 cannot emit light, and in the light emission process, an external light source is required to be utilized for realizing the emission of the optical signal. For this purpose, the optical module provided in this embodiment further includes a light source 600, where the light source 600 is disposed on the circuit board 300 and connected to a power supply circuit of the circuit board 300 for generating outgoing light. The light source 600 is connected with the silicon optical chip 400 through a third optical fiber 503, one end of the third optical fiber 503 is coupled with the silicon optical chip 400, the other end of the third optical fiber 503 is connected with the light source 600, and outgoing light generated by the light source 600 enters the silicon optical chip 400 through the third optical fiber 503.

The light source 600 is internally packaged with a laser chip, in the light emission process, the circuit board 300 supplies power to the light source 600, the light source 600 is driven to generate emergent light, the silicon optical chip 400 receives the emergent light generated by the light source 600 through the third optical fiber 503, the emergent light is modulated to obtain an emergent light signal, the light power of the emergent light signal meets the light requirement of the optical module, and the modulated light signal is sent to the optical interface 205 through the first optical fiber 501. The number of the laser chips arranged in the light source 600 may be multiple, and the specific number of the laser chips may be determined according to the use requirement of the optical module, that is, according to the optical path setting of the modulated light of the silicon optical chip 400, if the silicon optical chip 400 can realize the modulation of three paths of incident light and four paths of emergent light, the laser chips need to be three, and the light emitted by each laser chip enters the corresponding incident optical waveguide in the silicon optical chip 400.

FIG. 6 is an overall optical path diagram of a silicon optical chip according to an embodiment of the present invention; fig. 7 is a modulated light path diagram of a silicon optical chip according to an embodiment of the present invention. Referring to fig. 6 and 7, in order to implement modulation of an optical signal, a silicon optical chip 400 provided in this embodiment includes: an incident optical waveguide 401, an optical power monitoring unit 402, an optical power modulating unit 403, a monitoring optical waveguide 407, and an exit optical waveguide 404.

The light inlet of the incident light waveguide 401 is connected to the light source 600 through the third optical fiber 503, and the incident light waveguide 401 is used for receiving the outgoing light generated by the light source 600 through the third optical fiber 503. The number of the incident light waveguides 401 may be plural, and at this time, the number of the light inlets of the silicon optical chip 400 is plural, so that the number of the incident light waveguides 401, the number of the laser chips, and the number of the light inlets are the same to ensure efficient transmission of light. That is, each incident optical waveguide 401 is connected to a corresponding laser chip through a corresponding light inlet and a third optical fiber 503, so that the outgoing light emitted by each laser chip in the light source 600 can enter the corresponding incident optical waveguide 401 to continue to propagate.

The optical power modulation unit 403 is a device for implementing optical modulation of the silicon optical chip 400, one end of the optical power modulation unit 403 is connected to an optical outlet of the incident optical waveguide 401, and the optical power modulation unit 403 is configured to perform optical power modulation on the outgoing light propagated by the incident optical waveguide 401 according to a signal circuit of the circuit board, so as to obtain an outgoing optical signal.

One end of the outgoing optical waveguide 404 is connected to the other end of the optical power modulation unit 403, the outgoing optical waveguide 404 is used for emitting an outgoing optical signal modulated by the optical power modulation unit 403, the other end of the outgoing optical waveguide 404 is connected to the optical fiber ribbon 500, and the outgoing optical signal enters the optical fiber ribbon 500 through the outgoing optical waveguide 404 and is emitted. Specifically, the outgoing optical waveguide 404 is connected to the first optical fiber 501, and the outgoing optical signal enters the first optical fiber 501 after passing through the outgoing optical waveguide 404, and propagates into the optical interface 205 by the first optical fiber 501.

In order to ensure that the optical power modulation unit 403 can modulate three beams of outgoing light to obtain four paths of outgoing light signals, in this embodiment, the optical power modulation unit 403 includes: a light splitting unit group 4031, a modulating unit group 4032, and a light combining unit group 4033.

One end of the light-splitting unit group 4031 is connected to the incident light waveguide 401, and splits the outgoing light propagating through the incident light waveguide 401. Since the outgoing light propagating through the incident light waveguide 401 is emitted by the light source 600, when the optical power modulating unit 403 modulates the outgoing light to obtain an optical signal meeting the optical power requirement, the optical power of the outgoing light entering the optical power modulating unit 403 has a certain requirement, and cannot be higher than the upper threshold limit or lower than the lower threshold limit. Therefore, to ensure that the light power of the outgoing light entering the light power modulation unit 403 meets the modulation requirement, the light splitting unit group 4031 is used to split and combine the multiple beams of light emitted by the light source 600, so as to complement the light power of a certain outgoing light. For example, the light source 600 emits three light beams, and the three light beams enter the corresponding incident light waveguides (4011, 4012, 4013) through the three light inlets (L0, L1, L2), and as the light power of the three light beams may not meet the light power requirement, the three light beams need to be split into two light beams, and the light in the light inlet L1 is split by the light splitting unit 1 (the light splitting unit 1 in fig. 7) and then is combined into the outgoing light in the light inlets L0 and L2, so as to reinforce the light power of the outgoing light in the light inlets L0 and L2.

One end of the modulation unit group 4032 is connected to the other end of the light splitting unit group 4031 through the first optical waveguide group, and the modulation unit group 4032 is configured to perform optical power modulation on the emitted light after the light splitting unit group 4031 is split according to the signal circuit of the circuit board, so as to obtain a modulated optical signal. The number of the modulation unit groups 4032 is related to the number of optical signals that the silicon optical chip 400 needs to output, and if the silicon optical chip 400 needs to emit four optical signals, the modulation unit groups 4032 need to be provided with four groups.

