CN114554070A

CN114554070A - Optical anti-shake camera module

Info

Publication number: CN114554070A
Application number: CN202011338735.7A
Authority: CN
Inventors: 卞强龙; 李剑虹; 吴湖; 刘佳
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2020-11-25
Filing date: 2020-11-25
Publication date: 2022-05-27
Anticipated expiration: 2040-11-25
Also published as: CN114554070B

Abstract

The invention relates to an optical anti-shake camera module, which comprises: a lens; a photosensitive assembly including a photosensitive chip; the first driving part is suitable for mounting the lens and driving the lens to translate in the directions of an x axis and a y axis; and a second driving part adapted to mount the photosensitive assembly and drive the photosensitive chip to translate in x-axis and y-axis directions, the lens and the photosensitive chip being configured to be driven simultaneously and to move in opposite directions, wherein the second driving part includes a second base part including a base and a cover, and a second movable part; the second movable part comprises at least two chip end carriers arranged from bottom to top; the base part base and the at least two chip end carriers are provided with a plurality of guide grooves, and different guide grooves are respectively used for guiding the translation of the translation in the x-axis direction and the y-axis direction. This application can be separated x-axis and y-axis translation track through the second movable part that has multilayer ball and composite construction, has improved the anti-shake precision.

Description

Optical anti-shake camera module

Technical Field

The invention relates to the technical field of camera equipment, in particular to an optical anti-shake camera module.

Background

With the increase of the demand of consumers for mobile phone photographing, the functions of a mobile phone camera (i.e., a camera module) are more and more abundant, functions of portrait photographing, telephoto photographing, optical zooming, optical anti-shake and the like are all integrated in a camera with a limited volume, and the functions of auto-focusing, optical anti-shake, optical zooming and the like are often realized by an optical actuator (sometimes also referred to as a motor).

Fig. 1 shows a typical camera module with a motor in the prior art. Referring to fig. 1, the camera module generally includes a lens 1, a motor mechanism 2 (which may be simply referred to as a motor), and a photosensitive member 3. In the shooting state of the camera module, light from a shooting object is focused on a photosensitive element 3a of a photosensitive assembly 3 through a lens 1. Structurally, the lens 1 is fixed to a motor carrier (specifically shown in fig. 1) of a motor, and the motor carrier is a movable component which can drive the lens 1 to move in the optical axis direction under the action of a driving element of the motor to realize a focusing function. For a camera module with an optical anti-shake (OIS) function, the motor usually has a more complicated structure. This is because the motor needs to drive the lens 1 to move in other degrees of freedom (e.g., in a direction perpendicular to the optical axis) in addition to the lens to move in the optical axis direction to compensate for a shake at the time of shooting. In general, the shake of the image pickup module includes translation in a direction perpendicular to the optical axis (translation in the x-axis and y-axis directions) and rotation (rotation in the xoy plane, whose rotation axis direction may be substantially the same as the optical axis), and tilt shake (rotation around the x-axis and y-axis, and tilt shake is also called tilt shake in the field of image pickup modules). When the gyroscope (or other position sensing element) in the module detects the shake in a certain direction, a command can be sent to make the motor drive the lens to move a distance in the opposite direction, so as to compensate the shake of the lens. Generally, the lens is only translated and/or rotated in a direction perpendicular to the optical axis to compensate the shake of the camera module, because if the lens is rotated around the x and y axes, i.e. if the anti-shake effect is achieved through tilt adjustment of the lens, the imaging quality of the module may be reduced, and even the basic imaging quality requirement may be difficult to achieve due to imaging blur.

However, as the imaging quality of the mobile phone camera module is higher and higher, the volume and weight of the lens are higher and higher, and the requirement for the driving force of the motor is also higher and higher. The current electronic device (e.g., a mobile phone) also has a great limitation on the volume of the camera module, and the occupied volume of the motor increases correspondingly with the increase of the lens. In other words, in the trend of the lens barrel toward larger volume and larger weight, the driving force provided by the motor is difficult to increase accordingly. On the premise that the driving force is limited, the heavier the lens is, the shorter the stroke of the motor capable of driving the lens to move is, and the anti-shake capability is affected. On the other hand, the heavier the lens, the slower the motor can drive the lens to move, and the longer the lens reaches the predetermined compensation position, which also affects the anti-shake effect.

Therefore, a solution capable of improving the anti-shake stroke and anti-shake response speed of the camera module is urgently needed.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provide a solution capable of improving the anti-shake stroke and anti-shake response speed of a camera module.

In order to solve the above technical problem, the present invention provides an optical anti-shake camera module, which includes: a lens; the photosensitive assembly comprises a photosensitive chip; the first driving part is suitable for mounting the lens and driving the lens to translate in the directions of an x axis and a y axis; and the second driving part is suitable for mounting the photosensitive assembly and driving the photosensitive chip to translate in the directions of an x axis and a y axis, the lens and the photosensitive chip are configured to be driven simultaneously and move towards opposite directions, the x axis and the y axis are two coordinate axes perpendicular to the direction of the optical axis of the camera module, and the x axis and the y axis are perpendicular to each other. Wherein the second driving part comprises a second base part comprising a base part base and a cover, and a second movable part; the second movable part comprises at least two chip end carriers arranged from bottom to top; a plurality of guide grooves are arranged on the base part base and the at least two chip end carriers, and each guide groove comprises a first guide groove and a second guide groove; the upper surface of the base or the lower surface of the chip end carrier of the second movable part located lowermost has the first guide groove in which a first ball is provided and can roll along the first guide groove, the upper surface of the base and the chip end carrier of the second movable part located lowermost being supported by the first ball; in the second movable portion, for any two chip end carriers adjacent vertically, the second guide groove is provided on the upper surface of the chip end carrier located below or the lower surface of the chip end carrier located above, a second ball is provided in the second guide groove and can roll along the second guide groove, and the upper surface of the chip end carrier located below and the lower surface of the chip end carrier located above are supported by the second ball; the photosensitive assembly is mounted on the chip end carrier positioned at the uppermost part of the second movable part; and the guiding direction of at least one of the guiding grooves is a direction of translation along the x-axis, and the guiding direction of at least one of the guiding grooves is a direction of translation along the y-axis.

Wherein the guiding direction of the first guiding groove is a direction of translation along the x-axis or along the y-axis, and wherein the guiding direction of the second guiding groove of one of the chip end carriers is perpendicular to the guiding direction of the first guiding groove.

The chip end carrier comprises a chip end first carrier, a chip end second carrier and a chip end third carrier which are sequentially arranged from top to bottom; the second guide groove comprises an arc-shaped guide groove and a linear guide groove; the arc-shaped guide groove is used for guiding the second ball to roll along an arc rotating around a z-axis, wherein the z-axis is a coordinate axis consistent with the direction of the optical axis; the rectilinear guide groove is used for guiding the second ball to roll along the x axis or the y axis.

In the second movable portion, for any two chip end carriers adjacent up and down, a second adapting groove is formed in the lower surface of the chip end carrier located above or the upper surface of the chip end carrier located below, and the second adapting groove is adapted to the second guide groove and jointly forms a guide channel of the second ball.

The arc center of the arc-shaped guide groove is located right below the photosensitive center, wherein the photosensitive center is the center of the photosensitive area of the photosensitive chip.

Each chip end carrier comprises a carrier substrate and a carrier wall formed by extending upwards from the edge area of the carrier substrate, and the carrier wall surrounds the photosensitive assembly.

Wherein the second guide groove is positioned on the upper surface of the carrier wall; for any two chip end carriers adjacent up and down, the lower surface of the carrier wall of the chip end carrier positioned above is supported by the second ball.

Wherein the carrier wall comprises a wall body and an extension part formed by extending outwards from the top area of the wall body; for any two chip end carriers which are adjacent up and down, the second guide groove is positioned on the upper surface of the extension part of the chip end carrier below, and the lower surface of the extension part of the chip end carrier above is supported by the second ball.

Wherein, for any two chip end carriers adjacent up and down, the wall body of the chip end carrier below surrounds the wall body of the chip end carrier above; and there is a gap between the walls of the two chip end carriers.

Wherein each chip end carrier comprises a ring-shaped carrier wall surrounding the photosensitive assembly, and the second guide groove is positioned on the upper surface of the carrier wall.

Wherein at least one of said chip end carriers is a frame structure solely formed by said carrier walls.

In the second movable portion, a part of the chip end carrier is a frame structure formed by the carrier walls alone, and another part of the chip end carrier includes a carrier substrate and the carrier walls formed by extending upward from an edge area of the carrier substrate.

In the second movable portion, the uppermost chip end carrier includes the carrier substrate and the carrier wall, and the photosensitive element is mounted in a receiving groove formed by the carrier substrate and the carrier wall.

The lower surface of the chip end carrier or the upper surface of the base part base, which is positioned at the lowest part of the second movable part, is provided with a first adapting groove, and the first adapting groove is adapted to the first guide groove and jointly forms a guide channel of the first ball.

The second ball bearings comprise an upper layer of second ball bearings and a lower layer of second ball bearings; the upper layer of second balls is arranged between the lower surface of the chip end first carrier and the upper surface of the chip end second carrier; the lower layer second ball is arranged between the lower surface of the chip end second carrier and the upper surface of the chip end third carrier.

Wherein the first ball is disposed between a lower surface of the chip-end third carrier and an upper surface of the base portion base.

The arc-shaped guide groove is positioned on the lower surface of the first chip end carrier or the upper surface of the second chip end carrier; the straight guide groove is positioned on the lower surface of the chip end second carrier or the upper surface of the chip end third carrier.

Wherein the lid includes a lid sidewall and a bearing platform formed extending inwardly from a top region of the lid sidewall; the bottom of the cover side wall is connected with the base of the base part, the bearing table is positioned above the first chip end carrier, and a gap is formed between the lower surface of the bearing table and the upper surface of the first chip end carrier.

In a top view, the chip end carrier is rectangular in shape, and an edge area of the chip end carrier comprises a first edge, a second edge opposite to the first edge, a third edge intersecting with the first edge, and a fourth edge opposite to the third edge; the lengths of the first and second sides are greater than the lengths of the third and fourth sides; under the overlooking angle, the arc-shaped guide groove is arranged on the first edge and the second edge.

The linear guide grooves are arranged in four corner areas of the chip end carrier in a top view angle.

Wherein, in a top view, the second base part is rectangular in shape; the first guide grooves are arranged in four corner regions of the second base part or the chip end carrier.

The driving elements of the second driving part are coil magnet combinations, wherein magnets in the coil magnet combinations are all installed in the edge area of the second base part, and coils in the coil magnet combinations are all installed in the edge area of the chip end first carrier; the coil magnet combination comprises a first coil magnet pair, a second coil magnet pair and a third coil magnet pair; wherein the first coil magnet pair and the second coil magnet pair are used for providing driving force in the x-axis direction; the third coil magnet pair is used for providing driving force in the y-axis direction; and in a plan view, the first coil magnet pair and the second coil magnet pair may be arranged along a first side and a second side of the second driving part, respectively, the first side and the second side not intersecting, and the second coil magnet pair may be arranged along a third side of the second driving part, the third side intersecting both the first side and the second side.

Wherein the lid includes a lid sidewall and a bearing platform formed extending inwardly from a top region of the lid sidewall; the bottom of the cover side wall is connected with the base part of the base part, the bearing table is positioned above the first chip end carrier, and a gap is formed between the lower surface of the bearing table and the upper surface of the first chip end carrier; wherein the magnets in the coil magnet assembly are mounted to the cover, the base portion base, or the chip end third carrier; and wherein the magnets of the first coil magnet pair and the magnets of the second coil magnet pair are mounted to the same member, the member being one of the cover, the base, and the chip end third carrier.

