CN114823455B - Device and method for adjusting wafer position - Google Patents
Device and method for adjusting wafer position Download PDFInfo
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- CN114823455B CN114823455B CN202210767535.6A CN202210767535A CN114823455B CN 114823455 B CN114823455 B CN 114823455B CN 202210767535 A CN202210767535 A CN 202210767535A CN 114823455 B CN114823455 B CN 114823455B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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Abstract
The embodiment of the invention discloses a device and a method for adjusting the position of a wafer, wherein the device comprises the following components: a light source for irradiating a light beam to a wafer to form a first light spot and a second light spot on a surface of the wafer, wherein the first light spot and the second light spot are both linear and both end points of each are located at a periphery of the wafer; the sensor is used for sensing the actual center position of the wafer according to the first light spot and the second light spot; a processor for obtaining a deviation between the actual center position and a target center position of the wafer; and the controller is used for controlling the wafer to move according to the deviation so as to enable the actual center position to coincide with the target center position.
Description
Technical Field
The present invention relates to the field of semiconductor manufacturing technology, and in particular, to an apparatus and method for adjusting a wafer position.
Background
Multi-arm wafer transfer apparatus for transferring wafers stored in a wafer cassette are known in the art. The wafer cassette typically has a plurality of slots arranged in a stacked fashion within the wafer cassette, each slot adapted to receive a single wafer, and the multi-arm wafer transfer apparatus has a plurality of gripper arms that can simultaneously or once grip a respective plurality of wafers in the slots corresponding to the plurality of gripper arms, and which can move with the robot arm of the apparatus to transfer the gripped wafers to a target location. In the wafer production process, in order to perform grinding/etching/polishing/inspection and the like on the wafer, the wafer is frequently taken out/put into the cassette by the robot arm, and the wafer position is often inspected.
A common wafer position detection method is to make a manipulator pass through a specific detection device in a state of carrying a wafer, and a specific sensor in the detection device records the moment when the wafer enters the sensor and the moment when the wafer leaves the sensor, and determines the position of the wafer by using time and speed.
However, the accuracy of the current detection mode is greatly affected by the response time of the sensor, the communication delay, the acceleration and deceleration of the manipulator, and the like, so that the detection accuracy is low, and the process that the manipulator carries the wafer to pass through the specific detection device can affect the production progress, thereby affecting the productivity.
Disclosure of Invention
In order to solve the above-mentioned problems, it is desirable to provide an apparatus and a method for sensing a wafer position and adjusting the wafer to a target position in a non-contact manner.
The technical scheme of the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides an apparatus for adjusting a position of a wafer, the apparatus including:
a light source for irradiating a light beam to a wafer to form a first light spot and a second light spot on a surface of the wafer, wherein the first light spot and the second light spot are both linear and both end points of each are located at a periphery of the wafer;
the sensor is used for sensing the actual center position of the wafer according to the first light spot and the second light spot;
a processor for obtaining a deviation between the actual center position and a target center position of the wafer;
and the controller is used for controlling the wafer to move according to the deviation so as to enable the actual center position to coincide with the target center position.
In a second aspect, an embodiment of the present invention provides a method for adjusting a position of a wafer, the method including:
irradiating a light beam to a wafer to form a first light spot and a second light spot on the surface of the wafer, wherein the first light spot and the second light spot are both linear and two end points of each are positioned at the periphery of the wafer;
sensing an actual center position of the wafer according to the first light spot and the second light spot;
obtaining a deviation between the actual center position and a target center position of the wafer;
and controlling the wafer to move according to the deviation so as to enable the actual center position to coincide with the target center position.
The embodiment of the invention provides a device and a method for adjusting the position of a wafer; the device comprises a light source, a sensor, a processor and a controller, wherein the sensor senses the actual center position of the wafer according to a light spot formed by a light beam projected on the surface of the wafer by the light source, the controller controls the movement of the wafer according to the deviation between the actual center position obtained by the processor and the target center position so as to enable the actual center position of the wafer to coincide with the target center position, thereby determining the actual center position of the wafer in a non-contact mode, the sensor, the processor and the controller form closed loop control, and the controller executes the operation of adjusting the position of the wafer according to the sensing and calculating results, so that the position of the wafer can be adjusted in a simple and accurate mode.