The modulation unit group 4032 includes two modulation circuits, one of which is provided with a phase converter and a modulator, and the other of which is provided with only the modulator, and the phase converter is connected with the modulator through an optical waveguide. In order to ensure that the optical power of the optical signal in the modulation unit group 4032 meets the modulation requirement, before entering the modulation unit group 4032, the optical splitting unit group 4031 needs to be utilized for optical splitting. As shown in fig. 7, the light-splitting unit group 4031 includes seven light-splitting units, and the light-splitting ratio of each light-splitting unit is 1:1. The light splitting unit 1 is configured to split the outgoing light in the second incident light waveguide 4012. One end of the first incident optical waveguide 4011 is provided with a spectroscopic unit 2 (spectroscopic unit 2 in fig. 7), the spectroscopic unit 2 and the spectroscopic unit 1 are connected by an optical waveguide, and the spectroscopic unit 1 supplements a part of the light after the spectroscopic treatment to the first incident optical waveguide 4011 through a corresponding optical waveguide. One end of the third incident light guide 4013 is provided with a light splitting unit 3 (light splitting 3 in fig. 7), the light splitting unit 1 and the light splitting unit 3 are connected by light guides, and the light splitting unit 1 supplements another part of light after the light splitting treatment into the third incident light guide 4013 by corresponding light guides.

The other end of the light-splitting unit 2 is connected with two light waveguides, wherein the other end of one light waveguide is connected with a light-splitting unit 4 (light-splitting unit 4 in fig. 7), and the other end of the other light waveguide is connected with a light-splitting unit 5 (light-splitting unit 5 in fig. 7); the other end of the light-splitting unit 3 is connected to two light guides, one of which has the other end connected to the light-splitting unit 6 (light-splitting unit 6 in fig. 7) and the other end connected to the light-splitting unit 7 (light-splitting unit 7 in fig. 7), so that three paths of outgoing light are split into four paths of light signals by seven light-splitting units. The other ends of the light splitting unit 4, the light splitting unit 5, the light splitting unit 6 and the light splitting unit 7 are respectively connected with one modulation unit group 4032, and four groups of modulation unit groups 4032 respectively modulate four paths of optical signals so as to obtain four paths of optical signals meeting the optical power requirement.

In order to obtain the optical signal of the optical power required by the optical module, two paths of modulation circuits are built in the modulation unit group 4032, so that the optical splitting unit 4, the optical splitting unit 5, the optical splitting unit 6 and the optical splitting unit 7 respectively perform optical splitting again, that is, two optical waveguides are respectively connected to the other ends of the optical splitting unit 4, the optical splitting unit 5, the optical splitting unit 6 and the optical splitting unit 7, one path of optical waveguide is connected to the phase converter and the modulator, and the other path of optical waveguide is connected to the modulator. The modulation unit group 4032 may adopt an MZ (mach-zehnder) modulator, and the modulation principle thereof may be that two paths of modulation circuits generate optical interference effects, so that two paths of light generate phase differences, and a high-speed modulated optical signal, that is, an outgoing optical signal meeting the optical power requirement, is obtained after superposition.

In this embodiment, the light combining unit group 4033 is used to superimpose two paths of light, so as to obtain an outgoing light signal. One end of the light combining unit group 4033 is connected to the other end of the modulating unit group 4032 through the second optical waveguide group, the other end of the light combining unit group 4033 is connected to the emitting optical waveguide 404, and the light combining unit group is used for combining the modulated optical signals to obtain emitting optical signals. The number of the light combining unit groups 4033 is the same as the number of the modulation unit groups 4032, and the number of the light combining unit groups is related to several paths of light signals output by the silicon optical chip 400. In the case that the silicon optical chip 400 needs to output four optical signals, four groups (four light combining units) of the light combining unit groups 4033 are also provided, and each of the light combining unit groups 4033 is correspondingly connected to one of the modulation unit groups 4032. Since two paths of modulation circuits are arranged in the modulation unit group 4032, for light superposition, the light combining unit group 4033 is connected with the modulation unit group 4032 through two paths of optical waveguides, that is, one end of the light combining unit group 4033 is connected with two optical waveguides, one optical waveguide is connected with the path of the modulation unit group 4032 provided with the phase converter and the modulator, and the other optical waveguide is connected with the path of the modulation unit group 4032 provided with the modulator only.

The other end of the light combining unit 4033 is connected to the output light waveguide 404, and the other end of the output light waveguide 404 is connected to the first optical fiber 501, so that the output light signal is the light signal meeting the light power requirement. The outgoing optical signal enters the first optical fiber 501 after passing through the outgoing optical waveguide 404, and the outgoing optical signal propagates into the optical interface 205 by the first optical fiber 501. The number of the light emitting waveguides 404 is the same as the number of the light combining unit groups 4033, and is related to several optical signals output from the silicon optical chip 400. In the case where the silicon optical chip 400 needs to output four optical signals, the output optical waveguides 404 are also provided in four groups. Specifically, the first outgoing optical waveguide 4041 is connected to the light combining unit 1 (light combining 1 in fig. 7), and the first outgoing optical signal TX0 generated through the light combining unit 1 propagates in the first outgoing optical waveguide 4041; the second outgoing optical waveguide 4042 is connected to the light combining unit 2 (light combining unit 2 in fig. 7), and the second outgoing optical signal TX1 generated by the light combining unit 2 propagates in the second outgoing optical waveguide 4042; the third outgoing optical waveguide 4043 is connected to the light combining unit 3 (light combining unit 3 in fig. 7), and the third outgoing optical signal TX2 generated by the light combining unit 3 propagates in the third outgoing optical waveguide 4043; the fourth output optical waveguide 4044 is connected to the light combining unit 4 (light combining unit 4 in fig. 7), and the fourth output optical signal TX3 generated by the light combining unit 4 propagates through the fourth output optical waveguide 4044. The four-way outgoing optical waveguide 404 propagates the corresponding outgoing optical signal into the first optical fiber 501, and the first optical fiber 501 propagates the four-way outgoing optical signal into the optical interface 205.

