CN111863918B - Display backboard, manufacturing method thereof, display panel and display device - Google Patents
Display backboard, manufacturing method thereof, display panel and display device Download PDFInfo
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- CN111863918B CN111863918B CN202010744555.2A CN202010744555A CN111863918B CN 111863918 B CN111863918 B CN 111863918B CN 202010744555 A CN202010744555 A CN 202010744555A CN 111863918 B CN111863918 B CN 111863918B
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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Abstract
The invention provides a display backboard, a manufacturing method thereof, a display panel and a display device. The display back plate comprises a substrate base plate, a light-emitting element and a pixel defining layer, wherein the pixel defining layer defines a plurality of first openings, the light-emitting element comprises a cathode, an anode and a light-emitting layer, the light-emitting layer is positioned in the first openings, and the display back plate further comprises: and the conductive film layer is arranged on the surface, far away from the substrate, of the pixel defining layer, and is electrically connected with the cathode. The display backboard is not easy to generate color crosstalk among pixels, and has high display quality.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display backboard, a manufacturing method thereof, a display panel and a display device.
Background
At present, an organic electroluminescent display (OLED) has been highly valued in the field of flat panel display and illumination because it has the advantages of high brightness, color saturation, thinness, flexibility, etc. However, in the related art, there are still some problems of the OLED display back panel, such as color crosstalk between pixels is more likely to occur, especially at low gray scales, and the color crosstalk between pixels of the OLED display back panel is more serious, which seriously affects the display effect and the display quality.
Thus, the existing OLED display technology has yet to be improved.
Disclosure of Invention
The present invention has been completed based on the following findings by the inventors:
in the related art, in order to make the number of electrons or holes sufficiently large on both sides of the light emitting layer in the display back plate, the light emitting element in the display back plate may include a multi-layer functional layer 301 in addition to the cathode, anode and light emitting layer which may be generally included, referring to fig. 1a, specifically, the functional layer 301 may generally include a hole injection layer, a hole transport layer, an electron blocking layer, a light emitting layer, a hole blocking layer, an electron transport layer, an electron injection layer, etc., thereby lowering the energy barrier to makeThe light-emitting layer emits light better. However, the functional layer 301 is usually fabricated by using an Open Mask for process conditions, which is convenient to form and has low cost, however, the functional layer 301 is fabricated by using an Open Mask, and the functional layer 301 covers sub-pixel regions of different colors during fabrication, so that carriers in a plurality of light emitting elements can be conducted through the entire functional layer 301 disposed continuously because the functional layers 301 in the plurality of sub-pixel regions are connected. Referring to fig. 1a and 1b, the display back plate 10 has a first sub-pixel area a 1 A second sub-pixel area A 2 A third sub-pixel area A 3 And a non-pixel region B, according to the foregoing, since the functional layer 301 is present in the light emitting element, in the display back panel 10, the light emitting elements located in different sub-pixel regions are connected together, so that when the light emitting layers in the light emitting elements emit light, especially when the driving voltages to the light emitting elements in different sub-pixel regions are different, there is a potential difference between the two sub-pixel regions, and carriers in the light emitting elements are likely to appear to be conducted from one sub-pixel region to the other sub-pixel region (for example, the direction indicated by the arrow in FIG. 1a is the conduction direction of the carriers, and the light emitting elements in FIG. 1a emit light from the first sub-pixel region A) 1 Is conducted to the second sub-pixel area A 2 At this time, referring to fig. 1c, carriers pass through the first sub-pixel area a 1 Is R 1 The carriers pass through the second sub-pixel area A 2 Is R 2 Carriers from the first sub-pixel area A 1 Flows to the second sub-pixel area A 2 Is 2R 3 The method comprises the steps of carrying out a first treatment on the surface of the Of course, it will be understood by those skilled in the art that the direction of the flow of the carriers may be different in different display requirements, for example, from the second sub-pixel area A 2 Flows to the first sub-pixel area A 1 Or a third sub-pixel area A 3 Etc.), thereby causing the display backplate 10 to suffer from inter-pixel color crosstalk when the display is implemented, and especially at lower gray levels, and with dopants incorporated into the light emitting elements, due to the greater difference between the drive voltages to the different sub-pixel regions (especially whenWhen the difference between the driving voltages of the different sub-pixel regions exceeds 0.3V, the above-mentioned problem of color crosstalk is further aggravated; in addition, in the display back panel 10 of the related art, in order to increase the resolution as much as possible, the distance between the different sub-pixel regions is also designed to be relatively small (especially when the distance between the different sub-pixel regions is smaller than 30 μm), which further aggravates the problem of color crosstalk between pixels, so that the display quality is poor.
