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CN112522759A - Preparation method of fingerprint-resistant copper-aluminum alloy-like profile - Google Patents

Preparation method of fingerprint-resistant copper-aluminum alloy-like profile Download PDF

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Publication number
CN112522759A
CN112522759A CN202011537515.7A CN202011537515A CN112522759A CN 112522759 A CN112522759 A CN 112522759A CN 202011537515 A CN202011537515 A CN 202011537515A CN 112522759 A CN112522759 A CN 112522759A
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China
Prior art keywords
fingerprint
copper
aluminum alloy
treatment
aluminum
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Application number
CN202011537515.7A
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Chinese (zh)
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不公告发明人
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Huzhou Lichun Auto Parts Co ltd
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Huzhou Lichun Auto Parts Co ltd
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Priority to CN202011537515.7A priority Critical patent/CN112522759A/en
Publication of CN112522759A publication Critical patent/CN112522759A/en
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
    • C25D11/08—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing inorganic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D167/00—Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/16—Antifouling paints; Underwater paints
    • C09D5/1687—Use of special additives
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/02—Light metals
    • C23F3/03—Light metals with acidic solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/16—Pretreatment, e.g. desmutting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C25D11/20—Electrolytic after-treatment
    • C25D11/22—Electrolytic after-treatment for colouring layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/3045—Sulfates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Wing Frames And Configurations (AREA)

Abstract

The invention discloses a preparation method of an anti-fingerprint imitation copper aluminum alloy section, which comprises the following steps: putting the aluminum profile on a shelf, degreasing, and washing with water; chemically polishing the surface of the aluminum alloy flat tube by using phosphoric acid; then adopting sulfuric acid and aluminum ions to carry out anodic oxidation, and washing with water again; carrying out copper-imitating electrolytic coloring treatment on the aluminum profile after washing: carrying out anti-fingerprint coating treatment on the aluminum profile after washing, and then carrying out baking curing treatment on the aluminum profile; and putting the aluminum profile subjected to baking and curing treatment on a shelf, inspecting, and packaging after the inspection is qualified. The anti-fingerprint coating adopted by the invention comprises the following components in percentage by weight: 30-40% of hydroxyl polyester resin, 5-8% of modified polytetrafluoroethylene, 2-3% of polyacrylate, 6-10% of curing agent, 8-15% of barium sulfate and the balance of carboxyl-terminated polyester resin. The aluminum alloy section prepared by the invention has good copper imitation effect and obvious fingerprint prevention effect.

