CN110739257B - Operation method of micro laser system for aligning chip and substrate and fine leveling - Google Patents
Operation method of micro laser system for aligning chip and substrate and fine leveling Download PDFInfo
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- CN110739257B CN110739257B CN201911143853.XA CN201911143853A CN110739257B CN 110739257 B CN110739257 B CN 110739257B CN 201911143853 A CN201911143853 A CN 201911143853A CN 110739257 B CN110739257 B CN 110739257B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/8012—Aligning
- H01L2224/80121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/8012—Aligning
- H01L2224/80121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/8013—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
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Abstract
The invention discloses an operation method of a micro laser system for aligning and fine leveling a chip and a substrate, which solves the problem of how to combine laser fine positioning and a micro optical system together to realize bonding fine positioning. The invention realizes the alignment of the chip and the substrate by returning the coaxial light rays emitted by the microscopic imaging camera with a coaxial light source to the microscopic imaging camera after being reflected by the chip target reflector and the substrate target reflector respectively; the three positioning laser points are respectively formed on the three target reflectors on the chip by the same optical path system through the two-way laser, so that the accurate position of the horizontal plane where the chip is located is obtained, the three positioning laser points are respectively formed on the three target reflectors on the substrate by the same optical path system through the two-way laser, so that the accurate position of the horizontal plane where the substrate is located is obtained, and the accurate adjustment of the parallelism of the two planes is completed.
Description
Technical Field
The invention relates to a large-scale integrated circuit device manufacturing device, in particular to an operation method of a micro laser system for aligning and fine leveling a chip and a substrate in a bonding process device for flip chip.
Background
The flip chip welding equipment is mainly used for the flip chip welding process of manufacturing large-scale integrated circuit devices, and completes the direct interconnection and bonding of the chip and the substrate, so that the package has more excellent circuit characteristics of high frequency, low delay and low crosstalk, and the reliability of the assembly and interconnection of circuits, parts or systems can be effectively improved; the flip chip bonding equipment mainly comprises three parts: the first part is a readout circuit substrate placing table arranged on a marble reference platform, and the readout circuit substrate placing table can be adjusted in position along the X direction, in position along the Y direction and in rotation along a theta axis vertical to a plane formed by the X direction and the Y direction; the second part is a Z-direction lifting arm mechanism arranged right above the marble reference platform, the lower end of the Z-direction lifting arm mechanism is provided with a pitching and deflecting platform, a chip sucker is arranged on the pitching and deflecting platform, the main function of the Z-direction lifting arm mechanism is to realize the bonding of a chip and a substrate by pressing down, and before the bonding, the leveling of the chip sucker and the substrate sucker is realized by the adjustment of pitching and deflecting; the third part is an optical system which is arranged between the reading circuit substrate placing table and the Z-direction lifting arm mechanism and mainly used for detecting whether the chip and the substrate are aligned in place or not and detecting the parallelism of bonding of the chip and the substrate; the bonded reading circuit substrate is placed on the XY theta positioning platform, the bonded chip is adsorbed on the pitching and deflecting platform, the position of the XY theta positioning platform is adjusted and controlled, the bonded chip and the reading circuit substrate are aligned in place, the pitching and deflecting platform is adjusted, the reading circuit substrate and the bonded chip meet the bonding parallelism requirement, after alignment and parallelism adjustment are finished, the Z-direction lifting arm is pressed downwards, the bonded chip and the reading circuit substrate are pressed and bonded together, and therefore the flip-chip bonding technological process of the chip is completed.
The existing bonding process equipment is provided with an optical system, and a microscopic system and a laser system are respectively arranged in the optical system; the parallelism of the sucking discs of the bonded chip and the sucking discs for placing the reading circuit substrate is measured through a laser system in an optical system, and the parallelism of the two sucking discs can meet the requirement of the designed bonding parallelism by adjusting the pitching and the yawing platforms according to the parallelism measuring result of the two sucking discs; then, adsorbing the pre-bonded chip on a chip adsorption sucker, placing a read circuit substrate on the read circuit substrate sucker with a reflector surface, starting a microscope system, aligning the chip adsorbed on the chip adsorption sucker with the read circuit substrate adsorbed on the substrate sucker, pressing down a Z-direction lifting arm after aligning is completed, and pressing and bonding the chip and the read circuit substrate together through compression; the existing optical system only completes the parallelism detection and adjustment of a chip adsorption sucker and a read-out circuit substrate sucker, but not the parallelism determination and adjustment of two bonding bodies of a bonded chip and a read-out circuit substrate, and has the problem that the parallelism between the two bonding bodies can not be ensured to meet the design requirement when the chip and the substrate are bonded, thereby directly influencing the working performance of a circuit board after the bonding is completed; in addition, a laser system and a microscope system in an optical system of the existing equipment are respectively and independently arranged, and the defect that the optical system occupies a large space exists.
