CN117976508B - Wafer driving device and semiconductor device - Google Patents
Wafer driving device and semiconductor device Download PDFInfo
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- CN117976508B CN117976508B CN202410390334.8A CN202410390334A CN117976508B CN 117976508 B CN117976508 B CN 117976508B CN 202410390334 A CN202410390334 A CN 202410390334A CN 117976508 B CN117976508 B CN 117976508B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 9
- 230000007246 mechanism Effects 0.000 claims abstract description 153
- 230000000149 penetrating effect Effects 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 8
- 239000007888 film coating Substances 0.000 abstract description 2
- 238000009501 film coating Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 154
- 238000006243 chemical reaction Methods 0.000 description 39
- 238000000034 method Methods 0.000 description 19
- 230000001105 regulatory effect Effects 0.000 description 11
- 230000008569 process Effects 0.000 description 10
- 238000005229 chemical vapour deposition Methods 0.000 description 7
- 238000005507 spraying Methods 0.000 description 6
- 230000003028 elevating effect Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 230000033001 locomotion Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/12—Substrate holders or susceptors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32743—Means for moving the material to be treated for introducing the material into processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32788—Means for moving the material to be treated for extracting the material from the process chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3321—CVD [Chemical Vapor Deposition]
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application discloses a wafer driving device and semiconductor equipment, wherein the wafer driving device comprises an adjusting component and a wafer driving structure connected with the adjusting component, the adjusting component is used for adjusting the position of the wafer driving structure along a first direction or a second direction, and the first direction is not overlapped with the second direction, so that the adjusting range of the adjusting component is enlarged, and the adjusting capability of the wafer driving device is improved; the wafer driving structure is provided with an end face used for bearing a wafer and used for adjusting an included angle between the end face and a horizontal plane; the wafer driving structure comprises a base, a rotating mechanism and a lifting mechanism. Through the arrangement, the wafer driving device capable of adjusting the position of the wafer in any direction is beneficial to film coating and picking of the wafer and improves the processing quality of the wafer.
Description
Technical Field
The present application relates to the field of wafer processing technology, and in particular, to a wafer driving device and a semiconductor device.
Background
In the prior art, an epitaxial growth apparatus is a common apparatus for performing a process according to a chemical vapor deposition principle, and generally includes a reaction chamber system in which a wafer is subjected to chemical vapor deposition. The reaction cavity system comprises an air inlet end, an air outlet end, a reaction cavity, a wafer conveying port and a cavity tube, wherein the air inlet end and the air outlet end are respectively positioned at two sides of the reaction cavity, the wafer conveying port and the air inlet end are positioned at the same side, the cavity tube is positioned below the reaction cavity and communicated with the reaction cavity, the air inlet device is connected at the air inlet end, the air outlet device is connected at the air outlet end, and the heating device is abutted to the upper surface and the lower surface of the reaction cavity. The reaction chamber system further comprises a wafer driving device at least partially arranged in the reaction chamber, wherein the wafer driving device is used for bearing the wafer.
Because deviation of the levelness and the gravity center of the wafer has a great influence on the film coating quality of the wafer in the chemical vapor deposition process, a device capable of realizing the position adjustment of the wafer is needed to be convenient for adjusting the position of the wafer.
Disclosure of Invention
In order to solve the defects in the prior art, the application aims to provide a wafer driving device and semiconductor equipment, which solve the problem that the wafer position adjusting means in a reaction cavity is complex.
In order to achieve the above purpose, the present application adopts the following technical scheme:
In a first aspect, the present application provides a wafer driving apparatus, the wafer driving apparatus including an adjustment assembly and a wafer driving structure, the adjustment assembly being connected to the wafer driving structure; the adjusting component is used for adjusting the position of the wafer driving structure along the first direction; the adjusting component is also used for adjusting the position of the wafer driving structure along a second direction, wherein the first direction is not coincident with the second direction; the wafer driving structure is provided with an end face for bearing a wafer, and the adjusting assembly is also used for adjusting an included angle between the end face and the horizontal plane; the wafer driving structure comprises a rotating mechanism and a lifting mechanism, the rotating mechanism and the lifting mechanism are coaxially arranged, the rotating mechanism comprises a base for bearing a wafer, the lifting mechanism comprises a telescopic piece, and the telescopic piece is arranged in the base in a penetrating manner along the vertical direction; when the rotating mechanism is connected with the lifting mechanism, the rotating mechanism and the lifting mechanism synchronously move, and the wafer is supported by the base; when the rotating mechanism is separated from the lifting mechanism, the rotating mechanism and the lifting mechanism move relatively, the telescopic piece can extend out to the upper side of the base, and the wafer is supported by the telescopic piece, so that a gap is reserved between the wafer and the base.
Further, the adjusting assembly comprises an adjusting panel and a mounting bracket, the adjusting panel comprises a first adjusting plate, a second adjusting plate, a third adjusting plate and a fourth adjusting plate which are arranged along the vertical direction, and the first adjusting plate is connected with the wafer driving structure; the fourth regulating plate is fixedly connected with the mounting bracket.
Further, the adjusting assembly further comprises a first adjusting mechanism and a second adjusting mechanism, the first adjusting mechanism is arranged between the second adjusting plate and the third adjusting plate, the first adjusting mechanism is used for moving the second adjusting plate along the first direction, the second adjusting mechanism is arranged between the third adjusting plate and the fourth adjusting plate, and the second adjusting mechanism is used for moving the third adjusting plate along the second direction.
Further, the first adjusting mechanism comprises a first adjusting piece, one end of the first adjusting piece is fixedly connected with the third adjusting plate, and the other end of the first adjusting piece is in threaded connection with the second adjusting plate; the second adjusting mechanism comprises a second adjusting piece which is basically consistent with the first adjusting piece in structure, one end of the second adjusting piece is fixedly connected with the fourth adjusting plate, and the other end of the second adjusting piece is in threaded connection with the third adjusting plate.
