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CN111312643A - Electronic automatic cleaning device - Google Patents

Electronic automatic cleaning device Download PDF

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Publication number
CN111312643A
CN111312643A CN202010218690.3A CN202010218690A CN111312643A CN 111312643 A CN111312643 A CN 111312643A CN 202010218690 A CN202010218690 A CN 202010218690A CN 111312643 A CN111312643 A CN 111312643A
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CN
China
Prior art keywords
support column
seat
bottom plate
support
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010218690.3A
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Chinese (zh)
Inventor
朱颖莉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanjing Institute of Railway Technology
Original Assignee
Nanjing Institute of Railway Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanjing Institute of Railway Technology filed Critical Nanjing Institute of Railway Technology
Priority to CN202010218690.3A priority Critical patent/CN111312643A/en
Publication of CN111312643A publication Critical patent/CN111312643A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02Devices for holding articles during cleaning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775Docking arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

The invention discloses an electronic automatic cleaning device, and mainly relates to the technical field of automation. The bottom plate comprises a base plate, the middle part at the top of bottom plate is equipped with the support column, the top of bottom plate uses the axial lead of support column to be equipped with a plurality of supporting seat, a plurality of as central annular array in the supporting seat including a feeding seat, a play material seat, a plurality of washing seat, the upside of feeding seat is equipped with the feeding conveyer belt of outside extension, the upside of going out the material seat is equipped with the ejection of compact conveyer belt of outside extension, the upper portion of support column is equipped with the support frame, be equipped with the elevating system of adjustment support frame height on the support column, the bottom of support frame uses the axial lead of support column to be equipped with the grabbing device that a plurality of is used for snatching the washing basket as central annular array, one side of bottom. The invention has the beneficial effects that: the diode cleaning device can improve the cleaning efficiency of the diode, reduce the cleaning cost and improve the cleaning effect.