In the optical module provided in this embodiment, the silicon optical chip 400 is coupled to the third optical fiber 503 to implement photoelectric conversion in the light emission process, but because the diameter of the optical fiber is too small, when the third optical fiber 503 is docked with the silicon optical chip 400, the coupling effect of the optical module is very easy to be poor due to the fact that the third optical fiber 503 cannot be docked accurately. And, the outgoing light enters the silicon optical chip 400 to generate loss including optical waveguide loss, coupling loss, end face loss, etc., so that the optical power of the outgoing light signal is different from that of the outgoing light. Therefore, in order to ensure that the coupling effect between the silicon optical chip 400 and the third optical fiber 503 can be accurately represented according to the light power of the outgoing light and the modulated outgoing light signal, the outgoing light signal propagated by the outgoing light waveguide 404 needs to be subjected to power detection.

In order to perform power detection and monitoring of optical coupling effects on an output optical signal, as shown in fig. 6, an optical module provided in this embodiment is provided with an optical power monitoring unit 402 and a monitoring optical waveguide 407 in a silicon optical chip 400, where one end of the monitoring optical waveguide 407 is connected to an outgoing optical waveguide 404, and is configured to receive outgoing light split by the outgoing optical waveguide 404 according to a splitting ratio; one end of the optical power monitoring unit 402 is connected to the control chip 700, and the other end is connected to the outgoing optical waveguide 404 through the monitoring optical waveguide 407, so as to receive the outgoing optical signal propagating in the monitoring optical waveguide 407, perform optical power monitoring on the outgoing optical signal, and the outgoing optical signal for performing optical power monitoring is obtained by splitting the outgoing optical signal by the outgoing optical waveguide 404 according to a splitting ratio. The optical power monitoring unit 402 may optionally use a Monitoring Photodiode (MPD), and the optical power monitoring unit 402 includes a P-pole and an N-pole. The optical power monitoring unit 402 is connected to the outgoing optical waveguide 404, and when an outgoing optical signal propagates in the outgoing optical waveguide 404, the optical power monitoring unit 402 can receive a certain proportion of the optical signal to perform power monitoring.

The outgoing optical waveguide 404 is a main path, and the part connected with the optical power monitoring unit 402 is a branch path, that is, the monitoring optical waveguide 407 is a branch path, and the optical signal in the branch path accounts for 2% -5% of the optical signal in the main path. That is, the optical signal propagating in the outgoing optical waveguide 404, after reaching the junction of the branches, splits light with a split ratio of 2% -5% and propagates into the optical power monitoring unit 402 through the branches, and the optical power monitoring unit 402 performs power monitoring to determine whether the silicon optical chip 400 and the third optical fiber 503 are coupled in place. In splitting the optical signal into the branches, the optical power monitoring unit 402 may set the splitting ratio, for example, 2% -5%, so that only the optical signal meeting the ratio requirement is split into the branches to enter the optical power monitoring unit 402.

In order to ensure that the optical power monitoring unit 402 can detect that the silicon optical chip 400 and the third optical fiber 503 are coupled in place through monitoring, the optical module provided in this embodiment connects the silicon optical chip 400 to a control chip 700, and the control chip 700 is disposed on the circuit board 300 and connected to the optical power monitoring unit 402, and is configured to receive the monitoring data of the optical power monitoring unit 402, and perform analysis and calculation according to the monitoring data, and determine whether the monitored power reaches the maximum value, so as to determine whether the silicon optical chip 400 and the third optical fiber 503 are coupled in place. If the monitored power reaches the maximum value, it indicates that the silicon optical chip 400 and the third optical fiber 503 are coupled in place, and the maximum power refers to the optical power value corresponding to the optimal coupling of the optical module, that is, the optical power value corresponding to the optimal position of the silicon optical chip 400 and the third optical fiber 503 when the silicon optical chip 400 and the third optical fiber 503 are in butt joint.

Fig. 8 is a circuit diagram of a connection between a control chip and an optical power monitoring unit according to an embodiment of the present invention. As shown in fig. 5 and 8, to implement the optical power modulation unit 403 to monitor the reception of data, the control chip 700 includes: MCU701, first resistor 703, second resistor 704, filter capacitor 702, bias voltage and signal select chip 705. The control chip 700 is connected to the optical power monitoring unit 402, and the optical power monitoring unit 402 includes a P-pole (MPD-P in fig. 8) and an N-pole (MPD-N in fig. 8), and for this purpose, the MCU701 is connected to the P-pole of the optical power monitoring unit 402.