The field operation steps are as follows: the reading circuit substrate is placed on an XY theta positioning platform below, the bonded chip is adsorbed on an upper pitching deflection platform, and accurate alignment of the chip and the substrate is firstly carried out; then, the pitching deflection platform is controlled to enable the reading circuit substrate to be parallel to the bonded chip, finally, the Z-direction lifting arm presses the pitching deflection platform downwards, the bonded chip and the reading circuit substrate are bonded together through pressure welding, and therefore the flip chip bonding process of the chip is completed; the existing leveling means is used for adjusting the parallelism of the two suckers in a self-adaptive mode, namely, a chip sucker is pressed down to a substrate sucker in advance to be leveled and set, and the parallelism of the two suckers is adjusted according to the memory set for leveling.
Before bonding, the chip and the substrate are aligned and adjusted to ensure the coincidence of the pre-bonding positions on the chip and the substrate, so that the chip is accurately bonded in an inverted manner.
Disclosure of Invention
The invention provides an operation method of a micro laser system for aligning and precisely leveling a chip and a substrate, which solves the technical problem of how to combine laser precise positioning and a micro optical system together to realize bonding precise positioning.
The invention solves the technical problems by the following technical scheme:
a bonding process device for chip inversion comprises a marble reference platform, a Y-direction moving guide rail mounting base is arranged on the marble reference platform, a positioning platform Y-direction moving platform guide rail is mounted on the Y-direction moving guide rail mounting base, a positioning platform Y-direction moving slide block is arranged on the positioning platform Y-direction moving platform guide rail, a positioning platform X-direction moving guide rail is arranged on the top end surface of the positioning platform Y-direction moving slide block, a positioning platform X-direction moving slide block is arranged on the positioning platform X-direction moving guide rail, the positioning platform X-direction moving slide block is movably arranged on the positioning platform X-direction moving guide rail through the bottom surface of the rear side end of the positioning platform X-direction moving slide block, an air-floating supporting pad is arranged on the bottom surface of the front side end of the positioning platform X-direction moving slide block, the air-floating supporting pad is movably arranged on the top surface of the marble reference platform, a theta rotation platform and a rotation driving motor are respectively arranged on the top end surface of the positioning platform X-direction moving slide block, a reading circuit substrate placing table is arranged on the top surface of the theta rotating platform, a substrate sucker with a reflecting mirror surface is arranged on the reading circuit substrate placing table, a reading circuit substrate is placed on the substrate sucker with the reflecting mirror surface, and a substrate parallelism adjusting mark point is arranged on the reading circuit substrate; a Z-direction lifting arm is arranged right above the theta rotating platform, a pitching deflection adjusting motor and a pitching deflection adjusting platform are respectively arranged at the bottom end of the Z-direction lifting arm, a chip adsorption platform is fixedly arranged on the lower bottom surface of the pitching deflection adjusting platform, a chip sucker with a reflecting mirror surface is adsorbed on the lower bottom surface of the chip adsorption platform, a chip is adsorbed on the lower bottom surface of the chip sucker with the reflecting mirror surface, and a chip parallelism adjusting mark point is arranged on the lower bottom surface of the chip; an XY direction moving platform of the optical system is movably arranged between the reading circuit substrate placing platform and the Z direction lifting arm, and an optical system operation box is hung on the XY direction moving platform of the optical system.
The optical system operation box is provided with a collimation light path for leveling a chip adsorption sucker and a reading circuit substrate sucker, the collimation light path consists of a red LED point light source, a blue LED point light source, a semi-transparent semi-reflective mirror, a collimation objective lens, a reflector, a target image generating plate, a light filter, a substrate sucker with a reflecting mirror surface, a chip sucker with a reflecting mirror surface and a collimation imaging camera, an icon generated by irradiating the light of the red LED point light source on the target image generating plate is reflected by the chip sucker with the reflecting mirror surface, a chip sucker position state image A is generated in the collimation imaging camera, an icon generated by irradiating the light of the blue LED point light source on the target image generating plate is reflected by the substrate sucker with the reflecting mirror surface, and a substrate sucker position state image B is generated in the collimation imaging camera.
A bonding method for flip chip characterized by the steps of: a microscopic light path for aligning the chip and the substrate is arranged in the optical system operation box, and the microscopic light path consists of a semi-transparent semi-reflecting mirror, a collimating objective, a reflecting mirror, a focusing objective, a pentagonal prism and a microscopic imaging camera with a light source; light rays of a light source in the microscopic imaging camera with the light source irradiate the reflecting surface at the mark point on the chip, and the reflected light rays image the mark point image C of the chip in the microscopic imaging camera; meanwhile, light of a light source in a microscopic imaging camera with the light source irradiates a reflecting surface at a mark point on a substrate, the reflected light images a substrate mark point image D in the microscopic imaging camera, and if the chip mark point image C is not coincident with the substrate mark point image D, a read circuit substrate placing table is adjusted until the chip mark point image C is coincident with the substrate mark point image D, so that the alignment work of the chip and the read circuit substrate is completed.
