CN111010807A - PCB thin plate solder mask hole plugging method with plate thickness less than 600um - Google Patents
PCB thin plate solder mask hole plugging method with plate thickness less than 600um Download PDFInfo
- Publication number
- CN111010807A CN111010807A CN201911372006.0A CN201911372006A CN111010807A CN 111010807 A CN111010807 A CN 111010807A CN 201911372006 A CN201911372006 A CN 201911372006A CN 111010807 A CN111010807 A CN 111010807A
- Authority
- CN
- China
- Prior art keywords
- hole
- plugging
- solder mask
- plate
- hole plugging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09581—Applying an insulating coating on the walls of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention belongs to the technical field of board thickness, and particularly relates to a PCB sheet solder-resisting hole plugging method with the board thickness less than 600 um. The invention realizes the comprehensive effect that the plugging requirement of the PCB board is equal to or more than 70% of the full plugging slice, the plugging is smooth, the problem of false copper exposure of plugging holes due to yellowing is avoided, and the final plugging quality meets the requirement of a client.
Description
Technical Field
The invention relates to the technical field of board thickness, in particular to a PCB thin board solder mask hole plugging method with the board thickness less than 600 um.
Background
Pcb (printed circuit board), i.e. printed wiring board, printed circuit board for short, is one of the important parts in the electronics industry. Almost every kind of electronic equipment, as small as electronic watches, calculators, as large as computers, communication electronics, military weaponry systems, has electronic components such as integrated circuits, and printed boards are used to electrically interconnect the various components. The printed circuit board consists of an insulating bottom plate, a connecting lead and a welding disc for assembling and welding electronic elements, and has double functions of a conductive circuit and the insulating bottom plate. The circuit can replace complex wiring to realize electrical connection among elements in the circuit, thereby simplifying the assembly and welding work of electronic products, reducing the wiring workload in the traditional mode and greatly lightening the labor intensity of workers; and the volume of the whole machine is reduced, the product cost is reduced, and the quality and the reliability of the electronic equipment are improved. The printed circuit board has good product consistency, can adopt standardized design, and is beneficial to realizing mechanization and automation in the production process. Meanwhile, the whole printed circuit board subjected to assembly and debugging can be used as an independent spare part, so that the exchange and maintenance of the whole product are facilitated. At present, printed wiring boards have been used very widely in the manufacture of electronic products.
The earliest printed wiring boards used paper-based copper-clad printed boards. Since the advent of semiconductor transistors in the 50's of the 20 th century, the demand for printed boards has risen dramatically. Particularly, due to rapid development and wide application of integrated circuits, electronic devices are smaller and smaller, and the circuit wiring density and difficulty are higher and higher, which requires continuous updating of printed boards. At present, the variety of the printed board is developed from a single-sided board to a double-sided board, a multilayer board and a flexible board; the structure and quality have also been developed to ultra-high density, miniaturization, and high reliability; new design methods, design articles, board making materials and board making processes are emerging continuously. In recent years, application software of various Computer Aided Design (CAD) printed wiring boards has been popularized and popularized in the industry, and in specialized printed wiring board manufacturers, the manual operation has been completely replaced by the mechanical and automatic production.
Copper exposure and redness appear in the poor orifice of traditional via hole plughole plumpness, and plug hole department unevenness BGA encapsulation department printing ink unevenness influences customer's encapsulation, and the phenomenon of soldering and welding foaming, peeling appears in the orifice printing ink after hot-blast flattening behind the via hole plughole simultaneously, can't satisfy the requirement of customer to the consent quality.
Disclosure of Invention
This section is for the purpose of summarizing some aspects of embodiments of the invention and to briefly introduce some preferred embodiments. In this section, as well as in the abstract and the title of the invention of this application, simplifications or omissions may be made to avoid obscuring the purpose of the section, the abstract and the title, and such simplifications or omissions are not intended to limit the scope of the invention.
The invention is provided in view of the above and/or the problems existing in the conventional solder mask via hole method for the PCB thin plate with the plate thickness less than 600 um.
Therefore, the invention aims to provide a PCB sheet solder mask hole plugging method with the plate thickness of less than 600um, which realizes that the PCB has the hole plugging requirement, can reach the plump not less than 70% of the hole plugging slice, realizes smooth hole plugging, does not have the problem of hole plugging yellowing false copper exposure, and finally realizes the hole plugging quality meeting the requirements of customers.