In view of the above, the present invention aims to solve at least one of the technical problems in the related art to some extent. Therefore, an object of the present invention is to provide a display back plate in which color crosstalk between pixels is less likely to occur and display quality is high.
In one aspect of the invention, a display back panel is provided. According to an embodiment of the present invention, the display back plate includes a substrate base plate, a light emitting element, and a pixel defining layer, the pixel defining layer defining a plurality of first openings, the light emitting element including a cathode, an anode, and a light emitting layer, the light emitting layer being located in the first openings, further including: and the conductive film layer is arranged on the surface, far away from the substrate, of the pixel defining layer, and is electrically connected with the cathode. The display backboard is not easy to generate color crosstalk among pixels, and has high display quality.
According to an embodiment of the present invention, a first orthographic projection of the pixel defining layer on the substrate covers a second orthographic projection of the conductive film layer on the substrate, and the conductive film layer has a second opening at a position corresponding to a plurality of the first openings, and a gap is provided between a contour line of the first opening and a contour line of the second opening.
According to an embodiment of the present invention, the conductive film layer includes: a metal thin film disposed on a surface of the pixel defining layer remote from the substrate base plate, and electrically connected to the cathode; and the resistance adjusting layer is arranged on the surface of the metal film, which is far away from the substrate base plate.
According to an embodiment of the present invention, the metal thin film satisfies at least one of the following conditions: the thickness is 1 nm-15 nm; the minimum width of the metal film between two adjacent first openings is 1-20 mu m; the forming material includes at least one of magnesium, silver, ytterbium, copper, aluminum, and samarium.
According to an embodiment of the present invention, the resistance adjustment layer satisfies at least one of the following conditions: the thickness is 0.01 mu m to 1 mu m; the minimum width of the resistance adjusting layer between two adjacent first openings is 5-20 mu m; the resistivity is 100 to 10000 Ω cm.
According to an embodiment of the present invention, the first orthographic projection of the pixel defining layer on the substrate and the third orthographic projection of the first opening on the substrate together form a fourth orthographic projection, the light emitting element further includes a hole injection layer disposed between the anode and the light emitting layer, and the fifth orthographic projection of the hole injection layer on the substrate overlaps with the fourth orthographic projection, wherein a first resistance of hole carriers generated by a portion of the hole injection layer located in one of the first openings to the light emitting layer in the other of the first openings is greater than a second resistance of hole carriers to the conductive film layer.
In another aspect of the invention, a method of making the display back panel described above is provided. According to an embodiment of the invention, the method comprises: forming a pixel defining layer defining a plurality of first openings on a surface of the substrate base plate; forming a conductive film layer on a surface of the pixel defining layer remote from the substrate base plate; forming a light emitting element so as to obtain the display back plate. The method is simple and convenient to operate, easy to realize industrial production, and capable of effectively manufacturing the display backboard.
According to an embodiment of the present invention, the step of forming the conductive film layer further includes: forming a metal film on a surface of the pixel defining layer away from the substrate base plate; and forming a resistance adjusting layer on the surface of the metal film, which is far away from the substrate.
In yet another aspect of the present invention, a display panel is provided. According to an embodiment of the present invention, the display panel includes the display back plate described above. The display panel is not easy to generate color crosstalk among pixels, has high display quality, has all the characteristics and advantages of the display backboard, and is not repeated herein.