Description

Electronic automatic cleaning device
Technical Field
The invention relates to the technical field of automation, in particular to an electronic automatic cleaning device.
Background
The diode is a commonly used electronic components, in the production of diode, need adopt the activator to wash the diode after the welding, traditional washing mode, place the diode in washing the basket, the manual work is washed in putting into different washing tanks in proper order with washing the basket, it is time-consuming and energy-consuming, low working efficiency, and some automatic belt cleaning device of current, the mode of simulating manual cleaning is mostly, utilize grabbing device to snatch washing basket, will wash the basket and place in different washing tanks in proper order and wash, generally wash the diode in the basket after finishing with the diode in a washing basket, wash the diode in the next washing basket again, though replaced the manual work, staff's intensity of labour has been reduced, but work efficiency still has very big promotion space.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides an electronic automatic cleaning device capable of circularly and uninterruptedly cleaning a diode, which can improve the cleaning efficiency of the diode, reduce the cleaning cost and improve the cleaning effect.
In order to achieve the purpose, the invention is realized by the following technical scheme:
an electronic automatic cleaning device comprises a bottom plate, wherein a support column is arranged in the middle of the top of the bottom plate and is rotatably connected with the bottom plate, a first motor used for driving the support column to rotate is arranged on one side of the support column, the first motor is arranged on the bottom plate, a plurality of support seats are arranged on the top of the bottom plate in an annular array mode by taking the axial lead of the support column as the center, the plurality of support seats comprise a feeding seat, a discharging seat and a plurality of cleaning seats, the feeding seat is adjacent to the discharging seat, a cleaning groove is arranged at the top of the cleaning seat, a feeding conveying belt extending outwards is arranged on the upper side of the feeding seat, a discharging conveying belt extending outwards is arranged on the upper side of the discharging seat, the feeding conveying belt and the discharging conveying belt are used for conveying cleaning baskets, a support frame is arranged on the upper portion of the support column and is in sliding connection with the, the lifting mechanism is arranged on the supporting column and used for adjusting the height of the supporting frame, a plurality of grabbing devices used for grabbing the cleaning basket are arranged at the bottom of the supporting frame by taking the axial lead of the supporting column as a central annular array, a control cabinet is arranged on one side of the bottom plate, and the first motor, the feeding conveying belt, the discharging conveying belt, the lifting mechanism and the grabbing devices are all in signal connection with the control cabinet.
Preferably, the bottom of support column is equipped with the supporting disk, the edge of the bottom of supporting disk is inlayed and is had a plurality of ball, ball and bottom plate butt, the bottom of supporting disk is equipped with the axle of being connected with the bottom plate rotation.
Preferably, the bottom of one side of the cleaning tank, which is far away from the supporting column, is hinged with the cleaning seat.
Preferably, the feeding conveying belt and the discharging conveying belt are respectively provided with a clapboard adaptive to the cleaning basket.
Preferably, the supporting column is a hollow column, and a conductive slip ring is arranged at the bottom of the supporting column.
Preferably, the lifting mechanism is provided with a supporting plate on one side of the top of the supporting column, the top of the supporting plate is provided with a second motor, a supporting shaft is horizontally arranged on one side of the second motor, the supporting shaft is perpendicular to a rotating shaft of the second motor, the second motor is in transmission connection with the supporting shaft through a bevel gear, cranks are arranged at two ends of the supporting shaft, one end, away from the supporting shaft, of each crank is hinged to a connecting rod, and one end, away from the crank, of each connecting rod is hinged to the supporting frame.
Preferably, the supporting column is provided with a supporting block, the top of the supporting block is provided with a guide post, and the supporting frame is provided with a guide hole matched with the guide post.
Preferably, the edge at the top of washing basket is equipped with outside extension's epitaxial plate, grabbing device includes the U type frame that the opening is decurrent, the bottom symmetry of U type frame is equipped with the clamp splice, be equipped with the recess that suits with the epitaxial plate on the clamp splice, one side that the recess was kept away from to the clamp splice is equipped with two horizon bars, be equipped with the through-hole that suits with the horizon bar on the U type frame, one side that the clamp splice was kept away from to the horizon bar is equipped with the stopper, two be equipped with the electro-magnet between the through-hole, it has the magnet that suits with the electro-magnet to inlay on the clamp splice, the cover is equipped with the spring on the horizon bar, the one end and the U type frame butt of spring, the other end.
Compared with the prior art, the invention has the beneficial effects that:
the first motor is used for driving the support column to rotate; the cleaning basket is used for placing the diode; the grabbing device is used for grabbing the cleaning basket; the number of the gripping devices is the same as that of the supporting seats, and the supporting frame rotates along with the supporting columns; during the use, when feeding conveyer belt will wash the basket and carry the upside to the feeding seat, elevating system drives the support frame and moves down, grabbing device snatchs the washing basket, elevating system drives the support frame and moves up, first motor drives the support frame and rotates certain angle, the washing basket with the feeding conveyer belt upside moves to in the washing tank adjacent with the feeding seat, then elevating system drives the support frame and reciprocates many times, feeding conveyer belt carries a washing basket to the upside of feeding seat again, outwards carries on ejection of compact conveyer belt is put to the washing basket that finishes to grabbing device of ejection of compact conveyer belt upside, accomplish a circulation, when the support column rotates the round, accomplish a plurality of cleaning cycle, can improve the cleaning efficiency of diode, reduce the cleaning cost, improve the cleaning performance.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of a connection structure between a support column and a base plate;
FIG. 3 is a schematic view of a connection structure between a support frame and a support column;
FIG. 4 is a schematic diagram of a lift mechanism;
FIG. 5 is a schematic view showing a coupling structure of the support shaft;
fig. 6 is a schematic view of the structure of the grasping apparatus.
The reference numbers in the drawings: 1. a base plate; 2. a support pillar; 3. a first motor; 4. a supporting seat; 5. a feeding seat; 6. a discharging seat; 7. cleaning a seat; 8. a cleaning tank; 9. a feed conveyor belt; 10. a discharge conveyer belt; 11. cleaning the basket; 12. a support frame; 13. a lifting mechanism; 14. a gripping device; 15. a control cabinet; 16. a support disc; 17. a ball bearing; 18. a partition plate; 19. a support plate; 20. a second motor; 21. a support shaft; 22. a crank; 23. a connecting rod; 24. a support block; 25. a guide post; 26. an epitaxial plate; 27. a U-shaped frame; 28. a clamping block; 29. a groove; 30. a horizontal bar; 31. a limiting block; 32. an electromagnet; 33. a magnet; 34. a spring; 35. a gear box.
Detailed Description
The invention will be further illustrated with reference to the following specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Further, it should be understood that various changes or modifications of the present invention may be made by those skilled in the art after reading the teaching of the present invention, and these equivalents also fall within the scope of the present application.
Example (b): as shown in fig. 1, the invention relates to an electronic automatic cleaning device, which comprises a bottom plate 1, wherein the bottom plate 1 is fixed on the ground through foundation bolts. The middle part at the top of bottom plate 1 is vertical to be equipped with support column 2, support column 2 rotates with bottom plate 1 to be connected. Preferably, for the stability of guaranteeing the support column, as shown in fig. 2, the bottom welding of support column 2 has supporting disk 16, the edge of the bottom of supporting disk 16 is inlayed and is had a plurality of ball 17, ball 17 and 1 butt of bottom plate, the bottom welding of supporting disk 16 has the axle of being connected with the rotation of bottom plate 1, and the axle of bottom plate 1 bottom is inserted in bottom plate 1 and is connected through bearing and bottom plate 1 rotation, improves the area of contact between support column 2 and the bottom plate 1 through ball 17, supporting disk 16, can improve the stability of support column greatly. Furthermore, the support column 2 is a hollow column, and a conductive slip ring is arranged at the bottom of the support column 2, so that a lead is convenient to arrange, and electric energy can be provided for parts on the rotating support column 2. One side of support column 2 is equipped with and is used for driving support column 2 pivoted first motor 3, first motor 3 installs on bottom plate 1, is connected through gear drive between shown first motor 3 and the support column 2, and first motor 3 starts, can drive support column 2 and rotate. The top of bottom plate 1 uses the axial lead of support column 2 to weld as central annular array has a plurality of supporting seat 4, and the quantity of supporting seat 4 can be set for as required, can establish six, six including a feeding seat 5, a play material seat 6, four wash seat 7 in the supporting seat 4, feeding seat 5 is adjacent with ejection of compact seat 6, and the top of washing seat 7 is equipped with washing tank 8, contains the activator in the washing tank 8 for wash the diode. Preferably, in order to facilitate cleaning of the cleaning tank, the bottom of the side of the cleaning tank 8 away from the supporting column 2 is hinged with the cleaning seat 7. The upside of feeding seat 5 is equipped with the feeding conveyer belt 9 of outside extension, the upside of play material seat 6 is equipped with the ejection of compact conveyer belt 10 of outside extension, feeding conveyer belt 9, ejection of compact conveyer belt 10 are used for carrying washing basket 11, and is preferred, for the convenience of washing basket's location all inlay on feeding conveyer belt 9, the ejection of compact conveyer belt 10 and have a plurality of and wash 11 baffle 18 that suit of basket, and the distance between two adjacent baffles 18 suits