A collimation light path structure for adjusting parallelism of a chip sucker and a substrate sucker comprises an optical system operation box, a chip sucker with a reflector surface and a substrate sucker with a reflector surface, wherein a red LED point light source is arranged in the optical system operation box, a first half-transmitting half-reflecting mirror is arranged on the right side of the red LED point light source, a first collimation objective lens is arranged on the right side of the first half-transmitting half-reflecting mirror, a target image generating plate is arranged on the right side of the first collimation objective lens, a first reflector forming an angle of 45 degrees with the horizontal plane is arranged on the right side of the target image generating plate, a second half-transmitting half-reflecting mirror is arranged under the first reflector, a second reflector forming an angle of 135 degrees with the horizontal plane is arranged on the right side of the second half-transmitting half-reflecting mirror, a first light filter is arranged right above the second reflector, and a chip sucker with a reflector surface is arranged right above the first light filter, a third reflector forming an angle of 135 degrees with the horizontal plane is arranged on the left side of the second half-transmitting half-reflecting mirror, a fourth reflector forming an angle of 135 degrees with the horizontal plane is arranged right below the third reflector, a second collimating objective lens is arranged on the left side of the fourth reflector, and a collimating imaging camera is arranged on the left side of the second collimating objective lens; a blue LED point light source is arranged under the first semi-transparent semi-reflective mirror, a fifth reflective mirror forming an angle of 45 degrees with the horizontal plane is arranged under the second semi-transparent semi-reflective mirror, a sixth reflective mirror forming an angle of 45 degrees with the horizontal plane is arranged on the right side of the fifth reflective mirror, a second optical filter is arranged under the sixth reflective mirror, and a substrate sucker with a reflective mirror surface is arranged under the second optical filter.
A target generation image A of a target image reflected by a chip sucker with a reflector and a target generation image B of the target image reflected by a substrate sucker with a reflector are respectively generated in the collimation imaging camera.
A method for adjusting the parallelism of a chip sucker and a substrate sucker by using a collimated light path is characterized by comprising the following steps:
red light rays emitted by a red LED point light source are transmitted by a first half-mirror and a first collimating objective in sequence, and then target image red light rays are formed on a target image generating plate, the formed target image red light rays are reflected by a first reflecting mirror, a second half-mirror and a second reflecting mirror in sequence, are filtered by a first optical filter, irradiate on a reflecting mirror surface of a chip sucker with a reflecting mirror surface, and are reflected by the reflecting mirror surface, and then are sequentially filtered by the first optical filter, reflected by the second reflecting mirror, transmitted by the second half-mirror, reflected by a third reflecting mirror, reflected by a fourth reflecting mirror and transmitted by the second collimating objective to generate a target generating image A in a collimating imaging camera, wherein the target generating image A is formed by the target image reflected by the chip sucker with the reflecting mirror surface;
after the blue light emitted by the blue LED point light source is reflected by the first half-transmitting half-reflecting mirror and transmitted by the first collimating objective lens in sequence, forming a target image blue light on the target image generating plate, wherein the formed target image blue light is reflected by the first reflector, transmitted by the second half-transmitting and half-reflecting mirror, reflected by the fifth reflector and reflected by the sixth reflector in sequence, after being filtered by a second optical filter, the light irradiates on a reflecting mirror surface of a substrate sucker with a reflecting mirror surface, and after being reflected by the reflecting mirror surface of the substrate sucker, the light passes through the second optical filter for filtering, the reflection of a sixth reflecting mirror, the reflection of a fifth reflecting mirror, the reflection of a second semi-permeable semi-reflecting mirror, the reflection of a third reflecting mirror, the reflection of a fourth reflecting mirror and the transmission of a second collimating objective lens in sequence, generating a target generation image B of a target image after the target image is reflected by a substrate sucker with a reflector surface in a collimation imaging camera;
and if the target generation image A and the target generation image B are not coincident, adjusting the pitching and yawing adjusting platform, changing the posture of the chip sucker with the reflecting mirror surface until the target generation image A after the target image is reflected by the chip sucker with the reflecting mirror surface is coincident with the target generation image B after the target image is reflected by the substrate sucker with the reflecting mirror surface, and finishing the adjustment operation of the parallelism of the chip sucker and the substrate sucker.
A microscopic laser system for aligning and fine leveling of chip and substrate is composed of a microscopic imaging camera with coaxial light source, a dual-channel laser, a chip and a read-out circuit substrate, the microscopic imaging camera with coaxial light source is arranged in the operation box of optical system, the first focusing objective lens is arranged at right side of the microscopic imaging camera with coaxial light source, the third collimating objective lens is arranged at right side of the first focusing objective lens, the third semi-transmitting and semi-reflecting mirror at 45 deg. to horizontal plane is arranged at right side of the third collimating objective lens, the fourth semi-transmitting and semi-reflecting mirror at 135 deg. to horizontal plane is arranged at right side of the third semi-transmitting and semi-reflecting mirror, the seventh reflecting mirror is arranged at right side of the fourth semi-transmitting and semi-reflecting mirror at 135 deg. to horizontal plane, the second focusing objective lens is arranged right above the seventh reflecting mirror, the chip is arranged right above the second focusing objective lens, and a chip target reflecting mirror is arranged on the chip, an eighth reflector is arranged under the third semi-transparent semi-reflective reflector, a fifth semi-transparent semi-reflective reflector is arranged on the right side of the eighth reflector, a pentagonal prism is arranged on the right side of the fifth semi-transparent semi-reflective reflector, a third focusing objective lens is arranged under the pentagonal prism, and a reading circuit substrate is arranged under the third focusing objective lens.
