CN117672918B - Wafer position monitoring and scheduling device, system and method - Google Patents
Wafer position monitoring and scheduling device, system and method Download PDFInfo
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- CN117672918B CN117672918B CN202311679032.4A CN202311679032A CN117672918B CN 117672918 B CN117672918 B CN 117672918B CN 202311679032 A CN202311679032 A CN 202311679032A CN 117672918 B CN117672918 B CN 117672918B
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- 238000012544 monitoring process Methods 0.000 title claims abstract description 178
- 238000000034 method Methods 0.000 title claims abstract description 35
- 235000012431 wafers Nutrition 0.000 claims abstract description 148
- 238000004891 communication Methods 0.000 claims abstract description 10
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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Abstract
The embodiment of the invention discloses a wafer position monitoring and scheduling device, a system and a method. The wafer position monitoring and scheduling device comprises: at least two load ports; the front loading module is used for loading the wafer through the loading port; the monitoring dispatching modules are in one-to-one correspondence with the loading ports, are connected with the corresponding loading ports in parallel, and are used for monitoring the loading ports and generating monitoring dispatching signals; and the main controller is in communication connection with the monitoring and dispatching module and the front loading module and is used for controlling the working state of the front loading module according to the monitoring and dispatching signals so as to realize the loading and dispatching of the wafers through at least two loading ports. The wafer position monitoring and scheduling device, the system and the method provided by the embodiment of the invention can improve the loading and scheduling reliability.
Description
Technical Field
Embodiments of the present invention relate to semiconductor technologies, and in particular, to a wafer position monitoring and scheduling apparatus, system, and method.
Background
For wafers of semiconductor devices, the wafers are placed in cassettes and need to be loaded by a robot to a pre-positioning device for processing the wafers. In the wafer loading process, the wafer position is monitored and the wafer is loaded and scheduled by the wafer position monitoring and scheduling device.
At present, in the existing wafer position monitoring and dispatching device, after the wafer of one loading port is loaded, the wafer of the other loading port is loaded, if the wafer of the other loading port needs to be loaded in the wafer loading process of the one loading port, the problem of machine clamping exists, and the reliability of loading and dispatching is affected.
Disclosure of Invention
The embodiment of the invention provides a wafer position monitoring and dispatching device, a system and a method, which are used for improving the reliability of monitoring and dispatching.
In a first aspect, an embodiment of the present invention provides a wafer position monitoring and scheduling apparatus, including:
At least two load ports;
the front loading module is used for loading the wafer through the loading port;
The monitoring scheduling modules are in one-to-one correspondence with the loading ports, are connected with the corresponding loading ports in parallel, and are used for monitoring the loading ports and generating monitoring scheduling signals;
The main controller is in communication connection with the monitoring and dispatching module and the front loading module, and is used for controlling the working state of the front loading module according to the monitoring and dispatching signals so as to realize loading and dispatching of the wafers through at least two loading ports.
Optionally, the monitoring and dispatching module includes a first monitoring and dispatching module, a second monitoring and dispatching module and a third monitoring and dispatching module, and the main controller, the first monitoring and dispatching module, the second monitoring and dispatching module and the third monitoring and dispatching module are connected in serial port in sequence.
Optionally, the loading port includes a first loading port, a second loading port and a third loading port, the first loading port is connected with the parallel port of the first monitoring and dispatching module, the second loading port is connected with the parallel port of the second monitoring and dispatching module, and the third loading port is connected with the parallel port of the third monitoring and dispatching module.
Optionally, the first monitoring and dispatching module, the second monitoring and dispatching module, the third monitoring and dispatching module and the front loading module are sequentially connected in serial, and each loading port is in communication connection with the front loading module.
Optionally, the front loading module includes a slave controller, a manipulator control unit and a pre-positioning unit, where the slave controller is in communication connection with the master controller and the pre-positioning unit, and the slave controller, the manipulator control unit and the manipulator are sequentially electrically connected.
Optionally, the manipulator includes at least two arms.
