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CN111409328A - Sandwich board and preparation method thereof - Google Patents

Sandwich board and preparation method thereof Download PDF

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Publication number
CN111409328A
CN111409328A CN202010362879.XA CN202010362879A CN111409328A CN 111409328 A CN111409328 A CN 111409328A CN 202010362879 A CN202010362879 A CN 202010362879A CN 111409328 A CN111409328 A CN 111409328A
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CN
China
Prior art keywords
epoxy resin
layer
carbon fiber
material layer
reinforcing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010362879.XA
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Chinese (zh)
Inventor
熊文华
吴卫生
程智
袁彦松
蒋枭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhongke Weihe Technology Zhaoqing Co ltd
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Zhongke Weihe Technology Zhaoqing Co ltd
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Priority to CN202010362879.XA priority Critical patent/CN111409328A/en
Publication of CN111409328A publication Critical patent/CN111409328A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/067—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of fibres or filaments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/06—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions for securing layers together; for attaching the product to another member, e.g. to a support, or to another product, e.g. groove/tongue, interlocking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B32B3/14—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a face layer formed of separate pieces of material which are juxtaposed side-by-side
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/047—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of fibres or filaments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/20—All layers being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0253—Polyolefin fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0261—Polyamide fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0276—Polyester fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/06—Vegetal fibres
    • B32B2262/062—Cellulose fibres, e.g. cotton
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/06—Vegetal fibres
    • B32B2262/062—Cellulose fibres, e.g. cotton
    • B32B2262/065—Lignocellulosic fibres, e.g. jute, sisal, hemp, flax, bamboo
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/106—Carbon fibres, e.g. graphite fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/28—Glass

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a sandwich plate which comprises a reinforcing material layer, and carbon fiber layers and epoxy resin glass fiber layers which are arranged on the upper surface and the lower surface of the reinforcing material layer, wherein the carbon fiber layers and the epoxy resin glass fiber layers are closely connected side by side. The invention also discloses a preparation method of the sandwich plate, which comprises the steps of (1) preparing glue solution, (2) manufacturing an adhesive sheet, (3) preparing a reinforcing material layer, (4) paving a carbon fiber and epoxy resin glass fiber prepreg layer and (5) hot press molding. The sandwich board prepared by the method is a non-bearing structure or part of bearing structure parts of the keyboard and the protective sleeve, has the advantages of low manufacturing cost, high strength, small transmission attenuation of electromagnetic signals and the like, and is suitable for being matched with 5G products.

