CN112188336A

CN112188336A - Earphone microphone

Info

Publication number: CN112188336A
Application number: CN202011050635.4A
Authority: CN
Inventors: 杨宗隆
Original assignee: Cotron Corp
Current assignee: Cotron Corp
Priority date: 2015-08-10
Filing date: 2015-11-10
Publication date: 2021-01-05
Also published as: TW201707469A; CN106454567A; TWI605721B; CN205123953U

Abstract

The invention discloses an earphone microphone, which comprises a shell, an ear pad, a loudspeaker unit and a microphone. The shell is provided with a cavity and a sound outlet which are communicated. The ear pad is arranged outside the shell. The speaker unit and the microphone are disposed in the cavity, and the microphone is located between the sound outlet and the speaker unit.

Description

Earphone microphone

The application is a divisional application of Chinese invention patent application (application number: 201510759795.9, application date: 2015, 11 and 10 days, invention name: earphone microphone).

Technical Field

The invention relates to an earphone microphone, in particular to an earphone microphone capable of resisting noise passively.

Background

With the continuous progress of science and technology, personal electronic products are not developed towards the trend of light and miniaturization, and smart phones, tablet computers or notebook computers and the like are indispensable to daily life of people. Regardless of the electronic products, in order to allow users to listen to the sound information provided by the electronic products without interfering with other people, the earphone has become an essential accessory of the electronic products. The headset provides a better sound transmission for the listener so that the listener can clearly hear and understand the sound content, unlike the situation where the sound transmission in the air causes unclear conditions and is not affected particularly during the movement of the user, such as in sports, driving, vigorous activity, or noisy environments. In addition, in order to enable a call using an electronic product, an earphone microphone equipped with a microphone is also a common accessory.

In order to take into account both the functions of listening to sound and collecting sound, the conventional earphone microphone adopts a design in which an earphone and a microphone are separated, and the earphone and the microphone are connected with each other through a signal line or a simple mechanism. Thus, the earphone can be close to the ear, and the microphone can be close to the mouth. However, such a design allows the microphone to also receive ambient noise, so that the intelligibility of the user's voice is greatly affected. If active noise immunity is used, noise immunity circuit is needed to increase the cost, and the active noise immunity will also destroy the fidelity of the collected sound. In addition, in order to reduce the volume of the earphone microphone, another conventional earphone microphone adopts bluetooth communication, and the earphone and the microphone are arranged in the same casing. However, the microphone of this design is still designed at the end closest to the mouth, and because the distance between the microphone and the mouth is increased, a directional microphone with a higher price is required for sound collection.

Disclosure of Invention

The invention aims to provide an earphone microphone, which can solve the problems of poor sound receiving effect and high noise-resistant cost of a microphone in the prior art.

To achieve the above object, the earphone microphone of the present invention comprises a housing, a speaker unit, an ear pad and a microphone. The shell is provided with a cavity and a sound outlet which are communicated. The ear pad is arranged at the periphery of the shell. The speaker unit and the microphone are disposed in the cavity, and the microphone is located between the sound outlet and the speaker unit.

In an embodiment of the invention, the speaker unit divides the chamber into a front chamber and a rear chamber that are not ventilated, and the microphone is located in the front chamber.

In an embodiment of the invention, the diameter of the microphone is less than or equal to 6 mm.

In an embodiment of the present invention, the microphone is a condenser microphone.

In an embodiment of the invention, a channel is provided between the microphone and a wall of the chamber, for transmitting the sound provided by the speaker unit out of the sound outlet through the channel.

In an embodiment of the invention, the earphone microphone further includes a bluetooth communication unit electrically connecting the speaker unit and the microphone. The Bluetooth communication unit has an audio feedback suppression (echo cancellation) circuit.

In an embodiment of the present invention, the shell is integrally formed, and the maximum outer diameter of the shell is less than 8mm, so that the shell can be placed in the ear canal when being worn by a user.

In an embodiment of the present invention, the sound receiving port of the microphone is aligned with the sound outlet.

In an embodiment of the invention, the headset microphone further comprises a printed circuit board. The printed circuit board is clamped in the cavity. The microphone is soldered to the printed circuit board. A channel is arranged between the printed circuit board and the cavity wall of the cavity and is used for transmitting the sound provided by the speaker unit out of the sound outlet through the channel.

In an embodiment of the invention, the headset microphone further comprises a microphone lead. The wall of the chamber is provided with a wire groove. The microphone lead is electrically connected with the microphone and extends to the outside through the wire slot.

Based on the above, in the earphone microphone of the present invention, the speaker unit and the ear pad provide a sealed noise elimination function together. Therefore, the earphone microphone can isolate the environmental noise to obtain better sound receiving effect.