In a second aspect, an embodiment of the present invention provides a wafer position monitoring and dispatching device system, which includes the wafer position monitoring and dispatching device according to the first aspect, and further includes a magazine for placing a plurality of wafers, where the magazine corresponds to the loading port one by one.
Optionally, different wafers are placed at different positions in the magazine.
In a third aspect, an embodiment of the present invention provides a wafer position monitoring and scheduling method, where the wafer position monitoring and scheduling method is performed by the main controller according to the first aspect, and the wafer position monitoring and scheduling method includes:
Receiving a monitoring scheduling signal;
And controlling the working state of the front loading module according to the monitoring and dispatching signal so as to realize loading and dispatching of the wafers through the two loading ports at the same time.
Optionally, the controlling the working state of the front-end loading module according to the monitoring scheduling signal includes:
And when the wafers including at least two loading ports in the monitoring and dispatching signals need to be loaded, controlling the front loading module to simultaneously load the wafers through the at least two loading ports.
The wafer position monitoring and scheduling device, the system and the method provided by the embodiment of the invention comprise the following steps: at least two load ports; the front loading module is used for loading the wafer through the loading port; the monitoring dispatching modules are in one-to-one correspondence with the loading ports, are connected with the corresponding loading ports in parallel, and are used for monitoring the loading ports and generating monitoring dispatching signals; and the main controller is in communication connection with the monitoring and dispatching module and the front loading module and is used for controlling the working state of the front loading module according to the monitoring and dispatching signals so as to realize the loading and dispatching of the wafers through at least two loading ports. According to the wafer position monitoring and dispatching device, system and method provided by the embodiment of the invention, the main controller controls the working state of the front-end loading module according to the monitoring and dispatching signals, for example, the main controller controls the front-end loading module to carry out loading and dispatching on wafers through one loading port according to the monitoring and dispatching signals, temporarily shields monitoring and dispatching signals corresponding to other loading ports, if the front-end loading module can carry out loading and dispatching on wafers of other loading ports at the same time, the front-end loading module is controlled to carry out loading and dispatching on wafers through two loading ports, the wafers are loaded to a preset position, the monitoring and dispatching signals corresponding to other loading ports are shielded in the process, and after the front-end loading module carries out loading and dispatching on wafers to the preset position through the two loading ports, the loading and dispatching of the wafers through the other loading port is controlled, so that the work of carrying out loading and dispatching on the wafers through the at least two loading ports is realized, the problem that a card machine exists in the wafer loading process of one loading port in the prior art is solved, and the dispatching reliability of the loading and dispatching machine is improved.
Drawings
FIG. 1 is a block diagram of a wafer position monitoring and dispatching apparatus according to an embodiment of the present invention;
Fig. 2 is a block diagram of a wafer position monitoring and dispatching device according to a second embodiment of the present invention;
fig. 3 is a schematic diagram of a monitoring and scheduling module according to a second embodiment of the present invention;
Fig. 4 is a flowchart of a wafer position monitoring and dispatching method according to a third embodiment of the present invention.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
Example 1
Fig. 1 is a block diagram of a wafer position monitoring and dispatching apparatus according to an embodiment of the present invention. Referring to fig. 1, a wafer position monitoring and scheduling apparatus includes: at least two load ports 10, at least two monitor dispatch modules 30 of front end load modules 20, and a main controller 40.
Wherein the front loading module 20 is used for loading wafers through the loading port 10; the monitoring and dispatching modules 30 are in one-to-one correspondence with the loading ports 10, the monitoring and dispatching modules 30 are connected with the corresponding loading ports 10 in parallel, and the monitoring and dispatching modules 30 are used for monitoring the loading ports 10 and generating monitoring and dispatching signals; the main controller 40 is in communication connection with the monitoring and dispatching module 30 and the front loading module 20, and the main controller 40 is configured to control the working state of the front loading module 20 according to the monitoring and dispatching signals, so as to implement loading and dispatching of the wafers through the two loading ports 10 at the same time.