Drawings
FIG. 1 illustrates a schematic diagram of an apparatus for adjusting wafer position in accordance with an embodiment of the present invention;
FIG. 2 illustrates a schematic diagram of an apparatus for adjusting a position of a wafer sensing an actual center position of the wafer according to an embodiment of the present invention;
FIG. 3 shows a schematic view of an apparatus for adjusting a position of a wafer sensing an actual center position of the wafer according to another embodiment of the present invention;
FIG. 4 shows a schematic view of an apparatus for adjusting a position of a wafer sensing an actual center position of the wafer according to another embodiment of the present invention;
FIG. 5 shows a schematic view of an apparatus for adjusting a position of a wafer sensing an actual center position of the wafer according to another embodiment of the present invention;
fig. 6 shows a schematic diagram of a method for adjusting wafer position according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1, an embodiment of the present invention provides an apparatus 1 for adjusting a wafer position, the apparatus 1 including: a light source 10 for irradiating a light beam to a wafer W to form a first light spot B1 and a second light spot B2 on a surface of the wafer W, wherein the first light spot B1 and the second light spot B2 are both linear and both end points of each are located at a peripheral edge WP of the wafer W; a sensor 11, wherein the sensor 11 is used for sensing an actual center position PA of the wafer W according to the first light spot B1 and the second light spot B2; a processor 12, wherein the processor 12 is configured to obtain a deviation DA between the actual center position PA and a target center position PP of the wafer W; and a controller 13, wherein the controller 13 is used for controlling the wafer W to move according to the deviation DA so as to enable the actual center position PA to coincide with the target center position PP.
The embodiment of the invention provides a device for adjusting the position of a wafer; the apparatus 1 includes a light source 10, a sensor 11, a processor 12, and a controller 13, the sensor 11 senses an actual center position PA of the wafer W based on two light spots formed by light beams projected on a surface of the wafer W by the light source 10, the controller 13 controls the movement of the wafer W based on a deviation DA between the actual center position PA obtained by the processor 12 and a target center position PP so that the actual center position PA of the wafer W coincides with the target center position PP, whereby the actual center position PA of the wafer W can be determined in a noncontact manner, and the sensor 11, the processor 12, and the controller 13 form a closed loop control, and the controller 13 performs an operation of adjusting the position of the wafer W based on the sensed and calculated results, realizing an adjustment of the position of the wafer W in a simple and highly accurate manner.
The manner in which the sensor 11 senses the actual center position of the wafer will be described by various embodiments.
According to a preferred embodiment of the present invention, referring to fig. 2, the sensor 11 acquires at least three positions among a first position P1 of a first end point D1 of the first light spot B1, a second position P2 of a second end point D2 of the first light spot B1, a third position P3 of a first end point D3 of the second light spot B2, and a fourth position P4 of a second end point D4 of the second light spot B2, and takes a position of an intersection point of bisectors of two line segments connecting the at least three positions as the actual center position PA of the wafer W. In the embodiment shown in fig. 2, the first position P1 connecting the first endpoint D1 of the first light spot B1 and the second position P2 connecting the second endpoint D2 of the first light spot B1 form a first line segment N1, and the first position P1 connecting the first endpoint D1 of the first light spot B1 and the fourth position P4 connecting the second endpoint D4 of the second light spot B2 form a second line segment N2, the perpendicular bisector of the first line segment N1 is O1, the perpendicular bisector of the second line segment N2 is O2, one end of the perpendicular bisector O1 perpendicularly intersects the first line segment N1 at the point M1, one end of the perpendicular bisector O2 perpendicularly intersects the second line segment N2 at the point M2, the other end of the perpendicular bisector O1 intersects the other end of the perpendicular bisector O2, and the intersection point of the perpendicular bisector O2 is the actual center position PA of the wafer W.