The magnets of the first coil magnet pair are arranged on one side, close to the third edge, of the first edge, and the second coil magnet pair is arranged on one side, away from the third edge, of the second edge.

Determining a lens moving distance b for driving the lens to move by the first driving module and a photosensitive chip moving distance c for driving the photosensitive chip to move by the second driving module according to the detected inclined shaking angle a of the camera module; the lens moving distance b, the photosensitive chip moving distance c and the image space focal length f of the camera module meet the following requirements: a is arctan (b/f) + arctan (c/f).

The driving structure further comprises a driving logic module, wherein the driving logic module is used for keeping the proportion of the lens moving distance b to the photosensitive chip moving distance c at a preset fixed proportion.

The driving structure further comprises a driving logic module which is provided with an anti-shake threshold K, the driving logic module is used for keeping the proportion of the lens moving distance b to the photosensitive chip moving distance c at a preset fixed proportion when the inclined shake angle a is smaller than or equal to the anti-shake threshold K, and the photosensitive chip moving distance c reaches the maximum value c of the moving stroke when the inclined shake angle a is larger than the anti-shake threshold K_maxThe lens moving distance b is in accordance with the relation b ═ tan (a/f) -c_maxAnd (6) calculating.

The preset fixed proportion of the moving distance of the lens and the moving distance of the photosensitive chip is set according to the weight of the lens, the driving force of the first driving part, the weight of the photosensitive chip or the photosensitive assembly and the driving force of the second driving part, so that the time for moving the lens and the photosensitive chip to the respective anti-shake target positions is consistent.

Wherein the first driving part includes a first base part and a first movable part, and the first base part and the second base part are fixed together.

The camera module comprises a first driving part, a second driving part and a photosensitive assembly, wherein the photosensitive assembly comprises a circuit board, the camera module further comprises a first connecting belt and a second connecting belt, the first connecting belt is arranged in the top area of the first driving part and is electrically connected with the first driving part, and the second connecting belt is connected with and conducted with the circuit board of the photosensitive assembly; wherein the second connecting belt is provided with a plurality of bends to form a bending and stacking shape.

Wherein the first driving part includes a first base part and a first movable part, and the second driving part includes a second base part and a second movable part; the second base part is fixed with the first base part, the second movable part is positioned below the second base part and movably connected with the second base part, and the photosensitive assembly is positioned below the second movable part and fixed on the second movable part; the photosensitive assembly comprises a suspension type circuit board, the suspension type circuit board comprises a rigid circuit board main body and a flexible connecting band, the connecting band is led out from a first side face and a second side face of the circuit board main body and is bent upwards to form a bent portion, the top of the bent portion extends along the periphery of the photosensitive assembly in the horizontal direction, so that the connecting band surrounds the peripheries of the first side face, the second side face and a third side face of the photosensitive assembly, the connecting bands positioned on the first side face, the second side face and the third side face are respectively provided with at least one suspension part, and the suspension parts are fixed on the second base part of the second driving part or fixed with the second base part through an intermediary; the photosensitive assembly is provided with a first side face and a second side face, the positions of the first side face and the second side face are consistent with those of the circuit board main body, the first side face and the second side face are oppositely arranged, and the third side face intersects with the first side face and the second side face.

The connecting band comprises a third connecting band and a fourth connecting band, the third connecting band is led out from the first side face of the circuit board main body and is bent upwards to form a bent part, then the third connecting band extends along the first side face of the photosensitive assembly, and the third connecting band is bent in the horizontal direction at a corner and continues to extend along the third side face; the fourth connecting band is led out from the second side face of the circuit board main body and is bent upwards to form another bent part, then extends along the second side face of the photosensitive assembly, is horizontally bent at a corner and continues to extend along the third side face; the third connecting belt and the fourth connecting belt are jointed at the third side surface and are mutually conducted; the hanging part of the connecting belt positioned on the third side is also connected with a fifth connecting belt, and the fifth connecting belt is provided with a connector for external connection; the suspension type circuit board is also provided with a fixing part for fixing the fifth connecting band.

Compared with the prior art, the application has at least one of the following technical effects:

1. this application can improve the anti-shake stroke of the module of making a video recording to can compensate the great shake of the module of making a video recording.

2. This application can improve the anti-shake response speed of the module of making a video recording.

3. The driving structure for the optical actuator has the advantage of compact structure, and is particularly suitable for miniaturized camera modules.

4. In some embodiments of the present application, the setting can be performed according to the weight of the lens, the driving force of the first driving portion, the weight of the photosensitive chip (or the photosensitive assembly), the driving force of the second driving portion, and other factors, so that the time for the lens and the photosensitive chip to move to the respective anti-shake target positions is substantially consistent, and a better anti-shake effect is obtained.

5. In some embodiments of this application, can reduce the interference that the connecting band removed the sensitization subassembly anti-shake through the suspension type circuit board to guarantee anti-shake stroke and response speed effectively.

6. In some embodiments of the present application, the x-axis and y-axis translation rails (guide grooves) may be separated by the second movable part having a multi-layer ball and composite structure, improving the anti-shake precision.

7. In some embodiments of the present application, the degree of freedom of the anti-shake movement can be further increased and the anti-shake accuracy can be improved by adding a guide groove that rotates about the z-axis to the second movable part or the second base part. The inventor researches and discovers that when the driving element provides a driving force rotating around the z-axis, x-axis deviation or y-axis deviation is easily generated in the second movable part, so that anti-shake precision is reduced, and the guide groove and the layer of balls are separately designed for rotating around the z-axis, so that negative influence of the rotation motion on the anti-shake precision in the x-axis direction and the y-axis direction can be avoided.

Drawings

FIG. 1 illustrates a typical camera module having a motor in the prior art;

fig. 2 is a schematic cross-sectional view illustrating a camera module with an anti-shake function according to an embodiment of the present application;

fig. 3 is a schematic cross-sectional view illustrating a camera module with an anti-shake function according to another embodiment of the present application;

FIG. 4 is a schematic diagram illustrating the relationship between the moving distance of the lens and the photosensitive chip and the inclination angle of the module under four different conditions in the present application;

fig. 5 is a schematic cross-sectional view illustrating a camera module according to an embodiment of the present application;

fig. 6 is a schematic cross-sectional view illustrating a camera module according to another embodiment of the present disclosure;

fig. 7 shows a schematic cross-sectional view of a camera module in a further embodiment of the present application;

fig. 8 is a schematic cross-sectional view illustrating a camera module according to still another embodiment of the present application;

FIG. 9 illustrates an exploded perspective view of a second drive portion in one embodiment of the subject application;

FIG. 10 is an enlarged partial schematic view of a chip side third carrier and a corner region of a base portion pedestal in one embodiment of the present application;

FIG. 11 shows a perspective view of three chip end carriers and a base portion pedestal in one embodiment of the present application;

FIG. 12 shows a perspective view of two of the chip end carriers and base portion pedestals of FIG. 11;

fig. 13 shows a schematic cross-sectional view of a camera module of an embodiment of the present application;

FIG. 14 shows an enlarged schematic view of region A of FIG. 13;

FIG. 15 shows a schematic cross-sectional view of a second driving portion with a through hole in the base of the base portion of an embodiment of the present application;

fig. 16a shows the mounting position of the drive element of the second drive in an embodiment of the application in a top view;

FIG. 16b shows a schematic cross-sectional view of a second drive section of an embodiment of the present application including a drive element;

FIG. 17a is an exploded perspective view of a second drive section showing the position of the coils and magnets in one embodiment of the present application;

FIG. 17b is an exploded perspective view of a second drive section showing the position of the coils and magnets in another embodiment of the present application;

FIG. 17c is an exploded perspective view of the second driving portion showing the position of the coil and the magnet in a modified embodiment of the present application;

FIG. 17d is an exploded perspective view of the second driving portion showing the positions of the coil and the magnet in another modified embodiment of the present application;

FIG. 18a is a schematic view of the second drive portion of one embodiment of the present application as assembled prior to assembly;

FIG. 18b is a schematic view showing the manner of assembling the second driving part before assembling in another embodiment of the present application;

fig. 19 shows an arrangement of the camera module and the connecting band thereof in an embodiment of the present application;

FIG. 20 is a perspective view of the second driving portion and the photosensitive assembly after assembly in one embodiment of the present application;

FIG. 21 illustrates an exploded view of a second drive portion and a photosensitive assembly in one embodiment of the present application;

FIG. 22 is a perspective view of a photosensitive assembly and a suspended circuit board used therein according to one embodiment of the present application;

fig. 23a shows a schematic front view of a suspension board in an embodiment of the present application after deployment;

fig. 23b shows a schematic back view of a suspension board in an embodiment of the present application after deployment;

fig. 24a shows a schematic front view of a suspension board according to another embodiment of the present application after deployment;

fig. 24b shows a schematic view of the back side of a suspended wiring board after deployment in an embodiment of the present application;

fig. 25 is an exploded perspective view of a suspension board based camera module according to an embodiment of the present application;

fig. 26 illustrates a perspective view of a suspension circuit board based camera module with a housing according to an embodiment of the present application.

Detailed Description

For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the present application and does not limit the scope of the present application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.

It should be noted that the expressions first, second, etc. in this specification are used only to distinguish one feature from another feature, and do not indicate any limitation on the features. Thus, a first body discussed below may also be referred to as a second body without departing from the teachings of the present application.

In the drawings, the thickness, size, and shape of an object have been slightly exaggerated for convenience of explanation. The figures are purely diagrammatic and not drawn to scale.

It will be further understood that the terms "comprises," "comprising," "includes," "including," "has," "including," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Moreover, when a statement such as "at least one of" appears after a list of listed features, the entirety of the listed features is modified rather than modifying individual elements in the list. Furthermore, when describing embodiments of the present application, the use of "may" mean "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.

As used herein, the terms "substantially," "about," and the like are used as terms of table approximation and not as terms of table degree, and are intended to account for inherent deviations in measured or calculated values that will be recognized by those of ordinary skill in the art.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

The invention is further described below with reference to the accompanying drawings and specific embodiments.