A right-angle prism is arranged between the fourth semi-transmitting semi-reflecting mirror and the fifth semi-transmitting semi-reflecting mirror, and a double-path laser is arranged on the right side of the right-angle prism.
An operation method of a micro laser system for aligning and fine leveling a chip and a substrate is characterized by comprising the following steps:
the method comprises the following steps of moving an optical system operation box hung on an XY direction moving platform of an optical system to enable a reflector image C of a first chip target on a chip and a reflector image D of a first substrate target on a substrate to be imaged in a microscopic imaging camera with a coaxial light source, wherein the specific process comprises the following steps:
after coaxial light source light rays in a microscopic imaging camera with a coaxial light source are focused by a first focusing objective lens and transmitted by a third collimating objective lens;
a part of light rays sequentially pass through the transmission of a third semi-transparent semi-reflective mirror, the transmission of a fourth semi-transparent semi-reflective mirror, the reflection of a seventh reflective mirror and the focusing of a second focusing objective lens, then irradiate on a chip target reflecting mirror arranged on a chip, and after the light rays reflected on the chip target reflecting mirror sequentially pass through the transmission of the second focusing objective lens, the reflection of the seventh reflective mirror, the transmission of the fourth semi-transparent semi-reflective mirror, the transmission of the third semi-transparent semi-reflective mirror, the transmission of a third collimating objective lens and the transmission of the first focusing objective lens, a reflecting mirror image C of a first chip target is formed in a microscopic imaging camera with a coaxial light source;
the other part of light rays sequentially pass through the reflection of a third semi-transparent semi-reflective mirror, the reflection of an eighth mirror, the transmission of a fifth semi-transparent semi-reflective mirror, the refraction of a pentagonal prism and the focusing of a third focusing objective lens, irradiate onto a substrate target reflecting mirror arranged on a read circuit substrate, and sequentially pass through the transmission of the third focusing objective lens, the refraction of the pentagonal prism, the transmission of the fifth semi-transparent semi-reflective mirror, the reflection of the eighth mirror, the reflection of the third semi-transparent semi-reflective mirror, the transmission of a third collimating objective lens and the transmission of the first focusing objective lens after being reflected by the substrate target reflecting mirror, and a reflecting mirror image D of a first substrate target is formed in the microscopic imaging camera with a coaxial light source;
starting the two-way laser, wherein the first path of laser light on the two-way laser is reflected by the upper side reflecting surface of the right-angle prism, then sequentially reflected by the fourth semi-transparent semi-reflective emitter, reflected by the seventh reflector and focused by the second focusing objective lens, and then irradiates on a chip target reflector arranged on the chip to form a laser spot on a first chip target reflector image C on the chip;
after being reflected by the lower side reflecting surface of the right-angle prism, the second path of laser light on the two-path laser device sequentially passes through the reflection of a fifth semi-transparent semi-reflective emitter, the refraction of the pentagonal prism and the focusing of a third focusing objective lens and irradiates a substrate target reflector arranged on a read circuit substrate to form a laser spot on a first substrate target reflector image D;
moving the optical system operation box suspended on the XY direction moving platform of the optical system again, repeating the steps from the first step to the fourth step to obtain a laser point on a second chip target reflector image E on the chip and a second substrate target reflector image F on the substrate corresponding to the laser point;
continuing to move the operation of the optical system suspended on the XY-direction moving platform of the optical system, and repeating the steps from the first step to the fourth step to obtain a laser point on a third chip target reflector image G on the chip and a third substrate target reflector image H on the substrate corresponding to the laser point;
a laser point on a first chip target reflector image C, a laser point on a second chip target reflector image E and a laser point on a third chip target reflector image G are made into a plane, and a chip horizontal state plane is obtained; making a laser point on the first substrate target reflector image D, a laser point on the second substrate target reflector image F and a laser point on the third substrate target reflector image H into a plane to obtain a substrate horizontal state plane;
and (3) calculating a parallelism included angle between the horizontal state plane of the chip and the horizontal state plane of the substrate, finishing fine leveling of the chip and the substrate if the parallelism included angle meets the design requirement index, adjusting the pitching deflection adjusting platform if the parallelism included angle is greater than the design requirement index, and repeating the steps from the first step to the seventh step after adjustment until the parallelism included angle meets the design requirement index.
The invention realizes the alignment of the chip and the substrate by returning the coaxial light rays emitted by the microscopic imaging camera with a coaxial light source to the microscopic imaging camera after being reflected by the chip target reflector and the substrate target reflector respectively; the method comprises the steps of forming three positioning laser points on three target reflectors on a chip respectively through a double-path laser by using the same optical path system, obtaining the accurate position of the horizontal plane where the chip is located, forming three positioning laser points on three target reflectors on a substrate respectively through the double-path laser by using the same optical path system, obtaining the accurate position of the horizontal plane where the substrate is located, calculating the included angle formed by the two planes, finally obtaining the included angle of the parallelism of the two planes, comparing the obtained included angle of the parallelism with the index required by design, and thus completing the accurate adjustment of the parallelism of the two planes.