Further, be equipped with on the first regulating plate and run through its self regulation hole along vertical direction, adjusting part is including wearing to locate the regulating part in regulation hole, regulating part and first regulating plate threaded connection, and the regulating part is used for adjusting the interval of first regulating plate and second regulating plate in vertical direction.
Further, the wafer driving structure further comprises an adjusting block and a driving motor, wherein the adjusting block is used for connecting the rotating mechanism and the lifting mechanism; the driving motor is in transmission connection with the lifting mechanism and is used for driving the lifting mechanism to move along the vertical direction.
Further, the lifting mechanism comprises a lifting shaft and a lifting support, the lifting shaft is connected with the lifting support, the rotating mechanism comprises a rotating shaft and a rotating support, the rotating shaft is connected with the rotating support, the rotating shaft penetrates through the lifting shaft and supports the base, and the adjusting block is used for connecting the lifting support and/or the rotating support.
Further, when the lifting support is connected with the rotating support through the adjusting block, the lifting shaft and the rotating shaft move synchronously in the vertical direction, and when the adjusting block is separated from the lifting support and/or the rotating support, the lifting shaft and the rotating shaft move relatively in the vertical direction.
Further, the telescopic member is arranged at the top end of the lifting shaft, and when the adjusting block is separated from the lifting support and/or the rotating support, the lifting shaft can push the telescopic member to extend out of the base along the vertical direction.
In a second aspect, the present application also provides a semiconductor device comprising any one of the wafer driving apparatuses of the first aspect.
Above-mentioned reaction chamber module can be through setting up the connected mode of regulating block to realize the pick-up mode of quick change wafer, thereby improve the high efficiency of wafer at the pick-up in-process, wafer drive arrangement has not only integrated multiple wafer pick-up mode simultaneously, still is convenient for switch wafer pick-up mode, and then is favorable to improving wafer drive arrangement's regulatory capacity and wholeness ability, and the structure of adjusting the subassembly has been optimized, in order to increase the accommodation of adjusting the subassembly, still be favorable to improving wafer drive arrangement's regulatory capacity simultaneously.
Drawings
FIG. 1 is a schematic view of the overall structure of a reaction chamber module according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a wafer driving apparatus according to an embodiment of the application.
FIG. 3 is an exploded view of the structure of the regulator panel according to the embodiment of the present application.
Fig. 4 is an enlarged view of a portion of fig. 3a in accordance with the present application.
Fig. 5 is a schematic view of a portion of a wafer driving apparatus according to an embodiment of the application.
Fig. 6 is a schematic diagram of a pick-up method on a wafer driving apparatus according to an embodiment of the present application.
Fig. 7 is a schematic diagram of a structure of a pick-up method under a wafer driving apparatus according to an embodiment of the present application.
Fig. 8 is a partial enlarged view of the present application at B in fig. 7.
Fig. 9 is a schematic structural view of a first adjusting member according to an embodiment of the present application.
Fig. 10 is a schematic diagram illustrating steps of a method for picking up a part according to an embodiment of the present application.
In the figure: the reaction chamber module 100, the accommodation space 101, the first direction 102, the second direction 103, the reference surface 104, the gap 201, the frame 11, the connection plate 111, the housing 12, the reaction chamber 13, the gas inlet device 14, the wafer drive device 15, the wafer drive structure 151, the base 1511, the rotating mechanism 1512, the rotating bracket 1512a, the rotating shaft 1512b, the lifting mechanism 1513, the telescopic member 1513a, the lifting bracket 1513b, the lifting shaft 1513c, the adjusting block 1514, the driving motor 1515, the adjusting assembly 152, the adjusting panel 1521, the first adjusting plate 1521a, the second adjusting plate 1521b, the third adjusting plate 1521c, the fourth adjusting plate 1521d, the mounting bracket 1522, the mounting post 1522a, the first adjusting mechanism 1523, the first slider 1523a, the first adjusting member 1523b, the first portion 1523c, the second portion 1523d, the second adjusting mechanism 1524, the second slider 1524a, the second adjusting member 1524b, the adjusting hole 1525, the adjusting member 1526, the adjusting member 1521c, the integrated bracket 1521, the mechanical fork 153, and the mechanical fork 17.
Detailed Description
In order to make the present application better understood by those skilled in the art, the technical solutions in the specific embodiments of the present application will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present application.
The application provides a semiconductor device, which comprises an epitaxial growth furnace, wherein the epitaxial growth furnace at least comprises a feeding module, a carrying cavity module, a reaction cavity module 100, a special gas module and a power cabinet, and the feeding module, the carrying cavity module, the reaction cavity module 100 and the special gas module are sequentially connected into an integral structure.
The reactor module 100 shown in FIG. 1, which uses CVD (Chemical Vapor Deposition) techniques, CVD is known as chemical vapor deposition, is a chemical reaction process. It is formed into a desired film by heating one or more gases to decompose it, produce reaction products, and deposit on the semiconductor surface. The technique in the present application is capable of heating and spraying a gas onto the surface of a wafer to form a coated wafer. The reaction chamber module 100 includes a frame 11, a housing 12, a reaction chamber 13, an air inlet device 14 and a wafer driving device 15, the frame 11 surrounds a receiving space 101, the housing 12 is connected with the frame 11, the housing 12 surrounds and seals the receiving space 101, the reaction chamber 13, the air inlet device 14 and the wafer driving device 15 are all located in the receiving space 101, the reaction chamber 13, the air inlet device 14 and the wafer driving device 15 are all connected to the frame 11, the frame 11 is used for supporting the reaction chamber 13, the air inlet device 14 and the wafer driving device 15, and the housing 12 is used for protecting the reaction chamber 13, the air inlet device 14 and the wafer driving device 15. For clarity of description of the technical solution of the application, front, rear, left, right, up and down are also defined as shown in fig. 1. In the present application, the longitudinal direction of the reaction chamber module 100 refers to the front-rear direction, the width direction of the reaction chamber module 100 refers to the left-right direction, and the vertical direction refers to the up-down direction.