Description

Preparation method of fingerprint-resistant copper-aluminum alloy-like profile
Technical Field
The invention relates to the technical field of aluminum alloy sections, in particular to a preparation method of an anti-fingerprint copper-like aluminum alloy section.
Background
The highest end in the exterior door and window market today is the copper door, which is known for its high end top grade and is a somewhat respectful symbol. However, copper doors have the following disadvantages: copper is a precious metal, the resource of the copper is limited, particularly, the copper resource of China is not much, and the copper is used as a main raw material to be used, which is not in accordance with the national situation of China. When copper is used as the copper door, the cost is high, the selling price is more expensive, and the copper door can not be consumed by common people except for being used in a few occasions. The biggest defect of the copper door is that the copper door is easy to oxidize to generate verdigris, is easy to collide and damage and is not easy to maintain. In addition, the copper door has the problems of less style, simpler structure and the like, and the choice of the user is limited. These have all restricted the wide range of applications for copper doors.
In order to reduce the cost, improve the quality of the aluminum alloy imitation copper door and endow the aluminum alloy imitation copper door with good fingerprint and stain prevention effects, the invention provides a preparation method of a fingerprint-resistant imitation copper aluminum alloy section.
Disclosure of Invention
Based on the technical problems in the background art, the invention provides a preparation method of an anti-fingerprint imitation copper-aluminum alloy section.
The technical scheme of the invention is as follows:
a preparation method of an anti-fingerprint imitation copper aluminum alloy section comprises the following steps:
a, putting an aluminum profile on a shelf, degreasing, and washing with water;
b, chemically polishing the surface of the aluminum alloy flat tube by adopting phosphoric acid;
c, carrying out anodic oxidation by adopting sulfuric acid and aluminum ions, and washing with water again;
d, carrying out copper-imitating electrolytic coloring treatment on the aluminum profile after washing:
e, carrying out anti-fingerprint coating treatment on the aluminum profile after washing, and then carrying out baking curing treatment on the aluminum profile;
and F, putting the aluminum profile subjected to baking and curing treatment on a shelf, inspecting, and packaging after the inspection is qualified.
Preferably, in step C, the process parameters of the anodic oxidation treatment are as follows: the temperature of the oxidation tank is 15-25 ℃, the oxidation voltage is 17-18V, the concentration of sulfuric acid is 80-90g/L, the concentration of aluminum ions is 18-25g/L, and the oxidation time is 25-35 min.
Preferably, in the step C, the thickness of the oxide film on the surface of the aluminum profile is 20-30 μm.
Preferably, in the step C, the imitation copper electrolytic coloring treatment adopts an imitation red copper coloring tank, and the process parameters are as follows: 12-15g/L free acid, 25-30 ℃, coloring voltage of 16-18V and coloring time of 300-400 s.
Preferably, in the step D, the passivation treatment uses a passivation tank, and the process parameters are as follows: ni2+1.5-2.5g/L, pH value 5.5-6.2, temperature 60-65 deg.C, and time 15-20 min.
Preferably, in the step E, the anti-fingerprint coating comprises the following components in percentage by weight: 30-40% of hydroxyl polyester resin, 5-8% of modified polytetrafluoroethylene, 2-3% of polyacrylate, 6-10% of curing agent, 8-15% of barium sulfate and the balance of carboxyl-terminated polyester resin.
Preferably, the hydroxyl value of the hydroxyl polyester resin is 60-80 KOH/g; the hydroxyl value of the carboxyl-terminated polyester resin is 35-50 KOH/g.
Preferably, the thickness of the anti-fingerprint coating after baking and curing treatment is 15-25 μm.
The invention has the advantages that: the preparation method of the fingerprint-resistant imitation copper aluminum alloy section comprises the following steps: putting the aluminum profile on a shelf, degreasing, and washing with water; chemically polishing the surface of the aluminum alloy flat tube by using phosphoric acid; then adopting sulfuric acid and aluminum ions to carry out anodic oxidation, and washing with water again; carrying out copper-imitating electrolytic coloring treatment on the aluminum profile after washing: carrying out anti-fingerprint coating treatment on the aluminum profile after washing, and then carrying out baking curing treatment on the aluminum profile; and putting the aluminum profile subjected to baking and curing treatment on a shelf, inspecting, and packaging after the inspection is qualified. The anti-fingerprint coating adopted by the invention comprises the following components in percentage by weight: 30-40% of hydroxyl polyester resin, 5-8% of modified polytetrafluoroethylene, 2-3% of polyacrylate, 6-10% of curing agent, 8-15% of barium sulfate and the balance of carboxyl-terminated polyester resin. The preparation method of the copper-imitated aluminum alloy section bar has the advantages of good copper-imitated effect and obvious fingerprint prevention effect.
Detailed Description
Example 1
A preparation method of an anti-fingerprint imitation copper aluminum alloy section comprises the following steps:
a, putting an aluminum profile on a shelf, degreasing, and washing with water;
b, chemically polishing the surface of the aluminum alloy flat tube by adopting phosphoric acid;
c, carrying out anodic oxidation by adopting sulfuric acid and aluminum ions, and washing with water again;
d, carrying out copper-imitating electrolytic coloring treatment on the aluminum profile after washing:
e, carrying out anti-fingerprint coating treatment on the aluminum profile after washing, and then carrying out baking curing treatment on the aluminum profile;