In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

Fig. 1 is a partial cross-sectional view of a headset microphone in accordance with an embodiment of the present invention;

fig. 2 is a schematic cross-sectional view of a speaker according to another embodiment of the present invention;

fig. 3A is a partial cross-sectional view of a speaker according to still another embodiment of the present invention;

fig. 3B is a partial cross-sectional view of the housing of the speaker of fig. 3A.

Description of the symbols

100. 200 and 300: earphone microphone

110. 210, 310: shell body

120: horn unit

130: microphone (CN)

150. 250: ear pad

C10, C20: chamber

C12: front chamber

C14: rear chamber

P10, P12, P20: sound outlet

W10, W20: chamber wall

T10, T20: channel

240: bluetooth communication unit

260: dust-proof net

370. 372: printed circuit board

G12: clamping groove

380: microphone lead wire

G14: wire slot

Detailed Description

Fig. 1 is a partial sectional view of a headset microphone according to an embodiment of the present invention. Referring to fig. 1, the earphone microphone 100 of the present embodiment includes a housing 110, an ear pad 150, a speaker unit 120, and a microphone 130. The housing 110 has a cavity C10 and a sound outlet P10. The chamber C10 communicates with the sound outlet P10. The ear pad 150 is disposed outside the housing 110. The speaker unit 120 and the microphone 130 are disposed in the cavity C10, and the microphone 130 is located between the sound outlet P10 and the speaker unit 120. When the earphone microphone 100 is worn on the ear of the user, the sound outlet P10 faces the eardrum of the ear, and the speaker unit 120 and the ear pad 250 block the transmission of the ambient noise to the microphone 130, thereby generating the passive anti-noise effect and improving the sound fidelity. Specifically, the speaker unit 120 prevents the transmission of the ambient noise from the inside of the housing 110 to the microphone 130, and the ear pad 250 prevents the transmission of the ambient noise from the outside of the housing 110 to the microphone 130. In addition, since the microphone 130 is close to the eardrum of the user, sound waves generated by vibration of the eardrum caused by the user speaking can be sensitively detected and collected by the microphone 130, and human bones can well transmit the sound generated by the user into the ear canal and be collected by the microphone 130.

In the present embodiment, the speaker unit 120 divides the chamber C10 into a front chamber C12 and a rear chamber C14 that are not vented to each other, and the microphone 130 is located in the front chamber C12. In other words, the contact portion of the horn unit 120 and the chamber C10 is substantially airtight, so that the gas cannot be transferred from the rear chamber C14 to the front chamber C12, thereby reducing the possibility of ambient noise being collected by the microphone 130. The ear pad 250 of the present embodiment is disposed outside the housing 110, and the sound outlet P10 is located inside the ear pad 250. In addition, the diameter of the microphone 130 of the present embodiment is, for example, 6mm or less, so that the microphone 130 can be inserted into the ear canal of the user together with the housing 110 to approach the tympanic membrane. The maximum outer diameter of the shell 110 is, for example, less than 8mm, so that the shell can be placed in the ear canal of a user when worn by the user. The microphone 130 may be a condenser microphone or other form of microphone whose appearance may be a pie shape or other appearance. The sound receiving port 132 of the microphone 130 is opposite to the sound outlet P10, that is, the sound receiving port 132 of the microphone 130 can be seen from the sound outlet P10, so as to obtain better sound receiving effect.

A channel T10 is provided between the microphone 130 and a wall W10 of the chamber C10 in the embodiment, so that the sound provided by the speaker unit 120 is transmitted out of the sound outlet P10 through the channel T10. Therefore, the sound provided from the speaker unit 120 can be well transmitted to the eardrum. In addition, the housing 110 of the present embodiment is integrally formed, so that the overall structure is simple and the assembly is easy. The headphone microphone 100 of the present embodiment may be of a monaural or binaural design. When a binaural design is used, only one side may be provided with microphones 130, while the other side may be provided with virtual microphones to make the sound fields on both sides uniform. The virtual microphone has the same shape as the real microphone 130, but has no function of sound reception.

Fig. 2 is a schematic cross-sectional view of a speaker according to another embodiment of the present invention. Referring to fig. 2, the earphone microphone 200 of the present embodiment is similar to the earphone microphone 100 of fig. 1, and only the differences therebetween will be described. The earphone microphone 200 of the present embodiment further includes a bluetooth communication unit 240 electrically connecting the speaker unit 120 and the microphone 130. The electrical connection between the bluetooth communication unit 240 and the speaker unit 120 and the microphone 130 may be achieved through wires and a circuit board, which are omitted in fig. 2 and not shown. The earphone microphone 200 of the present embodiment transmits and receives sound signals to and from an electronic device in a bluetooth communication manner through the bluetooth communication unit 240. Meanwhile, the bluetooth communication unit 240 has a sound feedback suppression circuit, so that only the voice signal recorded from the speaker, that is, the sound of the user, is included in the voice signal transmitted from the microphone 130, and the voice of the receiver transmitted from the speaker unit 120 is not mixed. Of course, the earphone microphone of the present invention may also transmit and receive the sound signal with the electronic device in a wired manner. The electronic device can have the sound feedback suppression function. In addition, the earphone microphone 200 may be configured with a battery therein, but is omitted from fig. 2 and not shown. The whole earphone microphone 200 can be almost placed in the ear canal, which is not only more beautiful, but also reduces the burden on the ear of the user. In addition, an ear pad 250 may be assembled outside the housing 210 of the earphone microphone 200. The ear pad 250 is suitably elastically deformed according to the contour of the user's ear canal to fit the ear canal and substantially isolate external sounds. The sound outlet P12 of the housing 210 may be provided with a dust screen 260 to prevent foreign objects from entering the housing 210.