Fig. 2 is a schematic cross-sectional view illustrating a camera module with an anti-shake function according to an embodiment of the present application. Referring to fig. 2, in the present embodiment, the image capturing module includes a lens 10, a photosensitive assembly 20, a first driving portion 30, and a second driving portion 40. Wherein the photosensitive assembly 20 includes a photosensitive chip 21. The first driving part 30 is configured to drive the lens 10 to move in both x and y directions, and the second driving part 40 is configured to drive the photosensitive chip 21 to move in both x and y directions. In this embodiment, the x and y directions are perpendicular to each other and are parallel to the light-sensing surface of the light-sensing element 20. The z direction is parallel to the normal direction of the light-sensing surface. For the sake of understanding, fig. 2 also shows a three-dimensional rectangular coordinate system constructed based on x, y, and z directions. In this embodiment, the control module drives the lens 10 and the photosensitive chip 21 to move in opposite directions at the same time, so as to achieve optical anti-shake of the camera module. Specifically, the lens 1 and the photosensitive chip 21 are configured to be driven simultaneously and move in opposite directions, for example, when the lens 10 is driven to move in the positive x-axis direction, the photosensitive chip 21 is driven to move in the negative x-axis direction; when the lens 10 is driven to move towards the positive y-axis direction, the photosensitive chip 21 is driven to move towards the negative y-axis direction; alternatively, the lens 10 is driven to move in the x-axis and the y-axis, and the photosensitive chip 21 is driven to move in the x-axis and the y-axis in the opposite direction to the movement of the lens 10, in other words, when the movement in the x-axis and the y-axis is required, the directions of the displacement vector of the lens 10 and the displacement vector of the photosensitive chip 21 are opposite on the xoy plane. The camera module generally includes a position sensor for detecting shake of the camera module or a terminal device (i.e., an electronic device, such as a mobile phone, on which the camera module is mounted). When the shake is detected, the position sensor sends a signal to the camera module to drive the lens 10 and the photosensitive chip 21 to move correspondingly to compensate the shake, so that the purpose of optical anti-shake is achieved. In this embodiment, the lens 10 and the photosensitive chip 21 are configured to move simultaneously, and the moving directions of the lens 10 and the photosensitive chip 21 are opposite, so that a faster response can be realized, and a better anti-shake effect is achieved. In addition, the anti-shake angle range of the camera module is usually limited by the suspension system and the driving system, and a relatively large compensation angle range cannot be achieved. In addition, in the present embodiment, by driving the lens 10 or the photosensitive chip 21 to move in opposite directions at the same time, compared with a scheme of driving only the lens 10 to move, a stroke of the relative movement between the lens 10 and the photosensitive chip 21 is larger (for convenience of description, the stroke of the relative movement may be referred to as an anti-shake stroke), and a better compensation effect may be achieved. Particularly, due to the increase of the anti-shake stroke, the embodiment also has a good compensation effect on the tilt shake of the camera module. Further, the moving direction of the anti-shake movement of the embodiment can be defined in the xoy plane, and the optical axis of the lens 10 or the photosensitive chip 21 does not need to be inclined, so that the image blurring problem caused by the anti-shake movement is avoided.

Further, in another embodiment of the present application, the photosensitive chip 21 can also be driven by the second driving portion 40 to rotate in the xoy plane, so as to compensate for the shake in the rotation direction of the image capturing module.

Further, still referring to fig. 2, in an embodiment of the present application, the image pickup module includes a first driving part 30, a lens 10, a second driving part 40, and a photosensitive assembly 20. The lens 10 is mounted on the first driving unit 30. The first driving unit 30 may have a cylindrical first motor carrier, which may be a movable portion of the first driving unit, and the lens may be mounted on an inner side surface of the first motor carrier. The first driving part is also provided with a static part or a basic part. In this embodiment, the base portion may be implemented as a motor housing. The motor housing may include a base and a cover. The base is provided with a light through hole. The movable part is movably connected with the base part. The drive element may be a coil magnet combination, which may be mounted between the movable part and the base part. For example between the first motor carrier and the motor housing. In fact, the first driving part in the present embodiment may directly adopt the common structure of the optical anti-shake motor in the prior art. Further, in the present embodiment, the second driving portion 40 may be supported and fixed on the bottom surface of the first driving portion 30. The second driving unit 40 may include a base unit and a movable unit. Wherein the base portion is directly connected with the first driving portion. The movable part is positioned below the base part and movably connected with the base part. The photosensitive assembly 20 includes a circuit board 23, a photosensitive chip 21 mounted on a surface of the circuit board, and a lens holder 22 surrounding the photosensitive chip 21. The base of the mirror base 22 may be attached to the surface of the circuit board 23, and the top surface thereof may be fixed to the movable portion of the second driving portion 40. The lens holder 22 has a light-passing hole at the center, and a filter 24 is mounted on the lens holder 22 (the filter 24 can also be regarded as a component of the photosensitive assembly 20). Under the driving of the movable portion of the second driving portion 40, the photosensitive assembly 20 can translate in the x and y directions or rotate on the xoy plane with respect to the base portion. For convenience of description, the base portion of the first driving portion 30 is sometimes referred to as a first base portion, the base portion of the second driving portion 40 is sometimes referred to as a second base portion, the movable portion of the first driving portion 30 is sometimes referred to as a first movable portion, and the movable portion of the second driving portion 40 is sometimes referred to as a second movable portion.

Fig. 3 is a schematic cross-sectional view illustrating a camera module with an anti-shake function according to another embodiment of the present application. In this embodiment, the image capturing module includes a first driving portion 30, a lens 10, a second driving portion 40, and a photosensitive assembly 20. The lens 10 is mounted on the first driving unit 30. The structure and assembly of the first driving part 30 and the lens 10 may be the same as those of the previous embodiment shown in fig. 2, and are not described again. The present embodiment differs from the previous embodiment in that: the second driving portion 40 is located inside the photosensitive assembly 20. In this embodiment, the photosensitive assembly 20 includes a circuit board 23, a lens holder 22, a filter 24, and a photosensitive chip 21. The base of the lens holder 22 may be mounted on the surface of the circuit board 23, and the top surface thereof may be fixed to the base of the first driving unit 30. The lens holder 22 has a light-passing hole at the center thereof, and a filter 24 is mounted on the lens holder 22. The lens holder 22, the filter 24 and the circuit board 23 may form a cavity, and the photosensitive chip 21 is located in the cavity 25. In this embodiment, the second driving portion 40 may be located in the cavity 25. Specifically, the base portion of the second driving portion 40 may be mounted on the surface of the circuit board 23, and the movable portion of the second driving portion 40 may be movably connected to the base portion. The photosensitive chip 21 is mounted on the surface of the movable portion. In this way, the photosensitive chip 21 can be translated in the x and y directions or rotated on the xoy plane with respect to the base portion by the movable portion of the second driving portion 40.

Different structural implementations of the second driving part of the camera module according to the present application are described above with reference to two embodiments. The following further introduces a method for compensating the tilt jitter of the camera module based on the design idea of the present application.

Fig. 4 is a schematic diagram illustrating the relationship between the moving distance of the lens and the photosensitive chip and the inclination angle of the module under four different conditions in the present application. The position A in the figure represents the moving distance combination of the lens and the photosensitive chip for compensating the shake angle a of the camera module. As shown in fig. 4, the lens moving distance is b, the photosensitive chip (hereinafter sometimes simply referred to as chip) moving distance is c, and the lens or chip moving distance may be equivalent to an angle of an image plane from an optical axis in optical imaging. Specifically, when the lens is translated by a distance b in the xoy plane, it causes an arithmetic relationship between the image plane offset angle α 1 and the image distance, which is different at different shooting distances, where the image distance is replaced with the image space focal distance for the sake of calculation and convenience of expression. Specifically, it causes the relationship between the image plane offset angle α 1 and the lens image space focal length f to be: tan (α 1) ═ b/f, which causes the relationship between the image plane shift angle α 2 and the lens image focal length f when the photosensitive chip is translated by a distance c in the xoy plane, to be: tan (α 2) ═ c/f. In this embodiment, the moving directions of the lens and the photosensitive chip are opposite, so the calculation mode of the comprehensive compensation angle a of the camera module is as follows: α 1+ α 2 is arctan (b/f) + arctan (c/f). In one embodiment, the moving distance of the lens and the photosensitive chip may be set to be the same, i.e., b ═ c. In another embodiment, the distance that the lens and the photosensitive chip move may be set to be unequal, for example, the distance that the lens moves may be greater than the distance that the photosensitive chip moves, i.e., b > c. In this embodiment, the second driving portion may select a smaller-sized driver (such as a mems driver, etc., and the movable stroke of such a driver is usually relatively small), so as to help achieve miniaturization of the camera module as a whole.

Further, in an embodiment of the present application, a ratio between a lens moving distance and a photo sensor moving distance is optionally set to maintain a fixed ratio, for example, b/c is 6:4, or b/c is 7:3, or b/c is 5:5, and the moving distances of the lens and the photo sensor maintain the preset ratio no matter what compensation value (for example, the comprehensive compensation angle a) of the camera module shake, which is beneficial to uniformity of compensation effect of the camera module in a compensation range and also beneficial to reduction of design difficulty of the camera module anti-shake system driving logic module.

Further, on the mirrorUnder the configuration that the head movement distance and the photosensitive chip movement distance are subjected to anti-shake movement based on a fixed ratio, the shake of the camera module may exceed the maximum movement stroke of the photosensitive chip sometimes because the movable range of the photosensitive chip is small. Therefore, in an embodiment of the present application, an anti-shake threshold may be set, for example, a threshold K may be set for a shake angle a that needs to be compensated, and when the actually calculated shake angle a is smaller than or equal to the anti-shake threshold K, the lens moving distance b and the photosensitive chip moving distance c are maintained at a fixed ratio, which may be set in advance, for example, b/c is 6:4, b/c is 7:3, or b/c is 5: 5. When the actually calculated shaking angle a is larger than the anti-shaking threshold K, the moving distance c of the photosensitive chip is the maximum value of the moving stroke, namely the maximum stroke c of the photosensitive chip_maxAnd the lens moving distance b is tan (a/f) -c_max. In other words, when the shake angle of the camera module to be compensated is above the anti-shake threshold K, the lens moves to the maximum value corresponding to the moving distance of the photosensitive chip (i.e. the maximum stroke c of the photosensitive chip) based on the preset fixed proportion_max) After the position of (a), the first driving unit may drive the lens to move continuously until the lens moving distance b is tan (a/f) -c_max. At the same time, the photosensitive chip is firstly synchronously moved to the maximum value c of the moving distance of the photosensitive chip in the opposite direction_maxAnd then remain stationary.

Further, in another embodiment of the present application, the maximum stroke b of the lens movement is within the xoy plane_maxThe corresponding anti-shake angle (the anti-shake angle refers to the angle of inclined shake of the camera module) can be smaller than the maximum stroke c of the photosensitive chip_maxThe corresponding anti-shake angle. Under this kind of design, the anti-shake system of the module of making a video recording can have faster response speed. In a high-end lens, the lens often has more lenses, for example, the number of lenses in a rear main shooting lens in a current smart phone can reach 8, in order to further improve the imaging quality, some lenses also use glass lenses, which all result in larger lens weight. When the driving force is not increased significantly, the speed at which the driving device drives the lens to move will decrease. And the weight of the photosensitive chip or the photosensitive assemblyThe amount is relatively light and the preset position can be reached with a small driving force. Therefore, in the scheme of the embodiment, the advantages that the weight of the photosensitive chip or the photosensitive assembly is relatively close and the moving speed is relatively high can be better utilized, and the response speed of the camera module anti-shake system is effectively improved.

Further, in another embodiment of the present application, the fixed ratio of the moving distance of the lens to the moving distance of the photosensitive chip may be set according to the weight of the lens, the driving force of the first driving portion, the weight of the photosensitive chip (or the photosensitive assembly), the driving force of the second driving portion, and other factors, and a suitable fixed ratio is set, so that the time for the lens and the photosensitive chip to move to the respective anti-shake target positions is substantially the same, thereby obtaining a better anti-shake effect. Specifically, the weight of the lens and the driving force of the first driving portion may substantially determine the moving speed of the lens, and the weight of the photosensitive chip (or the photosensitive assembly) and the driving force of the second driving portion may substantially determine the moving speed of the photosensitive chip, and when the moving speed of the lens is smaller than the moving speed of the photosensitive chip (for example, when the weight of the lens is large), the moving distance of the photosensitive chip may occupy a larger proportion when the fixed proportion is set, so that the characteristic that the moving speed of the photosensitive chip is fast can be utilized, so that the photosensitive chip moves a longer distance, and the time for moving the lens and the photosensitive chip to the respective anti-shake target positions is substantially the same.