and F, putting the aluminum profile subjected to baking and curing treatment on a shelf, inspecting, and packaging after the inspection is qualified.
In the step C, the process parameters of the anodic oxidation treatment are as follows: the temperature of the oxidation tank is 18 ℃, the oxidation voltage is 17.5V, the concentration of sulfuric acid is 85g/L, the concentration of aluminum ions is 22g/L, and the oxidation time is 30 min.
In the step C, the thickness of the oxide film on the surface of the aluminum profile is 25 μm.
In the step C, the imitation copper electrolytic coloring treatment adopts an imitation red copper coloring tank, and the technological parameters are as follows: 13g/L of free acid, 28 ℃, 16.5V of coloring voltage and 320s of coloring time.
In the step D, the passivation treatment adopts a passivation tank, and the technological parameters are as follows: ni2+2.1g/L, pH 5.9, temperature 62 ℃, time 17 min.
In the step E, the anti-fingerprint coating consists of the following components in percentage by weight: 34% of hydroxyl polyester resin, 6% of modified polytetrafluoroethylene, 2.5% of polyacrylate, 8% of curing agent, 11.5% of barium sulfate and the balance of carboxyl-terminated polyester resin.
The hydroxyl value of the hydroxyl polyester resin is 60-80 KOH/g; the hydroxyl value of the carboxyl-terminated polyester resin is 35-50 KOH/g.
The thickness of the anti-fingerprint coating after baking and curing treatment is 22 mu m.
Example 2
A preparation method of an anti-fingerprint imitation copper aluminum alloy section comprises the following steps:
a, putting an aluminum profile on a shelf, degreasing, and washing with water;
b, chemically polishing the surface of the aluminum alloy flat tube by adopting phosphoric acid;
c, carrying out anodic oxidation by adopting sulfuric acid and aluminum ions, and washing with water again;
d, carrying out copper-imitating electrolytic coloring treatment on the aluminum profile after washing:
e, carrying out anti-fingerprint coating treatment on the aluminum profile after washing, and then carrying out baking curing treatment on the aluminum profile;
and F, putting the aluminum profile subjected to baking and curing treatment on a shelf, inspecting, and packaging after the inspection is qualified.
In the step C, the process parameters of the anodic oxidation treatment are as follows: the temperature of the oxidation tank is 25 ℃, the oxidation voltage is 17V, the sulfuric acid concentration is 80g/L, the aluminum ion concentration is 25g/L, and the oxidation time is 35 min.
In the step C, the thickness of the oxide film on the surface of the aluminum profile is 30 μm.
In the step C, the imitation copper electrolytic coloring treatment adopts an imitation red copper coloring tank, and the technological parameters are as follows: free acid 12g/L, temperature 30 ℃, coloring voltage 16V and coloring time 400 s.
In the step D, the passivation treatment adopts a passivation tank, and the technological parameters are as follows: ni2+1.5g/L, pH 6.2, temperature 60 deg.C, time 20 min.
In the step E, the anti-fingerprint coating consists of the following components in percentage by weight: 40% of hydroxyl polyester resin, 5% of modified polytetrafluoroethylene, 3% of polyacrylate, 6% of curing agent, 15% of barium sulfate and the balance of carboxyl-terminated polyester resin.
The hydroxyl value of the hydroxyl polyester resin is 60-80 KOH/g; the hydroxyl value of the carboxyl-terminated polyester resin is 35-50 KOH/g.
The thickness of the anti-fingerprint coating after baking and curing treatment is 15 microns.
Example 3
A preparation method of an anti-fingerprint imitation copper aluminum alloy section comprises the following steps:
a, putting an aluminum profile on a shelf, degreasing, and washing with water;
b, chemically polishing the surface of the aluminum alloy flat tube by adopting phosphoric acid;
c, carrying out anodic oxidation by adopting sulfuric acid and aluminum ions, and washing with water again;
d, carrying out copper-imitating electrolytic coloring treatment on the aluminum profile after washing:
e, carrying out anti-fingerprint coating treatment on the aluminum profile after washing, and then carrying out baking curing treatment on the aluminum profile;
and F, putting the aluminum profile subjected to baking and curing treatment on a shelf, inspecting, and packaging after the inspection is qualified.
In the step C, the process parameters of the anodic oxidation treatment are as follows: the temperature of the oxidation tank is 15 ℃, the oxidation voltage is 18V, the sulfuric acid concentration is 90g/L, the aluminum ion concentration is 18g/L, and the oxidation time is 25 min.
In the step C, the thickness of the oxide film on the surface of the aluminum profile is 20 μm.
In the step C, the imitation copper electrolytic coloring treatment adopts an imitation red copper coloring tank, and the technological parameters are as follows: free acid 15g/L, temperature 25 ℃, coloring voltage 18V and coloring time 300 s.
In the step D, the passivation treatment adopts a passivation tank, and the technological parameters are as follows: ni2+2.5g/L, pH 5.5, temperature 65 deg.C, time 15 min.
In the step E, the anti-fingerprint coating consists of the following components in percentage by weight: 30% of hydroxyl polyester resin, 8% of modified polytetrafluoroethylene, 2% of polyacrylate, 10% of curing agent, 8% of barium sulfate and the balance of carboxyl-terminated polyester resin.
The hydroxyl value of the hydroxyl polyester resin is 60-80 KOH/g; the hydroxyl value of the carboxyl-terminated polyester resin is 35-50 KOH/g.
The thickness of the anti-fingerprint coating after baking and curing treatment is 25 mu m.
The aluminum alloy section bar is applied to the imitation copper door or imitation copper window, and can ensure that the surface of the aluminum alloy section bar is not stained with fingerprints and other stains within 5 years.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims (8)