In yet another aspect, the present invention provides a display device. According to an embodiment of the present invention, the display device includes the foregoing display panel. The display device is not easy to generate color crosstalk among pixels, has high display quality, has all the characteristics and advantages of the display panel, and is not repeated here.
Drawings
Fig. 1a is a schematic cross-sectional view showing a back plate in the related art.
FIG. 1b shows a schematic plan view of the back plate shown in FIG. 1 a.
Fig. 1c shows an equivalent circuit diagram of the back plate of fig. 1 a.
FIG. 2a is a schematic cross-sectional view of a display back plate according to an embodiment of the invention.
Fig. 2b shows a schematic plan view of the back plate shown in fig. 2 a.
Fig. 2c shows an equivalent circuit diagram of the back plate shown in fig. 2 a.
Fig. 3 is a schematic cross-sectional view of a display back plate according to another embodiment of the invention.
Fig. 4 is a schematic cross-sectional view of a display back plate according to another embodiment of the invention.
FIG. 5 is a flow chart of a method for fabricating a display back plate according to an embodiment of the invention.
Fig. 6a, 6b and 6c are schematic flow diagrams illustrating a method for fabricating a display back plate according to another embodiment of the present invention.
FIG. 7 is a flow chart of a method for fabricating a display back plate according to another embodiment of the invention.
Fig. 8a, 8b and 8c are schematic flow diagrams illustrating a method for fabricating a display back plate according to still another embodiment of the present invention.
Reference numerals:
10: display back plate 100: substrate base 200: pixel defining layers 310a, 310b: anode 320: hole injection layer 330: hole transport layers 340a, 340b: electron blocking layers 350a, 350b: light emitting layer 351: ineffective light emitting layer 360: hole blocking layer 370: electron transport layer 380: electron injection layer 390: cathode 400: conductive film layer 410: metal thin film 420: resistance adjusting layer A 1 : first sub-pixel area A 2 : second sub-pixel area A 3 : third sub-pixel region B: non-pixel region p: gap of
Detailed Description
Embodiments of the present invention are described in detail below. The following examples are illustrative only and are not to be construed as limiting the invention. The examples are not to be construed as limiting the specific techniques or conditions described in the literature in this field or as per the specifications of the product.
In one aspect of the invention, a display back panel is provided. According to an embodiment of the present invention, referring to fig. 2a, the display back plate 10 includes a substrate 100, a light emitting element and a pixel defining layer 200, wherein the pixel defining layer 200 defines a plurality of first openings (the positions of the first openings are the positions of the sub-pixel regions, such as the first sub-pixel region a shown in fig. 2 a) 1 And a second sub-pixel area A 2 ) The light emitting device includes a cathode 390, anodes 310a, 310b, and light emitting layers 350a, 350b, where the light emitting layers 350a, 350b are located in the first opening (those skilled in the art will understand that there is an inactive light emitting layer 351 between the light emitting layer 350a and the light emitting layer 350b in the non-pixel area, where the inactive light emitting layer 351 does not emit light after being energized due to the overlapping portion formed by the light emitting layer 350a and the light emitting layer 350b during fabrication, and its specific structure and thickness are the same as those of the inactive light emitting layer in the conventional display back plate, and will not be repeated here), and further includes: a conductive film layer 400, the conductive film 400 being disposed on a surface of the pixel defining layer 200 remote from the substrate base plate 100, and the conductive film layer 400 being electrically connected with the cathode (fig.)Not shown). Since the conductive film 400 electrically connected to the cathode is disposed in the display back plate 10, referring to fig. 2a, the conductive film is located in the first sub-pixel area a 1 At least a portion of the carriers can flow to the conductive film 400 (as indicated by the arrow in fig. 2 a) without continuing to flow to the second sub-pixel region a 2 Compared with the display backboard in the related art, the display backboard is not easy to generate color crosstalk among pixels, and has high display quality.