In order to make the sensed actual center position of the wafer more accurate, it is preferable that the two positions where each line segment is connected are not adjacent, specifically, as shown in fig. 3, the first position P1 connecting the first end point D1 of the first spot B1 and the third position P3 connecting the first end point D3 of the second spot B2 form a first line segment N1, the second position P2 connecting the second end point D2 of the first spot B1 and the fourth position P4 connecting the second end point D4 of the second spot B2 form a second line segment N2, and as can be seen from fig. 2, the two end points of the first line segment N1 are not adjacent to each other in the circumferential direction of the wafer but are separated by the second end point D2 of the first spot B1, and as well, the two end points of the second line segment N2 are not adjacent to each other in the circumferential direction of the wafer but are separated by the first end point D3 of the second spot B2, whereby the positions of the four end points of the two spots can be taken as the actual center position values of the wafer at the same time. The actual center position PA of the wafer W can be determined by obtaining the position of the intersection point of the perpendicular bisector of the first line segment N1 and the perpendicular bisector of the second line segment N2.
According to a preferred embodiment of the present invention, referring to fig. 4, the first end point D1 of the first spot B1 coincides with the second end point D4 of the second spot B2 and the first spot B1 and the second spot B2 are perpendicular to each other, the sensor 11 acquires the first position P1 of the second end point D2 of the first spot B1 and the second position P2 of the first end point D3 of the second spot B2, and takes the position of the midpoint of the line segment connecting the first position P1 and the second position P2 as the actual center position PA of the wafer W.
Specifically, referring to fig. 4, the first end point D1 of the first light spot B1 coincides with the second end point D4 of the second light spot B2, and the first light spot B1 and the second light spot B2 are perpendicular to each other, in this case, the first position P1 of the second end point D2 of the first light spot B1 and the second position P2 of the first end point D3 of the second light spot B2 are connected, so that the first line segment N1 may be obtained, and the position of the midpoint of the first line segment N1 may be used as the actual center position PA of the wafer W.
According to another preferred embodiment of the present invention, referring to fig. 5, the first spot B1 and the second spot B2 are perpendicular to each other and the second spot B2 passes through the midpoint of the first spot B1, the sensor 11 acquires the position of the midpoint of the second spot B2 and takes the position of the midpoint of the second spot B2 as the actual center position PA of the wafer W.
For the light source 10, preferably, referring to fig. 1, the light source 10 includes a light emitting body 101 for emitting a light beam and a guide 102 for guiding the light beam in a straight line.
During processing of wafers, transfer of the wafers between the different stations is typically performed by a robot arm, for which the light source 10 is preferably arranged on a robot arm R for picking and placing wafers W, see fig. 1.
Further preferably, the controller 13 controls the robot arm R to move so that the actual center position PA of the wafer W gripped by the robot arm R coincides with the target center position PP.
The position of the wafer is controlled by controlling the movement of the mechanical arm R, the wafer can be placed at the target position once after being aligned with the target position, the process of repeatedly picking and placing the wafer is avoided, the risk of damaging the wafer by the mechanical arm is reduced, and the operation efficiency is improved.
Referring to fig. 6, an embodiment of the present invention further provides a method for adjusting a wafer position, the method including:
s101: irradiating a light beam to a wafer to form a first light spot and a second light spot on the surface of the wafer, wherein the first light spot and the second light spot are both linear and two end points of each are positioned at the periphery of the wafer;
s102: sensing an actual center position of the wafer according to the first light spot and the second light spot;
s103: obtaining a deviation between the actual center position and a target center position of the wafer;
s104: and controlling the wafer to move according to the deviation so as to enable the actual center position to coincide with the target center position.
The sensing the actual center position of the wafer according to the first light spot and the second light spot comprises:
acquiring at least three positions of a first position of a first endpoint of the first light spot, a second position of a second endpoint of the first light spot, a third position of the first endpoint of the second light spot and a fourth position of the second endpoint of the second light spot;
and taking the position of the intersection point of the perpendicular bisectors of the two line segments connecting the at least three positions as the actual center position of the wafer.