As shown in fig. 2, as an implementation manner, the wafer driving device 15 includes a wafer driving structure 151 and an adjusting component 152, where the wafer driving structure 151 is connected to the adjusting component 152, the wafer driving structure 151 is used for carrying a wafer, and the adjusting component 152 is used for adjusting a position of the wafer driving structure 151.
Specifically, the wafer is disposed in the reaction chamber 13, the upper end of the wafer driving structure 151 is at least partially located in the reaction chamber 13 to realize wafer loading, the adjusting component 152 can adjust the position of the wafer driving structure 151 to adjust the position of the wafer in the reaction chamber 13, the air inlet device 14 is communicated with the reaction chamber 13, and the reaction gas in the air inlet device 14 is injected into the reaction chamber 13 to realize wafer spraying. Through the arrangement, the wafer driving structure 151 can stably support the wafer, so that the stability of the wafer in the spraying process is improved, and meanwhile, the adjusting component 152 can adjust the position of the wafer, so that the reaction gas can be uniformly sprayed on the surface of the wafer, the uniformity of the coating film of the wafer is improved, the spraying quality of the wafer is improved, and the yield of the wafer is improved.
In the present embodiment, the adjustment assembly 152 is used to adjust the position of the wafer drive structure 151 along the first direction 102, and the adjustment assembly 152 is also used to adjust the position of the wafer drive structure 151 along the second direction 103.
As shown in fig. 2, specifically, the adjusting assembly 152 includes an adjusting panel 1521, a mounting bracket 1522, a first adjusting mechanism 1523 and a second adjusting mechanism 1524, the adjusting panel 1521 is connected with the wafer driving structure 151, the adjusting panel 1521 has the capability of supporting and adjusting the wafer driving structure 151, the mounting bracket 1522 is at least partially disposed at the bottom of the adjusting panel 1521, and the adjusting panel 1521 is connected with the mounting bracket 1522, so that the mounting bracket 1522 is used for supporting the adjusting panel 1521, and it should be noted that the mounting bracket 1522 and the frame 11 are kept relatively fixed.
More specifically, a first adjustment mechanism 1523 is at least partially disposed on the adjustment panel 1521, the first adjustment mechanism 1523 being capable of driving relative movement of the adjustment panel 1521 in the first direction 102.
Further, a second adjustment mechanism 1524 is at least partially disposed on the adjustment panel 1521, the second adjustment mechanism 1524 being capable of driving relative movement of the adjustment panel 1521 in the second direction 103.
The first direction 102 and the second direction 103 are not coincident, so that the adjusting component 152 can adjust the wafer driving structure 151 to move in different directions, which is beneficial to improving the adjusting range of the wafer driving structure 151, so as to better adjust the position of the wafer.
For example, the first direction 102 and the second direction 103 may be arranged substantially perpendicular.
As shown in fig. 3, a reference plane 104 perpendicular to the vertical direction is defined, and the first direction 102 and the second direction 103 are parallel to the reference plane 104, and in the example of the present application, the first direction 102 is parallel to the length direction of the reaction chamber module 100, and the second direction 103 is parallel to the width direction of the reaction chamber module 100. Therefore, the levelness of the adjusting panel 1521 can be ensured in the process of adjusting the adjusting panel 1521, so as to maintain the levelness of the wafer driving structure 151, so that the wafer is basically parallel to the reference plane 104, and further, the spraying effect of the wafer is improved.
As shown in fig. 2, as an implementation, the wafer drive structure 151 has an end surface for carrying a wafer, and the adjustment assembly 152 is further configured to adjust the angle between the end surface and a horizontal plane.
As shown in fig. 3 and 4, specifically, an adjusting hole 1525 extending along a vertical direction is provided on the adjusting panel 1521, the adjusting hole 1525 is provided through the adjusting panel 1521, an adjusting member 1526 is provided in the adjusting hole 1525, the adjusting member 1526 is rotatably connected with the adjusting hole 1525, and the adjusting member 1526 can adjust the levelness of the adjusting panel 1521.
For example, the adjustment member 1526 and the adjustment aperture 1525 may be configured as a threaded connection.
As shown in fig. 1 and 2, as one implementation, the mounting bracket 1522 includes a plurality of mounting posts 1522a extending in a vertical direction, and the frame 11 includes a connection plate 111 connected to the mounting posts 1522a, where the connection plate 111 is disposed above the first adjustment mechanism 1523 and the second adjustment mechanism 1524.
Specifically, the reaction cavity 13, the air inlet device 14 and the wafer driving device 15 are all integrally connected to the connection board 111, the upper end of the installation upright post 1522a is connected to the connection board 111, and the lower end of the installation upright post 1522a is connected to the adjustment panel 1521, so that the adjustment panel 1521 and the connection board 111 keep a certain distance in the vertical direction, when the adjustment panel 1521 needs to be adjusted, the connection board 111 can be prevented from interfering with the first adjustment mechanism 1523 and the second adjustment mechanism 1524, thereby reducing the operation difficulty of the adjustment assembly 152, and further being beneficial to improving the layout rationality of the reaction cavity module 100.
As shown in fig. 5, as one implementation, the wafer drive structure 151 includes a base 1511, a rotation mechanism 1512, a lifting mechanism 1513, an adjustment block 1514, and a drive motor 1515. The wafer driving device 15 is divided into an upper pickup mode (see fig. 6) and a lower pickup mode (see fig. 7), and the upper pickup mode and the lower pickup mode are used for picking up wafers, so that the wafers can be placed in the reaction cavity 13 and can be taken out from the reaction cavity 13.