Further, according to an embodiment of the present invention, the specific arrangement manner of the conductive film layer 400 is not particularly limited, for example, in some embodiments of the present invention, the conductive film layer 400 may be disposed only in a non-pixel region between a partial sub-pixel region and a sub-pixel region of the display back panel. In other embodiments of the present invention, referring to fig. 2a and 2b, the first orthographic projection of the pixel defining layer 200 on the substrate 100 may be a second orthographic projection of the conductive film layer 400 on the substrate 100, and the pixel defining layer may be formed on the substrate 100 in a sub-pixel region (e.g. a first sub-pixel region a 1 A second sub-pixel area A 2 Or a third sub-pixel area A 3 ) And a gap p is formed between the contour line of the first opening and the contour line of the second opening. By the conductive film layer 400 arranged in this way, the problem of color crosstalk between pixels can be better solved, and the problem of color crosstalk between pixels can be better solved between pixel units of the display backboard 10, so that the display quality of the display backboard 10 is high.
According to an embodiment of the present invention, referring still further to fig. 3, the conductive film layer may include: a metal thin film 410, the metal thin film 410 being disposed on a surface of the pixel defining layer 200 remote from the substrate 100, and the metal thin film 410 being electrically connected to the cathode (not shown in the figure); and a resistance adjustment layer 420, the resistance adjustment layer 420 being disposed onThe metal film 410 is on a surface remote from the substrate 100. Thus, by the metal film 410 and the resistance adjusting layer 420 being matched with each other, on one hand, the metal film 410 has good conductivity, so that the metal film is positioned in the first sub-pixel area A 1 At least a portion of the carriers can flow directly to the conductive film 400 without continuing to flow to the second sub-pixel region A when the carriers are transported to the vicinity of the conductive film 2 The method comprises the steps of carrying out a first treatment on the surface of the On the other hand, since the metal thin film 410 has good conductivity, the electrical resistance of the circuit formed by the metal thin film 410 and the cathode may be too small, and thus a short circuit may occur in the circuit, and thus, by providing the resistance adjusting layer 410, the circuit formed by the metal thin film 410 and the cathode may have a certain electrical resistance, and thus, a short circuit may not occur in the circuit, and the above-described function of preventing color crosstalk between pixels may be better realized.
According to an embodiment of the present invention, specifically, the thickness of the metal thin film 410 may be 1nm to 15nm, and in some embodiments of the present invention, the thickness of the metal thin film 410 may be specifically 1nm, 3nm, 5nm, 10nm, 12nm, 15nm, or the like. Thus, the metal film 410 having the thickness can have a suitable resistance, so that carriers can flow into the metal film more effectively, and color crosstalk between pixels can be prevented.
In addition, the forming material of the metal thin film 410 may include at least one of magnesium, silver, ytterbium, copper, aluminum, and samarium according to an embodiment of the present invention. Therefore, the material source is wide and easy to obtain, the cost is low, and the metal film 410 formed by the material has proper resistance, so that carriers can flow into the metal film effectively, and color crosstalk between pixels is prevented.
According to embodiments of the present invention, in particular, the thickness of the resistance adjustment layer 420 may be 0.01 μm to 1 μm, and in some embodiments of the present invention, the thickness of the resistance adjustment layer 420 may be in particular 0.01 μm, 0.05 μm, 0.1 μm, 0.2 μm, 0.5 μm, 0.8 μm, 1 μm, or the like. Therefore, the resistance adjusting layer 420 with the thickness can ensure that the whole conductive film layer has a resistance which is not too small, so that the short circuit is not easy to occur in a loop formed by the metal film layer 410 and the cathode, and the function of preventing color crosstalk between pixels is better realized.
According to an embodiment of the present invention, the resistivity of the resistance adjusting layer 420 may be 100 Ω·cm to 10000 Ω·cm, specifically, 100 Ω·cm, 500 Ω·cm, 1000 Ω·cm, 2000 Ω·cm, 5000 Ω·cm, 10000 Ω·cm, or the like. Therefore, the resistance adjusting layer 420 with the resistivity can ensure that the whole conductive film layer has a resistance which is not too small, so that the short circuit is not easy to occur in a loop formed by the metal film layer 410 and the cathode, and the function of preventing color crosstalk between pixels is better realized.