According to a preferred embodiment of the invention, the two locations where each line segment connects are not adjacent.
It should be noted that: the technical schemes described in the embodiments of the present invention may be arbitrarily combined without any collision.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. An apparatus for adjusting a wafer position, the apparatus comprising:
a light source for irradiating a light beam to a wafer to form a first light spot and a second light spot on a surface of the wafer, wherein the first light spot and the second light spot are both linear and both end points of each are located at a periphery of the wafer;
the sensor is used for sensing the actual center position of the wafer according to the first light spot and the second light spot;
a processor for obtaining a deviation between the actual center position and a target center position of the wafer;
a controller for controlling the wafer movement according to the deviation so that the actual center position coincides with the target center position;
the sensor acquires at least three positions of a first position of a first endpoint of the first light spot, a second position of a second endpoint of the first light spot, a third position of the first endpoint of the second light spot and a fourth position of the second endpoint of the second light spot, and takes a position of an intersection point of perpendicular bisectors of two line segments connecting the at least three positions as the actual center position of the wafer, wherein the two positions connected by each line segment are not adjacent.
2. The apparatus of claim 1, wherein the light source is disposed on a robotic arm for picking and placing wafers.
3. The apparatus of claim 2, wherein the controller is configured to control the robot arm to move such that the actual center position of the wafer held by the robot arm coincides with the target center position.
4. An apparatus for adjusting a wafer position, the apparatus comprising:
a light source for irradiating a light beam to a wafer to form a first light spot and a second light spot on a surface of the wafer, wherein the first light spot and the second light spot are both linear and both end points of each are located at a periphery of the wafer;
the sensor is used for sensing the actual center position of the wafer according to the first light spot and the second light spot;
a processor for obtaining a deviation between the actual center position and a target center position of the wafer;
a controller for controlling the wafer movement according to the deviation so that the actual center position coincides with the target center position;
wherein a first end point of the first light spot coincides with a second end point of the second light spot and the first light spot and the second light spot are perpendicular to each other, the sensor acquires a first position of the second end point of the first light spot and a second position of the second end point of the second light spot, and takes a position of a midpoint of a line segment connecting the first position and the second position as the actual center position of the wafer.
5. The apparatus of claim 4, wherein the light source is disposed on a robotic arm for picking and placing wafers.
6. The apparatus of claim 5, wherein the controller is configured to control the robotic arm to move such that the actual center position of the wafer held by the robotic arm coincides with the target center position.
7. An apparatus for adjusting a wafer position, the apparatus comprising:
a light source for irradiating a light beam to a wafer to form a first light spot and a second light spot on a surface of the wafer, wherein the first light spot and the second light spot are both linear and both end points of each are located at a periphery of the wafer;
the sensor is used for sensing the actual center position of the wafer according to the first light spot and the second light spot;
a processor for obtaining a deviation between the actual center position and a target center position of the wafer;
a controller for controlling the wafer movement according to the deviation so that the actual center position coincides with the target center position;
wherein the first light spot and the second light spot are perpendicular to each other and the second light spot passes through a midpoint of the first light spot, the sensor acquires a position of the midpoint of the second light spot, and the position of the midpoint of the second light spot is taken as the actual center position of the wafer.
8. The apparatus of claim 7, wherein the light source is disposed on a robotic arm for picking and placing wafers.
9. The apparatus of claim 8, wherein the controller is configured to cause the actual center position of the wafer held by the robot arm to coincide with the target center position by controlling the robot arm to move.