As shown in fig. 6 and 7, in particular, the reaction chamber module 100 includes a mechanical chuck 16 and a mechanical fork 17, and the up-take mode refers to picking up a wafer from above Fang Shequ the wafer by the mechanical chuck 16, and the down-take mode refers to picking up a wafer from below the wafer by the mechanical fork 17. Through the above arrangement, the reaction chamber module 100 can be switched between two film taking modes, and one of the two film taking modes is selected, so that film taking tools can be replaced according to different film taking requirements, and the working efficiency of the reaction chamber module 100 is improved.
As shown in fig. 8, in the present embodiment, the susceptor 1511 is configured to carry a wafer, the rotation mechanism 1512 is disposed coaxially with the lifting mechanism 1513, the lifting mechanism 1513 includes a telescopic member 1513a, and the telescopic member 1513a is disposed in the susceptor 1511 in a penetrating manner in a vertical direction. Wherein the pedestal 1511 remains substantially stationary relative to the wafer, and the pedestal 1511 can improve the stability of the wafer during the spraying process.
Illustratively, when the wafer driving apparatus 15 adopts the pick-up mode, the rotating mechanism 1512 is connected to the lifting mechanism 1513, and the rotating mechanism 1512 and the lifting mechanism 1513 move synchronously to support the wafer through the pedestal 1511; when the wafer driving apparatus 15 adopts the take-down method, the rotation mechanism 1512 is separated from the lifting mechanism 1513, the rotation mechanism 1512 and the lifting mechanism 1513 are relatively moved, the telescopic member 1513a can be extended above the base 1511, and the wafer is supported by the telescopic member 1513a so that a gap 201 is provided between the wafer and the base 1511.
In addition, the rotation mechanism 1512 extends at least partially along the vertical direction of the wafer driving device 15, the lifting mechanism 1513 extends at least partially along the vertical direction and is circumferentially distributed around the axis of the rotation mechanism 1512, a base through hole (not shown) extending along the vertical direction and penetrating through the base 1511 itself is formed in the base 1511, and the upper end of the telescopic piece 1513a can be clamped in the base through hole so as to limit the telescopic piece 1513a from being completely separated from the base 1511 under the influence of gravity, and meanwhile, the telescopic piece 1513a can move along the axial direction of the base through hole.
The adjusting block 1514 is used for connecting the rotating mechanism 1512 and the lifting mechanism 1513, the driving motor 1515 is in transmission connection with the lifting mechanism 1513, and the driving motor 1515 is used for driving the lifting mechanism 1513 to move in the vertical direction.
For example, when the rotating mechanism 1512 is connected to the lifting mechanism 1513 through the adjusting block 1514, the driving motor 1515 drives the rotating mechanism 1512 to move synchronously with the lifting mechanism 1513, and supports the wafer through the base 1511, so that the base 1511 can drive the wafer to move along the vertical direction of the wafer driving device 15, so that the mechanical chuck 16 can pick up the wafer, thereby facilitating the picking up of the wafer, and further facilitating the pick-up mode.
It will be appreciated that when the adjustment block 1514 is separated from the lifting mechanism 1513 and/or the rotating mechanism 1512, the driving motor 1515 drives the rotating mechanism 1512 to move relative to the lifting mechanism 1513 in the vertical direction, so that the telescopic member 1513a extends at least partially above the base 1511, and the wafer is supported by the telescopic member 1513a, and a gap 201 is formed between the wafer and the base 1511, so that the mechanical fork 17 is inserted between the wafer and the base 1511 and picks up the wafer, thereby facilitating picking up the wafer, and further facilitating implementation of a take-down mode.
Through the arrangement, the wafer driving device 15 is provided with two pick-up modes, and the wafer driving device 15 can rapidly switch between the pick-up mode and the pick-down mode, so that the switching speed of the wafer driving device 15 is improved, and the adjustment efficiency of the wafer driving device 15 is improved.
It should be noted that, the telescopic piece 1513a may be configured as a thimble, and the number of the thimbles is at least three, so that the telescopic piece 1513a is stable in the process of supporting the wafer, thereby being beneficial to improving the stability of the wafer.
It will be appreciated that the specific structure of the telescopic member 1513a may be set according to actual needs to support and push the wafer, and the structures of the mechanical suction tool 16 and the mechanical fork 17 may be set according to actual situations to meet the requirement of picking up the wafer.
As shown in fig. 3, as one implementation, the adjustment panel 1521 includes a first adjustment plate 1521a, a second adjustment plate 1521b, a third adjustment plate 1521c, and a fourth adjustment plate 1521d arranged in a vertical direction, where two adjacent adjustment plates can relatively move along a set direction, and the first adjustment plate 1521a is connected to the wafer driving structure 151; the fourth adjustment plate 1521d is fixedly coupled to the mounting bracket 1522.
Specifically, the rotating assembly 1512 and the lifting assembly 1513 are connected to the first adjusting plate 1521a through the integrated bracket 153, and the integrated bracket 153 connected to the first adjusting plate 1521a can drive the rotating assembly 1512 and the lifting assembly 1513 to move synchronously.
More specifically, the fourth adjustment plate 1521d is coupled to the frame 11 by a mounting bracket 1522 such that the fourth adjustment plate 1521d is capable of supporting the first adjustment plate 1521a, the second adjustment plate 1521b, the third adjustment plate 1521c, and the carrier 151, the fourth adjustment plate 1521d being relatively stationary with respect to the mounting bracket 1522. By integrating a plurality of adjusting plates, the adjusting panel has adjusting capability in a plurality of directions.