Specifically, the wafer is located in the pod, and the load port 10 may scan the wafer in the pod through its own sensor to determine whether there is a wafer in the pod and a specific position of the wafer in the pod. Different cassettes are arranged near different loading ports, for example, three loading ports 10 are provided, cassettes are arranged near each loading port 10, when wafers in the cassettes of the three loading ports 10 are required to be loaded, each monitoring dispatch module 30 monitors that the corresponding loading port 10 is not loaded with wafers, when the front end loading module 20 does not work, corresponding monitoring dispatch signals are generated and transmitted to the main controller, the main controller 40 controls the front end loading module 20 to carry out loading dispatch on the wafers through one loading port 10 according to the monitoring dispatch signals, temporarily shields the monitoring dispatch signals corresponding to the other loading ports 10, if the front end loading module 20 can also carry out loading dispatch on the wafers of the other loading ports 10 at the same time, the front end loading module 20 is controlled to carry out loading dispatch on the wafers to a preset position through the two loading ports 10, in the process, the front end loading module 20 shields the monitoring dispatch signals corresponding to the other loading ports 10 at the same time, after the front end loading module 20 carries out loading dispatch on the wafers through the two loading ports 10 at the same time, and the front end loading module 20 is controlled to carry out loading dispatch on the wafers through the other loading ports 10 at the other loading ports at the same time, and therefore the loading dispatch operation of the wafers through the other loading ports is realized.
It should be noted that, the number of the loading ports and the monitoring and dispatching modules in this embodiment is only schematically illustrated, and may be specifically determined according to the actual loading and dispatching requirements, which is not limited herein.
According to the wafer position monitoring and dispatching device provided by the embodiment, the main controller controls the working state of the front-end loading module according to the monitoring and dispatching signals, if the main controller controls the front-end loading module to carry out loading and dispatching on a wafer through one loading port according to the monitoring and dispatching signals and temporarily shields the monitoring and dispatching signals corresponding to other loading ports, if the front-end loading module can carry out loading and dispatching on the wafer of other loading ports at the same time, the front-end loading module is controlled to carry out loading and dispatching on the wafer through two loading ports at the same time, the wafer is loaded to a preset position through the two loading ports, the monitoring and dispatching signals corresponding to the other loading ports are shielded in the process, and after the front-end loading module carries out loading and dispatching on the wafer through the other loading port at the same time, the wafer loading and dispatching operation of the wafer through the other loading port is carried out, so that the problem that a card machine exists when the wafer of the other loading port is loaded in the wafer loading process of the loading port in the prior art is solved, and the loading and dispatching reliability is improved.
Example two
Fig. 2 is a block diagram of a wafer position monitoring and dispatching apparatus according to an embodiment of the present invention. The present embodiment is based on the first embodiment, and referring to fig. 2, optionally, the monitoring and dispatching module 30 includes a first monitoring and dispatching module 31, a second monitoring and dispatching module 32, and a third monitoring and dispatching module 33, where the main controller 40, the first monitoring and dispatching module 31, the second monitoring and dispatching module 32, and the third monitoring and dispatching module 33 are sequentially connected in serial.
Wherein, each monitoring and dispatching module corresponds to different loading ports, the monitoring and dispatching signals generated by the third monitoring and dispatching module 33 are sequentially transmitted to the main controller 40 through the second monitoring and dispatching module 32 and the first monitoring and dispatching module 31, and the main controller 40 controls the working state of the front loading module 20 according to the monitoring and dispatching signals transmitted by each monitoring and dispatching module. For example, when the monitoring dispatch signals transmitted by each monitoring dispatch module include the signals that need to load the wafer through the corresponding load port, the main controller 40 controls the front end load module 20 to load the wafer through the load port corresponding to the first monitoring dispatch module 31, and performs interrupt masking, that is, temporarily masks signals of other monitoring dispatch modules, if the front end load module 20 can also load and dispatch the wafer of other load ports at this time, the front end load module 20 is controlled to load the wafer through the load ports corresponding to the first monitoring dispatch module 31 and the second monitoring dispatch module 32 at the same time, and load the wafer to the preset position, in this process, temporarily masks signals of the third monitoring dispatch module 33, and after the front end load module 20 loads the wafer to the preset position, the front end load module 20 is controlled to load and dispatch the wafer through the load port corresponding to the third monitoring dispatch module 33, thereby realizing the simultaneous loading of the wafer through at least two load ports. The process of the main controller 40 controlling the front loading module 20 to simultaneously load wafers through the loading ports corresponding to any two monitoring and dispatching modules and temporarily shielding signals of other monitoring and dispatching modules is similar to the above-mentioned control process, and will not be repeated here.
