CN110045269A - A kind of apparatus for testing chip and method - Google Patents
A kind of apparatus for testing chip and method Download PDFInfo
- Publication number
- CN110045269A CN110045269A CN201910386403.7A CN201910386403A CN110045269A CN 110045269 A CN110045269 A CN 110045269A CN 201910386403 A CN201910386403 A CN 201910386403A CN 110045269 A CN110045269 A CN 110045269A
- Authority
- CN
- China
- Prior art keywords
- chip
- probe
- measured
- testing
- microprocessor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
It includes pedestal, probe card, three-dimensional mobile platform, microprocessor that the present invention, which provides a kind of apparatus for testing chip and method, the test device,；When test, it is electrically connected with driving the probe in probe card to carry out three-dimensional motion from the probe made in probe card and the test contact on chip to be measured by the movement of microprocessor control three-dimensional mobile platform.Apparatus for testing chip provided by the invention and method, it can be effectively avoided that chip testing process probe bends and probe pushes defect with stronger dynamics, improve chip testing accuracy, and effectively reduce chip during the test by tissue damage a possibility that.
Description
Technical field
The invention belongs to chip testing fields, more particularly, to a kind of apparatus for testing chip and method.
Background technique
The independent research and development capacity of current chip, which has become, determines the key factor that can new technology fast-developing.In chip
R&D process in, be related to chip design, manufacture, encapsulation, test etc. multiple links, especially chip testing, as verifying core
It is particularly important whether piece manufactures the last one successful link.
It currently, is usually that being electrically connected between test macro and chip to be measured is realized using probe card to the test of chip
It connects.Specifically, by the way that the probe in probe card to be electrically connected with chip to be measured, then from microprocessor to the spy of probe card
Needle sends test signal, and receives the test signal that feeds back of probe, by microprocessor to the test signal of sending and
The test signal fed back to is analyzed, and the performance test to chip to be measured is completed.
In actual test, since each component has that height is inconsistent in circuit specific on chip surface to be measured,
The height of contact to be measured is different i.e. on chip, therefore is contacted using flexible probe with chip to be measured, to adapt to difference
The contact to be measured of height.However, the lower surging of probe card is consistent in specific test process, in order to ensure probe and often
A contact to be measured is all effectively steadily electrically connected, the contact force between contact to be measured and probe that must make height higher in this way
Contact between the contact to be measured relatively low greater than height and probe.It on the one hand will lead to and sent out in the probe test process of part as a result,
Biggish bending is sent, and influences chip testing accuracy；On the other hand also due to probe is larger by surging and destroys chip
On contact to be measured, and cause unnecessary waste.Therefore, aiming at the problems existing in the prior art, it is urgent to provide one kind to keep away
Exempt from transmitting bending and the chip detecting method excessive by surging in probe test process.
Summary of the invention
The technical problem to be solved by the present invention is in chip testing process in the prior art, probe be easily bent and
It is larger by surging, so as to cause chip testing accuracy it is not high and wear chip to be measured the problem of.To solve this technical problem,
The present invention provides a kind of apparatus for testing chip and method that probe height can be preset according to the specific structure of chip to be measured, avoids
Chip testing process probe bends and the defect excessive by surging.
The technical solution adopted by the present invention to solve the technical problems is:
A kind of apparatus for testing chip, including pedestal, probe card, three-dimensional mobile platform, microprocessor；Wherein, chip to be measured
It places on the base, probe card is arranged below three-dimensional mobile platform；Microprocessor and probe card respectively with three-dimensional mobile platform
Electrical connection；Probe card is equipped with the probe for being electrically connected with the test contact on chip to be measured.When test, by microprocessor control
The movement of three-dimensional mobile platform processed, to drive probe in probe card to carry out three-dimensional motion, from the probe made in probe card with to
The test contact surveyed on chip is electrically connected.
The present invention also provides a kind of chip detecting methods, specifically include following testing procedure:
S1 after microprocessor issues chip testing enabled instruction, is moved downward by controller control probe card, makes probe card
On probe be effectively electrically connected with the test contact on chip to be measured；
S2, microprocessor sends test signal to chip to be measured, and receives the chip testing signal fed back to by probe；
S3, test signal of the microprocessor based on sending and the feedback signal received analysis obtain chip testing result.
In the step S1, further comprise before microprocessor issues chip testing instruction:
S11 determines height value h1 of the probe tip apart from pedestal；
S12 measures physical circuit three-D profile on chip to be measured, and the three-dimensional of the chip obtained according to measurement is taken turns
Exterior feature determines the height h2 of the test contact on chip to be measured；
S13, height value h1, h2 that microprocessor is obtained based on measurement, control probe move downward distance h3, wherein h3=
H1-h2, makes to test probe and is exactly in contact with the test contact on chip to be measured, avoids probe and bends and lower surging
It is excessive；
S14, microprocessor issue prediction trial signal, and whether detection probe is effectively electrically connected with the test contact on chip to be measured
It connects, if probe is effectively electrically connected with test contact, thens follow the steps S2, otherwise, microprocessor control probe moves still further below
H3/n (n is the natural number more than or equal to 10), until detecting that probe is effectively electrically connected as with the test contact on chip to be measured
Only.