In the present embodiment, the first adjusting mechanism 1523 is disposed between the second adjusting plate 1521b and the third adjusting plate 1521c, the first adjusting mechanism 1523 is configured to move the second adjusting plate 1521b along the first direction 102, and the first adjusting mechanism 1523 is capable of driving the second adjusting plate 1521b to move relative to the third adjusting plate 1521c along the first direction 102, and the second adjusting plate 1521b is connected to the first adjusting plate 1521a, such that the second adjusting plate 1521b drives the first adjusting plate 1521a to move along the first direction 102.
It can be appreciated that the second adjusting mechanism 1524 is disposed between the third adjusting plate 1521c and the fourth adjusting plate 1521d, the second adjusting mechanism 1524 is configured to move the third adjusting plate 1521c in the second direction 102, and the second adjusting mechanism 1524 is capable of driving the third adjusting plate 1521c to move relatively in the second direction 103, such that the third adjusting plate 1521c moves the first adjusting plate 1521a and the second adjusting plate 1521b in the second direction 103 due to the interconnection of the third adjusting plate 1521c, the second adjusting plate 1521b, and the first adjusting plate 1521 a. Through the above arrangement, the movable range of the bearing mechanism 151 is enlarged, and the adjusting performance of the adjusting component 152 is improved, and meanwhile, the first adjusting mechanism 1523 and the second adjusting mechanism 1524 do not interfere with each other, that is, the first adjusting mechanism 1523 and the second adjusting mechanism 1524 can work synchronously, so that the adjusting speed of the adjusting component 152 in the adjusting process is improved.
It should be noted that, the setting direction may be at least one of the first direction 102, the second direction 103 or the vertical direction, and the setting direction may be any other direction, so that the two adjacent adjusting plates can move relatively, and the moving direction is not unique, which falls within the protection scope of the present application.
As shown in fig. 4, as an implementation manner, the first adjusting plate 1521a is provided with an adjusting hole 1525 penetrating through the first adjusting plate 1521a in the vertical direction, and the adjusting assembly 152 includes an adjusting member 1526 penetrating through the adjusting hole 1525, where the adjusting member 1526 is in threaded connection with the first adjusting plate 1521a, and the adjusting member 1526 is configured to adjust the distance between the first adjusting plate 1521a and the second adjusting plate 1521b in the vertical direction.
Specifically, the adjusting member 1526 can extend out of the adjusting hole 1525 in the direction of the second adjusting plate 1521b, and one end of the adjusting member 1526 extending out of the adjusting hole 1525 abuts against the second adjusting plate 1521b, thereby increasing or decreasing the gap between the first adjusting plate 1521a and the second adjusting plate 1521b by the adjusting member 1526, and thereby changing the levelness of the first adjusting plate 1521a with respect to the reference surface 104.
More specifically, the base 1511 is held relatively stationary with the first adjustment plate 1521a, and the adjustment member 1526 adjusts the levelness of the base 1511 by adjusting the first adjustment plate 1521a so that the upper surface of the base 1511 is substantially parallel to the reference surface 104.
Alternatively, the adjustment hole 1525 may be provided on the second adjustment plate 1521b, the third adjustment plate 1521c, or the fourth adjustment plate 1521d to meet the level of the adjustment base 1511. In addition, the adjusting member 1526 and the adjusting hole 1525 may be adjusted according to practical situations, so as to adjust the distance between two adjacent adjusting plates along the vertical direction.
It should be noted that the number of the adjusting members 1526 and the number of the adjusting holes 1525 may be set according to actual needs, so as to facilitate improving the adjusting speed and the adjusting accuracy of the first adjusting plate 1521a, and thus facilitate improving the horizontal adjusting capability of the adjusting assembly 152
As shown in fig. 3, as an implementation manner, the first adjusting mechanism 1523 includes a first sliding member 1523a and a first adjusting member 1523b, where the first sliding member 1523a is located between the second adjusting plate 1521b and the third adjusting plate 1521c, the first sliding member 1523a is installed on the third adjusting plate 1521c, the second adjusting plate 1521b and the third adjusting plate 1521c are slidably connected through the first sliding member 1523a, one end of the first adjusting member 1523b is fixedly connected to the third adjusting plate 1521c, and the other end of the first adjusting member 1523b is in threaded connection with the second adjusting plate 1521 b.
As shown in fig. 9, specifically, the first adjusting member 1523b includes a first portion 1523c fixedly coupled to the third adjusting plate 1521c and a second portion 1523d disposed through the second adjusting plate 1521b in the first direction 102, the second portion 1523d being threadably coupled to the second adjusting plate 1521 b.
More specifically, the first portion 1523c is rotatably connected to the second portion 1523d, and the second portion 1523d is rotatable on the first portion 1523c, such that the second portion 1523d applies a force to the second adjustment plate 1521b in the first direction 102, such that when the second adjustment plate 1521b is desired to be adjusted, the fastener secured to the second adjustment plate 1521b and the third adjustment plate 1521c may be released, and such that the second portion 1523d is rotated to urge the second adjustment plate 1521b to move, such that the fastener is capable of reconnecting the second adjustment plate 1521b to the third adjustment plate 1521c after the second adjustment plate 1521b has been adjusted. With the above arrangement, the first slider 1523a can reduce the friction between the second and third adjustment plates 1521b, 1521c to facilitate movement of the second and third adjustment plates 1521b, 1521c, thereby facilitating an increase in the adjustment efficiency of the second and third adjustment plates 1521b, 1521c, and can facilitate an adjustment of the position of the second adjustment plate 1521b without the second and third adjustment plates 1521b, 1521c being completely separated, thereby simplifying the adjustment steps and facilitating an increase in the adjustment efficiency of the adjustment assembly 152.