One end of the first resistor 703 (R1 in fig. 8) is connected to the N-pole of the optical power monitoring unit 402, and the other end of the first resistor 703 is connected to the bias voltage (VCC in fig. 8) to perform bias processing; one end of the signal selection chip 705 is connected with the P pole of the optical power monitoring unit 402, and the other end of the signal selection chip 705 is connected with the second resistor 704; the other end of the second resistor 704 is connected to one end of the filter capacitor 702 (C1 in fig. 8) to form a sampling circuit. The other end of the filter capacitor 702 is connected with the MCU701 through an analog-to-digital conversion interface (ADC in FIG. 8), data collected by the sampling circuit is sent to the MCU701, and is processed by the MCU701 to determine whether the silicon optical chip 400 and the third optical fiber 503 are coupled in place by judging whether the collected power reaches the maximum value. MCU701 can be selected from a single chip microcomputer.

In the present embodiment, the N-pole of the optical power monitoring unit 402 is connected to the bias voltage through the first resistor 703, but in other embodiments, the N-pole of the optical power monitoring unit 402 may be directly connected to the bias voltage. Both embodiments can realize the monitoring of the optical signal, and the difference is that the optical signal is worse when the power monitoring is performed by the scheme that the first resistor is not connected with the bias voltage.

Specifically, in another embodiment, the control chip 700 includes: MCU701, second resistor 704, signal select chip 705, bias voltage and filter capacitor 702.MCU701 is connected with the P pole of optical power monitoring unit 402; the N pole of the optical power monitoring unit 402 is connected with the bias voltage; one end of the signal selection chip 705 is connected with the P pole of the optical power monitoring unit 402, and the other end of the signal selection chip 705 is connected with the second resistor 704; the other end of the second resistor 704 is connected with one end of the filter capacitor 702, and the other end of the filter capacitor 702 is connected with the MCU701 through an analog-digital conversion interface.

According to the two schemes for implementing the connection between the control chip 700 and the optical power monitoring unit 402 provided in the foregoing embodiments, the power monitoring of the optical power monitoring unit 402 can be implemented, and the monitoring data is sent to the control chip 700, so that the optical power of the outgoing optical signal propagated in the outgoing optical waveguide 404 can be known, so that the control chip 700 can conveniently determine according to the monitored power data, and further determine the coupling effect between the silicon optical chip 400 and the third optical fiber 503.

Fig. 9 is a light path diagram of a silicon optical chip according to an embodiment of the present invention. Referring to fig. 9, since the silicon optical chip 400 can simultaneously implement the reception of multiple outgoing lights and the emission of multiple optical signals, the use requirement of the optical module can be satisfied. Therefore, when the silicon optical chip 400 needs to receive a plurality of optical signals, a plurality of incident optical waveguides 401 are provided in the silicon optical chip 400, and therefore, the same number of laser chips need to be provided in the light source 600. Meanwhile, a plurality of outgoing optical waveguides 404 are disposed in the silicon optical chip 400, and the number of the outgoing optical waveguides 404 is related to the requirement of the silicon optical chip 400 to emit several optical signals.

When a plurality of light emitting waveguides 404 are disposed in the silicon optical chip 400, in order to perform power detection on the light emitting signals propagating in each light emitting waveguide 404, one light power monitoring unit 402 needs to be disposed at each light emitting waveguide 404, that is, the light power monitoring units 402 are disposed in the same number as the light emitting waveguides 404 and are connected in a one-to-one correspondence manner. Specifically, the first optical power monitoring unit 4021 is connected to the first exit optical waveguide 4041, the second optical power monitoring unit 4022 is connected to the second exit optical waveguide 4042, the third optical power monitoring unit 4023 is connected to the third exit optical waveguide 4043, and the fourth optical power monitoring unit 4024 is connected to the fourth exit optical waveguide 4044.

Fig. 10 is a light path diagram of a control chip connected to a plurality of optical power monitoring units according to an embodiment of the present invention. The control chip 700 is connected to a plurality of optical power monitoring units 402 to receive monitoring data of each optical power monitoring unit 402. Referring to fig. 8 and 10, this embodiment provides a possible implementation of the connection between the control chip and the plurality of optical power monitoring units, that is, the N-pole of each optical power monitoring unit 402 is connected together in series, and the N-pole of each optical power monitoring unit 402 and the P-pole of each optical power monitoring unit 402 connected together in series are connected to the control chip 700 through the same interface (ADC).

In this embodiment, taking four outgoing optical waveguides and four optical power monitoring units as an example, the silicon optical chip 400 is used to connect the N stages of four MPDs together, and the connected N stages (MPD-N) are connected to the control chip 700. Specifically, the MPD-N connected together is connected to the bias voltage VCC through the first resistor 703, or the MPD-N connected together is directly connected to the bias voltage VCC, so as to perform bias processing. The P-stages of the four MPDs are individually connected to the control chip 700, that is, the P-stages of the four MPDs (MPD-P0, MPD-P1, MPD-P2, and MPD-P3) are respectively connected to the signal selection chip 705, the signal selection chip 705 is connected to the MCU701 through the second resistor 704 and the filter capacitor 702, and performs data sampling, so as to send the monitoring data of the optical power monitoring unit 402 to the control chip 700, and the optical power of the optical signal propagated in the first outgoing optical waveguide 4041, the second outgoing optical waveguide 4042, the third outgoing optical waveguide 4043, or the fourth outgoing optical waveguide 4044 can be obtained through calculation.