10. A method for adjusting wafer position, the method comprising:
irradiating a light beam to a wafer to form a first light spot and a second light spot on the surface of the wafer, wherein the first light spot and the second light spot are both linear and two end points of each are positioned at the periphery of the wafer;
sensing an actual center position of the wafer according to the first light spot and the second light spot;
obtaining a deviation between the actual center position and a target center position of the wafer;
controlling the wafer to move according to the deviation so as to enable the actual center position to coincide with the target center position;
wherein the sensing the actual center position of the wafer according to the first light spot and the second light spot includes:
acquiring at least three positions of a first position of a first endpoint of the first light spot, a second position of a second endpoint of the first light spot, a third position of the first endpoint of the second light spot and a fourth position of the second endpoint of the second light spot;
and taking the position of the intersection point of the perpendicular bisectors of the two line segments connecting the at least three positions as the actual center position of the wafer, wherein the two positions connected by each line segment are not adjacent.
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| CN202210767535.6A CN114823455B (en) | 2022-07-01 | 2022-07-01 | Device and method for adjusting wafer position |
| TW111140347A TWI817786B (en) | 2022-07-01 | 2022-10-25 | Device and method for adjusting wafer position |
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| CN202210767535.6A CN114823455B (en) | 2022-07-01 | 2022-07-01 | Device and method for adjusting wafer position |
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| CN114823455A CN114823455A (en) | 2022-07-29 |
| CN114823455B true CN114823455B (en) | 2023-05-12 |
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| CN117080119B (en) * | 2023-08-17 | 2024-09-13 | 泓浒(苏州)半导体科技有限公司 | Method and system for detecting and calibrating semiconductor wafer position |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101190525A (en) * | 2006-11-22 | 2008-06-04 | 富士迈半导体精密工业（上海）有限公司 | Automatic correction mechanical arm |
| CN110849898A (en) * | 2018-08-21 | 2020-02-28 | 深圳中科飞测科技有限公司 | Wafer defect detection system and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3137160B2 (en) * | 1994-04-01 | 2001-02-19 | 日立電子エンジニアリング株式会社 | Wafer misalignment correction method |
| JP5417343B2 (en) * | 2007-12-27 | 2014-02-12 | ラム リサーチ コーポレーション | System and method for calibrating an end effector alignment using at least one light source |
| CN106783712B (en) * | 2015-11-24 | 2019-07-02 | 沈阳新松机器人自动化股份有限公司 | The method of dynamic wafer centre deviation position is verified in AWC system |
| CN106684026B (en) * | 2017-03-13 | 2023-07-11 | 北京京仪自动化装备技术股份有限公司 | Automatic wafer center-searching device |
| CN208478309U (en) * | 2018-05-29 | 2019-02-05 | 深圳信息职业技术学院 | A kind of optical imaging device and wafer alignment system for wafer alignment |
| CN208433384U (en) * | 2018-08-03 | 2019-01-25 | 德淮半导体有限公司 | Wafer position real-time detection system |
| WO2020038359A1 (en) * | 2018-08-21 | 2020-02-27 | 深圳中科飞测科技有限公司 | Detection system and method |
| CN111106053B (en) * | 2018-10-25 | 2023-08-04 | 上海微电子装备（集团）股份有限公司 | Silicon wafer prealignment device and method |
| CN110411378B (en) * | 2019-08-06 | 2021-02-09 | 杭州众硅电子科技有限公司 | Wafer detection device and detection method thereof |
| CN113380686A (en) * | 2021-05-18 | 2021-09-10 | 沈阳芯源微电子设备股份有限公司 | Automatic wafer centering method |
| CN113793826B (en) * | 2021-11-16 | 2022-03-08 | 西安奕斯伟材料科技有限公司 | Silicon wafer orientation alignment device and silicon wafer defect detection equipment |
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- 2022-10-25 TW TW111140347A patent/TWI817786B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101190525A (en) * | 2006-11-22 | 2008-06-04 | 富士迈半导体精密工业（上海）有限公司 | Automatic correction mechanical arm |
| CN110849898A (en) * | 2018-08-21 | 2020-02-28 | 深圳中科飞测科技有限公司 | Wafer defect detection system and method |
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| Publication number | Publication date |
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| TWI817786B (en) | 2023-10-01 |
| CN114823455A (en) | 2022-07-29 |
| TW202312340A (en) | 2023-03-16 |
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Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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