Drawings
FIG. 1 is a schematic diagram of a laser microscope two-in-one optical path structure according to the present invention;
FIG. 2 is a schematic view of the structure of the microscopic light path of the present invention;
FIG. 3 is a schematic diagram of the laser beam path structure of the present invention;
FIG. 4 is a diagram of a collimated light path for adjusting parallelism between a chip chuck and a substrate chuck in accordance with the present invention;
FIG. 5 is a schematic diagram of the general structure of the bonding process equipment for flip chip of the present invention;
fig. 6 is a schematic view of the structure of XY θ stage on the marble reference stage 21 of the present invention;
FIG. 7 is a schematic diagram of the optical system operation platform of the present invention;
fig. 8 is a schematic structural view of the Z-direction lift arm mechanism of the present invention.
Detailed Description
The invention is described in detail below with reference to the accompanying drawings:
a bonding process device for chip flip-chip comprises a marble reference platform 21, a Y-direction moving guide rail mounting base 9 is arranged on the marble reference platform 21, a positioning platform Y-direction moving platform guide rail 8 is arranged on the Y-direction moving guide rail mounting base 9, a positioning platform Y-direction moving slider 7 is arranged on the positioning platform Y-direction moving platform guide rail 8, a positioning platform X-direction moving guide rail 6 is arranged on the top end surface of the positioning platform Y-direction moving slider 7, a positioning platform X-direction moving slider 22 is arranged on the positioning platform X-direction moving guide rail 6, the positioning platform X-direction moving slider 22 is movably arranged on the positioning platform X-direction moving guide rail 6 through the bottom surface of the rear end of the positioning platform X-direction moving slider 22, an air-floating supporting pad 10 is arranged on the bottom surface of the front end of the positioning platform X-direction moving slider 22, the air-floating supporting pad 10 is movably arranged on the top surface of the marble reference platform 21, a theta rotation platform 3 and a rotation driving motor 11 are respectively arranged on the top end surface of a positioning platform X-direction moving slide block 22, a read circuit substrate placing platform 1 is arranged on the top surface of the theta rotation platform 3, a substrate sucker 2 with a reflecting mirror surface is arranged on the read circuit substrate placing platform 1, a read circuit substrate 4 is arranged on the substrate sucker 2 with the reflecting mirror surface, and a substrate parallelism adjusting mark point 5 is arranged on the read circuit substrate 4; a Z-direction lifting arm 17 is arranged right above the theta rotary platform 3, a pitching deflection adjusting motor 18 and a pitching deflection adjusting platform 12 are respectively arranged at the bottom end of the Z-direction lifting arm 17, a chip adsorption platform 13 is fixedly arranged on the lower bottom surface of the pitching deflection adjusting platform 12, a chip sucker 14 with a reflecting mirror surface is adsorbed on the lower bottom surface of the chip adsorption platform 13, a chip 15 is adsorbed on the lower bottom surface of the chip sucker 14 with the reflecting mirror surface, and a chip parallelism adjusting mark point 16 is arranged on the lower bottom surface of the chip 15; an XY-direction moving table 19 of an optical system is movably provided between the reading circuit board placement table 1 and the Z-direction lift arm 17, and an optical system operation box 20 is hung on the XY-direction moving table 19 of the optical system.
An optical system operation box 20 is internally provided with a collimation light path for leveling a chip adsorption sucker and a reading circuit substrate sucker, wherein the collimation light path consists of a red LED point light source, a blue LED point light source, a semi-transparent semi-reflecting mirror, a collimation objective lens, a reflecting mirror, a target image generating plate, a light filter, a substrate sucker 2 with a reflecting mirror surface, a chip sucker 14 with a reflecting mirror surface and a collimation imaging camera, an icon generated by irradiating the light of the red LED point light source on the target image generating plate is reflected by the chip sucker 14 with the reflecting mirror surface, a chip sucker position state image A is generated in the collimation imaging camera, and an icon generated by irradiating the light of the blue LED point light source on the target image generating plate is reflected by the substrate sucker 2 with the reflecting mirror surface, and a substrate sucker position state image B is generated in the collimation imaging camera; the invention adjusts the pitching and the yawing degree of the chip sucker by respectively carrying out the light reflection imaging on the chip sucker and the light reflection imaging on the substrate sucker on the same target image through the collimation light path and comparing whether the two images are superposed or not, thereby achieving the parallelism of the two suckers.
A bonding method for flip chip characterized by the steps of: a microscopic light path for aligning the chip and the substrate is arranged in the optical system operation box 20, and the microscopic light path consists of a semi-transparent semi-reflecting mirror, a collimating objective lens, a reflecting mirror, a focusing objective lens, a pentagonal prism and a microscopic imaging camera with a light source; light rays of a light source in the microscopic imaging camera with the light source irradiate the reflecting surface at the mark point on the chip, and the reflected light rays image the mark point image C of the chip in the microscopic imaging camera; meanwhile, light of a light source in a microscopic imaging camera with the light source irradiates a reflecting surface at a mark point on a substrate, the reflected light images a mark point image D of the substrate in the microscopic imaging camera, and if the chip mark point image C is not coincident with the substrate mark point image D, the read circuit substrate placing table 1 is adjusted until the chip mark point image C is coincident with the substrate mark point image D, so that the alignment work of the chip and the read circuit substrate is completed; the invention combines the light source in the microscopic imaging camera, and irradiates the chip mark point and the substrate mark point through the respective light rays irradiated by the microscopic imaging camera, so that the two mark points are reflected and imaged in the microscopic imaging camera, and the accurate alignment of the chip and the substrate is realized by adjusting the superposition of the reflected and imaged two mark points.