Further, in another embodiment of the present application, the first driving portion may employ a driving element having a large driving force, and a suspension system having a large stroke. For example, the first drive portion may be driven using an SMA (shape memory alloy) element. Compare traditional coil magnet combination, the SMA component can provide great drive power with less occupation space, consequently first drive division can design compacter, is favorable to making a video recording the miniaturization of module.

Further, fig. 5 shows a schematic cross-sectional view of a camera module in an embodiment of the present application. Referring to fig. 5, in the present embodiment, the base portion 41 of the second driving portion 40 is fixed with the base portion (not specifically shown in fig. 5) of the first driving portion 30. The lens 10 may be mounted to a movable portion (e.g., a first motor carrier, not specifically shown in fig. 5) of the first driving portion 30. The photosensitive assembly 20 includes a circuit board 23, a photosensitive chip 21, a lens holder 22, an optical filter 24, and the like. The photosensitive member 20 may be mounted to the movable portion 42 of the second driving portion 40. Specifically, the bottom surface of the moving portion 42 may bear against the top surface of the mirror base 22 of the photosensitive assembly 20. In the second driving portion 40, the base portion 41 and the movable portion 42 may be elastically connected by a suspension system. In this embodiment, the suspension system allows the movable part 42 to translate in the xoy plane relative to the base part 41. Alternatively, the suspension system may be a ball system, which has the advantages of: in the z direction, the movable part 42 and the base part 41 are in contact with each other through the balls, the movable part 42 moves only in the xoy plane, and the movement in the optical axis direction can be prevented by the balls between the movable part 42 and the base part 41, thereby avoiding the influence on the focusing of the image pickup module.

Alternatively, in another embodiment, the suspension system may comprise an elastic element (e.g., a spring) by which the fixed part and the movable part are connected, which allows the movable part to translate relative to the base part in the xoy plane, but prevents the movable part from moving relative to the base part outside the xoy plane. Compared with a ball system, the elastic element has the advantages that: the elastic element can provide an initial force between the base part and the movable part, and the initial force can be matched with the driving force of the driving element to control the moving distance of the movable part or keep the position of the movable part, so that the driving element is not required to be additionally arranged to provide a conjugate driving force to control the position of the movable part. If a ball system is used, the movable part is free to move in the xoy direction relative to the base part in the case of a drive element which does not provide a driving force, so that it is often necessary to provide at least one pair of mutually opposite driving forces to control the holding of the movable part in its initial position.

Further, still referring to fig. 5, in one embodiment of the present application, anti-shake may be achieved by driving the entire photosensitive assembly 20 to move. Simultaneously, circuit board 23, sensitization chip 21, microscope base 22, light filter 24 encapsulation are as an organic whole, and circuit board 23, microscope base 22, light filter 24 form an enclosure space, and sensitization chip 21 holds in this enclosure space, has promoted sensitization subassembly 20's closure, has guaranteed that sensitization chip 21 images and does not receive the influence of dust in the module preparation of making a video recording or use.

In this embodiment, still referring to fig. 5, in an embodiment of the present application, the back surface of the circuit board may directly abut against a terminal device (i.e., an electronic device carrying the camera module, such as a mobile phone), and specifically, the back surface of the circuit board 23 may abut against a main board or other abutting member 90 of the terminal device. Although the movable portion 42 is connected to the photosensitive assembly 20 and the base portion 41 is connected to the first driving portion 30 in the present embodiment, it is understood that the movable portion 42 and the base portion 41 move relatively. In the anti-shake movement, the opposite moving directions mean: the moving direction of the movable part of the first driving part relative to the base part is opposite to the moving direction of the movable part of the second driving part relative to the base part.

Further, fig. 6 shows a schematic cross-sectional view of a camera module according to another embodiment of the present application. Referring to fig. 6, in the present embodiment, a rear case 49 is added below the second driving portion 40, the rear case 49 is connected to the base portion 41 of the second driving portion 40, and forms an accommodating cavity, and the movable portion 42 of the second driving portion 40 and the photosensitive assembly 20 are accommodated in the accommodating cavity. As shown in fig. 6, there may be a gap 49a between the photosensitive assembly 20 and the bottom of the rear housing 49. That is, the photosensitive assembly 20 is suspended, and the photosensitive assembly 20 is connected only to the movable portion 42 of the second driving portion 40. In this embodiment, the rear housing 49 directly bears against the terminal device. Since the rear case 49 connects the terminal device, the second driving unit 40, and the base of the first driving unit 30, the movable portions of the first driving unit 30 and the second driving unit 40 respectively drive the lens 10 and the photosensitive assembly 20 to move in opposite directions simultaneously with respect to the terminal device during the anti-shake process. Further, in the present embodiment, the movable portion 42 of the second driving portion 40 is directly bonded to the upper end surface of the photosensitive assembly 20, so that the filter 24 can be spaced from the external space, and debris generated by friction or collision of the movable portion 42 during movement relative to the base portion 41 is prevented from directly falling onto the surface of the filter 24.

Fig. 7 shows a schematic cross-sectional view of a camera module in a further embodiment of the present application. Referring to fig. 7, in the present embodiment, the first driving part 30 is implemented to be adapted to drive the lens 10 to move in the optical axis direction to implement a focusing function, while also being adapted to drive the lens 10 to move in the xoy plane to implement an anti-shake function. Optionally, the first driving part 30 includes at least two carriers, namely a first carrier 31 and a second carrier 32, the lens 10 is supported by the first carrier 31, a suspension system is disposed between the first carrier 31 and the second carrier 32, and a suspension system is disposed between the second carrier 32 and the housing 33 of the first driving part 30. In this embodiment, the suspension system between the first carrier 31 and the second carrier 32 (i.e. the first suspension system) is configured as a ball bearing system, and the suspension system between the second carrier 32 and the housing 33 (i.e. the second suspension system) is a suspension system based on elastic elements (e.g. spring plates). In the present embodiment, the second suspension system is provided outside the first suspension system, the first suspension system allowing the lens 10 and the first carrier 31 to translate in the xoy plane to realize the anti-shake function, and the second suspension system allowing the lens 10, the first carrier 31, and the second carrier 32 to integrally move in the optical axis direction to realize the focusing function. Alternatively, in another embodiment, the second suspension system may also be arranged inside the first suspension system. In another modified embodiment, the second suspension system may also be disposed below the first suspension system. In this embodiment, the suspension system refers to a system in which two members are movably connected and the degree of freedom of relative movement (i.e., the moving direction) of the two members is limited. These two articulatable parts may be referred to as a base part and a movable part, respectively. Typically, the suspension system is used in conjunction with a drive element (e.g., an SMA element or a coil magnet combination). Wherein a driving force is provided by the driving element, under which driving force the movable part is moved relative to the base part in a movement direction defined by the suspension system.

Further, fig. 8 shows a schematic perspective structure of the second driving portion in an embodiment of the present application. Referring to fig. 8, in the present embodiment, the second driving portion 40 includes a second movable portion 42 and a second base portion 41. The second base portion 41 includes a base portion base 41a and a cover 41 b. An edge area of the second movable portion 42 is provided between the base portion base 41a and the cover 41 b.

Further, fig. 9 shows a perspective exploded view of the second driving part in one embodiment of the present application. Referring to fig. 9, in the present embodiment, the second movable portion includes at least two chip end carriers (to be distinguished from the carrier of the first movable portion in the foregoing, the carrier of the second movable portion may be referred to as a chip end carrier, and the carrier of the first movable portion may be referred to as a lens end carrier). Three chip-side carriers are shown in fig. 9, a chip-side first carrier 421, a chip-side second carrier 422 and a chip-side third carrier 423, respectively. Wherein the upper surface of the base 41a or the lower surface of the lowermost chip terminal carrier of the second movable part 42 has a first guide groove 431, a first ball 46a is provided in the first guide groove 431 and the first ball 46a is rollable along the first guide groove 431, and the upper surface of the base 41a and the lowermost chip terminal carrier of the second movable part 42 are supported by the first ball 46 a. In the second movable portion 42, for any two of the chip end carriers adjacent vertically, a second guide groove 432 is provided on the upper surface of the chip end carrier located below or the lower surface of the chip end carrier located above, a second ball 46b is provided in the second guide groove 432, the second ball 46b is rollable along the second guide groove 432, and the upper surface of the chip end carrier located below and the lower surface of the chip end carrier located above are supported by the second ball 46 b. In this embodiment, the photosensitive assembly 20 is mounted on the uppermost chip end carrier of the second movable portion 42; and the guiding direction of the first guiding groove 431 is along the x-axis translation direction or along the y-axis translation direction (the guiding direction of the first guiding groove 431 is the x-axis translation direction in fig. 9), and the guiding direction of the second guiding groove 432 of one of the chip end carriers is perpendicular to the guiding direction of the first guiding groove 431 (the guiding direction of the second guiding groove 432 is the y-axis translation direction in fig. 9, and is perpendicular to the guiding direction of the first guiding groove 431).

More specifically, still referring to fig. 9, in the present embodiment, the chip side carrier includes a chip side first carrier 421, a chip side second carrier 422, and a chip side third carrier 423. The chip end first carrier 421, the chip end second carrier 422, and the chip end third carrier 423 are sequentially arranged from top to bottom. The second guide groove 432 includes an arc-shaped guide groove and a straight guide groove; the arc-shaped guide groove is configured to guide the second ball 46b to roll along an arc rotating around a z-axis, which is a coordinate axis coinciding with the optical axis direction; the rectilinear guide groove is used to guide the second ball 46b to roll along the x-axis or the y-axis. The second guide grooves 432 of the third carrier 423 on the chip side in fig. 9 are linear guide grooves having a y-axis translational direction perpendicular to the guide direction (x-axis translational direction) of the first guide grooves 431. Further, fig. 10 shows a partially enlarged schematic view of a chip-side third carrier and a corner region of the base portion pedestal in an embodiment of the present application. Fig. 10 shows a first guide groove 431 and a first ball 46a provided in the first guide groove 431, and also shows a second guide groove 432 as a rectilinear guide groove provided on the upper surface of the chip-side third carrier 423, and a second ball 46b provided in the first guide groove. Further, fig. 11 shows a schematic perspective view of three chip end carriers and a base part base in an embodiment of the present application. Fig. 12 shows a perspective view of the two chip end carriers and base part base of fig. 11. Referring to fig. 10, 11 and 12 in combination, in the present embodiment, the second rolling balls 46b include upper layer second rolling balls 46b1 and lower layer second rolling balls 46b 2; the upper layer second ball bearings 46b1 are disposed between the lower surface of the chip end first carrier 421 and the upper surface of the chip end second carrier 422; the lower layer second balls 46b2 are disposed between the lower surface of the chip end second carrier 422 and the upper surface of the chip end third carrier 423. The first balls 46a are disposed between the lower surface of the chip-end third carrier 423 and the upper surface of the base portion base 41 a. The second guide groove 432 includes two kinds of grooves located at different layers, one is an arc-shaped guide groove, and the other is a straight-line guide groove. Wherein, the arc-shaped guiding slot is located on the lower surface of the chip end first carrier 421 or the upper surface of the chip end second carrier 422; the straight guide grooves are located on the lower surface of the chip-end second carrier 422 or the upper surface of the chip-end third carrier 423.

Further, in an embodiment of the present application, an arc center of the arc-shaped guiding groove is located right below a photosensitive center, where the photosensitive center is a center of a photosensitive area of the photosensitive chip.