with the width that washs basket 11, will wash the basket card between two baffles 18, is used for the location, is convenient for snatch. The upper portion of support column 2 is equipped with support frame 12, and support frame 12 adopts annular support or plectane, and the middle part of support frame 12 is equipped with the through hole that suits with support column 2, and support frame 12 can slide from top to bottom along support column 2. Preferably, in order to ensure the stability of the up-and-down movement of the support frame, as shown in fig. 3, a support block 24 is welded on the support column 2, two guide posts 25 are vertically welded on the top of the support block 24, a guide hole adapted to the guide post 25 is formed in the support frame 12, and the guide post 25 is matched with the guide hole to provide a guide for the up-and-down movement of the support frame 12. And the supporting column 2 is provided with a lifting mechanism 13 for adjusting the height of the supporting frame 12, and the lifting mechanism 13 can adopt an air cylinder. Further, in order to meet the requirement of frequent lifting of the support frame, as shown in fig. 4 and 5, the lifting mechanism 13 includes a support plate 19 welded on one side of the top of the support column 2, a second motor 20 is arranged on the top of the support plate 19, the second motor 20 is fixed on the support plate 19 through screws, a support shaft 21 is horizontally arranged on one side of the second motor 20, the support shaft 21 is perpendicular to a rotating shaft of the second motor 20, both the rotating shaft of the second motor 20 and the support shaft 21 are provided with bevel gears, the support plate 19 is provided with a gear box 35, both the second motor 20 and the bevel gears on the support shaft 21 are located in the gear box 35, the support shaft 21 is rotatably connected with the gear box 35, both ends of the support shaft 21 extend out of the gear box 35, the second motor 20 is in transmission connection with the support shaft 21 through the bevel gears, both ends of the support shaft 21 are provided with, crank 22 and back shaft 21 key-type connection, the one end that back shaft 21 was kept away from to crank 22 articulates there is connecting rod 23, the one end that crank 22 was kept away from to connecting rod 23 is articulated with support frame 12, utilizes two sets of crank rocker mechanisms to provide balanced vertical ascending power of side for support frame 12, can guarantee the stability that support frame 12 frequently goes up and down. The bottom of support frame 12 uses the axial lead of support column 2 to be equipped with a plurality of grabbing device 14 that is used for snatching washing basket 11 as central annular array, preferentially, in order to snatch washing basket, as shown in fig. 6, the edge at the top of washing basket 11 is equipped with outside extension board 26, grabbing device 14 includes U type frame 27 that the opening is decurrent, the bottom symmetry of U type frame 27 is equipped with clamp 28, be equipped with the recess 29 that suits with extension board 26 on the clamp 28, the clamp 28 is kept away from one side of recess 29 and is equipped with two horizontal poles 30, be equipped with the through-hole that suits with horizontal pole 30 on the U type frame 27, the one side that clamp 28 was kept away from to horizontal pole 30 is equipped with stopper 31, two be equipped with electro-magnet 32 between the through-hole, inlay the magnet 33 that suits with electro-magnet 32 on the clamp 28, the cover is equipped with spring 34 on the horizontal pole 30, spring 34's one end and U type frame 27 butt, the other end and clamp splice 28 butt, when electro-magnet 32 circular telegram, electro-magnet 32 attracts magnet 33, the length that is greater than washing basket 11 between two clamp splice 28, electro-magnet 32 outage, spring 34 promotes clamp splice 28, and the distance between two clamp splice reduces, and extension board 26 card is gone into in the recess 29, can be firm snatch washing basket 11, guarantees to wash the stability that basket 11 reciprocated the in-process. One side of the bottom plate 1 is provided with a control cabinet 15, and the first motor 3, the feeding conveyer belt 9, the discharging conveyer belt 10, the lifting mechanism 13 and the gripping device 14 are in signal connection with the control cabinet 15.
Taking six supporting seats 4 as an example, when in use, the feeding conveyer belt 9 conveys the cleaning basket 11 to the upper side of the feeding seat 5, the lifting mechanism 13 drives the supporting frame 12 to move downwards, after the grabbing device 14 grabs the cleaning basket, the lifting mechanism 13 drives the supporting frame 12 to move upwards, the first motor 3 drives the supporting frame 12 to rotate 60 degrees, the cleaning basket 11 on the upper side of the feeding conveyer belt 9 is moved to the upper side of the cleaning tank 8 adjacent to the feeding seat 5, then the lifting device 13 drives the supporting frame 12 to move upwards and downwards for a plurality of times, the cleaning basket 11 moves upwards and downwards in the cleaning tank 8 to clean diodes in the cleaning basket 11, the feeding conveyer belt 9 conveys one cleaning basket 11 to the upper side of the feeding seat 5, the grabbing device 14 on the upper side of the discharging conveyer belt 10 puts the cleaned cleaning basket 11 onto the discharging conveyer belt 10 to convey outwards to complete a cycle, when the supporting column 2 rotates for, the diode cleaning device can complete four times of cleaning, improve the cleaning efficiency of the diode, reduce the cleaning cost and improve the cleaning effect.