To solve the above technical problem, according to an aspect of the present invention, the present invention provides the following technical solutions:
a PCB sheet resistance welding hole plugging method with the plate thickness less than 600um researches and adopts a universal air guide screen printing plate, the air guide screen printing plate is suitable for plugging holes of all material numbers with the plate thickness between 100-600 um, and ensures that a cutter plug is full and the quality of the plugged holes is ensured.
As a preferable scheme of the solder mask hole plugging method of the thin plate with the plate thickness of less than 600umPCB, the method comprises the following steps: aiming at the plate thickness between 100 um-600 um, the aluminum sheet drilling is adopted as the hole plugging jig, and the drilling aperture meets the following design requirements:
1) the hole diameter of a drilled hole of the product is less than or equal to 0.3mm, and the design of an aluminum sheet is designed according to the increase of 0.1 mm.
2) The hole diameter of the drilled hole of the product is 0.3mm < the hole diameter of the drilled hole is less than or equal to 0.45, and the aluminum sheet is designed according to the same size.
3) The hole diameter of the drilled hole of the product is larger than 0.45mm, and the design of the aluminum sheet is reduced by 0.2 mm.
When the large and small holes are required during hole plugging, the hole plugging speed of the large and small holes is consistent.
As a preferable scheme of the solder mask hole plugging method of the thin plate with the plate thickness of less than 600umPCB, the method comprises the following steps: aiming at the special air guide screen plate adopted between the plate thickness of 100 um-600 um, the special manufacturing requirement of the air guide screen plate and the blocking point net operation, the specific flow is as follows:
preprocessing a stop point net connecting plug belt, printing a first surface, pre-baking a screen printing second surface, pre-baking 2 alignment, exposure, development and the like. When the first face of silk screen printing, adopt special air guide backing plate, increase scraper pressure, reduce scraper speed, make printing ink fill in to the protruding surface, nevertheless on-stick to the face, the quality of sheet metal consent is realized to the inspection back consent degree behind the first face of silk screen printing, tests the section and verifies, confirms that the consent quality satisfies customer's requirement.
Compared with the prior art: the method has the advantages that the situation that the hole plugging requirement of the PCB is met, the full size of the hole plugging slice is larger than or equal to 70%, the hole plugging is smooth, the problem that the hole plugging is yellow and false copper exposure is avoided, and finally the hole plugging quality meets the requirements of customers.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise. Wherein:
FIG. 1 is a drawing of a universal air guide plate according to the present invention;
FIG. 2 is a 3mm square side length picture of the universal air guide plate design of the present invention;
FIG. 3 is a via hole plugging picture according to the present invention;
FIG. 4 is a picture of the invention, which is enlarged to 1.5mm from the Via hole aperture.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described herein, and it will be apparent to those of ordinary skill in the art that the present invention may be practiced without departing from the spirit and scope of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
Next, the present invention will be described in detail with reference to the drawings, wherein for convenience of illustration, the cross-sectional view of the device structure is not enlarged partially according to the general scale, and the drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
The invention provides a PCB sheet resistance welding hole plugging method with a plate thickness less than 600um, which researches and adopts a universal air guide screen plate, wherein the air guide screen plate is suitable for plugging holes of all material numbers with the plate thickness between 100-600 um, ensures that a cutter plug is full, and ensures the quality of the plugged holes.
As a preferable scheme of the solder mask hole plugging method of the thin plate with the plate thickness of less than 600umPCB, the method comprises the following steps: aiming at the plate thickness between 100 um-600 um, the aluminum sheet drilling is adopted as the hole plugging jig, and the drilling aperture meets the following design requirements:
1) the hole diameter of a drilled hole of the product is less than or equal to 0.3mm, and the design of an aluminum sheet is designed according to the increase of 0.1 mm.
2) The hole diameter of the drilled hole of the product is 0.3mm < the hole diameter of the drilled hole is less than or equal to 0.45, and the aluminum sheet is designed according to the same size.
3) The hole diameter of the drilled hole of the product is larger than 0.45mm, and the design of the aluminum sheet is reduced by 0.2 mm.
When the large and small hole plugging is required, the plugging speed of the large hole is consistent with that of the small hole, and the problem that the large hole plugging is accumulated and the small hole plugging is insufficient is effectively avoided.