The signal selection chip 705 is controlled by the MCU701 to perform selection of signals. Since the P-stages of the four MPDs are all connected to the MCU701 through the signal selection chip 705, a four-way sampling circuit can be formed. However, only one interface (ADC) is disposed on the MCU701, the monitoring data of the four sampling circuits are all sent to the MCU701 through the same interface, and if the four sampling circuits monitor at the same time, the MCU701 will receive four sets of monitoring data at the same time, so that the MCU701 cannot accurately determine the corresponding relationship between each set of monitoring data and the optical power of the optical signal in each outgoing optical waveguide 404, and thus cannot determine whether the coupling between the silicon optical chip 400 and the third optical fiber 503 is in place.

Therefore, in the optical module provided in this embodiment, the signal selection chip 705 is used to select the sampling circuits, so that only one of the sampling circuits is selected for output during each power monitoring. That is, when monitoring the optical power of the optical signal in the four-way output optical waveguide 404, the signal selection chip 705 selects the P-level of one of the MPDs to connect under the control of the MCU701, for example, when the current power monitoring is the optical power of the first output optical signal TX0 propagating in the first output optical waveguide 404, the signal selection chip 705 is connected to the P-level (MPD-P0) of the first MPD, and the monitoring data received by the MCU701 is only the optical power of the first output optical signal TX 0. In the optical power of the optical signal of the next outgoing optical waveguide 404, the signal selection chip 705 may be connected to the P-stage of the corresponding MPD, and so on.

In this embodiment, the plurality of optical power monitoring units 402 individually monitor the optical signals in the corresponding outgoing optical waveguides 404 according to a certain period, and when one optical power monitoring unit 402 is monitoring, the other optical power monitoring units 402 are in a non-monitoring state, so as to determine the coupling state of each path in the silicon optical chip 400 and the third optical fiber 503. In this embodiment, the power monitoring of the optical signals in each of the outgoing optical waveguides 404 is implemented in a manner of monitoring individually according to a certain period, which can save resources, but cannot implement simultaneous monitoring of the optical signals in the four outgoing optical waveguides, so that the monitoring efficiency is lower. Therefore, the optical module provided by the embodiment of the invention also provides a connection scheme of the control chip capable of performing simultaneous monitoring and a plurality of optical power monitoring units.

FIG. 11 is another circuit diagram of a connection between a control chip and an optical power monitoring unit according to an embodiment of the present invention; fig. 12 is another optical path diagram of a control chip connected to a plurality of optical power monitoring units according to an embodiment of the present invention. Referring to fig. 11 and 12, to implement the reception of the monitoring data of the optical power monitoring unit 402, the control chip 700 includes: MCU701, first resistor 703, second resistor 704, bias voltage, and filter capacitor 702. The control chip 700 is connected to the optical power monitoring unit 402, and the optical power monitoring unit 402 includes a P-pole (MPD-P in fig. 11) and an N-pole (MPD-N in fig. 11), and for this purpose, the MCU701 is connected to the P-pole of the optical power monitoring unit 402.

One end of the first resistor 703 (R1 in fig. 11) is connected to the N-pole of the optical power monitoring unit 402, and the other end of the first resistor 703 is connected to the bias voltage (VCC in fig. 11) to perform bias processing; one end of the second resistor 704 (R2 in fig. 11) is connected to the P pole of the optical power monitoring unit 402; the other end of the second resistor 704 is connected to one end of the filter capacitor 702 (C1 in fig. 11) to form a sampling circuit. The other end of the filter capacitor 702 is connected with the MCU701 through an analog-to-digital conversion interface (ADC in FIG. 11), data collected by the sampling circuit is sent to the MCU701, and is processed by the MCU701 to determine whether the silicon optical chip 400 and the third optical fiber 503 are coupled in place by judging whether the collected power reaches the maximum value. MCU701 can be selected from a single chip microcomputer.

In the present embodiment, the N-pole of the optical power monitoring unit 402 is connected to the bias voltage through the first resistor, but in other embodiments, the N-pole of the optical power monitoring unit 402 may be directly connected to the bias voltage. Both embodiments can realize the monitoring of the optical signal, and the difference is that the optical signal is worse when the power monitoring is performed by the scheme that the first resistor is not connected with the bias voltage.

Specifically, in another embodiment, the control chip 700 includes: MCU701, second resistor 704, bias voltage and filter capacitor 702.MCU701 is connected with the P pole of optical power monitoring unit 402; the N pole of the optical power monitoring unit 402 is connected with the bias voltage; one end of the second resistor 704 is connected with the P pole of the optical power monitoring unit 402; the other end of the second resistor 704 is connected with one end of the filter capacitor 702, and the other end of the filter capacitor 702 is connected with the MCU701 through an analog-digital conversion interface.

When the plurality of outgoing optical waveguides 404 and the plurality of optical power monitoring units 402 are disposed in the silicon optical chip 400, in order to ensure that each optical power monitoring unit 402 can monitor the optical power of the optical signal in the outgoing optical waveguide 404 connected thereto, to determine whether the silicon optical chip 400 and the third optical fiber 503 are coupled in place, the control chip 700 needs to be connected to the plurality of optical power monitoring units 402. The connection mode adopted in this embodiment is different from the connection mode shown in fig. 10, and as shown in fig. 12, the connection mode provided in this embodiment is that each optical power monitoring unit 402 is individually connected to the control chip 700.

Specifically, the P-pole (MPD-P in fig. 12) and the N-pole (MPD-N in fig. 12) of each optical power monitoring unit 402 are connected together, and each optical power monitoring unit 402 is connected to the control chip 700 through a corresponding interface. The P-pole and the N-pole of each optical power monitoring unit 402 are connected by the same bias and sampling circuit, as shown in fig. 11, and the specific connection manner can refer to the description of the circuit shown in fig. 11 in the above embodiment, which is not repeated here.