According to the embodiment of the present invention, further, since the aforementioned conductive film layer is realized to prevent occurrence of color crosstalk between pixels by causing carriers to flow to itself by changing directions on the way from one sub-pixel region to another sub-pixel region, it can be understood that the width of the conductive film layer between two adjacent sub-pixel regions is particularly important to achieve the above technical effect. For example, referring to FIG. 2b, the minimum width L of the metal film between two adjacent first openings 1 Is 1 μm to 20 μm, specifically, the distance L 1 May be 1 μm, 5 μm, 10 μm, 15 μm, 20 μm, or the like; minimum width L of the resistance adjusting layer between two adjacent first openings 2 May be 5 μm to 20 μm, specifically, the distance L 2 May be 5 μm, 10 μm, 15 μm, 20 μm, or the like (in FIG. 2b, the distance L is shown 1 And the distance L 2 When equal, those skilled in the art will appreciate that the distance L 1 And the distance L 2 Or may be unequal; in addition, it will be understood by those skilled in the art that the two adjacent first openings described above may refer to two adjacent first openings in the same pixel unit or two adjacent first openings in different pixel unitsA first opening). Thus, the above-described function of preventing color crosstalk between pixels can be preferably realized by the arrangement of the metal thin film and the resistance adjustment layer in the conductive film layer 400, and short-circuiting is less likely to occur in the display back plate 10.
Further, in the display back plate 10, the hole carrier transport property between different pixels is better than the electron carrier, so, referring to fig. 4, the hole injection layer 320 and the hole transport layer 330 in the display back plate 10 are more likely to conduct the hole carrier from one sub-pixel region to another sub-pixel region; in addition, the inventors have found through extensive and intensive studies and experimental verification that the hole injection layer 320 is more conductive to hole carriers than the hole transport layer 330, that is, if color crosstalk between pixels occurs in the display back panel in the related art, it is likely that the hole injection layer 320 in the display back panel is conductive to hole carriers. Thus, referring to fig. 4, the display back plate 10 according to the present invention has the following arrangement: the first orthographic projection of the pixel defining layer 200 on the substrate 100 and the third orthographic projection of the first opening on the substrate 100 together form a fourth orthographic projection, the light emitting element further includes a hole injection layer 320, the hole injection layer 320 is disposed between the anodes 310a, 310b and the light emitting layers 350a, 350b, and the fifth orthographic projection of the hole injection layer 320 on the substrate 100 overlaps with the fourth orthographic projection, in other words, the hole injection layer 320 is a continuous integral layer structure covering the pixel defining layer 200 and the first opening, wherein a first resistance of hole carriers 320 generated by a portion of the hole injection layer 320 located in one of the first openings is greater than a second resistance of hole carriers conducted to the light emitting layer in the other of the first openings. Specifically, referring to fig. 2c, carriers pass through the first sub-pixel area a 1 Is R 1 The carriers pass through the second sub-pixel area A 2 Is R 2 Carriers from the first sub-pixel area A 1 Flows to the second sub-pixel area A 2 Equivalent electricity of (a)Resistance is 2R 3 By providing the conductive film layer 400, it is equivalent to having the resistance R in the equivalent circuit when hole carriers are transported in the hole injection layer 320 4 The resistance R 4 And R is R 3 In parallel, it has been described that by providing the conductive film layer, the metal film and the resistance adjusting layer are further provided, and further, the resistance R can be made by the thicknesses and materials of the metal film and the resistance adjusting layer 4 Is sized so that in the circuit formed by the display back plate 10, there is R 4 <R 2 +R 3 That is, the first resistance of the hole carrier 320 generated by the part of the hole injection layer 320 located in one of the first openings to the light emitting layer in the other one of the first openings is greater than the second resistance of the hole carrier to the conductive film layer, so that the second sub-pixel area A can be reduced or even eliminated 2 The current flows in the pixel, thereby preventing the occurrence of color crosstalk between pixels.