It should be noted that, although the arc-shaped guide grooves are provided between the chip-side first carrier and the chip-side second carrier in the above-described embodiments, the present application is not limited thereto. For example, in another embodiment, an arc-shaped guide slot may also be provided between the base portion base and the chip-side third carrier. Specifically, an arc-shaped guide groove may be provided, for example, in the upper surface of the base portion, in which the first ball is arranged. In this way, the second movable part can make rotational movement in the direction of rotation about the z-axis integrally with respect to the base part base.

Further, fig. 13 shows a schematic cross-sectional view of a camera module according to an embodiment of the present application, and fig. 14 shows an enlarged schematic view of a region a in fig. 13. Referring to fig. 13 and 14, in the present embodiment, each of the chip end carriers includes a carrier substrate 440 and a carrier wall 441 extending upward from an edge region of the carrier substrate 440, and the carrier wall 441 surrounds the periphery of the photosensitive assembly 20. The second guide groove 432 is located on the upper surface of the carrier wall 441; for any two of the chip end carriers adjacent up and down, the lower surface of the carrier wall 441 of the chip end carrier located above is supported by the second balls 46 b. The carrier wall 441 comprises a wall body 441a and an extension portion 441b formed by extending outwards from the top area of the wall body 441 a; for any two chip end carriers adjacent vertically, the second guide groove 432 is provided on the upper surface of the extension portion 441b of the chip end carrier below, and the lower surface of the extension portion 441b of the chip end carrier above is supported by the second ball 46 b. For any two of the chip end carriers adjacent up and down, the wall 441a of the lower chip end carrier surrounds the wall 441a of the upper chip end carrier; and a gap is provided between the walls 441a of the two chip end carriers. Further, the cover 41b includes a cover sidewall 41b1 and a bearing platform 41b2 formed extending inwardly from a top region of the cover sidewall 41b 1; the bottom of the cover sidewall 41b1 is connected to the base portion base 41a, the rest platform 41b2 is located above the chip end first carrier 421, and a gap is provided between the lower surface of the rest platform 41b2 and the upper surface of the chip end first carrier 421. In this embodiment, the top surface of the support platform 41b2 and the bottom surface of the first driving part 30 are bonded by a rubber material 90. The glue 90 may be an adhesive for an active calibration process. In this embodiment, a gap suitable for active calibration may be reserved between the top surface of the bearing platform 41b2 and the bottom surface of the first driving portion 30 in the design stage, then the relative position between the optical lens and the photosensitive chip is determined through active calibration, and finally the complete camera module is formed by bonding with the adhesive material 90. Note that the first base portion and the first movable portion of the first driving portion are not shown in fig. 13. In this embodiment, the bottom surface of the first driving part is generally the bottom surface of the first base part, the first base part may include the motor housing and the motor base, and the bottom surface of the first base part may be the bottom surface of the motor base. The active calibration is a process of adjusting the attitude (tilt angle) of the lens and the photosensitive chip and the position of the optical center based on the actual imaging result of the photosensitive chip to optimize the imaging quality. The adjustment degrees of freedom for active calibration may include one or more of x-axis, y-axis, z-axis translation, and rotation about the x-axis, y-axis, z-axis.

Further, in an embodiment of the present application, each of the chip end carriers includes a ring-shaped carrier wall surrounding the photosensitive assembly, and the second guide groove is located on an upper surface of the carrier wall. At least one of the chip end carriers is a frame structure formed by the carrier walls alone (i.e. the chip end carrier may not be provided with a carrier substrate and forms a hollow frame structure).

Further, in another embodiment of the present application, in the second movable portion, a part of the chip end carrier is a frame structure formed by the carrier walls alone, and another part of the chip end carrier includes a carrier substrate and the carrier walls extending upward from an edge area of the carrier substrate. In the second movable portion, the uppermost chip end carrier includes the carrier substrate and the carrier wall, and the photosensitive element is mounted in a housing groove formed by the carrier substrate and the carrier wall. The uppermost chip end carrier is provided with a carrier substrate which can bear against the bottom surface of the photosensitive assembly so as to enhance the reliability and firmness of the bonding of the second movable part and the photosensitive assembly.

Further, referring to fig. 13 and 14 in combination, in an embodiment of the present application, a lower surface of the chip terminal carrier located at the lowermost position of the second movable portion or an upper surface of the base portion base has a first fitting groove, and the first fitting groove 431a is fitted with the first guide groove 431 and constitutes a guide channel of the first ball 46a together. Further, in the second movable portion, for any two chip end carriers adjacent vertically, a second fitting groove 432a is provided on a lower surface of the chip end carrier located above or an upper surface of the chip end carrier located below, and the second fitting groove 432a is fitted with the second guide groove 432, and together form a guide passage for the second ball 46 b.

Further, in an embodiment of the present application, the chip end carrier has a rectangular shape in a top view, and the edge region of the chip end carrier includes a first edge 45a, a second edge 45b opposite to the first edge 45a, a third edge 45c intersecting the first edge 45a, and a fourth edge 45d opposite to the third edge 45 c; the lengths of the first side 45a and the second side 45b are greater than the lengths of the third side 45c and the fourth side 45 d; the arc-shaped guide grooves are provided on the first side 45a and the second side 45b in a plan view (see fig. 12). It should be noted that the positions of the arc-shaped guiding slots of the present embodiment are not exclusive, for example, in another embodiment, the arc-shaped guiding slots can be disposed in the four corner regions of the chip end carrier. The four corner regions, i.e., the four corner regions of the rectangular chip-side carrier, are not described in detail below.

Further, in another embodiment of the present application, in a top view, the guiding grooves are disposed in four corner regions of the chip end carrier; the second base part is rectangular in shape; the first guide grooves are arranged in four corner regions of the second base part or the chip end carrier.

Further, fig. 15 shows a schematic cross-sectional view of the second driving part with a through hole in the base of the base part according to an embodiment of the present application. Referring to fig. 15, in the present embodiment, the center of the base 41a of the second base 41 has a through hole 41a1, and at least a part of the chip-side third carrier 423 (the lowermost chip-side carrier) is located in the through hole 41a 1. This design can further reduce the height (i.e., the dimension in the z-axis direction) of the camera module.

Further, fig. 16a shows a mounting position of the driving element of the second driving portion in a top view in one embodiment of the present application. Fig. 16b shows a schematic cross-sectional view of a second drive section containing a drive element in an embodiment of the present application. Referring to fig. 16a and 16b together, in an embodiment of the present application, the driving element of the second driving portion 40 is a coil magnet assembly. The magnet 61 may be disposed in an edge region of the second base portion 41, and specifically, the magnet 61 may be disposed in the bearing platform 41b2 of the cover 41b in this embodiment. The coil 62 may be disposed at an edge region of the chip-side first carrier 421. The coil 62 can be soldered to the circuit board 23 of the photosensitive assembly 20 through an FPC board (flexible board) provided at the chip side first carrier 421. Because the chip end first carrier 421 and the photosensitive assembly 20 move synchronously in the anti-shake process, when the design scheme that the coil 62 is welded to the circuit board 23 through the FPC board is adopted, no relative movement of a lead or a welding part in the moving process can be ensured, and the risk of electrical connection failure or poor contact at the welding part is reduced. In another embodiment, since the relative position of the chip end first carrier 421 and the photosensitive assembly 20 is fixed, the coil 62 and the circuit board of the photosensitive assembly 20 can be electrically connected through a contact array, thereby avoiding the use of an FPC board (flexible board) for electrical connection.

Further, referring to fig. 16a, in one embodiment of the present application, preferably, the coil magnet assembly includes three coil magnet pairs, referred to as a first coil magnet pair 63, a second coil magnet pair 64, and a third coil magnet pair 65, respectively. Wherein each coil magnet pair may include a coil and a magnet. The first coil magnet pair 63 and the second coil magnet pair 64 are for driving the movable portion 42 to translate in the x-axis direction, i.e., to provide a driving force in the x-axis direction. The third coil magnet pair 65 is used to drive the movable portion 42 to translate in the y-axis direction, i.e., to provide a driving force in the y-axis direction. In a top view (or a bottom view), the first coil magnet pair 63 and the second coil magnet pair 64 may be respectively disposed along two opposite sides of the second driving portion, which may be referred to as a first side 48 and a second side 49, and the first side 48 and the second side 49 do not intersect (generally, the first side 48 is parallel to the second side 49). And the second coil magnet pair 64 may be disposed along a third side 47 of the second driving portion, the third side 47 intersecting both the first side 48 and the second side 49 (generally, the third side 47 is perpendicular to the first side 48 and also perpendicular to the second side 49). In this embodiment, the three coil magnet pairs may realize both x-axis translation and y-axis translation, and may also realize rotation on the xoy plane. For example, when the first coil magnet pair 63 and the second coil magnet pair 64 are supplied with driving forces in opposite directions, a combined driving force for rotating the one chip end carrier of the second movable portion on the xoy plane can be generated. Note that the driving force for rotation in the xoy plane is not exclusively provided, and for example, the first coil magnet pair 63 and the third coil magnet pair 65 operate to generate a combined driving force for rotating one chip end carrier of the second movable portion in the xoy plane. Alternatively, the positions of the first coil magnet pair and the second coil magnet pair may be staggered (that is, the arrangement positions of the first coil magnet pair and the second coil magnet pair may be asymmetric with respect to the central axis of the second driving portion) to provide a driving force to realize rotation in the xoy plane (that is, movement in the Rz direction). Specifically, the magnets of the first coil magnet pair 63 are provided on the first side 48 close to the third side 47, and the second coil magnet pair 64 is provided on the second side 49 close to the fourth side (i.e., on the side away from the third side 47), so that the first coil magnet pair 63 and the second coil magnet pair 64 are displaced from each other.

Further, fig. 17a is an exploded perspective view of the second driving unit showing the positions of the coil and the magnet in one embodiment of the present application. Referring to fig. 17a, in the present embodiment, a first coil magnet pair 63, a second coil magnet pair 64, and a third coil magnet pair 65 are located on the first side 48, the second side 49, and the third side 47, respectively. The first coil magnet pair 63 is provided in the middle region of the first side 48, and the second coil magnet pair 64 is provided in the middle region of the second side 47, that is, the first coil magnet pair 63 and the second coil magnet pair 64 may be provided axisymmetrically. The first magnet 63a (i.e., the magnets of the first coil magnet pair), the second magnet 64a (i.e., the magnets of the first coil magnet pair), and the third magnet 65a (i.e., the magnets of the third coil magnet pair) are all located on the cover 41b of the second base portion, and the first coil 63b (i.e., the coils of the first coil magnet pair), the second coil 64b (i.e., the coils of the second coil magnet pair), and the third coil 65b (i.e., the coils of the third coil magnet pair) are all located on the chip-end first carrier 421. The first coil 63b, the second coil 64b, and the third coil 65b may be located directly below the first magnet 63a, the second magnet 63b, and the third magnet 63c, respectively.

Further, fig. 17b is an exploded perspective view of the second driving unit showing the positions of the coil and the magnet according to another embodiment of the present invention. In this embodiment, the positions of the first coil magnet pair 63 and the second coil magnet pair 64 are staggered, so that the driving photosensitive assembly is more labor-saving in rotation in the xoy plane (and further contributes to increasing the anti-shake stroke and improving the anti-shake response speed). Otherwise, the other contents of this embodiment are completely the same as the embodiment of fig. 17a, and are not described again.