In this embodiment, the P-stage and the N-stage of the optical power monitoring units 402 are connected together, so that the optical power monitoring units 402 are devices that exist separately, and each optical power monitoring unit 402 is connected to the control chip 700 respectively. For this reason, a plurality of ADC interfaces are required to be disposed on the control chip 700, and the number of ADC interfaces is the same as the number of the optical power monitoring units 402. Taking the silicon optical chip 400 with four outgoing optical waveguides and four optical power monitoring units as an example, the number of ADC interfaces is also four (not shown in the figure), and after the P-stage and the N-stage of the first optical power monitoring unit 4021 (MPD 1 in fig. 12) are connected together, the first optical power monitoring unit is connected to the control chip 700 through the first ADC interface; after the second optical power monitoring unit 4022 (MPD 2 in fig. 12) connects the P-stage and the N-stage thereof, the second optical power monitoring unit is connected to the control chip 700 through a second ADC interface; after the P-stage of the third optical power monitoring unit 4023 (MPD 3 in fig. 12) and the N-stage thereof are connected together, the third optical power monitoring unit is connected to the control chip 700 through a third ADC interface; after the P-stage of the fourth optical power monitoring unit 4024 (MPD 4 in fig. 12) and the N-stage thereof are connected together, the fourth optical power monitoring unit is connected to the control chip 700 through a fourth ADC interface. The specific connection manner of the P-stage and N-stage of each optical power monitoring unit 402 and the control chip 700 may refer to the circuit diagram shown in fig. 11.

It can be seen that the plurality of optical power monitoring units 402 are connected to the control chip 700 in parallel in this embodiment, and the plurality of optical power monitoring units 402 do not affect each other when monitoring optical power. Specifically, since each optical power monitoring unit 402 is connected to the control chip 700 through different ADC interfaces, the control chip 700 can separately receive the monitoring data from different optical power monitoring units 402, and multiple sets of monitoring data do not interfere with each other, so that the processing procedure of the control chip 700 is not affected, and the accuracy of data receiving can be ensured. Therefore, the connection manner provided in this embodiment can enable the plurality of optical power monitoring units 402 to operate independently, and can monitor the optical power of the optical signal in the outgoing optical waveguide 404 connected thereto at the same time, thereby improving the monitoring efficiency.

The optical module provided by the embodiment of the invention is used for simultaneously realizing the conversion of photoelectric signals by using the silicon optical chip 400 as an optical transceiver instead of the traditional optical transceiver. In order to ensure that the optical power of the silicon optical chip 400 in modulating the optical signal can meet the use requirement of the optical module, an optical power monitoring unit 402 is arranged in the silicon optical chip 400 to monitor the power of the outgoing optical signal so as to detect whether the silicon optical chip 400 and the third optical fiber 503 are coupled in place.

The silicon optical chip 400 can realize input and output of multiple paths of optical signals, and can be specifically determined according to practical application conditions. Taking the silicon optical chip 400 to implement three-way input and four-way output as an example, referring to fig. 9, the optical power modulation unit 403 in the silicon optical chip 400 needs to modulate three-way outgoing light into four-way outgoing light signals, for this purpose, the silicon optical chip 400 includes three incident optical waveguides (4011, 4012, 4013), an optical power modulation unit 403, four monitoring optical waveguides 407, four outgoing optical waveguides (4041, 4042, 4043, 4044), four optical power monitoring units (4021, 4022, 4023, 4024) connected to the four outgoing optical waveguides in a one-to-one correspondence, and three laser chips encapsulated in the light source 600 for generating three outgoing light beams.

To receive three outgoing light beams, the silicon optical chip 400 includes three light inlets (L0, L1, L2), each of which is connected to one incident light waveguide, that is, the first light inlet L0 is connected to the first incident light waveguide 4011, the second light inlet L1 is connected to the second incident light waveguide 4012, and the third light inlet L2 is connected to the third incident light waveguide 4013. Each laser chip in the light source 600 is connected to one light inlet through a third optical fiber 503, that is, a first light inlet L0 corresponding to the first incident optical waveguide 4011 is opposite to a first laser chip in the light source 600 through the third optical fiber 503, the first laser chip is used for generating first outgoing light, and the first incident optical waveguide 4011 is used for receiving the first outgoing light generated by the light source 600 through the first light inlet L0 and the third optical fiber 503. The second light inlet L1 corresponding to the second incident light waveguide 4012 is opposite to a second laser chip in the light source 600 through the third optical fiber 503, the second laser chip is used for generating second outgoing light, and the second incident light waveguide 4012 is used for receiving the second outgoing light generated by the light source 600 through the second light inlet L1 and the third optical fiber 503. The third light inlet L2 corresponding to the third incident light waveguide 4013 is opposite to a third laser chip in the light source 600 through the third optical fiber 503, the third laser chip is configured to generate third outgoing light, and the third incident light waveguide 4013 is configured to receive the third outgoing light generated by the light source 600 through the third light inlet L2 and the third optical fiber 503.