Apparatus for testing chip and method of the invention, can be effectively avoided chip testing process probe bend and
Probe pushes defect with stronger dynamics, improves chip testing accuracy, and effectively reduce chip and visited during the test
A possibility that needle damages.
Detailed description of the invention
Fig. 1 is apparatus for testing chip schematic diagram of the invention.
Fig. 2 is chip detecting method flow chart of the invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
The embodiment of the present invention, every other reality obtained by those of ordinary skill in the art without making creative efforts
Example is applied, shall fall within the protection scope of the present invention.
As shown in Figure 1, a kind of apparatus for testing chip provided by the invention, including pedestal 1, probe card 2, three-dimensional mobile platform
3, microprocessor 4；Wherein, chip 5 to be measured is placed on pedestal 1, and probe card 2 is arranged below three-dimensional mobile platform 3；Micro process
Device 4 is electrically connected with probe card 2, three-dimensional mobile platform 3 respectively；Probe card 2 be equipped with for the test contact on chip 5 to be measured
The probe 7 of 6 electrical connections.When test, the movement of three-dimensional mobile platform 3 is controlled, by microprocessor 4 to drive the spy in probe card 2
Needle 7 carries out three-dimensional motion, is electrically connected from the probe 7 made in probe card 2 and the test contact 6 on chip 5 to be measured.
Further, the probe card 2 and the probe 7 being arranged thereon are one or more.Further, described to be measured
The test contact 6 that chip 5 is is one or more.
Further, the probe 7 being arranged when the probe card 2 and thereon be it is multiple when, multiple probe card 2 respectively by
Multiple 3 independent controls of three-dimensional mobile platform respectively touch the test of different height convenient for controlling the probe 7 in multiple probe cards 2
Point 6 is carried out while being tested.
Fig. 2 is a kind of flow chart of chip detecting method provided by the invention, describes illustrative core in conjunction with Fig. 1 and Fig. 2
Chip test method.
A kind of chip detecting method based on said chip test device, including following testing procedure:
S1 after microprocessor issues chip testing enabled instruction, is moved downward by controller control probe card, makes probe card
On probe be effectively electrically connected with the test contact on chip to be measured；
S2, microprocessor sends test signal to chip to be measured, and receives the chip testing signal fed back to by probe；
S3, test signal of the microprocessor based on sending and the feedback signal received analysis obtain chip testing result.
In the step S1, further comprise before microprocessor issues chip testing instruction:
S11 determines height value h1 of the probe tip apart from pedestal；
S12 measures physical circuit three-D profile on chip to be measured, and the chip three-D profile obtained according to measurement
Determine the height h2 of core on-chip testing to be measured contact；
S13, height value h1, h2 that microprocessor is obtained based on measurement, the distance h3=h1- that control probe moves downward
H2, makes to test probe and is exactly in contact with the test contact on chip to be measured, avoids probe and bends and lower surging mistake
Greatly；
S14, microprocessor issue prediction trial signal, and whether detection probe is effectively electrically connected with the test contact on chip to be measured
It connects, if probe is effectively electrically connected with test contact, thens follow the steps S2, otherwise, microprocessor control probe moves still further below
H3/n (n is the natural number more than or equal to 10), until detecting that probe is effectively electrically connected as with the test contact on chip to be measured
Only.
Further, in the step S12, physical circuit three-D profile on chip to be measured is measured, it is specifically logical
Cross the implementation of the methods of atomic force microscope, laser scanning, optical imagery.
Further, in the step S14, the value of n is the bigger the better, preferably value 100.
Above by specific embodiment and embodiment, invention is explained in detail, but these are not composition pair
Limitation of the invention.Without departing from the principles of the present invention, those skilled in the art can also make many deformations and change
Into these also should be regarded as protection scope of the present invention.
Claims (7)
1. a kind of apparatus for testing chip, including pedestal, probe card, three-dimensional mobile platform, microprocessor；It is characterized in that, to be measured
Chip is placed on the base, and probe card is arranged on three-dimensional mobile platform bottom；Microprocessor and probe card are moved with three-dimensional respectively
Moving platform electrical connection；Probe card is equipped with the probe for being electrically connected with the test contact on chip to be measured.
2. apparatus for testing chip according to claim 1, which is characterized in that the probe in the probe card is one or more
It is a.
3. apparatus for testing chip according to claim 1, which is characterized in that the test contact on the chip to be measured is one
It is a or multiple.