Description

Sandwich board and preparation method thereof
Technical Field
The invention relates to the technical field of composite boards, in particular to an electromagnetic shielding sandwich board and a preparation method thereof.
Background
The light epoxy board is prepared by adding glass beads or hollow engineering plastics into epoxy resin to soak glass cloth, and then pressing. The lightweight epoxy board prepared by the traditional method can only be used for forming materials with smaller size such as mobile phone protective cases because the hollow filler wall is thin, the compression strength index is not high, the volume ratio of the board occupied by the lightweight epoxy board is large, and the bending strength and the bending modulus of the lightweight epoxy board are lower.
In order to obtain a light high-strength high-modulus composite material, a carbon fiber material is often used as a surface material, and a light epoxy plate is used as an intermediate material to be compounded to obtain a sandwich plate, wherein the material can improve the bending strength and the bending modulus of the material, but the carbon fiber material has electromagnetic shielding performance, so that when the material is applied to a protective sleeve, the electromagnetic transmission signal of the material is weakened, and the normal use of the product is influenced.
Therefore, it is necessary to manufacture a sandwich board with high strength and anti-electromagnetic shielding.
Disclosure of Invention
The present invention is directed to a sandwich panel and a method for manufacturing the same, which is a high-strength and light-weight sandwich panel, and solves the above-mentioned problems of the prior art.
In order to solve the technical problems, the technical scheme provided by the invention is as follows: the utility model provides a sandwich plate, include the reinforcing material layer with set up in the fine layer of carbon fiber layer and the epoxy glass of the upper and lower surface of reinforcing material layer, the fine layer of carbon fiber layer and epoxy glass is side by side zonulae occludens.
By adopting the technical scheme, the carbon fiber layer has the characteristic of high strength and can be used as a surface supporting area to improve the strength of the sandwich plate; adopt the fine layer of epoxy resin glass at electronic components position for the installation sets up electronic components, cooperatees through the fine layer of epoxy resin glass and the carbon fiber layer of high strength, ensures the signal transmission between electronic components when improving intensity, has higher practicality.
The sandwich plate is characterized in that the reinforcing material layer is impregnated with the epoxy resin compound, the carbon fiber layer and the epoxy resin glass fiber layer are used for bonding the upper surface and the lower surface of the reinforcing material layer, and the epoxy resin compound is filled with hollow glass beads.
In the sandwich plate, the carbon fiber layers are arranged into a layered structure, and the number of the carbon fiber layers is 1-8.
In the sandwich plate, the epoxy resin glass fiber layer is arranged to be of a layered structure, the number of layers is 1-8, and the thickness of the epoxy resin glass fiber layer is the same as that of the carbon fiber layer.
In the sandwich plate, the carbon fiber layer is connected with the joint part of the epoxy resin glass fiber layer in an occlusion manner. Through the occlusion connection of the cross-over part, the connection structure of the carbon fiber layer and the epoxy resin glass fiber layer is firm.
The sandwich plate comprises a sandwich plate body, wherein the epoxy resin compound comprises one or more of bisphenol A type novolac epoxy resin, o-cresol epoxy resin, phosphorus-containing epoxy resin or dicyclopentadiene epoxy resin.
In the sandwich plate, the density of the plate of the reinforcing material layer is 0.5-1.5 g/cm3The thickness is 0.3 to 5.0 mm.
The sandwich plate comprises a sandwich plate body, wherein the sandwich plate body is made of a sandwich material layer, and the sandwich plate body is made of a sandwich plate body made of a sandwich material layer.
According to the sandwich plate, the hollow glass beads with the content of 15% -70% of the total weight of the reinforcing material layer are added into the reinforcing material layer.
In order to solve the above technical problems, another technical solution provided by the present invention is: the preparation method for manufacturing the sandwich plate in the technical scheme comprises the following steps:
(1) preparing glue solution: uniformly mixing epoxy resin and a curing agent according to a certain mass ratio to form an epoxy resin glue solution, adding 5-70% of hollow glass microspheres in percentage by weight of the total weight into the glue solution, and fully dispersing the hollow glass microspheres in the glue solution;
(2) manufacturing an adhesive sheet: soaking glass fiber cloth in the epoxy resin glue solution obtained in the step (1), and baking to form a prepreg bonding sheet with the thickness of 0.1-0.3 mm;
(3) preparing a reinforcing material layer: laying a corresponding number of semi-cured bonding sheets in the step (2), and performing hot-pressing curing under high-temperature, high-pressure and vacuum conditions, wherein the temperature is 130-200 ℃, the pressure is 40-180 psi, and the vacuum degree under the vacuum condition is 20-60 torr, so as to form a fully-cured lightweight plate;
(4) laying carbon fiber and epoxy resin glass fiber prepreg layers: symmetrically laying carbon fiber layers and epoxy resin glass fiber prepreg layers on the upper surface and the lower surface of the fully-cured lightweight board, wherein the carbon fiber layers and the epoxy resin glass fiber prepreg layers are laid side by side and are connected at the joint part through occlusion;
(5) hot-press molding: and starting the hot press, carrying out secondary hot-pressing curing molding, and cooling to obtain the sandwich plate, wherein the temperature of the secondary hot pressing is 130-200 ℃, the pressure is 40-180 psi, and the vacuum degree under the vacuum condition is 20-60 torr.
The beneficial effects obtained by the invention are as follows: through the epoxy compound, with the superficial layer and the reinforcing material layer complex that the fine layer of carbon fiber layer and epoxy glass is constituteed, wherein contain hollow glass microballon in the reinforcing material layer, the sandwich panel quality that obtains is lighter, intensity is higher and have anti-electromagnetic shielding function, accessible machining method and thermoplastic material are compound, non-bearing structure or partial bearing structure part as keyboard and protective sheath, have advantages such as the cost of manufacture is low, intensity is high, electromagnetic signal transmission decay reduces, be fit for being used for the supporting use of 5G product.
Drawings
FIG. 1 is a schematic view of a layered structure of a sandwich panel according to the invention;
FIG. 2 is a schematic cross-sectional view of the sandwich panel of FIG. 1.
Description of reference numerals: 1 reinforcing material layer, 2 carbon fiber layers, 3 fine layers of epoxy resin glass.