A collimation light path structure for adjusting parallelism of a chip sucker and a substrate sucker comprises an optical system operation box 20, a chip sucker 14 with a reflector surface and a substrate sucker 2 with a reflector surface, wherein a red LED point light source 23 is arranged in the optical system operation box 20, a first half-transmitting and half-reflecting mirror 24 is arranged on the right side of the red LED point light source 23, a first collimation objective 25 is arranged on the right side of the first half-transmitting and half-reflecting mirror 24, a target image generating plate 26 is arranged on the right side of the first collimation objective 25, a first reflector 27 forming an angle of 45 degrees with the horizontal plane is arranged on the right side of the target image generating plate 26, a second half-transmitting and half-reflecting mirror 28 is arranged under the first reflector 27, a second reflector 29 forming an angle of 135 degrees with the horizontal plane is arranged on the right side of the second half-transmitting and half-reflecting mirror 28, a first light filter 30 is arranged right above the second reflector 29, a chip sucker 14 with a reflector surface is arranged right above the first optical filter 30, a third reflector 31 forming an angle of 135 degrees with the horizontal plane is arranged on the left side of the second half-mirror 28, a fourth reflector 32 forming an angle of 135 degrees with the horizontal plane is arranged right below the third reflector 31, a second collimating objective lens 33 is arranged on the left side of the fourth reflector 32, and a collimating imaging camera 34 is arranged on the left side of the second collimating objective lens 33; a blue LED point light source 35 is provided directly below the first half mirror 24, a fifth mirror 36 forming an angle of 45 ° with the horizontal plane is provided directly below the second half mirror 28, a sixth mirror 37 forming an angle of 45 ° with the horizontal plane is provided on the right side of the fifth mirror 36, a second filter 38 is provided directly below the sixth mirror 37, and a substrate chuck 2 having a reflecting mirror surface is provided directly below the second filter 38.
In the collimating and imaging camera 34, a target generation image a in which the target image is reflected by the chip chuck 14 with a mirror surface and a target generation image B in which the target image is reflected by the substrate chuck 2 with a mirror surface are generated, respectively.
A method for adjusting the parallelism of a chip sucker and a substrate sucker by using a collimated light path is characterized by comprising the following steps:
after the red light emitted by the red LED point light source 23 is transmitted by the first half mirror 24 and the first collimating objective 25 in sequence, the target image red light is formed on the target image generating plate 26, and the formed target image red light is reflected by the first reflecting mirror 27, the second half mirror 28 and the second reflecting mirror 29 in this order, after being filtered by the first optical filter 30, the light irradiates the reflecting mirror surface of the chip sucker 14 with the reflecting mirror surface, and after being reflected by the reflecting mirror surface, the light is filtered by the first optical filter 30, reflected by the second reflecting mirror 29, transmitted by the second half mirror 28, reflected by the third reflecting mirror 31, reflected by the fourth reflecting mirror 32 and transmitted by the second collimating objective lens 33 in sequence, and then a target generation image A of a target image reflected by the chip sucker 14 with the reflecting mirror surface is generated in the collimating imaging camera 34;
after the blue light emitted by the blue LED point light source 35 is reflected by the first half mirror 24 and transmitted by the first collimating objective 25, the blue light of the target image is formed on the target image generating plate 26, and the formed blue light of the target image is reflected by the first reflector 27, transmitted by the second half mirror 28, reflected by the fifth reflector 36, and reflected by the sixth reflector 37 in sequence, and after being filtered by the second filter 38, the light irradiates the reflecting mirror surface of the substrate sucker 2 with the reflecting mirror surface, and after being reflected by the reflecting mirror surface of the substrate sucker 2, the light is filtered by the second filter 38, reflected by the sixth reflecting mirror 37, reflected by the fifth reflecting mirror 36, reflected by the second half mirror 28, reflected by the third reflecting mirror 31, reflected by the fourth reflecting mirror 32 and transmitted by the second collimating objective 33, generating a target generation image B in the collimation imaging camera 34 after the target image is reflected by the substrate sucker 2 with a reflecting mirror surface;
if the target generation image A and the target generation image B are not coincident, the pitching and yawing adjusting platform 12 is adjusted, the posture of the chip sucker 14 with the reflecting mirror surface is changed until the target generation image A after the target image is reflected by the chip sucker 14 with the reflecting mirror surface is coincident with the target generation image B after the target image is reflected by the substrate sucker 2 with the reflecting mirror surface, and the adjustment operation of the parallelism of the chip sucker and the substrate sucker is completed.