Optionally, the load port 10 includes a first load port 11, a second load port 12, and a third load port 13, where the first load port 11 is connected to the parallel port of the first monitor dispatch module 31, the second load port 12 is connected to the parallel port of the second monitor dispatch module 32, and the third load port 13 is connected to the parallel port of the third monitor dispatch module 33.
Specifically, each monitoring and dispatching module is cascaded and monitors the load ports connected by its own parallel port, for example, the first monitoring and dispatching module 31 monitors the first load port 11, and can monitor the state of the first load port 11, for example, whether the first load port 11 passes a wafer, and the second monitoring and dispatching module 32 monitors the second load port 12, and can monitor the state of the second load port 12.
Optionally, the first monitoring and dispatching module 31, the second monitoring and dispatching module 32, the third monitoring and dispatching module 33 and the front loading module 20 are sequentially connected in serial, and each loading port 10 is in communication connection with the front loading module 20.
Fig. 3 is a schematic diagram of a monitoring and scheduling module according to a second embodiment of the present invention. Referring to fig. 3, the monitoring and dispatching module includes a chip U1 and its peripheral circuits, the chip U1 is powered by a power source VCC, control signals CR1-CR6 of the chip U1 are respectively transmitted to different diodes, each monitoring and dispatching module may include a circuit structure as shown in fig. 3, and each monitoring and dispatching module and each loading port 10 may communicate with the serial port of the front loading module 20.
Optionally, the front loading module 20 includes a slave controller 21, a robot 22, a robot control unit 23, and a pre-positioning unit 24, where the slave controller 21 is communicatively connected to the master controller 40 and the pre-positioning unit 24, and the slave controller 21, the robot control unit 23, and the robot 22 are sequentially electrically connected.
The control command of the main controller 40 is received from the controller 21, and the working state of the robot control unit 23 is controlled according to the received control command, so that the robot control unit 23 controls the robot 22 to load the wafer, and the robot 22 can load the wafer to the pre-positioning position of the pre-positioning unit 24, that is, the preset position, through the loading port.
Optionally, the robot 22 includes at least two arms.
For example, the robot 22 includes two arms, and if at the present time, both arms of the robot 22 do not have loading operations, the two arms can simultaneously perform loading operations through two loading ports, respectively, wherein one arm loads a wafer through one loading port, and the other arm loads a wafer through the other loading port, so as to realize loading of wafers through both loading ports simultaneously.
In addition, the wafer position monitoring and dispatching device may further include a plurality of status indicator lamps, such as red, blue and yellow lamps, where each status indicator lamp is connected to the main controller, for example, the main controller is turned on when there is an interrupt shielding, and is turned on when there is no interrupt shielding, and the main controller is turned on when it sends a signal.