The other ends of the three incident light waveguides 401 are connected to an optical power modulation unit 403, and in order to realize modulation of three paths of outgoing light into four paths of outgoing light signals, the optical power modulation unit 403 includes seven light splitting units, four modulation units and four light combining units. The connection relationship between the seven light splitting units and the connection relationship with the three incident light waveguides 401 may refer to the description of the foregoing embodiments, and will not be repeated here. The light splitting unit 4 is connected with the first modulation unit through an optical waveguide, the first modulation unit is connected with the light combining unit 1 through an optical waveguide, and the light combining unit 1 is connected with the first emergent optical waveguide 4041; the light splitting unit 5 is connected with a second modulation unit through an optical waveguide, the second modulation unit is connected with the light combining unit 2 through an optical waveguide, and the light combining unit 2 is connected with a second emergent optical waveguide 4042; the light splitting unit 6 is connected with a third modulation unit through an optical waveguide, the third modulation unit is connected with the light combining unit 3 through an optical waveguide, and the light combining unit 3 is connected with a third emergent optical waveguide 4043; the light splitting unit 7 is connected to a fourth modulation unit via an optical waveguide, the fourth modulation unit is connected to the light combining unit 4 via an optical waveguide, and the light combining unit 4 is connected to a fourth outgoing optical waveguide 4044.

The first outgoing optical waveguide 4041 is used for propagating a first outgoing optical signal TX0 modulated by outgoing light from the third optical fiber 503 via the optical power modulating unit 403; the second outgoing optical waveguide 4042 is used for propagating a second outgoing optical signal TX1 modulated by outgoing light from the third optical fiber 503 via the optical power modulating unit 403; the third outgoing optical waveguide 4043 is used for propagating a third outgoing optical signal TX2 modulated by outgoing light from the third optical fiber 503 via the optical power modulating unit 403; the fourth outgoing optical waveguide 4044 is used for propagating a fourth outgoing optical signal TX3 modulated by outgoing light from the third optical fiber 503 via the optical power modulating unit 403. The four outgoing optical waveguides (4041, 4042, 4043, 4044) are respectively connected to the first optical fiber 501, and the first outgoing optical signal TX0 obtained by the light combining unit 1 through light combination propagates into the first optical fiber 501 through the first outgoing optical waveguide 4041; the second outgoing optical signal TX1 obtained by combining the light by the light combining unit 2 propagates into the first optical fiber 501 through the second outgoing optical waveguide 4042; the third outgoing optical signal TX2 obtained by combining the light by the light combining unit 3 propagates into the first optical fiber 501 through the third outgoing optical waveguide 4043; the fourth outgoing optical signal TX3 obtained by combining the light by the light combining unit 4 propagates into the first optical fiber 501 through the fourth outgoing optical waveguide 4044. Finally, the first optical fiber 501 propagates the four paths of outgoing optical signals into the optical interface 205, so as to implement an optical emission process.

The optical power modulation unit 403 modulates the three-way outgoing light into four-way outgoing optical signals, and propagates in the four outgoing optical waveguides 404, respectively. For power monitoring, each of the outgoing optical waveguides 404 is connected to an optical power monitoring unit 402, that is, a first optical power monitoring unit 4021 is connected to a first outgoing optical waveguide 4041 through a first monitoring optical waveguide, and is configured to monitor a first outgoing optical signal TX0 propagating through a beam split into the first monitoring optical waveguide; the second optical power monitoring unit 4022 is connected to the second outgoing optical waveguide 4042 through a second monitoring optical waveguide, and is configured to monitor the second outgoing optical signal TX1 propagated through the second monitoring optical waveguide by splitting; the third optical power monitoring unit 4023 is connected to the third outgoing optical waveguide 4043 through a third monitoring optical waveguide, and is configured to monitor the third outgoing optical signal TX2 propagated through the third monitoring optical waveguide by splitting; the fourth optical power monitoring unit 4024 is connected to the fourth outgoing optical waveguide 4044 through a fourth monitoring optical waveguide for monitoring the fourth outgoing optical signal TX3 propagated through the spectroscopic-in fourth monitoring optical waveguide. The four optical power monitoring units 402 are respectively connected to the control chip 700, and a specific optical path connection manner may be any one of fig. 10 and fig. 12, and a specific selection may be determined according to actual use requirements, which is not limited herein. Accordingly, any one of fig. 9 and fig. 11 may be adopted for the circuit connection manner of the four optical power monitoring units 402 and the control chip 700, and the specific connection manner may refer to the description of the corresponding parts in the foregoing embodiment, which is not repeated herein.

As can be seen from the above technical solution, the optical module provided by the embodiment of the present invention includes a circuit board 300, a silicon optical chip 400, a light source 600 and a control chip 700, which are disposed on the circuit board 300, wherein the light source 600 is connected with a signal circuit of the circuit board 300 for generating emergent light; the silicon optical chip is coupled with one end of the third optical fiber, the other end of the third optical fiber is connected with a light source, and emergent light generated by the light source propagates into the silicon optical chip through the third optical fiber. The silicon optical chip 400 includes an incident optical waveguide 401, an optical power modulation unit 403, an exit optical waveguide 404, and an optical power monitoring unit 402, where the incident optical waveguide 401 receives the exit light from the third optical fiber 503, propagates into the optical power modulation unit 403, and performs optical power modulation to obtain an exit optical signal. The outgoing optical waveguide 404 is configured to receive and output an outgoing optical signal; the optical power monitoring unit 402 is connected with the outgoing optical waveguide 404 through the monitoring optical waveguide 407, and is configured to receive the outgoing optical signal split by the outgoing optical waveguide 404 according to the splitting ratio, and perform optical power monitoring on the outgoing optical signal; the optical power monitoring unit 402 is connected to the control chip 700, and the control chip 700 is configured to receive the monitoring data of the optical power monitoring unit 402 to determine whether the coupling connection of the silicon optical chip 400 and the optical fiber ribbon 500 meets the requirement. Therefore, the optical module provided by the invention can detect the coupling effect of the silicon optical chip and the third optical fiber in the optical emission process, namely, the optical power monitoring unit 402 is additionally arranged in the silicon optical chip 400, the optical power monitoring unit 402 monitors the power of the emergent optical signal, and the coupling effect of the silicon optical chip 400 and the third optical fiber 503 can be accurately determined according to the monitoring data, so as to simplify the detection process of the optical module.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An optical module, comprising:

the silicon optical chip includes:

one end of the monitoring optical waveguide is connected with the emergent optical waveguide and is used for receiving emergent light which is split by the emergent optical waveguide according to a light splitting proportion, wherein the light splitting proportion is 2% -5%;