Fig. 17c shows a perspective exploded view of the second driving part showing the positions of the coil and the magnet in a modified example of the present application. In this embodiment, the positions of the first coil magnet pair 63, the second coil magnet pair 64, and the third coil magnet pair 65 are the same as those of the embodiment of fig. 17 b. The present embodiment is different in that only the third magnet 65a is located in the cover 41b of the second base portion, and both the first magnet 63a and the second magnet 64a are located in the edge region of the base portion base 41 a.

Fig. 17d is an exploded perspective view of the second driving unit showing the positions of the coil and the magnet in another modified embodiment of the present invention. In this embodiment, the positions of the first coil magnet pair 63, the second coil magnet pair 64, and the third coil magnet pair 65 are the same as those of the embodiment of fig. 17 b. The difference between this embodiment is that in this embodiment, only the third magnet 65a is located in the edge region of the base portion base 41a, and both the first magnet 63a and the second magnet 64a are located in the edge region of the chip-end third carrier 623.

In summary, in some embodiments of the present application, the magnets in the coil magnet assembly (i.e., three coil magnet pairs) may be mounted on the cover, the base, or the chip-end third carrier; and wherein the magnets of the first coil magnet pair and the magnets of the second coil magnet pair are mounted to the same member so that the first coil magnet pair and the second coil magnet pair can be better used in cooperation to more accurately provide the combined driving force. Here, the member means one of the cover, the base, and the chip end third carrier. Further, in some preferred embodiments, the magnets of the coil magnet assembly (i.e., three coil magnet pairs) may be mounted to the base portion base or the chip end third carrier, i.e., the magnets are not mounted to the cover. The design can avoid the magnet to interfere the glue distribution of the bonding surface of the second base part and the first base part. Generally, the adhesive material and the material for manufacturing the second base portion have a large adhesive force, and the adhesive force between the adhesive material and the magnet is small. And the top surface (upper surface) of the cover is often the bonding surface that bonds with the first base portion, so if the magnet avoids setting up in the cover, can avoid the magnet to occupy some areas of bonding surface to avoid the module structure reliability that leads to because of the adhesive force is insufficient to descend.

Further, fig. 18a shows a schematic view of an assembly of the second driving part before assembly in an embodiment of the present application. Referring to fig. 18a, in the present embodiment, the second driving part 40 may be assembled by three main members separated from each other, which are a base part base 41a, a cover 41b, and a second movable part 42, respectively, which may be assembled in a vertical direction. For example, the second driving unit 40 may be assembled by first disposing the base 41a having the first balls 46a on the assembly table, then disposing the second movable unit 42 above the base 41a so as to be supported by the first balls 46a in the base 41a, finally moving the cover 41b above the base 41a and the second movable unit 42, then moving the cover 41b downward so that the bottom surface of the cover side wall 41b1 is close to the top surface of the base 41a, and then bonding the bottom surface of the cover side wall 41b1 to the top surface of the base 41 a. The base portion base 41a may be constituted by a base sidewall and a base plate. However, it should be noted that in other embodiments, the base portion 41a may also be flat, without a base sidewall, and in this case, it may also be referred to as a substrate or a bottom plate.

Further, fig. 18b shows a schematic view of an assembly of the second driving part before assembly in another embodiment of the present application. Referring to fig. 18b, in the present embodiment, the second driving part 40 may be assembled in a side assembly manner. Specifically, three main components, i.e., the base main body 41', the second movable portion 42, and the side cover 41b ″ may be prepared separately from each other. Wherein the base body 41 'may include a base 41a and a cover body 41 b' connected to the base 41a (in some embodiments, the base 41a and cover body 41b 'may be integrally formed), the cover body 41 b' being a portion of the complete cover 41b that, together with the side cover 41b ", forms the complete cover 41 b. In this embodiment, the cover main body 41b 'may surround the second movable portion 42 (or the photosensitive element) on three sides, for example, and the remaining one side is provided with a notch, which can be used for inserting the second movable portion 42 (or the combination of the second movable portion 42 and the photosensitive element) into the base main body 41' from the side. The side cover 41b "corresponds to the notch, and after the assembly of the second movable portion 42 and the photosensitive assembly is inserted into the notch, the side cover 41 b" can be moved laterally to approach the base portion base 41a, and the outer side surface of the base portion base 41a and the inner side surface of the side cover 41b "are bonded together, thereby forming the complete second driving portion 40. In the side bonding method, the parallelism of the upper and lower end surfaces of the second base portion 41 is determined only by the manufacturing accuracy of the second base portion 41 itself, and therefore, the parallelism of the upper and lower end surfaces of the second base portion 41 and the parallelism between the upper end surface of the second base portion 41 and the second movable portion 42 can be improved.

Further, fig. 19 shows an arrangement of the camera module and the connection belt thereof in an embodiment of the present application. Referring to fig. 19, in the present embodiment, the image capturing module may include a first connecting belt 26a and a second connecting belt 26b, the first connecting belt 26a is disposed at a top region of the first driving portion 30 and electrically connected to the first driving portion 30, and the second connecting belt 26b is communicated with the circuit board 23 of the photosensitive assembly 20. Wherein the second connecting belt 26b can be provided with a plurality of bends to form a bending lamination shape so as to buffer the stress caused by the movement of the photosensitive assembly 20. The ends of the second connecting strips 26b may be provided with connectors that are optionally press-fitted and electrically connected to the center posts, and then the center posts 26c are used to conduct the motherboard (or other components) of the terminal device. Similarly, the end of the first connecting belt 26a can be connected to a connector, which is fixed and electrically connected to the middle rotating column 26c by pressing, and the main board (or other components) of the terminal device is conducted through the middle rotating column 26 c. In the solution of the present embodiment, the conducting circuit of the first driving portion 30 can be separated from the photosensitive element 20, and is not affected by the movement of the photosensitive element 20. The second connection strap 26b and the middle rotating post 26c may be accommodated in the second housing 70, the first connection strap 26a is located outside the second housing 70, and the top of the second housing 70 may have a third through hole 70a so that the connector of the first connection strap 26a extends into and is electrically communicated with the second connection strap 26b or the middle rotating post 26 c.

In the above embodiment, the first driving portion and the second driving portion may constitute a driving structure for the optical actuator, in which the first driving portion is adapted to mount the lens, the second driving portion is adapted to mount the photosensitive component, and the lens and the photosensitive chip are configured to be driven simultaneously and move in opposite directions. For example, if the lens is driven to move in the positive x-axis direction, the photosensitive chip is driven to move in the negative x-axis direction; the lens is driven to move towards the positive direction of the y axis, and then the photosensitive chip is driven to move towards the negative direction of the y axis; or the lens is driven to move in the x axis and the y axis, and the photosensitive chip is driven to move in the opposite direction to the lens movement in the x axis and the y axis, in other words, when the lens needs to move in the x axis and the y axis simultaneously, the directions of the displacement vector of the lens and the displacement vector of the photosensitive chip on the xoy plane are opposite. In this embodiment, dispose camera lens and sensitization chip into and move simultaneously, and camera lens and sensitization chip moving direction are opposite, can realize faster response, and it is better to have better anti-shake effect. In addition, the anti-shake angle range of the camera module is limited by the suspension system and the driving system, and a relatively large compensation angle range cannot be achieved. In addition, in this embodiment, by driving the lens or the photosensitive chip to move in opposite directions at the same time, compared with a scheme of driving only the lens to move, a stroke of the relative movement between the lens and the photosensitive chip is larger (for convenience of description, the stroke of the relative movement may be referred to as an anti-shake stroke), and a better compensation effect may be achieved. Particularly, due to the increase of the anti-shake stroke, the embodiment also has a good compensation effect on the tilt shake of the camera module. Further, the moving direction of the anti-shake movement of the embodiment can be limited in the xoy plane, and the optical axis of the lens or the photosensitive chip does not need to be inclined, so that the image blurring problem caused by the anti-shake movement is avoided.

Further, in the camera module, the circuit board of the photosensitive assembly generally includes a rigid circuit board main body and a flexible connection belt, one end of the flexible connection belt is connected to the circuit board main body, and the other end of the flexible connection belt is connected to and conducts the main board or other components of the electronic device through the connector. In the prior art, the flexible connecting band of the photosensitive assembly is usually led out from the side of the circuit board main body, and the flexible connecting band is approximately parallel to the surface of the circuit board column. In this arrangement, the flexible connection belt may generate a large resistance to the movement of the circuit board main body, which may increase the force required to drive the circuit board main body to move, resulting in insufficient anti-shake compensation stroke and reduced response speed. Also, the resistance caused by the connection belt is irregular, which makes it difficult for the second driving portion to compensate for the resistance, possibly causing a decrease in accuracy of the anti-shake compensation. Therefore, the present embodiment provides a suspended circuit board as the circuit board of the photosensitive component adapted to the second driving portion, which will help to overcome the above-mentioned drawbacks caused by the connection tape.

Fig. 20 is a perspective view illustrating an assembled second driving part and photosensitive assembly according to an embodiment of the present disclosure. FIG. 21 illustrates an exploded view of the second drive portion and the photosensitive assembly in one embodiment of the present application. FIG. 22 is a perspective view of a photosensitive assembly and a suspended circuit board used therein according to an embodiment of the present application. Referring to fig. 20, 21 and 22, in the camera module according to the embodiment, the photosensitive element 20 is connected to the movable portion 42 of the second driving portion 40, so that the circuit board main body 71 can move in the xoy plane under the driving of the movable portion 42. The circuit board 23 of the present embodiment is designed as a suspended structure. Specifically, the circuit board 23 includes a rigid circuit board main body 71 and a flexible connection tape 72, the connection tape 72 may include a third connection tape 72a and a fourth connection tape 72b, and the third connection tape 72a and the fourth connection tape 72b may be respectively led out from two opposite side surfaces (for convenience of description, the two opposite side surfaces may be referred to as a first side surface 74a and a second side surface 74b) of the circuit board main body 71 and bent upward. The bent third connection band 72a and the bent fourth connection band 72b may form a hanging portion 75, respectively. The suspended portion 75 may be connected with the base portion of the second driving portion 40 (or the first driving portion 30), thereby forming a suspended structure. The suspension structure allows the base portion to suspend the circuit board main body 71 and the components mounted on the surface thereof (i.e., suspend the photosensitive assembly 20) by the bent portion 73 of the flexible connection tape 72. Specifically, in one example, the suspension portion 75 may have a through hole (suspension hole 75a), and the base portion 41 of the second driving portion 40 may have a corresponding hook 75b, and the hook 75b hooks the through hole of the suspension portion 75 to connect the suspension portion 75. In the prior art, the connecting band and the circuit board main body are generally in the same plane, and the deflection of the connecting band relative to the circuit board main body on the same plane can generate larger resistance. In the present embodiment, the connecting position of the connecting band 72 and the circuit board main body 71 is provided with a bending portion 73 formed by bending upward, and at this time, the resistance generated by the connecting band 72 relative to the circuit board main body 71 in the xoy plane (which can be regarded as a horizontal plane) is relatively small.