According to the wafer position monitoring and dispatching device provided by the embodiment, the main controller controls the working state of the front-end loading module according to the monitoring and dispatching signals of the monitoring and dispatching modules, for example, the main controller controls the front-end loading module to load and dispatch the wafer through the first loading port and temporarily shield the monitoring and dispatching signals corresponding to other loading ports according to the monitoring and dispatching signals of the monitoring and dispatching modules, if the front-end loading module can also load and dispatch the wafer of other loading ports at the same time, the front-end loading module is controlled to load and dispatch the wafer to the preset position through the first loading port and the second loading port, the monitoring and dispatching signals corresponding to the third loading port are shielded in the process, and when the front-end loading module loads and dispatches the wafer to the preset position through the first loading port, the front-end loading module is controlled to load and dispatch the wafer through the third loading port, so that the wafer loading process of one loading port can be simultaneously carried out through at least two loading ports, the problem that the wafer loading process of the other loading ports in the prior art is met is solved, and the reliability of the wafer loading machine can be improved.
Example III
Fig. 3 is a flowchart of a wafer position monitoring and dispatching method provided in a second embodiment of the present invention, where the method may be applied to performing position monitoring and dispatching on a wafer, and the method may be performed by a main controller in a wafer position monitoring and dispatching device, where the main controller may be implemented in software and/or hardware, and the main controller may be integrated in an electronic device such as a computer, and the method specifically includes the following steps:
step 110, receiving a monitoring scheduling signal.
The monitoring scheduling signals are generated by a monitoring scheduling module in the monitoring scheduling modules and transmitted to the controller, and the monitoring scheduling signals can comprise monitoring information of the loading ports corresponding to the monitoring scheduling modules.
And 120, controlling the working state of the front loading module according to the monitoring and dispatching signals so as to realize the loading and dispatching of the wafers through the two loading ports at the same time.
Specifically, when the monitoring scheduling signals transmitted by at least two monitoring scheduling modules include wafers of corresponding loading ports to be loaded, if the front loading module is not in a working stage at this time, the controller controls the front loading module to load the wafers through at least two loading ports simultaneously. In an exemplary embodiment, when the monitoring dispatch signals transmitted by the two monitoring dispatch modules include wafers of a load port, if the front end load module is not in a working stage, the controller controls the front end load module to load the wafers through the two load ports at the same time, when the monitoring dispatch signals transmitted by the three monitoring dispatch modules (corresponding to the first load port, the second load port and the third load port respectively) include wafers of a load port, the controller controls the front end load module to load the wafers through the first load port and temporarily shield signals of the monitoring dispatch modules corresponding to the other load ports, if the front end load module can also load the wafers of the other load ports at this time, the controller controls the front end load module to load the wafers through the first load port and the second load port at the same time and load the wafers to a preset position, and temporarily shield signals of the monitoring dispatch module corresponding to the third load port in the process until the front end load module finishes loading the wafers to the preset position through the first load port and/or loads the wafers to the preset position through the second load port.
The embodiment also provides a wafer position monitoring and dispatching device system, which comprises the wafer position monitoring and dispatching device according to any embodiment of the invention, and further comprises a material box for placing a plurality of wafers, wherein the material boxes are in one-to-one correspondence with the loading ports. Wherein, each loading port corresponds to a material box, and the loading ports scan the corresponding material boxes.
Optionally, different wafers are placed in different positions in the magazine. Specifically, a plurality of wafers may be placed in the magazine, and each wafer in the magazine may have a respective position, e.g., the wafer is located in the first layer of the magazine, and the loading port may scan the magazine near the loading port, e.g., scan whether there is a wafer in the magazine and a specific position of the wafer, to determine whether there is a wafer to be loaded and load the wafer according to the position of the wafer.
The wafer position monitoring and dispatching system and method provided by the embodiment belong to the same invention conception as the wafer position monitoring and dispatching device provided by any embodiment of the invention, have corresponding beneficial effects, and the detailed technical details of the embodiment are not shown in the wafer position monitoring and dispatching device provided by any embodiment of the invention.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, and that various obvious changes, rearrangements, combinations, and substitutions can be made by those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (8)
1. A wafer position monitoring and scheduling apparatus, comprising:
At least two load ports;
the front loading module is used for loading the wafer through the loading port;
The monitoring scheduling modules are in one-to-one correspondence with the loading ports, are connected with the corresponding loading ports in parallel, and are used for monitoring the loading ports and generating monitoring scheduling signals;
The main controller is in communication connection with the monitoring and dispatching module and the front-end loading module, and is used for controlling the working state of the front-end loading module according to the monitoring and dispatching signals so as to realize loading and dispatching of the wafers through at least two loading ports;
The front loading module comprises a slave controller, a manipulator control unit and a pre-positioning unit, wherein the slave controller is in communication connection with the master controller and the pre-positioning unit, and the slave controller, the manipulator control unit and the manipulator are electrically connected in sequence; the manipulator includes at least two arms.