Claims (8)

1. The utility model provides an electronic automation belt cleaning device, includes bottom plate (1), its characterized in that: the middle part of the top of the bottom plate (1) is provided with a support column (2), the support column (2) is rotatably connected with the bottom plate (1), one side of the support column (2) is provided with a first motor (3) for driving the support column (2) to rotate, the first motor (3) is installed on the bottom plate (1), the top of the bottom plate (1) is provided with a plurality of support seats (4) by taking the axial lead of the support column (2) as a central annular array, the plurality of support seats (4) comprise a feeding seat (5), a discharging seat (6) and a plurality of cleaning seats (7), the feeding seat (5) is adjacent to the discharging seat (6), the top of the cleaning seat (7) is provided with a cleaning groove (8), the upside of the feeding seat (5) is provided with a feeding conveyer belt (9) extending outwards, the upside of the discharging seat (6) is provided with a discharging conveyer belt (10) extending outwards, feeding conveyer belt (9), ejection of compact conveyer belt (10) are used for carrying washing basket (11), the upper portion of support column (2) is equipped with support frame (12), support frame (12) and support column (2) sliding connection, be equipped with elevating system (13) of adjustment support frame (12) height on support column (2), the bottom of support frame (12) is equipped with grabbing device (14) that a plurality of is used for snatching washing basket (11) as central annular array with the axial lead of support column (2), one side of bottom plate (1) is equipped with switch board (15), first motor (3), feeding conveyer belt (9), ejection of compact conveyer belt (10), elevating system (13), grabbing device (14) all with switch board (15) signal connection.
2. The electronic automated cleaning apparatus of claim 1, wherein: the bottom of support column (2) is equipped with supporting disk (16), the edge of the bottom of supporting disk (16) is inlayed and is had a plurality of ball (17), ball (17) and bottom plate (1) butt, the bottom of supporting disk (16) is equipped with the axle of being connected with bottom plate (1) rotation.
3. The electronic automated cleaning apparatus of claim 1, wherein: the bottom of one side of the cleaning tank (8) far away from the supporting column (2) is hinged with the cleaning seat (7).
4. The electronic automated cleaning apparatus of claim 1, wherein: the feeding conveying belt (9) and the discharging conveying belt (10) are respectively provided with a clapboard (18) which is adaptive to the cleaning basket (11).
5. The electronic automated cleaning apparatus of claim 1, wherein: the support column (2) is a hollow column, and a conductive slip ring is arranged at the bottom of the support column (2).
6. The electronic automated cleaning apparatus of claim 1, wherein: elevating system (13) are equipped with backup pad (19) including fixing in one side at the top of support column (2), the top of backup pad (19) is equipped with second motor (20), one side level of second motor (20) is equipped with back shaft (21), back shaft (21) are perpendicular with the pivot of second motor (20), be connected through bevel gear transmission between second motor (20) and back shaft (21), the both ends of back shaft (21) all are equipped with crank (22), the one end that back shaft (21) were kept away from in crank (22) articulates there is connecting rod (23), the one end that crank (22) were kept away from in connecting rod (23) is articulated with support frame (12).
7. The electronic automated cleaning apparatus of claim 1, wherein: the supporting frame is characterized in that a supporting block (24) is arranged on the supporting column (2), a guide post (25) is arranged at the top of the supporting block (24), and a guide hole matched with the guide post (25) is formed in the supporting frame (12).
8. The electronic automated cleaning apparatus of claim 1, wherein: the edge at the top of washing basket (11) is equipped with outside extension board (26), grabbing device (14) are including opening decurrent U type frame (27), the bottom symmetry of U type frame (27) is equipped with clamp splice (28), be equipped with recess (29) that suit with extension board (26) on clamp splice (28), one side that recess (29) were kept away from in clamp splice (28) is equipped with two horizon bars (30), be equipped with the through-hole that suits with horizon bar (30) on U type frame (27), one side that clamp splice (28) were kept away from in horizon bar (30) is equipped with stopper (31), two be equipped with electro-magnet (32) between the through-hole, it has magnet (33) that suit with electro-magnet (32) to inlay on clamp splice (28), the cover is equipped with spring (34) on horizon bar (30), the one end and the U type frame (27) butt of spring (34), the other end is abutted against the clamping block (28).
CN202010218690.3A 2020-03-25 2020-03-25 Electronic automatic cleaning device Pending CN111312643A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010218690.3A CN111312643A (en) 2020-03-25 2020-03-25 Electronic automatic cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010218690.3A CN111312643A (en) 2020-03-25 2020-03-25 Electronic automatic cleaning device

Publications (1)

Publication Number Publication Date
CN111312643A true CN111312643A (en) 2020-06-19

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Application Number Title Priority Date Filing Date
CN202010218690.3A Pending CN111312643A (en) 2020-03-25 2020-03-25 Electronic automatic cleaning device

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Country Link
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114872239A (en) * 2022-05-24 2022-08-09 江西迪亚特自动化设备有限公司 Tire mould laser cleaning equipment
CN115513117A (en) * 2022-11-22 2022-12-23 芯达半导体设备(苏州)有限公司 Wafer back washing adsorption device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114872239A (en) * 2022-05-24 2022-08-09 江西迪亚特自动化设备有限公司 Tire mould laser cleaning equipment
CN115513117A (en) * 2022-11-22 2022-12-23 芯达半导体设备(苏州)有限公司 Wafer back washing adsorption device
CN115513117B (en) * 2022-11-22 2023-03-10 芯达半导体设备(苏州)有限公司 Wafer back washing adsorption device

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