According to an embodiment of the present invention, it will be understood by those skilled in the art that the display back panel may further include, in addition to the foregoing structure, the structure and components of a conventional display panel, for example, a thin film transistor array layer between a substrate and a light emitting element, a light extraction layer on a surface of a cathode far from the substrate, a reflective layer of an anode near the substrate, etc., where the specific structure, location, material, thickness and arrangement of the components are the same as those of the components of the conventional display back panel in the related art, and will not be repeated herein.
In another aspect of the invention, a method of making the display back panel described above is provided. According to an embodiment of the invention, referring to fig. 5 and 6a, 6b and 6c, the method may comprise the steps of:
s100: a pixel defining layer 200 defining a plurality of first openings is formed on a surface of the substrate 100 (see fig. 6a for a schematic structural view).
In accordance with an embodiment of the present invention, the specific process of forming the pixel defining layer 200 defining the plurality of first openings on the surface of the substrate 100 may be a sputtering process, and specific conditions and parameters of the sputtering process may be those of a conventional sputtering process, which will not be described herein in detail. Therefore, the method is simple and convenient to operate, easy to realize and easy for industrial production.
S200: a conductive film layer 400 is formed on a surface of the pixel defining layer 200 remote from the substrate base plate 100 (for a schematic structural view, refer to fig. 6 b).
According to an embodiment of the present invention, the specific process of forming the conductive film layer 400 on the surface of the pixel defining layer 200 away from the substrate 100 may be a sputtering process or a vacuum evaporation process, and the specific conditions and parameters of the sputtering process or the vacuum evaporation process may be those of a conventional sputtering process or vacuum evaporation process, which will not be described herein again. Therefore, the method is simple and convenient to operate, easy to realize and easy for industrial production.
According to an embodiment of the present invention, further, referring to fig. 7, the step of forming the conductive film layer may further include the sub-steps of:
s210: a metal thin film 410 is formed on a surface of the pixel defining layer 200 remote from the substrate base plate 100 (for a schematic structure, refer to fig. 8 a).
S220: a resistance adjusting layer 420 is formed on a surface of the metal thin film 410 remote from the substrate 100 (for a schematic structure, refer to fig. 8 b).
According to the embodiment of the present invention, the specific process for forming the metal thin film 410 and the resistance adjusting layer 420 is the specific process for forming the conductive film layer described above, and the detailed description is not repeated here. Therefore, the method is simple and convenient to operate, easy to realize and easy for industrial production.
S300: the light emitting element is formed so as to obtain the display back plate 10 (the schematic structural view is shown in fig. 6c or fig. 8c, and the anode, the cathode and the ineffective light emitting layer are not shown in fig. 6c and fig. 8 c).
According to the embodiment of the invention, the specific process for forming the light emitting element may be a vacuum evaporation process, an inkjet printing process, etc., and the specific conditions and parameters of the vacuum evaporation process and the inkjet printing process may be those of a conventional vacuum evaporation process and an inkjet printing process, which are not described herein in detail. Therefore, the method is simple and convenient to operate, easy to realize and easy for industrial production.
It will be understood by those skilled in the art that the order of S200 and S300 is not particularly limited, and for example, in some embodiments of the present invention, a part of the structure of the light emitting element, such as the anode, may be formed first, then the conductive film layer is formed, and finally another part of the structure of the light emitting element, such as the light emitting layer, the cathode, etc., will not be repeated here.
In yet another aspect of the present invention, a display panel is provided. According to an embodiment of the present invention, the display panel includes the display back plate described above. The display panel is not easy to generate color crosstalk among pixels, has high display quality, has all the characteristics and advantages of the display backboard, and is not repeated herein.