As a preferable scheme of the solder mask hole plugging method of the thin plate with the plate thickness of less than 600umPCB, the method comprises the following steps: aiming at the special air guide screen plate adopted between the plate thickness of 100 um-600 um, the special manufacturing requirement of the air guide screen plate and the blocking point net operation, the specific flow is as follows:
preprocessing a stop point net connecting plug belt, printing a first surface, pre-baking a screen printing second surface, pre-baking 2 alignment, exposure, development and the like. When the first face of silk screen printing, adopt special air guide backing plate, increase scraper pressure, reduce scraper speed, make printing ink fill in to the protruding surface, nevertheless on-stick to the face, the quality of sheet metal consent is realized to the inspection back consent degree behind the first face of silk screen printing, tests the section and verifies, confirms that the consent quality satisfies customer's requirement.
The PCB sheet solder-resisting hole plugging method with the thickness of less than 600 mu m can effectively realize that the plump size of a hole plugging slice is larger than or equal to 70 percent when the PCB sheet has the hole plugging requirement, the hole plugging is smooth, the problem of false copper exposure of hole plugging yellowing does not exist, the final hole plugging quality meets the requirements of customers, and the method has good economic benefit.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the various features of the disclosed embodiments of the invention may be used in any combination, provided that no structural conflict exists, and the combinations are not exhaustively described in this specification merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (3)
1. A PCB sheet solder mask hole plugging method with the thickness of less than 600um is characterized in that: the research adopts a universal air guide screen printing plate which is suitable for plugging holes of all material numbers with the plate thickness of 100-600 um, ensures that a knife plug is full and ensures the quality of the plugging holes.
2. The PCB sheet solder mask hole plugging method of claim 1, wherein the thickness of the PCB sheet solder mask hole is less than 600um, and the method comprises the following steps: aiming at the plate thickness between 100 um-600 um, the aluminum sheet drilling is adopted as the hole plugging jig, and the drilling aperture meets the following design requirements:
1) the hole diameter of a drilled hole of the product is less than or equal to 0.3mm, and the design of an aluminum sheet is designed according to the increase of 0.1 mm.
2) The hole diameter of the drilled hole of the product is 0.3mm < the hole diameter of the drilled hole is less than or equal to 0.45, and the aluminum sheet is designed according to the same size.
3) The hole diameter of the drilled hole of the product is larger than 0.45mm, and the design of the aluminum sheet is reduced by 0.2 mm.
When the large and small holes are required during hole plugging, the hole plugging speed of the large and small holes is consistent.
3. The PCB sheet solder mask hole plugging method of claim 1, wherein the thickness of the PCB sheet solder mask hole is less than 600um, and the method comprises the following steps: aiming at the special air guide screen plate adopted between the plate thickness of 100 um-600 um, the special manufacturing requirement of the air guide screen plate and the blocking point net operation, the specific flow is as follows:
preprocessing a stop point net connecting plug belt, printing a first surface, pre-baking a screen printing second surface, pre-baking 2 alignment, exposure, development and the like. When the first face of silk screen printing, adopt special air guide backing plate, increase scraper pressure, reduce scraper speed, make printing ink fill in to the protruding surface, nevertheless on-stick to the face, the quality of sheet metal consent is realized to the inspection back consent degree behind the first face of silk screen printing, tests the section and verifies, confirms that the consent quality satisfies customer's requirement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911372006.0A CN111010807A (en) | 2019-12-27 | 2019-12-27 | PCB thin plate solder mask hole plugging method with plate thickness less than 600um |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911372006.0A CN111010807A (en) | 2019-12-27 | 2019-12-27 | PCB thin plate solder mask hole plugging method with plate thickness less than 600um |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111010807A true CN111010807A (en) | 2020-04-14 |
Family