4. a kind of chip detecting method based on apparatus for testing chip described in claim 1, which is characterized in that including following survey
Try is rapid:
S1 after microprocessor issues chip testing enabled instruction, is moved downward by controller control probe card, is made in probe card
Probe is effectively electrically connected with the contact on chip to be measured；
S2, microprocessor sends test signal to chip to be measured, and receives the chip testing signal fed back to by probe；
S3, test signal of the microprocessor based on sending and the feedback signal received analysis obtain chip testing result.
5. chip detecting method according to claim 4, which is characterized in that in the step S1, issued in microprocessor
Further comprise before chip testing instruction:
S11 determines height value h1 of the probe tip apart from pedestal；
S12 measures physical circuit three-D profile on chip to be measured, and is determined according to the chip three-D profile that measurement obtains
The height h2 of core on-chip testing to be measured contact；
S13, height value h1, h2 that microprocessor is obtained based on measurement control the distance h3 that probe moves downward, wherein h3=
H1-h2, makes to test probe and is exactly in contact with the test contact on chip to be measured, avoids probe and bends and lower surging
It is excessive；
S14, microprocessor issue prediction trial signal, and whether detection probe is effectively electrically connected with the test contact on chip to be measured,
If probe is effectively electrically connected with test contact, S2 is thened follow the steps, otherwise, microprocessor control probe moves h3/ still further below
N, n are the natural number more than or equal to 10, until detecting that probe is effectively electrically connected with the test contact on chip to be measured.
6. chip detecting method according to claim 4, which is characterized in that in the step S12, to having on chip to be measured
Body circuit three-D profile measures, and implements particular by the methods of atomic force microscope, laser scanning, optical imagery.
7. chip detecting method according to claim 4, which is characterized in that n value is 100.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910386403.7A CN110045269A (en) | 2019-05-09 | 2019-05-09 | A kind of apparatus for testing chip and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910386403.7A CN110045269A (en) | 2019-05-09 | 2019-05-09 | A kind of apparatus for testing chip and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110045269A true CN110045269A (en) | 2019-07-23 |
Family
ID=67281496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910386403.7A Pending CN110045269A (en) | 2019-05-09 | 2019-05-09 | A kind of apparatus for testing chip and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110045269A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110456116A (en) * | 2019-08-21 | 2019-11-15 | 大同新成新材料股份有限公司 | A kind of test device and its method of three-dimension packaging chip through silicon via |
| CN111755341A (en) * | 2020-06-03 | 2020-10-09 | 武汉光谷信息光电子创新中心有限公司 | Dotting marking method and device for silicon photonic wafer |
| CN113341258A (en) * | 2021-06-18 | 2021-09-03 | 科大讯飞股份有限公司 | Screen test fixture, method and device |
| CN113640557A (en) * | 2021-08-11 | 2021-11-12 | 山东大学 | System and method for automatically adjusting height of needle insertion |
| CN114594365A (en) * | 2022-02-24 | 2022-06-07 | 厦门大学 | Probe device and detection method for realizing low-damage detection of chip |
| CN114814543A (en) * | 2022-04-22 | 2022-07-29 | 上海晶岳电子有限公司 | Temperature impact resistance test system and method for power management chip |
| CN116153384A (en) * | 2023-04-20 | 2023-05-23 | 长鑫存储技术有限公司 | Chip testing device |
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| CN2518113Y (en) * | 2001-12-14 | 2002-10-23 | 耀华电子股份有限公司 | Combined mould for testing circuit board |
| CN1745308A (en) * | 2002-12-16 | 2006-03-08 | 佛姆费克托公司 | Apparatus and method for limiting over travel in a probe card assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110456116A (en) * | 2019-08-21 | 2019-11-15 | 大同新成新材料股份有限公司 | A kind of test device and its method of three-dimension packaging chip through silicon via |
| CN111755341A (en) * | 2020-06-03 | 2020-10-09 | 武汉光谷信息光电子创新中心有限公司 | Dotting marking method and device for silicon photonic wafer |
| CN113341258A (en) * | 2021-06-18 | 2021-09-03 | 科大讯飞股份有限公司 | Screen test fixture, method and device |
| CN113640557A (en) * | 2021-08-11 | 2021-11-12 | 山东大学 | System and method for automatically adjusting height of needle insertion |
| CN114594365A (en) * | 2022-02-24 | 2022-06-07 | 厦门大学 | Probe device and detection method for realizing low-damage detection of chip |
| CN114814543A (en) * | 2022-04-22 | 2022-07-29 | 上海晶岳电子有限公司 | Temperature impact resistance test system and method for power management chip |
| CN116153384A (en) * | 2023-04-20 | 2023-05-23 | 长鑫存储技术有限公司 | Chip testing device |
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Application publication date: 20190723 |