Fig. 3A is a partial sectional view of a speaker according to still another embodiment of the present invention, and fig. 3B is a partial sectional view of a housing of the speaker of fig. 3A. Referring to fig. 3A and 3B, the earphone microphone 300 of the present embodiment is similar to the earphone microphone 200 of fig. 2, and only the differences therebetween will be described. The earphone microphone 300 of the present embodiment further includes a printed circuit board 370. The microphone 130 is soldered to the printed circuit board 370, for example, by Surface Mount Technology (SMT). The printed circuit board 370 is snapped into the cavity C20 of the housing 310. For example, the cavity wall W20 of the cavity C20 has a card slot G12, and the outer protrusion of the pcb 370 is just locked in the card slot G12. For the convenience of assembly, the card slot G12 may be closed on one side near the sound outlet P20 and open on the other side. In this manner, the printed circuit board 370 may be slid in from the open side of the card slot G12 and stopped at the closed side of the card slot G12. Further, by adjusting the distance between the closed side of the card slot G12 and the sound outlet P20, the distance between the microphone 130 and the sound outlet P20 can be controlled to a desired design value. In addition, a channel T20 is provided between the printed circuit board 370 and the wall W20 of the cavity C20, so that the sound provided by the speaker unit 120 is transmitted out of the sound outlet P20 through the channel T20. Moreover, the effect of adjusting the sound quality of the speaker unit 120 can be achieved by changing the cross-sectional shape and size of the channel T20. In addition, the earphone microphone 300 further includes a microphone lead 380. The cavity wall W20 of the cavity C20 is provided with a wire groove G14. The microphone lead 380 is electrically connected to the microphone 130, and the microphone lead 380 extends to the outside through the wire groove G14 to transmit signals and receive power. In other embodiments, the microphone lead 380 may be connected to another printed circuit board 372, and then the lead is pulled out from the printed circuit board 372 to extend to the outside. Wherein, the speaker unit 120 is disposed on the printed circuit board 372.

In summary, in the earphone microphone of the present invention, the microphone is located between the sound outlet and the speaker unit. Therefore, when the earphone microphone is worn on the ear of a user, the microphone is positioned between the speaker unit and the eardrum, the speaker unit and the microphone can jointly isolate the environmental noise to obtain better sound receiving effect, and the cost required by active noise resistance is saved.

Although the present invention has been described with reference to the above embodiments, it should be understood that the invention is not limited thereto, and that various changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the invention.

Claims

1. A headset microphone, comprising:

the shell is provided with a cavity and a sound outlet which are communicated;

an ear pad disposed outside the housing;

the loudspeaker monomer is configured in the cavity, and the part of the loudspeaker monomer, which is contacted with the cavity, is in airtight contact, wherein the loudspeaker monomer divides the cavity into a front cavity and a rear cavity which are not ventilated mutually, the microphone is positioned in the front cavity, the front cavity is only communicated with the outside through the sound outlet, and the microphone receives sound only through the sound outlet;

a microphone disposed in the chamber and located between the sound outlet and the speaker unit, wherein a channel is formed between the microphone and the chamber wall of the chamber for transmitting the sound provided by the speaker unit out of the sound outlet through the channel; and

the Bluetooth communication unit is electrically connected with the speaker unit and the microphone and is provided with a sound feedback suppression circuit.

2. The headset microphone of claim 1, wherein the microphone has a diameter of 6mm or less.

3. The headset microphone of claim 1, wherein the microphone is a condenser microphone.

4. The earphone microphone of claim 1, wherein the housing is integrally formed and has a maximum outer diameter of less than 8 mm.

5. The earphone microphone of claim 1, wherein the sound reception port of the microphone is opposite to the sound output port.

6. The headset microphone of claim 1, further comprising a printed circuit board, wherein the printed circuit board is mounted to the chamber, the microphone is soldered to the printed circuit board, and the channel is between the printed circuit board and a wall of the chamber.

7. The headset microphone of claim 1, further comprising a microphone lead, wherein a wall of the chamber has a wireway thereon, the microphone lead electrically connecting the microphone and extending through the wireway to the outside.