ID=70119191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911372006.0A Pending CN111010807A (en) | 2019-12-27 | 2019-12-27 | PCB thin plate solder mask hole plugging method with plate thickness less than 600um |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111010807A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112867278A (en) * | 2021-01-29 | 2021-05-28 | 深圳市强达电路有限公司 | Solder mask manufacturing method for printed circuit sheet |
| CN113677095A (en) * | 2021-08-17 | 2021-11-19 | 东莞市若美电子科技有限公司 | Manufacturing method of circuit board with air guide plate special for hole plugging printing replacing white paper hole plugging |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6291779B1 (en) * | 1999-06-30 | 2001-09-18 | International Business Machines Corporation | Fine pitch circuitization with filled plated through holes |
| CN102026495A (en) * | 2010-12-18 | 2011-04-20 | 奥士康精密电路（惠州）有限公司 | Sheet welding preventing method |
| CN106793518A (en) * | 2016-12-29 | 2017-05-31 | 奥士康科技股份有限公司 | A kind of aluminium flake consent half tone |
| CN109348633A (en) * | 2018-11-26 | 2019-02-15 | 深圳市博敏电子有限公司 | A kind of production method of PCB consent aluminium flake |
| CN110337185A (en) * | 2019-04-29 | 2019-10-15 | 惠州中京电子科技有限公司 | A kind of modified form PCB welding resistance aeroscopic plate |
-
2019
- 2019-12-27 CN CN201911372006.0A patent/CN111010807A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6291779B1 (en) * | 1999-06-30 | 2001-09-18 | International Business Machines Corporation | Fine pitch circuitization with filled plated through holes |
| CN102026495A (en) * | 2010-12-18 | 2011-04-20 | 奥士康精密电路（惠州）有限公司 | Sheet welding preventing method |
| CN106793518A (en) * | 2016-12-29 | 2017-05-31 | 奥士康科技股份有限公司 | A kind of aluminium flake consent half tone |
| CN109348633A (en) * | 2018-11-26 | 2019-02-15 | 深圳市博敏电子有限公司 | A kind of production method of PCB consent aluminium flake |
| CN110337185A (en) * | 2019-04-29 | 2019-10-15 | 惠州中京电子科技有限公司 | A kind of modified form PCB welding resistance aeroscopic plate |
Non-Patent Citations (1)
| Title |
|---|
| 曾祥福，张晃初，黄克强，贾宇治: "薄板阻焊塞孔技术探讨", 《印刷电路信息》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112867278A (en) * | 2021-01-29 | 2021-05-28 | 深圳市强达电路有限公司 | Solder mask manufacturing method for printed circuit sheet |
| CN113677095A (en) * | 2021-08-17 | 2021-11-19 | 东莞市若美电子科技有限公司 | Manufacturing method of circuit board with air guide plate special for hole plugging printing replacing white paper hole plugging |
| CN113677095B (en) * | 2021-08-17 | 2022-05-31 | 东莞市若美电子科技有限公司 | Manufacturing method of circuit board with air guide plate special for hole plugging printing replacing white paper hole plugging |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104363720B (en) | A kind of method for making deep blind slot in the pcb | |
| CN102438413B (en) | Second-order ladder groove bottom graphical printed board and processing method thereof | |
| CN102958289B (en) | Printed circuit board processing technology | |
| CN103220889B (en) | Layer manufacturing method thereof in a kind of oversize PCB backboard | |
| CN105357892A (en) | Printed circuit board and making method thereof | |
| CN104284520B (en) | A kind of PCB surface processing method | |
| CN104378931B (en) | The preparation method of metallization counterbore in a kind of PCB | |
| CN111010807A (en) | PCB thin plate solder mask hole plugging method with plate thickness less than 600um | |
| CN105578778A (en) | Manufacturing method of single-face local thick-gold plated PCB | |
| CN104717846A (en) | Method for manufacturing metallization groove holes in PCB | |
| CN107787122B (en) | Circuit board line compensation method and device | |
| CN108495486A (en) | A kind of production method and High speed rear panel of High speed rear panel | |
| CN101494957B (en) | Method and substrate for producing multi-layer circuit board | |
| CN108347838B (en) | circuit board manufacturing method, circuit board and mobile terminal | |
| CN107734859B (en) | PCB manufacturing method and PCB | |
| CN105682380B (en) | A kind of production method of the thick gold PCB of parcel plating | |
| CN110557886B (en) | Compensation method of Printed Circuit Board (PCB) cursor point, application of compensation method and PCB production process | |
| CN107172833A (en) | A kind of preparation method of high drop stepped circuit board | |
| CN105555040A (en) | Method for fabricating PCB capable of improving positional accuracy between outer pattern and drilled holes | |
| CN106525114A (en) | Method for testing production line hole making capability in positive process | |
| CN113993282A (en) | PCB pad design method, PCB pad and PCB | |
| CN114258198A (en) | Multilayer circuit board processing method for reducing plate warping | |
| CN207766641U (en) | A kind of multi-layer H DI plates of high stability | |
| CN105682365A (en) | Method of manufacturing semi-metallized platform on PCB | |
| CN106102352B (en) | A method of solving non-symmetrical line slab warping |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200414 |
|
| RJ01 | Rejection of invention patent application after publication |