As shown in fig. 3, it can be appreciated that the second adjustment mechanism 1524 includes a second slide 1524a and a second adjustment member 1524b that are substantially identical to the first adjustment member structure 1523, the second slide 1524a being positioned between the third adjustment plate 1521c and the fourth adjustment plate 1521d, the second slide 1524a extending in the second direction 103, the second slide 1524a being mounted on the fourth adjustment plate 1521d, the third adjustment plate 1521c and the fourth adjustment plate 1521d being slidably coupled by the second slide 1524a, one end of the second adjustment member 1524b being fixedly coupled to the fourth adjustment plate 1521d, and the other end of the second adjustment member 1524b being threadably coupled to the third adjustment plate 1521 c.
It should be noted that the structure of the second adjusting mechanism 1524 is substantially identical to that of the first adjusting mechanism 1523, that is, the second sliding member 1524a is identical to that of the first sliding member 1523a, and the second adjusting member 1524b is identical to that of the first adjusting member 1523b, which will not be described herein.
As shown in fig. 5, as one implementation, the wafer drive apparatus 15 includes an integrated support 153, and the rotation mechanism 1512 and the lifting mechanism 1513 are both connected to the integrated support 153 and are capable of sliding in a vertical direction with respect to the integrated support 153.
Specifically, the lifting mechanism 1513 includes a lifting support 1513b, a driving motor 1515 is fixedly connected to the integrated support 153, the lifting support 1513b is in transmission connection with the driving motor 1515, and the driving motor 1515 drives the lifting support 1513b to slide on the integrated support 153.
More specifically, the integrated support 153 is provided with a slide rail 1531 extending in a vertical direction, and the lifting support 1513b is slidably connected with the slide rail 1531, so that the lifting support 1513b can slide in the vertical direction, thereby facilitating the sliding of the lifting mechanism 1513 in the vertical direction, so that the telescopic piece 1513a pushes the wafer to move in the vertical direction, and further facilitating the wafer taking-down mode.
As shown in fig. 5, further, the rotating mechanism 1512 includes a rotating bracket 1512a, the rotating bracket 1512a is slidably connected to the slide rail 1531, the adjusting block 1514 is used to connect the lifting bracket 1513b and/or the rotating bracket 1512a, when the rotating bracket 1512a is connected to the lifting bracket 1513b through the adjusting block 1514, the driving motor 1515 drives the rotating bracket 1512a to slide along the extending direction of the slide rail 1531 through the lifting bracket 1513b, so that the driving motor 1515 can simultaneously drive the lifting bracket 1513b and the rotating bracket 1512a to synchronously move, and the lifting bracket 1513b and the rotating bracket 1512a remain substantially relatively stationary, so that the base 1511 and the telescopic piece 1513a remain substantially relatively stationary; when the driving motor 1515 drives the rotating mechanism 1512 to move along the vertical direction, the base 1511 can bear the movement of the wafer along the vertical direction, so as to be beneficial to realizing the loading and unloading mode of the wafer.
In the present embodiment, the lifting mechanism 1513 includes a lifting shaft 1513c extending in the vertical direction, the lifting shaft 1513c is connected to a lifting bracket 1513b, and the lifting bracket 1513b drives the lifting shaft 1513c to move in the vertical direction.
Further, the rotating bracket 1512a includes a rotating shaft 1512b extending in a vertical direction, the rotating shaft 1512b is connected to the rotating bracket 1512a, and the rotating bracket 1512a drives the rotating shaft 1512b to move in the vertical direction.
Specifically, the rotating shaft 1512b and the lifting shaft 1513c are both tubular members, the pipe diameter of the lifting shaft 1513c is larger than that of the rotating shaft 1512b, the rotating shaft 1512b is arranged in the lifting shaft 1513c in a penetrating manner and supports the base 1511, a certain adjusting gap is formed between the rotating shaft 1512b and the lifting shaft 1513c, so that coaxiality of the rotating shaft 1512b and the lifting shaft 1513c can be adjusted, wherein the rotating shaft 1512b is used for bearing the base 1511 and driving the base 1511 to rotate, and the lifting shaft 1513c is used for pushing the telescopic piece 1513a to extend out of the base 1511 in the vertical direction.
More specifically, the upper part of the rotating shaft 1512b is connected to the lower part of the base 1511, the lower part of the rotating shaft 1512b is connected to the rotating bracket 1512a, the rotating shaft 1512b has a rotating function, and the rotating shaft 1512b can drive the base 1511 to synchronously rotate in the rotating process, so that the base 1511 drives the wafer to rotate, thereby realizing the supporting and rotating of the wafer, and further the rotating mechanism 1512 has both the supporting function and the rotating function.
Illustratively, the telescopic member 1513a is disposed at the top end of the lifting shaft 1513c, the lower end of the lifting shaft 1513c is connected to the lifting bracket 1513b, and the driving motor 1515 can drive the lifting shaft 1513c by driving the lifting bracket 1513b, so that the lifting shaft 1513c can control the position of the telescopic member 1513a in the susceptor 1511, thereby facilitating adjustment of the position of the wafer, and further facilitating improvement of the picking efficiency of the wafer.
It should be noted that, when the lifting support 1513b is connected to the rotating support 1512a through the adjusting block 1514, the lifting shaft 1513c and the rotating shaft 1512b move synchronously in the vertical direction, and the driving motor 1515 pushes the base 1511 to move in the vertical direction through the rotating shaft 1512b, so as to push the wafer to move in the vertical direction by the base 1511, thereby facilitating the mechanical chuck 16 to pick up the wafer.
Further, when the adjustment block 1514 is separated from the elevating mechanism 1513 and/or the rotating mechanism 1512, the elevating shaft 1513c and the rotating shaft 1512b are relatively moved in the vertical direction.
Further, when the adjustment block 1514 is separated from the lifting bracket 1513b and/or the rotating bracket 1512a, the lifting shaft 1513c can push the telescopic member 1513a to extend out of the base 1511 in the vertical direction.