2. The optical module according to claim 1, wherein the spectral ratio of the outgoing optical signal propagating in the outgoing optical waveguide is 2% to 5%, and the optical signal corresponding to the spectral ratio of 2% to 5% is propagated into the optical power monitoring unit through the monitoring optical waveguide.

3. The optical module of claim 1, wherein the control chip comprises:

the MCU is connected with the P pole of the optical power monitoring unit; the optical power monitoring unit comprises a P pole and an N pole;

one end of the first resistor is connected with the N pole of the optical power monitoring unit, and the other end of the first resistor is connected with bias voltage;

the signal selection chip is connected with the P pole of the optical power monitoring unit at one end;

one end of the second resistor is connected with the signal selection chip;

and one end of the filter capacitor is connected with the other end of the second resistor, and the other end of the filter capacitor is connected with the MCU.

4. The optical module of claim 1, wherein the control chip comprises:

one end of the second resistor is connected with the P pole of the optical power monitoring unit;

5. The optical module according to claim 1, wherein the silicon optical chip comprises a plurality of outgoing optical waveguides and a plurality of optical power monitoring units, and the optical power monitoring units are connected with the outgoing optical waveguides in a one-to-one correspondence manner;

the optical power monitoring units comprise P poles and N poles, the N poles of each optical power monitoring unit are connected together in series, and the N poles of each optical power monitoring unit and the P poles of each optical power monitoring unit which are connected in series are connected with the control chip through the same interface.

6. The optical module according to claim 1, wherein the silicon optical chip comprises a plurality of outgoing optical waveguides and a plurality of optical power monitoring units, and the optical power monitoring units are connected with the outgoing optical waveguides in a one-to-one correspondence manner;

The optical power monitoring units comprise P poles and N stages, the P poles and the N poles of each optical power monitoring unit are connected together, and each optical power monitoring unit is connected with the control chip through a corresponding interface.

7. The optical module according to claim 1, wherein the silicon optical chip comprises four outgoing optical waveguides, and four optical power monitoring units connected to the four outgoing optical waveguides in one-to-one correspondence;

the first emergent light waveguide is used for transmitting a first emergent light signal modulated by the emergent light from the third optical fiber through the optical power modulation unit, and the first optical power monitoring unit is connected with the first emergent light waveguide through a first monitoring light waveguide and is used for monitoring the first emergent light signal;

the second emergent light waveguide is used for transmitting a second emergent light signal modulated by the emergent light from the third optical fiber through the optical power modulation unit, and the second optical power monitoring unit is connected with the second emergent light waveguide through a second monitoring light waveguide and is used for monitoring the second emergent light signal;

the third emergent light waveguide is used for transmitting a third emergent light signal modulated by the emergent light from the third optical fiber through the light power modulation unit, and the third light power monitoring unit is connected with the third emergent light waveguide through a third monitoring light waveguide and is used for monitoring the third emergent light signal;

The fourth outgoing optical waveguide is used for transmitting a fourth outgoing optical signal modulated by the outgoing light from the third optical fiber through the optical power modulation unit, and the fourth optical power monitoring unit is connected with the fourth outgoing optical waveguide through a fourth monitoring optical waveguide and is used for monitoring the fourth outgoing optical signal.

8. The optical module of claim 1, further comprising:

one end of the optical fiber ribbon is coupled with the silicon optical chip;

the optical interface is connected with the silicon optical chip through the optical fiber ribbon and is used for receiving the optical signal from the silicon optical chip through the optical fiber ribbon and transmitting the optical signal to the silicon optical chip through the optical fiber ribbon.

9. The optical module of claim 8, wherein the fiber optic ribbon comprises:

one end of the first optical fiber is coupled with the light outlet of the silicon optical chip, the other end of the first optical fiber is connected with the light interface, and the first optical fiber is used for receiving the emergent light signal modulated by the silicon optical chip and transmitting the emergent light signal into the light interface;

the second optical fiber, one end of the second optical fiber is coupled with the light receiving port of the silicon optical chip, the other end of the second optical fiber is connected with the optical interface, the second optical fiber is used for receiving a received optical signal sent by the optical interface, and the received optical signal is modulated by the silicon optical chip to obtain an electric signal and sent to the circuit board.

10. The optical module of claim 1, wherein the optical power modulation unit comprises:

the light splitting unit group is connected with the incident light waveguide at one end and is used for splitting the emergent light transmitted by the incident light waveguide;

the light splitting unit group is used for splitting the light emitted by the light splitting unit group into light beams, and the light beams are transmitted to the light splitting unit group through the light beams;

the light combining unit group is used for combining the modulated light signals to obtain emergent light signals, and the emergent light signals are transmitted into the emergent light waveguides.