2. The wafer position monitoring and dispatching device of claim 1, wherein the monitoring and dispatching modules comprise a first monitoring and dispatching module, a second monitoring and dispatching module and a third monitoring and dispatching module, and the main controller, the first monitoring and dispatching module, the second monitoring and dispatching module and the third monitoring and dispatching module are connected in series.
3. The wafer position monitoring scheduler of claim 2, wherein the load ports comprise a first load port, a second load port, and a third load port, the first load port is connected to the first monitoring scheduler module parallel port, the second load port is connected to the second monitoring scheduler module parallel port, and the third load port is connected to the third monitoring scheduler module parallel port.
4. The wafer position monitoring and dispatching device of claim 2, wherein the first monitoring and dispatching module, the second monitoring and dispatching module, the third monitoring and dispatching module and the front loading module are sequentially connected in serial, and each loading port is in communication connection with the front loading module.
5. A wafer position monitoring and dispatching device system, comprising the wafer position monitoring and dispatching device according to any one of claims 1-4, and further comprising a magazine for placing a plurality of wafers, wherein the magazine corresponds to the loading port one by one.
6. The wafer position monitoring scheduler system of claim 5, wherein different wafers are placed at different locations in the magazine.
7. A wafer position monitoring and dispatching method, wherein the wafer position monitoring and dispatching method is executed by the main controller according to any one of claims 1 to 4, and the wafer position monitoring and dispatching method comprises:
Receiving a monitoring scheduling signal;
And controlling the working state of the front loading module according to the monitoring and dispatching signal so as to realize loading and dispatching of the wafers through the two loading ports at the same time.
8. The wafer position monitoring and dispatching method of claim 7, wherein controlling the operating state of the front-end loading module according to the monitoring and dispatching signal comprises:
And when the wafers including at least two loading ports in the monitoring and dispatching signals need to be loaded, controlling the front loading module to simultaneously load the wafers through the at least two loading ports.
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| CN105185731A (en) * | 2015-08-17 | 2015-12-23 | 北京七星华创电子股份有限公司 | Wafer scheduling control method and system of semiconductor heat processing device |
| KR20200093222A (en) * | 2019-01-28 | 2020-08-05 | 코스텍시스템(주) | Transferring apparatus of wafer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102222603B (en) * | 2011-03-10 | 2016-01-27 | 上海华虹宏力半导体制造有限公司 | Wafer detection system |
| CN216902858U (en) * | 2021-12-28 | 2022-07-05 | 拓荆科技股份有限公司 | Wafer processing equipment |
| CN114783924B (en) * | 2022-04-06 | 2023-09-01 | 深圳市深科达智能装备股份有限公司 | Wafer carrying device, wafer carrying control method, electric device, and storage medium |
| CN115394694B (en) * | 2022-10-28 | 2023-03-24 | 泓浒(苏州)半导体科技有限公司 | Position monitoring system of image information based on wafer transmission process |
| CN116627620B (en) * | 2023-07-25 | 2023-09-29 | 无锡卓海科技股份有限公司 | Multi-task real-time concurrent processing method suitable for embedded SMIF loading mechanism |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105185731A (en) * | 2015-08-17 | 2015-12-23 | 北京七星华创电子股份有限公司 | Wafer scheduling control method and system of semiconductor heat processing device |
| KR20200093222A (en) * | 2019-01-28 | 2020-08-05 | 코스텍시스템(주) | Transferring apparatus of wafer |
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