As shown in fig. 10, the present application further provides a pick-up adjustment method, which is suitable for the wafer driving device 151.
The pick-up adjusting method comprises the following steps:
S1: the elevating mechanism 1513 is connected to the rotating mechanism 1512 via an adjustment block 1514.
In step S1, the rotating mechanism 1512 and the lifting mechanism 1513 may be fixedly connected through the adjusting block 1514, so that the rotating mechanism 1512 and the lifting mechanism 1513 are kept relatively stationary, and the driving motor 1515 may drive the lifting mechanism 1513 to move in the vertical direction and simultaneously drive the rotating mechanism 1512 to move in the vertical direction, which is further beneficial to improving the connection stability of the rotating mechanism 1512 and the lifting mechanism 1513.
S2: the lifting mechanism 1513 is driven by the driving motor 1515 to drive the rotating mechanism 1512 to move synchronously along the vertical direction, so that the base 1511 supports the wafer to move along the vertical direction, wherein the wafer is attached to the base 1511.
In step S2, the rotating mechanism 1512 may be connected to the lifting mechanism 1513 through the adjusting block 1514 to realize the synchronous motion of the rotating mechanism 1512 and the lifting mechanism 1513, and the rotating mechanism 1512 may drive the base 1511 to move along the vertical direction, so that the base 1511 drives the wafer to move along the vertical direction, so that the mechanical suction tool 16 may be advantageously adsorbed onto the wafer from above the wafer and drive the wafer to move, and it is noted that the adsorption force of the mechanical suction tool 16 may be reduced as the distance between the mechanical suction tool 16 and the wafer becomes larger, whereas the adsorption force of the mechanical suction tool 16 may be increased as the distance between the mechanical suction tool and the wafer becomes smaller, and the mechanical suction tool 16 may not move along the up-down direction, so that the stability of the mechanical suction tool 16 during the adsorption process may be increased by adjusting the position of the wafer.
S3: the adjustment block 1514 is separated from the lifting mechanism 1513 and/or the rotating mechanism 1512.
In step S3, the adjusting block 1514 may be connected to the lifting mechanism 1513 only, the adjusting block 1514 may be connected to the rotating mechanism 1512 only, and the adjusting block 1514 may be detached, so that the adjusting block 1514 may be connected as required, and the adjusting block 1514 may be connected to the lifting mechanism 1513 and the rotating mechanism 1512 by means of fasteners, thereby being beneficial to improving the assembly efficiency of the lifting mechanism 1513 and the rotating mechanism 1512.
S4: the elevating mechanism 1513 is driven by a driving motor 1515 to relatively move the elevating mechanism 1513 in the vertical direction with the rotating mechanism 1512.
In step S4, when the rotation mechanism 1512 is separated from the lifting mechanism 1513, the power of the driving motor 1515 directly acts on the lifting mechanism 1513 to drive the lifting mechanism 1513 to move, and the rotation mechanism 1512 is fixed to make the lifting mechanism 1513 move relative to the rotation mechanism 1512 along the vertical direction, so as to facilitate the lifting mechanism 1513 to push the wafer to move along the vertical direction.
S5: the expansion and contraction member 1513a provided at the tip of the lifting mechanism 1513 passes through the base 1511 and protrudes above the base 1511, and the wafer is supported by the expansion and contraction member 1513a so that a gap 201 is formed between the wafer and the base 1511.
In step S5: when the driving motor 1515 drives the lifting mechanism 1513 to move along the vertical direction, the telescopic piece 1513a arranged at the top end of the lifting mechanism 1513 passes through the base 1511 and extends out to the upper side of the base 1511, the upper end of the telescopic piece 1513a is abutted against the lower surface of the wafer and provides a thrust force for the wafer, the wafer is supported by the telescopic piece 1513a and moves in a direction far away from the base 1511, so that a gap 201 is formed between the wafer and the base 1511, and the mechanical fork 17 can be conveniently inserted into the gap, at the moment, the telescopic piece 1513a moves downwards from top to bottom, the lower surface of the wafer is abutted against the upper end of the mechanical fork 17, and the telescopic piece 1513a moves in a direction far away from the wafer and breaks the support of the wafer, so that the mechanical fork 17 carries the wafer, thereby being beneficial to the wafer picking up by the mechanical fork 17 and improving the stability of the wafer in the picking process.
It should be noted that, although the steps in the above-described flow or the flow chart of the drawings show a logical order, in some cases, the steps shown or described may be performed in an order different from that here.
It will be understood that modifications and variations will be apparent to those skilled in the art from the foregoing description, and it is intended that all such modifications and variations be included within the scope of the following claims.
Claims (9)
1. A wafer driving apparatus is characterized in that,
The wafer driving device comprises an adjusting component (152) and a wafer driving structure (151), wherein the adjusting component (152) is connected with the wafer driving structure (151); -the adjustment assembly (152) is for adjusting the position of the wafer drive structure (151) in a first direction (102); the adjustment assembly (152) is further configured to adjust a position of the wafer drive structure (151) in a second direction (103), wherein the first direction (102) is not coincident with the second direction (103); the wafer driving structure (151) is provided with an end face for bearing a wafer, and the adjusting component (152) is also used for adjusting an included angle between the end face and a horizontal plane; the adjusting assembly (152) comprises a mounting bracket (1522), and a first adjusting plate (1521 a), a second adjusting plate (1521 b), a third adjusting plate (1521 c) and a fourth adjusting plate (1521 d) which are distributed along the vertical direction, wherein the first adjusting plate (1521 a) is connected with the wafer driving structure (151), the fourth adjusting plate (1521 d) is connected with the mounting bracket (1522), a first sliding piece (1523 a) is arranged between the second adjusting plate (1521 b) and the third adjusting plate (1521 c) so that the second adjusting plate (1521 b) can slide along the first direction (102) relative to the third adjusting plate (1521 c), and a second sliding piece (1524 a) is arranged between the third adjusting plate (1521 c) and the fourth adjusting plate (1521 d) so that the third adjusting plate 1521c can slide along the second direction (103) relative to the fourth adjusting plate (1521 d);
The wafer drive structure (151) includes:
a susceptor (1511) for carrying the wafer;
A rotation mechanism (1512) for supporting the base (1511) and driving the base (1511) to rotate in the circumferential direction of the base (1511);
The lifting mechanism (1513), wherein the lifting mechanism (1513) comprises a telescopic piece (1513 a), and the telescopic piece (1513 a) penetrates through the base (1511) along the vertical direction.