According to the embodiment of the invention, the display panel may further include other necessary structures and components besides the display back panel, such as a packaging structure, etc., and those skilled in the art can supplement and design the display panel according to the specific type and use requirement of the display device, which will not be repeated here.
In yet another aspect, the present invention provides a display device. According to an embodiment of the present invention, the display device includes the foregoing display panel. The display device is not easy to generate color crosstalk among pixels, has high display quality, has all the characteristics and advantages of the display panel, and is not repeated here.
According to the embodiments of the present invention, the display device may further include other necessary structures and components besides the display panel described above, and those skilled in the art may make up and design according to the specific type and use requirements of the display device, which will not be described herein in detail.
The specific kind of the display device according to the embodiment of the present invention is not particularly limited, and includes, for example, but not limited to, a mobile phone, a tablet computer, a wearable device, a game console, a television, a car-mounted display, or the like.
In the description of the present invention, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.
Claims (9)
1. A display backplane comprising a substrate base plate, a light emitting element and a pixel defining layer defining a plurality of first openings, the light emitting element comprising a cathode, an anode and a light emitting layer, the light emitting layer being located in the first openings, further comprising:
a conductive film layer disposed on a surface of the pixel defining layer remote from the substrate base plate, and electrically connected with the cathode;
the conductive film layer includes: a metal thin film disposed on a surface of the pixel defining layer remote from the substrate base plate, and electrically connected to the cathode; and the resistance adjusting layer is arranged on the surface, far away from the substrate, of the metal film, the cathode of the metal film forms a loop, and the loop has a certain resistance, so that short circuit is not easy to occur in the loop, and the metal film meets the following conditions: the thickness is 1 nm-15 nm; the minimum width of the metal film between two adjacent first openings is 1-20 mu m, and the resistance adjusting layer meets the following conditions: the thickness is 0.01 mu m to 1 mu m; the minimum width of the resistance adjusting layer between two adjacent first openings is 5-20 mu m.
2. The display backplane of claim 1, wherein a first orthographic projection of the pixel defining layer on the substrate covers a second orthographic projection of the conductive film layer on the substrate, and wherein the conductive film layer has a second opening with a gap between a contour line of the first opening and a contour line of the second opening at a location corresponding to the plurality of first openings.
3. The display back plate according to claim 1, wherein the metal film
The forming material includes at least one of magnesium, silver, ytterbium, copper, aluminum, and samarium.
4. The display back plate according to claim 1, wherein the resistance-adjusting layer
The resistivity is 100 to 10000 ohm cm.
5. The display backplane of claim 1, wherein a first orthographic projection of the pixel defining layer on the substrate and a third orthographic projection of the first opening on the substrate together comprise a fourth orthographic projection, the light-emitting element further comprising a hole injection layer disposed between the anode and the light-emitting layer, a fifth orthographic projection of the hole injection layer on the substrate overlapping the fourth orthographic projection,
and the first resistance of the light-emitting layer in the other first opening, which is conducted by the hole carriers generated by the part of the hole injection layer in one first opening, is larger than the second resistance of the light-emitting layer in the other first opening, which is conducted by the hole carriers to the conductive film layer.
6. A method of making the display back panel of any one of claims 1-5, comprising:
forming a pixel defining layer defining a plurality of first openings on a surface of the substrate base plate;
forming a conductive film layer on a surface of the pixel defining layer remote from the substrate base plate;
forming a light emitting element so as to obtain the display back plate.
7. The method of claim 6, the step of forming the conductive film layer further comprising:
forming a metal film on a surface of the pixel defining layer away from the substrate base plate;
and forming a resistance adjusting layer on the surface of the metal film, which is far away from the substrate.
8. A display panel comprising the display back panel of any one of claims 1 to 5.
9. A display device comprising the display panel of claim 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010744555.2A CN111863918B (en) | 2020-07-29 | 2020-07-29 | Display backboard, manufacturing method thereof, display panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010744555.2A CN111863918B (en) | 2020-07-29 | 2020-07-29 | Display backboard, manufacturing method thereof, display panel and display device |
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