A micro laser system for aligning and fine leveling of a chip and a substrate comprises a micro imaging camera 39 with a coaxial light source, a two-way laser 51, a chip 15 and a reading circuit substrate 4, wherein the micro imaging camera 39 with the coaxial light source is arranged in an optical system operation box 20, a first focusing objective lens 40 is arranged at the right side of the micro imaging camera 39 with the coaxial light source, a third collimating objective lens 41 is arranged at the right side of the first focusing objective lens 40, a third half-transmitting and half-reflecting mirror 42 forming an angle of 45 degrees with the horizontal plane is arranged at the right side of the third collimating objective lens 41, a fourth half-transmitting and half-reflecting mirror 43 forming an angle of 135 degrees with the horizontal plane is arranged at the right side of the third half-transmitting and half-reflecting mirror 42, a seventh reflecting mirror 44 is arranged at the right side of the fourth half-transmitting and half-reflecting mirror 43 forming an angle of 135 degrees with the horizontal plane, a second focusing objective lens 45 is arranged right above the seventh reflecting mirror 44, a chip 15 is provided directly above the second focusing objective 45, a chip target mirror is provided on the chip 15, an eighth mirror 46 is provided directly below the third half mirror 42, a fifth half mirror 47 is provided on the right side of the eighth mirror 46, a pentagonal prism 48 is provided on the right side of the fifth half mirror 47, a third focusing objective 49 is provided below the pentagonal prism, and the read circuit board 4 is provided directly below the third focusing objective 49.
A rectangular prism 50 is provided between the fourth half mirror 43 and the fifth half mirror 47, and a two-way laser 51 is provided on the right side of the rectangular prism 50.
An operation method of a micro laser system for aligning and fine leveling a chip and a substrate is characterized by comprising the following steps:
by moving the optical system operation box 20 suspended on the optical system XY direction moving platform 19, the mirror image C of the first chip target on the chip 15 and the mirror image D of the first substrate target on the substrate are imaged in the microscopic imaging camera 39 with a coaxial light source, and the specific process is as follows:
after the coaxial light source light in the microscopic imaging camera 39 with the coaxial light source is focused by the first focusing objective lens 40 and is transmitted by the third collimating objective lens 41;
a part of light rays sequentially pass through the third half-mirror 42 for transmission, the fourth half-mirror 43 for transmission, the seventh mirror 44 for reflection and the second focusing objective 45 for focusing, then irradiate on a chip target reflector arranged on the chip 15, the light rays reflected on the chip target reflector sequentially pass through the second focusing objective 45 for transmission, the seventh mirror 44 for reflection, the fourth half-mirror 43 for transmission, the third half-mirror 42 for transmission, the third collimating objective 41 for transmission and the first focusing objective 40 for transmission, and then a reflector image C of a first chip target is formed in the microscopic imaging camera 39 with a coaxial light source;
the other part of the light rays are reflected by the third half mirror 42, reflected by the eighth mirror 46, transmitted by the fifth half mirror 47, refracted by the pentagonal prism 48 and focused by the third focusing objective 49 in sequence, irradiate onto a substrate target mirror arranged on the read circuit substrate 4, are reflected by the substrate target mirror, and then sequentially transmit by the third focusing objective 49, refracted by the pentagonal prism 48, transmitted by the fifth half mirror 47, reflected by the eighth mirror 46, reflected by the third half mirror 42, transmitted by the third collimating objective 41 and transmitted by the first focusing objective 40, so that a mirror image D of a first substrate target is formed in the microscopic imaging camera 39 with a coaxial light source;
starting the two-way laser 51, after the first path of laser light on the two-way laser 51 is reflected by the upper side reflecting surface of the right-angle prism 50, the first path of laser light is reflected by the fourth semi-transparent semi-reflective reflector 43, reflected by the seventh reflector 44 and focused by the second focusing objective 45, and then irradiates the chip target reflector arranged on the chip 15 to form a laser spot on the first chip target reflector image C on the chip;
after being reflected by the lower side reflecting surface of the right-angle prism 50, the second path of laser light on the two-path laser 51 sequentially passes through reflection of the fifth semi-transparent semi-reflective reflector 47, refraction of the pentagonal prism 48 and focusing of the third focusing objective 49, and irradiates on a substrate target reflector arranged on the read-out circuit substrate 4 to form a laser spot on a first substrate target reflector image D;
moving the optical system operation box 20 suspended on the XY direction moving platform 19 of the optical system again, repeating the steps from the first step to the fourth step to obtain a laser point on a second chip target reflector image E on the chip and a second substrate target reflector image F on the substrate corresponding to the laser point;
continuously moving an optical system operation box 20 suspended on the XY direction moving platform 19 of the optical system, repeating the steps from the first step to the fourth step to obtain a laser point on a third chip target reflector image G on the chip and a third substrate target reflector image H on the substrate corresponding to the laser point;
a laser point on a first chip target reflector image C, a laser point on a second chip target reflector image E and a laser point on a third chip target reflector image G are made into a plane, and a chip horizontal state plane is obtained; making a laser point on the first substrate target reflector image D, a laser point on the second substrate target reflector image F and a laser point on the third substrate target reflector image H into a plane to obtain a substrate horizontal state plane;
and (3) calculating a parallelism included angle between the horizontal state plane of the chip and the horizontal state plane of the substrate, finishing fine leveling of the chip and the substrate if the parallelism included angle meets the design requirement index, adjusting the pitching deflection adjusting platform 12 if the parallelism included angle is greater than the design requirement index, and repeating the steps from the first step to the seventh step after adjustment until the parallelism included angle meets the design requirement index.