Detailed Description
The invention is further described with reference to the following figures and detailed description.
Referring to fig. 1 and 2, the sandwich plate comprises a reinforcing material layer 1, and a carbon fiber layer 2 and an epoxy resin glass fiber layer 3 which are arranged on the upper surface and the lower surface of the reinforcing material layer 1, wherein the carbon fiber layer 2 and the epoxy resin glass fiber layer 3 are closely connected side by side. Carbon fiber layer 2 and the fine layer 3 of epoxy resin glass are as support panel and the panel that sets up installation electronic components and parts and use respectively, have anti-electromagnetic shielding effect when raising strength. Further, carbon fiber layer 2 is connected with the 4 interlocks of handing-over position of the fine layer 3 of epoxy resin glass, and wherein, the interlock of carbon fiber layer 2 and the fine layer 3's of epoxy resin glass's handing-over position is connected and can be the interlock mode of cockscomb structure, still can be the interlock mode of other forms, for example through setting up protruding and groove structure of mutually supporting at the handing-over position.
The reinforcing material layer 1 is impregnated with epoxy resin compound for bonding the carbon fiber layer 2 and the epoxy resin glass fiber layer 3 on the upper and lower surfaces of the reinforcing material layer 1, and hollow glass beads are filled in the epoxy resin compound. Wherein, the carbon fiber layer 2 and the epoxy resin glass fiber layer 3 are symmetrically arranged on two surfaces of the reinforcing material layer 1.
In the present embodiment, the carbon fiber layer 2 is provided as a layered structure, and the number of layers is 1 to 8, and in other embodiments, the number of layers of the carbon fiber layer 2 may be 1 to 4. The epoxy resin glass fiber layer 3 is set to be a layered structure, the number of layers is 1-8, and the thickness of the epoxy resin glass fiber layer 3 is the same as that of the carbon fiber layer 2. In other embodiments, the epoxy fiberglass layer 3 may be provided in 1-4 layers.
The epoxy resin compound comprises one or more of bisphenol A novolac epoxy resin, o-cresol epoxy resin, phosphorus-containing epoxy resin or dicyclopentadiene epoxy resin.
In the present embodiment, the reinforcing material layer 1 has a plate density of 0.5 to 1.5g/cm3The thickness is 0.3 to 5.0mm, and in other embodiments, the density of the reinforcing material layer 1 is preferably 0.5 to 1.0g/cm3. Wherein, the reinforcing material layer 1 comprises any one of polyester fiber, polypropylene fiber, glass fiber, polyamide fiber, hemp fiber, cotton fiber and aramid fiber or the compound combination thereof. Furthermore, the hollow glass beads with the content of 15-70% of the total weight of the reinforcing material layer are added into the reinforcing material layer 1, so that the reinforcing material layer 1 can strengthen the strength and reduce the weight at the same time. In other embodiments, the hollow glass microspheres may be present in an amountIs 30 to 50 percent.
The invention also discloses a preparation method of the sandwich plate, which comprises the following steps:
(1) preparing glue solution: uniformly mixing epoxy resin and a curing agent according to a certain mass ratio to form an epoxy resin glue solution, adding 5-70% of hollow glass microspheres in percentage by weight of the total weight into the glue solution, and fully dispersing the hollow glass microspheres in the glue solution;
(2) manufacturing an adhesive sheet: soaking glass fiber cloth in the epoxy resin glue solution obtained in the step (1), and baking to form a prepreg bonding sheet with the thickness of 0.1-0.3 mm;
(3) preparing a reinforcing material layer: laying a corresponding number of semi-cured bonding sheets in the step (2), and performing hot-pressing curing under high-temperature, high-pressure and vacuum conditions, wherein the temperature is 130-200 ℃, the pressure is 40-180 psi, and the vacuum degree under the vacuum condition is 20-60 torr, so as to form a fully-cured lightweight plate;
(4) laying carbon fiber and epoxy resin glass fiber prepreg layers: symmetrically laying carbon fiber layers and epoxy resin glass fiber prepreg layers on the upper surface and the lower surface of the fully-cured lightweight board, wherein the carbon fiber layers and the epoxy resin glass fiber prepreg layers are laid side by side and are connected at the joint part through occlusion;
(5) hot-press molding: and starting the hot press, carrying out secondary hot-pressing curing molding, and cooling to obtain the sandwich plate, wherein the temperature of the secondary hot pressing is 130-200 ℃, the pressure is 40-180 psi, and the vacuum degree under the vacuum condition is 20-60 torr.
The present invention is further illustrated by the following examples and comparative examples of the present invention:
the first embodiment is as follows: the preparation method is adopted to prepare the light high-strength sandwich plate with the thickness of 1.0mm, and the plate density, the bending strength and the electromagnetic signal attenuation ratio of the sandwich plate are tested.
The first comparative example is as follows: and (3) taking a pure light epoxy board with the same thickness of 1.0mm, and testing the density, the bending strength and the electromagnetic signal attenuation ratio of the board by comparison.
Comparative example two: and (3) taking a light high-strength plate which is formed by compounding carbon fiber materials in the middle of all surface layers with the same thickness of 1.0mm, and testing the density, the bending strength and the electromagnetic signal attenuation ratio of the plate by comparison.
The test results of the first example and the first and second comparative examples are compared as follows:
table 1 comparison of performance tests between examples and comparative examples
Item Example one Comparison example 1 Comparative example two
Thickness (mm) 1.0 1.0 1.0
Density (g/cm3) 1.05 0.75 1.02
Total number of samples (one) 10 10 10
Mean flexural strength (MPa) 1350 250 1500
Mean value of electromagnetic attenuation ratio (%) 0.8 0.5 >20
Compared with a pure light epoxy plate, the sandwich plate has obviously increased bending strength and can play a good role in supporting and protecting a keyboard, a tablet computer or a notebook computer.
For the sandwich plate, the surface of the composite plate is completely made of carbon fibers, the electromagnetic quantity attenuation proportion performance of the sandwich plate is improved, and the electromagnetic shielding effect is excellent.
In summary, the actual samples of the present invention are prepared according to the description and the drawings, and after a plurality of usage tests, the effect of the usage tests proves that the present invention can achieve the expected purpose, and the practical value is undoubted. The above-mentioned embodiments are only for convenience of illustration and not intended to limit the invention in any way, and those skilled in the art will be able to make equivalents of the features of the invention without departing from the technical scope of the invention.