Further, in an embodiment of the present application, the third connection tape 72a and the fourth connection tape 72b may extend along the periphery of the circuit board main body 71 and the photosensitive assembly 20, so that the connection tape 72 surrounds the photosensitive assembly on at least three sides. And, the third connection strap 72a and the fourth connection strap 72b are connected to each other and electrically conducted. The photosensitive assembly 20 has a first side 74a and a second side 74b that are aligned with the circuit board main body 71. The first side 74a and the second side 74b are oppositely disposed (i.e., mutually intersected), and the third side 74c of the photosensitive assembly 20 is intersected with both the first side 74a and the second side 74 b. The connecting band 72 may surround the first side 74a, the second side 74b and the third side 74c of the photosensitive assembly 20. The third connecting belt 72a is led out from the first side 74a of the circuit board main body 71 and bent upward to form the bent portion 73, then extends along the first side 74a of the photosensitive assembly 20, and is bent in the horizontal direction at a corner and continues to extend along the third side 74 c. The fourth connecting band 72b is led out from the second side 74b of the circuit board main body 71 and bent upward to form another bent portion 73, and then extends along the second side 74b of the photosensitive assembly 20, and is horizontally bent at a corner and continues to extend along the third side 74 c. The third connecting band 72a and the fourth connecting band 72b can be joined and conducted to each other at the third side 74c, thereby forming a complete connecting band 72. The three connection belt sections at the first, second and

third side surfaces

74a, 74b and 74c may respectively have at least one suspension portion 75, and each suspension portion 75 has at least one through hole to connect with the base portion 41 of the second driving portion 40 (or the first driving portion 30). In this embodiment, the suspending portion 75 can suspend the circuit board main body 71 through the bending portions 73 located at two opposite sides of the circuit board main body 71, so that when the circuit board main body 71 is driven by the second driving portion 40 to move, the bending portions 73 and the connecting band 72 can be bent and deformed, and the moving stroke of the circuit board main body 71 is satisfied.

Further, in one embodiment of the present application, the suspending portions 73 of the three connecting band sections located at the first side surface 74a, the second side surface 74b and the third side surface 74c may be each reinforced by a rigid substrate. For example, a rigid substrate may be attached to a partial region of the flexible connection tape to form the suspension portion 73. And other areas of the flexible connecting belt still keep a flexible state so as to be capable of bending and deforming and meet the moving stroke of the circuit board main body 71.

Further, in an embodiment of the present application, the connection belt section located on the third side 74c may have a rigid suspension portion 75c, the suspension portion 75c may lead out a fifth connection belt 76, and the fifth connection belt 76 may be used for connecting a main board of an electronic device (e.g. a mobile phone).

Further, in another embodiment of the present application, the suspension portion may also be connected with an external bracket (not shown in the drawings), which is directly or indirectly fixed with the base portion of the second driving portion. In the present application, the suspension portion may be fixed to the base portion of the second driving portion by another intermediary. The intermediate member may be directly or indirectly fixed to the base portion of the second driving portion. The intermediate has hooks for hooking the suspending part, or the intermediate is adhered to the suspending part. The intermediary member may be an external frame, a base of the first driving unit, or another intermediary member.

Further, in another embodiment of the present application, the suspension portion may not have the through hole. In this embodiment, the suspension portion may be fixed to the base portion of the second driving portion (or to the base portion of the first driving portion or the outer bracket) by means of adhesion. Further, in another embodiment of the present application, the third connecting band and the fourth connecting band may be rigid-flexible boards, wherein the portion forming the suspension portion may be a rigid board, and the portion connecting the suspension portion and the bending portion formed by bending upward may be flexible boards. Since the suspension portion is directly formed by the hard plate, the suspension portion in this embodiment may not be reinforced by attaching a rigid substrate.

Further, in an embodiment of the present application, the circuit board main body, the third connecting band and the fourth connecting band may be formed by a complete rigid-flex board.

Further, still referring to fig. 20, 21 and 22, in an embodiment of the present application, the circuit board may further have a fixing portion 76a for fixing the fifth connection band 76, which is designed to prevent the circuit board main body 71, the third connection band 72a and the fourth connection band 72b from being affected by external factors.

Further, fig. 23a shows a schematic front view of a suspension board in an embodiment of the present application after deployment; fig. 23b shows a schematic view of the back side of a hanging cord plate after deployment in one embodiment of the present application. Referring to fig. 23a and 23b, in this embodiment, the circuit board 23 may be formed by a rigid-flex board. The sections of the third connecting band 72a and the fourth connecting band 72b on the third side 74c can be snapped together by connectors 78 and 79 (see fig. 22), so that the third connecting band 72a and the fourth connecting band 72b are connected and fixed and further electrically connected. The third connecting band 72a and the fourth connecting band 72b are provided with circuits therein to lead out the circuits in the circuit board main body 71, and further connected to an external circuit through the fifth connecting band 76 and the connector 77 thereof. Since the third connecting band 72a and the fourth connecting band 72b can respectively lead out a part of the circuit through the corresponding bending part 73 formed by bending upwards, the circuit required to be led out by each bending part 73 can be reduced, so that the width of each bending part 73 can be reduced, and the resistance of the flexible connecting band 72 to the movement of the circuit board main body 71 can be further reduced, and the driving force required to be provided by the second driving part 40 can be further reduced. Note that in other embodiments of the present application, the circuit of the circuit board main body may also be led out through only one of the bent portions (for example, the bent portion bent upward of the third connection tape or the bent portion bent upward of the fourth connection tape).

Further, fig. 24a shows a schematic front view of a suspension board in another embodiment of the present application after being unfolded, and fig. 24b shows a schematic back view of the suspension board in one embodiment of the present application after being unfolded. Referring to fig. 24a and 24b, the photosensitive assembly 20 includes a suspension type circuit board, the suspension type circuit board includes a rigid circuit board main body 71 and a flexible connection strip 72, the connection strip 72 is led out from a first side surface 74a and a second side surface 74b of the circuit board main body 71 and is bent upwards to form a bent portion, a top of the bent portion extends along a circumference of the photosensitive assembly 20 in a horizontal direction, so that the connection strip 72 surrounds peripheries of the first side surface 74a, the second side surface 74b and a third side surface 74c of the photosensitive assembly 20, and the connection strips on the first side surface 74a and the second side surface 74b each have at least one suspension portion 75, and the suspension portions 75 are fixed to the second base portion 41 of the second driving portion 40 or fixed to the second base portion 41 through an interposer; the photosensitive assembly 20 has a first side surface 74a and a second side surface 74b corresponding to the positions of the circuit board main body 71, the first side surface 74a and the second side surface 74b are oppositely arranged, and the third side surface 74c intersects with both the first side surface 74a and the second side surface 74 b. The suspending portion 75 has a suspending hole 75a, and the second base portion 41 or the interposer has a hook that hooks the suspending hole 75 a. The rigid substrate is attached to part of the section of the connecting band for reinforcement to form the suspension part (in a deformed embodiment, the suspension circuit board can also be made of a rigid-flex board, wherein the circuit board main body and the suspension part are formed by the rigid board parts of the rigid-flex board, and the bending part and the connecting band section connected among the suspension parts are formed by the flexible board parts of the rigid-flex board). Unlike the previous embodiment, in the present embodiment, the third side surface 74c is not provided with the hanging portion, that is, the hanging portion 75 and the hanging hole 75a are provided only on the first side surface 74a and the second side surface 74 b. Instead, in the present embodiment, the connection band of the third side surface 74c is fixed to the second base portion 41 by a glue material (or fixed to the second base portion 41 by an intermediary). Specifically, in this embodiment, the connection tape may include a third connection tape 72a and a fourth connection tape 72b, where the third connection tape 72a is led out from the first side surface 74a of the circuit board main body 71 and is bent upward to form one bent portion 73, and then extends along the first side surface 74a of the photosensitive assembly 20, and is bent in a horizontal direction at a corner and continues to extend along the third side surface 74 c; the fourth connecting band 72b is led out from the second side surface 74b of the circuit board main body 71 and bent upward to form another bent portion, then extends along the second side surface 74b of the photosensitive assembly 20, and is horizontally bent at a corner and continues to extend along the third side surface 74 c; the third connection band 72a and the fourth connection band 72b are joined to each other at the third side 74c and are conducted to each other (the joining and conduction can be achieved by snap-fitting of a male and female connector or by welding). Further, fig. 25 is an exploded perspective view of a suspension board-based camera module according to an embodiment of the present application. Fig. 26 illustrates a perspective view of a suspension circuit board based camera module with a housing according to an embodiment of the present application. With reference to fig. 24a, 24b, 25 and 26, in this embodiment, the image capturing module further includes a first connecting strip 84 electrically connected to the first driving portion, and the first connecting strip 84 is led out from a top region of the first driving portion, and then bent downward and engaged with and conducted to the third connecting strip 72a or the fourth connecting strip 72b at the third side 74 c. The camera module further comprises a housing 81 and a module base 80, wherein the inner side surface of the housing 81 is provided with a receiving groove 82 for receiving the joint part of the third side surface 74 c; wherein the joint portion is a joint portion 83 where the first connecting band, the third connecting band 72a, and the fourth connecting band 72b are joined to each other; glue is poured into the accommodating groove 82 to fix the first connecting belt, the third connecting belt 72a and the fourth connecting belt 72b to the housing 81. The module base 80 and the housing 81 can be snapped together to enclose the first optical drive assembly 85 and the second optical drive assembly 86 inside the base 80 and the housing 81 (see fig. 25 and 26). Further, the connecting band on the third side 74c is further connected with a fifth connecting band 76, and the fifth connecting band 76 is provided with a connector 77 for external connection; the suspension board may further have a fixing portion 76a for fixing the fifth connection strap 76. The first optical driving assembly 85 includes a first driving portion and an optical lens, and the optical lens is mounted in the first movable portion of the first driving portion. The second optical driving assembly 86 includes a second driving portion and a photosensitive assembly fixed to a second movable portion of the second driving portion.

In assembling, the first driving unit and the optical lens may be assembled into the first optical driving module 85, and the second driving unit and the photosensitive module may be assembled into the second optical driving module 86. Then, the relative position of the optical lens and the photosensitive chip is adjusted by an active calibration process, and the first driving part (first base part) and the second driving part (second base part) are bonded by glue. Then, the bonded first optical driving component 85 and second optical driving component 86 are assembled in the through hole of the module housing 81 from bottom to top, and then the module base 80 is attached to the module housing 81; finally, glue is poured into the housing receiving groove 82 to fix the first optical driving assembly 85, the second optical driving assembly 86 and the module housing 81. Meanwhile, glue is poured into the accommodating groove 82, and the joint portion of the first connecting strip 84, the third connecting strip 72a, and the fourth connecting strip 72b may be fixed to the module housing 81, the first base portion, or the second base portion.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and are not limited. Although the present invention has been described in detail with reference to the embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. The utility model provides an optics anti-shake module of making a video recording which characterized in that includes:

a lens;

a photosensitive assembly including a photosensitive chip;

the first driving part is suitable for mounting the lens and driving the lens to translate in the directions of an x axis and a y axis; and

the second driving part is suitable for mounting the photosensitive assembly and driving the photosensitive chip to translate in the directions of an x axis and a y axis, the lens and the photosensitive chip are configured to be driven simultaneously and move towards opposite directions, the x axis and the y axis are two coordinate axes perpendicular to the direction of the optical axis of the camera module, and the x axis and the y axis are perpendicular to each other;

wherein the second driving part comprises a second base part comprising a base part base and a cover, and a second movable part; the second movable part comprises at least two chip end carriers arranged from bottom to top; a plurality of guide grooves are arranged on the base part base and the at least two chip end carriers, and each guide groove comprises a first guide groove and a second guide groove;

the upper surface of the base or the lower surface of the chip end carrier of the second movable part located lowermost has the first guide groove in which a first ball is provided and can roll along the first guide groove, the upper surface of the base and the chip end carrier of the second movable part located lowermost being supported by the first ball;

in the second movable portion, for any two chip end carriers adjacent vertically, the second guide groove is provided on the upper surface of the chip end carrier located below or the lower surface of the chip end carrier located above, a second ball is provided in the second guide groove and can roll along the second guide groove, and the upper surface of the chip end carrier located below and the lower surface of the chip end carrier located above are supported by the second ball;

the photosensitive assembly is mounted on the uppermost chip end carrier of the second movable part; and is

In the plurality of guide grooves, the guide direction of at least one of the guide grooves is a direction of translation along the x-axis, and the guide direction of at least one of the guide grooves is a direction of translation along the y-axis.