2. The wafer driving apparatus according to claim 1, wherein,
The adjustment assembly (152) further includes:
A first adjustment mechanism (1523), said first adjustment mechanism (1523) being disposed between said second adjustment plate (1521 b) and said third adjustment plate (1521 c), said first adjustment mechanism (1523) being configured to move said second adjustment plate (1521 b) in said first direction (102);
A second adjustment mechanism (1524), said second adjustment mechanism (1524) being disposed between said third adjustment plate (1521 c) and said fourth adjustment plate (1521 d), said second adjustment mechanism (1524) being configured to move said third adjustment plate (1521 c) in said second direction (103).
3. The wafer driving apparatus according to claim 2, wherein,
The first adjusting mechanism (1523) comprises a first adjusting piece (1523 b), one end of the first adjusting piece (1523 b) is fixedly connected with the third adjusting plate (1521 c), and the other end of the first adjusting piece (1523 b) is in threaded connection with the second adjusting plate (1521 b);
the second adjusting mechanism (1524) comprises a second adjusting member (1524 b) which is basically consistent with the first adjusting member (1523 b), one end of the second adjusting member (1524 b) is fixedly connected with the fourth adjusting plate (1521 d), and the other end of the second adjusting member (1524 b) is in threaded connection with the third adjusting plate (1521 c).
4. The wafer driving apparatus according to claim 1, wherein,
The first adjusting plate (1521 a) is provided with an adjusting hole (1525) penetrating through the first adjusting plate in the vertical direction, the adjusting assembly (152) comprises an adjusting piece (1526) penetrating through the adjusting hole (1525), the adjusting piece (1526) is in threaded connection with the first adjusting plate (1521 a), and the adjusting piece (1526) is used for adjusting the distance between the first adjusting plate (1521 a) and the second adjusting plate (1521 b) in the vertical direction.
5. The wafer driving apparatus according to claim 1, wherein,
The wafer driving structure (151) further comprises an adjusting block (1514) and a driving motor (1515), the adjusting block (1514) is used for connecting the rotating mechanism (1512) with the lifting mechanism (1513), the driving motor (1515) is in transmission connection with the lifting mechanism (1513), and the driving motor (1515) is used for driving the lifting mechanism (1513) to move along the vertical direction.
6. The wafer drive apparatus of claim 5, wherein,
The lifting mechanism (1513) comprises a lifting shaft (1513 c) and a lifting support (1513 b), the lifting shaft (1513 c) is connected with the lifting support (1513 b), the rotating mechanism (1512) comprises a rotating shaft (1512 b) and a rotating support (1512 a), the rotating shaft (1512 b) is connected with the rotating support (1512 a), the rotating shaft (1512 b) penetrates through the lifting shaft (1513 c) and supports the base (1511), and the adjusting block (1514) is used for connecting the lifting support (1513 b) and/or the rotating support (1512 a).
7. The wafer drive apparatus of claim 6, wherein,
When the lifting support (1513 b) is connected with the rotating support (1512 a) through the adjusting block (1514), the lifting shaft (1513 c) and the rotating shaft (1512 b) move synchronously along the vertical direction, and when the adjusting block (1514) is separated from the lifting support (1513 b) and/or the rotating support (1512 a), the lifting shaft (1513 c) and the rotating shaft (1512 b) move relatively along the vertical direction.
8. The wafer drive apparatus of claim 6, wherein,
The telescopic piece (1513 a) is arranged at the top end of the lifting shaft (1513 c), and when the adjusting block (1514) is separated from the lifting support (1513 b) and/or the rotating support (1512 a), the lifting shaft (1513 c) can push the telescopic piece (1513 a) to extend out of the base (1511) along the vertical direction.
9. A semiconductor device, characterized in that,
Comprising a wafer drive apparatus according to any one of claims 1 to 8.
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| KR102460311B1 (en) * | 2018-08-20 | 2022-10-28 | 주식회사 원익아이피에스 | Substrate processing apparatus and substrate processing method |
| KR20210012494A (en) * | 2019-07-25 | 2021-02-03 | 삼성전자주식회사 | Lift pin alignment method and alignemnet apparatus and substrate processing apparatus |
| CN113430504B (en) * | 2021-08-26 | 2021-11-09 | 上海陛通半导体能源科技股份有限公司 | Chemical vapor deposition equipment capable of conveniently lifting and clamping wafer |
| CN113921455A (en) * | 2021-09-29 | 2022-01-11 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and wafer supporting structure thereof |
| CN116038774B (en) * | 2023-03-31 | 2023-07-04 | 无锡卓海科技股份有限公司 | Parallelism adjusting structure and method for wafer carrying platform and mechanical arm |
| CN117476539B (en) * | 2023-10-07 | 2024-05-03 | 昆山日月同芯半导体有限公司 | Adjustment mechanism convenient to adjust thimble seat height |
| CN117248195B (en) * | 2023-11-15 | 2024-04-12 | 无锡尚积半导体科技有限公司 | CVD wafer level adjustment mechanism |
| CN117253842B (en) * | 2023-11-17 | 2024-02-13 | 上海隐冠半导体技术有限公司 | Micro-motion stage and shifting device |
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