Claims (10)

1. A sandwich panel, comprising: including reinforcing material layer (1) and set up in the fine layer (3) of carbon fiber layer (2) and the epoxy resin glass of upper and lower surface on reinforcing material layer (1), the fine layer (3) of carbon fiber layer (2) and epoxy resin glass side by side zonulae occludens.
2. The sandwich panel of claim 1, wherein: the reinforced material layer (1) is impregnated with an epoxy resin compound, the epoxy resin compound is used for bonding the carbon fiber layer (2) and the epoxy resin glass fiber layer (3) on the upper and lower surfaces of the reinforced material layer (1), and hollow glass beads are filled in the epoxy resin compound.
3. The sandwich panel of claim 1, wherein: the carbon fiber layer (2) is arranged into a layered structure, and the number of the layers is 1-8.
4. The sandwich panel of claim 3, wherein: the epoxy resin glass fiber layer (3) is of a layered structure, the number of layers is 1-8, and the thickness of the epoxy resin glass fiber layer (3) is the same as that of the carbon fiber layer (2).
5. The sandwich panel according to any one of claims 1 to 4, wherein: the carbon fiber layer (2) is connected with the joint part (4) of the epoxy resin glass fiber layer (3) in an occlusion manner.
6. The sandwich panel of claim 2, wherein: the epoxy resin compound comprises one or more of bisphenol A type novolac epoxy resin, o-cresol epoxy resin, phosphorus-containing epoxy resin or dicyclopentadiene epoxy resin.
7. The sandwich panel of claim 6, wherein: the density of the plate of the reinforcing material layer (1) is 0.5-1.5 g/cm3The thickness is 0.3 to 5.0 mm.
8. The sandwich panel of claim 7, wherein: the reinforcing material layer (1) comprises any one of polyester fiber, polypropylene fiber, glass fiber, polyamide fiber, hemp fiber, cotton fiber and aramid fiber or a composite combination thereof.
9. The sandwich panel of claim 1, wherein: the reinforcing material layer (1) is internally added with hollow glass beads with the content of 15-70% of the total weight of the reinforcing material layer.
10. A method of making a sandwich panel according to any one of claims 1 to 9, wherein: the method comprises the following steps:
(1) preparing glue solution: uniformly mixing epoxy resin and a curing agent according to a certain mass ratio to form an epoxy resin glue solution, adding 5-70% of hollow glass microspheres in percentage by weight of the total weight into the glue solution, and fully dispersing the hollow glass microspheres in the glue solution;
(2) manufacturing an adhesive sheet: soaking glass fiber cloth in the epoxy resin glue solution obtained in the step (1), and baking to form a prepreg bonding sheet with the thickness of 0.1-0.3 mm;
(3) preparing a reinforcing material layer: laying a corresponding number of semi-cured bonding sheets in the step (2), and performing hot-pressing curing under high-temperature, high-pressure and vacuum conditions, wherein the temperature is 130-200 ℃, the pressure is 40-180 psi, and the vacuum degree under the vacuum condition is 20-60 torr, so as to form a fully-cured lightweight plate;
(4) laying carbon fiber and epoxy resin glass fiber prepreg layers: symmetrically laying carbon fiber layers and epoxy resin glass fiber prepreg layers on the upper surface and the lower surface of the fully-cured lightweight board, wherein the carbon fiber layers and the epoxy resin glass fiber prepreg layers are laid side by side and are connected at the joint part through occlusion;
(5) hot-press molding: and starting the hot press, carrying out secondary hot-pressing curing molding, and cooling to obtain the sandwich plate, wherein the temperature of the secondary hot pressing is 130-200 ℃, the pressure is 40-180 psi, and the vacuum degree under the vacuum condition is 20-60 torr.
CN202010362879.XA 2020-04-30 2020-04-30 Sandwich board and preparation method thereof Pending CN111409328A (en)

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