2. The optical anti-shake camera module according to claim 1, wherein the guiding direction of the first guiding groove is a direction of translation along the x-axis or along the y-axis, and wherein the guiding direction of the second guiding groove of one of the chip end carriers is perpendicular to the guiding direction of the first guiding groove.

3. The optical anti-shake camera module according to claim 2, wherein the chip-side carrier includes a chip-side first carrier, a chip-side second carrier, and a chip-side third carrier arranged in sequence from top to bottom; the second guide groove comprises an arc-shaped guide groove and a linear guide groove; the arc-shaped guide groove is used for guiding the second ball to roll along an arc rotating around a z-axis, wherein the z-axis is a coordinate axis consistent with the direction of the optical axis; the rectilinear guide groove is used for guiding the second ball to roll along the x axis or the y axis.

4. The optical anti-shake imaging module according to claim 1, wherein for any two chip end carriers adjacent to each other up and down, the second movable portion has a second fitting groove on a lower surface of the chip end carrier located above or an upper surface of the chip end carrier located below, and the second fitting grooves are fitted with the second guide grooves and together form a guide passage for the second balls.

5. The optical anti-shake camera module according to claim 3, wherein an arc center of the arc-shaped guide groove is located right below a photosensitive center, wherein the photosensitive center is a center of a photosensitive area of the photosensitive chip.

6. The optical anti-shake camera module according to claim 1, wherein each of the chip end carriers includes a carrier substrate and a carrier wall extending upward from an edge region of the carrier substrate, the carrier wall surrounding the photosensitive element.

7. The optical anti-shake camera module according to claim 6, wherein the second guide groove is located on an upper surface of the carrier wall; for any two chip end carriers adjacent up and down, the lower surface of the carrier wall of the chip end carrier positioned above is supported by the second ball.

8. The optical anti-shake camera module according to claim 7, wherein the carrier wall includes a wall and an extension portion extending outwardly from a top region of the wall; for any two chip end carriers which are adjacent up and down, the second guide groove is positioned on the upper surface of the extension part of the chip end carrier below, and the lower surface of the extension part of the chip end carrier above is supported by the second ball.

9. The optical anti-shake imaging module according to claim 8, wherein for any two chip end carriers adjacent up and down, the wall of the lower chip end carrier surrounds the wall of the upper chip end carrier; and there is a gap between the walls of the two chip end carriers.

10. The optical anti-shake camera module according to claim 1, wherein each of the chip end carriers includes a ring-shaped carrier wall surrounding the photosensitive assembly, and the second guide groove is located on an upper surface of the carrier wall.

11. The optical anti-shake camera module according to claim 10, wherein at least one of the chip end carriers is a frame structure formed solely by the carrier walls.

12. The optical anti-shake camera module according to claim 10, wherein in the second movable portion, a part of the chip end carrier is a frame structure formed by the carrier walls alone, and another part of the chip end carrier includes a carrier substrate and the carrier walls extending upward from an edge area of the carrier substrate.

13. The optical anti-shake camera module according to claim 12, wherein in the second movable portion, the uppermost chip end carrier includes the carrier substrate and the carrier wall, and the photosensitive element is mounted in a receiving groove formed by the carrier substrate and the carrier wall.

14. The optical anti-shake camera module according to claim 1, wherein a lower surface of the chip end carrier located at the lowest position of the second movable portion or an upper surface of the base portion base has a first fitting groove, and the first fitting groove is fitted with the first guide groove and jointly forms a guide channel for the first ball.

15. The optical anti-shake camera module according to claim 3, wherein the second balls comprise an upper layer of second balls and a lower layer of second balls; the upper layer of second balls is arranged between the lower surface of the chip end first carrier and the upper surface of the chip end second carrier; the lower layer second ball is arranged between the lower surface of the chip end second carrier and the upper surface of the chip end third carrier.

16. The optical anti-shake camera module according to claim 15, wherein the first ball is disposed between a lower surface of the chip-side third carrier and an upper surface of the base portion base.

17. The optical anti-shake camera module according to claim 16, wherein the arc-shaped guide slot is located on a lower surface of the chip-end first carrier or an upper surface of the chip-end second carrier; the straight guide groove is positioned on the lower surface of the chip end second carrier or the upper surface of the chip end third carrier.

18. The optical anti-shake camera module defined in claim 15, wherein the cover comprises cover side walls and a bearing platform formed extending inwardly from a top region of the cover side walls; the bottom of the cover side wall is connected with the base of the base part, the bearing table is positioned above the first chip end carrier, and a gap is formed between the lower surface of the bearing table and the upper surface of the first chip end carrier.

19. The optical anti-shake camera module according to claim 5, wherein the chip end carrier has a rectangular shape in a top view, and an edge area of the chip end carrier includes a first edge, a second edge opposite to the first edge, a third edge intersecting the first edge, and a fourth edge opposite to the third edge; the lengths of the first and second sides are greater than the lengths of the third and fourth sides; under the overlooking angle, the arc-shaped guide groove is arranged on the first edge and the second edge.

20. The optical anti-shake camera module according to claim 19, wherein the rectilinear guide grooves are provided in four corner regions of the chip end carrier in a plan view.

21. The optical anti-shake imaging module according to claim 19, wherein the second base portion has a rectangular shape in a plan view; the first guide grooves are arranged in four corner regions of the second base part or the chip end carrier.

22. The optical anti-shake imaging module according to claim 21, wherein the driving elements of the second driving section are coil magnet assemblies, wherein magnets of the coil magnet assemblies are all mounted on an edge region of the second base section, and coils of the coil magnet assemblies are all mounted on an edge region of the chip-end first carrier;

the coil magnet combination comprises a first coil magnet pair, a second coil magnet pair and a third coil magnet pair; wherein the first coil magnet pair and the second coil magnet pair are used for providing driving force in the x-axis direction; the third coil magnet pair is used for providing driving force in the y-axis direction; and in a plan view, the first coil magnet pair and the second coil magnet pair may be arranged along a first side and a second side of the second driving part, respectively, the first side and the second side not intersecting, and the second coil magnet pair may be arranged along a third side of the second driving part, the third side intersecting both the first side and the second side.

23. The optical anti-shake camera module defined in claim 22, wherein the cover comprises cover side walls and a rest platform formed extending inwardly from a top region of the cover side walls; the bottom of the cover side wall is connected with the base part of the base part, the bearing table is positioned above the first chip end carrier, and a gap is formed between the lower surface of the bearing table and the upper surface of the first chip end carrier;

wherein the magnets in the coil magnet assembly are mounted to the cover, the base portion base, or the chip end third carrier; and wherein the magnets of the first coil magnet pair and the magnets of the second coil magnet pair are mounted to the same member, the member being one of the cover, the base, and the chip end third carrier.

24. The optical anti-shake imaging module according to claim 23, wherein the magnets of the first coil magnet pair are disposed on a side of the first side that is closer to the third side, and the second coil magnet pair is disposed on a side of the second side that is farther from the third side.

25. The optical anti-shake camera module according to claim 1, wherein a lens moving distance b for the first driving module to drive the lens to move and a photosensitive chip moving distance c for the second driving module to drive the photosensitive chip to move are determined according to the detected tilt shake angle a of the camera module; the lens moving distance b, the photosensitive chip moving distance c and the image space focal length f of the camera module meet the following requirements: a is arctan (b/f) + arctan (c/f).

26. The optical anti-shake camera module according to claim 25, wherein the driving structure further comprises a driving logic module for keeping a ratio of the lens moving distance b to the photosensitive chip moving distance c at a preset fixed ratio.

27. The optical anti-shake camera module according to claim 25, wherein the driving structure further comprises a driving logic module having an anti-shake threshold K, the driving logic module is configured to keep the ratio of the lens moving distance b to the photosensitive chip moving distance c at a predetermined fixed ratio when the inclined shake angle a is smaller than or equal to the anti-shake threshold K, and to make the photosensitive chip moving distance c reach the maximum value c of the moving stroke when the inclined shake angle a is larger than the anti-shake threshold K_maxThe lens moving distance b is in accordance with the relation b ═ tan (a/f) -c_maxAnd (6) calculating.

28. The optical anti-shake imaging module according to claim 26 or 27, wherein the preset fixed ratio of the lens moving distance and the photosensitive chip moving distance is set according to the weight of the lens, the driving force of the first driving part, the weight of the photosensitive chip or photosensitive assembly, and the driving force of the second driving part, so that the time for moving the lens and the photosensitive chip to the respective anti-shake target positions is consistent.

29. The optical anti-shake imaging module according to claim 1, wherein the first driving part includes a first base part and a first movable part, and the first base part and the second base part are fixed together.

30. The camera module according to claim 1, wherein the photosensitive assembly comprises a circuit board, the camera module further comprises a first connecting belt and a second connecting belt, the first connecting belt is disposed at a top region of the first driving portion and electrically connected to the first driving portion, and the second connecting belt is connected to and conducted with the circuit board of the photosensitive assembly; wherein the second connecting belt is provided with a plurality of bends to form a bending and stacking shape.

31. The camera module according to claim 30, wherein the first driving portion includes a first base portion and a first movable portion, and the second driving portion includes a second base portion and a second movable portion; the second base part is fixed with the first base part, the second movable part is positioned below the second base part and movably connected with the second base part, and the photosensitive assembly is positioned below the second movable part and fixed on the second movable part;

the photosensitive assembly comprises a suspension type circuit board, the suspension type circuit board comprises a rigid circuit board main body and a flexible connecting band, the connecting band is led out from a first side face and a second side face of the circuit board main body and is bent upwards to form a bent portion, the top of the bent portion extends along the periphery of the photosensitive assembly in the horizontal direction, so that the connecting band surrounds the peripheries of the first side face, the second side face and a third side face of the photosensitive assembly, the connecting bands positioned on the first side face, the second side face and the third side face are respectively provided with at least one suspension part, and the suspension parts are fixed on the second base part of the second driving part or fixed with the second base part through an intermediary; the photosensitive assembly is provided with a first side face and a second side face, the positions of the first side face and the second side face are consistent with those of the circuit board main body, the first side face and the second side face are oppositely arranged, and the third side face intersects with the first side face and the second side face.

32. The camera module according to claim 31, wherein the connecting band comprises a third connecting band and a fourth connecting band, the third connecting band is led out from the first side of the circuit board main body and bent upward to form a bent portion, then extends along the first side of the photosensitive assembly, and is bent in a horizontal direction at a corner and continues to extend along the third side; the fourth connecting band is led out from the second side face of the circuit board main body and is bent upwards to form another bent part, then extends along the second side face of the photosensitive assembly, is horizontally bent at a corner and continues to extend along the third side face; the third connecting band and the fourth connecting band are jointed on the third side surface and are mutually conducted; the hanging part of the connecting belt positioned on the third side is also connected with a fifth connecting belt, and the fifth connecting belt is provided with a connector for external connection; the suspension type circuit board is also provided with a fixing part for fixing the fifth connecting band.