1. The preparation method of the fingerprint-resistant copper-aluminum alloy imitation section is characterized by comprising the following steps of:
a, putting an aluminum profile on a shelf, degreasing, and washing with water;
b, chemically polishing the surface of the aluminum alloy flat tube by adopting phosphoric acid;
c, carrying out anodic oxidation by adopting sulfuric acid and aluminum ions, and washing with water again;
d, carrying out copper-imitating electrolytic coloring treatment on the aluminum profile after washing:
e, carrying out anti-fingerprint coating treatment on the aluminum profile after washing, and then carrying out baking curing treatment on the aluminum profile;
and F, putting the aluminum profile subjected to baking and curing treatment on a shelf, inspecting, and packaging after the inspection is qualified.
2. The method for preparing the fingerprint-resistant imitation copper aluminum alloy section bar according to claim 1, wherein in the step C, the process parameters of the anodic oxidation treatment are as follows: the temperature of the oxidation tank is 15-25 ℃, the oxidation voltage is 17-18V, the concentration of sulfuric acid is 80-90g/L, the concentration of aluminum ions is 18-25g/L, and the oxidation time is 25-35 min.
3. The method for preparing the fingerprint-resistant imitation copper aluminum alloy profile according to claim 1, wherein in the step C, the thickness of the oxide film on the surface of the aluminum profile is 20-30 μm.
4. The method for preparing the anti-fingerprint imitation copper aluminum alloy section bar according to claim 1, wherein in the step C, an imitation red copper coloring tank is adopted for the imitation copper electrolytic coloring treatment, and the process parameters are as follows: 12-15g/L free acid, 25-30 ℃, coloring voltage of 16-18V and coloring time of 300-400 s.
5. The method for preparing the fingerprint-resistant imitation copper aluminum alloy section bar according to claim 1, wherein in the step D, a passivation tank is adopted for passivation treatment, and the process parameters are as follows: ni2+1.5-2.5g/L, pH value 5.5-6.2, temperature 60-65 deg.C, and time 15-20 min.
6. The method for preparing the fingerprint-resistant imitation copper aluminum alloy profile according to claim 1, wherein in the step E, the fingerprint-resistant coating comprises the following components in percentage by weight: 30-40% of hydroxyl polyester resin, 5-8% of modified polytetrafluoroethylene, 2-3% of polyacrylate, 6-10% of curing agent, 8-15% of barium sulfate and the balance of carboxyl-terminated polyester resin.
7. The method for preparing the fingerprint-resistant imitation copper aluminum alloy profile according to claim 6, wherein the hydroxyl value of the hydroxyl polyester resin is 60-80 KOH/g; the hydroxyl value of the carboxyl-terminated polyester resin is 35-50 KOH/g.
8. The method for preparing the fingerprint-resistant imitation copper aluminum alloy section bar according to claim 6, wherein the thickness of the fingerprint-resistant coating after baking and curing treatment is 15-25 μm.
CN202011537515.7A 2020-12-23 2020-12-23 Preparation method of fingerprint-resistant copper-aluminum alloy-like profile Withdrawn CN112522759A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011537515.7A CN112522759A (en) 2020-12-23 2020-12-23 Preparation method of fingerprint-resistant copper-aluminum alloy-like profile

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011537515.7A CN112522759A (en) 2020-12-23 2020-12-23 Preparation method of fingerprint-resistant copper-aluminum alloy-like profile

Publications (1)

Publication Number Publication Date
CN112522759A true CN112522759A (en) 2021-03-19

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Country Status (1)

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