Claims (1)
1. An operation method of a micro laser system for aligning and fine leveling a chip and a substrate is characterized by comprising the following steps:
by moving an optical system operation box (20) hung on an optical system XY direction moving platform (19), a reflector image C of a first chip target on a chip (15) and a reflector image D of a first substrate target on a substrate are imaged in a microscopic imaging camera (39) with a coaxial light source, and the specific process is as follows:
the light of the coaxial light source in the microscopic imaging camera (39) with the coaxial light source is focused by a first focusing objective lens (40) and is transmitted by a third collimating objective lens (41);
a part of light rays are sequentially transmitted by a third semi-transparent semi-reflective mirror (42), transmitted by a fourth semi-transparent semi-reflective mirror (43), reflected by a seventh reflective mirror (44) and focused by a second focusing objective lens (45), then irradiate on a chip target reflective mirror arranged on a chip (15), the light rays reflected on the chip target reflective mirror are sequentially transmitted by the second focusing objective lens (45), reflected by the seventh reflective mirror (44), transmitted by the fourth semi-transparent semi-reflective mirror (43), transmitted by the third semi-transparent semi-reflective mirror (42), transmitted by a third collimating objective lens (41) and transmitted by a first focusing objective lens (40), and then a reflecting mirror image C of a first chip target is formed in a microscopic imaging camera (39) with a coaxial light source;
the other part of light rays are reflected by a third half-mirror (42), an eighth mirror (46), a fifth half-mirror (47), a pentagonal prism (48) and a third focusing objective lens (49) in sequence, irradiate onto a substrate target mirror arranged on a reading circuit substrate (4), are reflected by the substrate target mirror, and then sequentially pass through the third focusing objective lens (49), the pentagonal prism (48), the fifth half-mirror (47), the eighth mirror (46), the third half-mirror (42), the third collimating objective lens (41) and the first focusing objective lens (40) for transmission, so that a mirror image D of a first substrate target is formed in a microscopic imaging camera (39) with a coaxial light source;
starting a two-way laser (51), wherein a first path of laser light on the two-way laser (51) is reflected by an upper side reflecting surface of a right-angle prism (50), then is reflected by a fourth semi-transparent semi-reflective emitter (43), reflected by a seventh reflector (44) and focused by a second focusing objective lens (45) in sequence, and then irradiates a chip target reflector arranged on a chip (15) to form a laser spot on a first chip target reflector image C on the chip;
after being reflected by a lower side reflecting surface of a right-angle prism (50), a second path of laser light on a two-path laser (51) sequentially passes through reflection of a fifth semi-transparent semi-reflecting mirror (47), refraction of a pentagonal prism (48) and focusing of a third focusing objective lens (49) and irradiates a substrate target reflecting mirror arranged on a read-out circuit substrate (4) to form a laser spot on a first substrate target reflecting mirror image D;
moving the optical system operation box (20) hung on the XY direction moving platform (19) of the optical system again, repeating the steps from the first step to the fourth step to obtain a laser point on a second chip target reflector image E on the chip and a second substrate target reflector image F on the substrate corresponding to the laser point;
continuously moving an optical system operation box (20) hung on an XY direction moving platform (19) of the optical system, repeating the steps from the first step to the fourth step to obtain a laser point on a third chip target reflector image G on the chip and a third substrate target reflector image H on the substrate corresponding to the laser point;
a laser point on a first chip target reflector image C, a laser point on a second chip target reflector image E and a laser point on a third chip target reflector image G are made into a plane, and a chip horizontal state plane is obtained; making a laser point on the first substrate target reflector image D, a laser point on the second substrate target reflector image F and a laser point on the third substrate target reflector image H into a plane to obtain a substrate horizontal state plane;
and (3) calculating a parallelism included angle between the horizontal state plane of the chip and the horizontal state plane of the substrate, finishing fine leveling of the chip and the substrate if the parallelism included angle meets the design requirement index, and adjusting the pitching deflection adjusting platform (12) if the parallelism included angle is greater than the design requirement index until the parallelism included angle meets the design requirement index.
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| CN112666775A (en) * | 2020-11-06 | 2021-04-16 | 深圳市开玖自动化设备有限公司 | Coaxial light source imaging mechanism and lead bonding machine |
| CN115145007A (en) * | 2022-06-27 | 2022-10-04 | 深圳市路玖路玖科技有限公司 | Optical lens, optical camera shooting mechanism and chip mounter |
| CN115939009A (en) * | 2023-01-30 | 2023-04-07 | 天津中科晶禾电子科技有限责任公司 | Optical alignment method |
| CN116259554B (en) * | 2023-05-15 | 2023-10-17 | 拓荆键科(海宁)半导体设备有限公司 | Wafer bonding device, control method and storage medium |
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