CN114160993A - Laser cutting machine with byproduct removing function and laser cutting method - Google Patents
Laser cutting machine with byproduct removing function and laser cutting method Download PDFInfo
- Publication number
- CN114160993A CN114160993A CN202111547660.8A CN202111547660A CN114160993A CN 114160993 A CN114160993 A CN 114160993A CN 202111547660 A CN202111547660 A CN 202111547660A CN 114160993 A CN114160993 A CN 114160993A
- Authority
- CN
- China
- Prior art keywords
- plate
- wall
- laser cutting
- fixedly connected
- push rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000003698 laser cutting Methods 0.000 title claims abstract description 59
- 239000006227 byproduct Substances 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims description 20
- 238000005498 polishing Methods 0.000 claims abstract description 38
- 239000002699 waste material Substances 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 26
- 238000004140 cleaning Methods 0.000 claims description 16
- 238000005520 cutting process Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 description 13
- 230000033001 locomotion Effects 0.000 description 7
- 238000007599 discharging Methods 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 239000011435 rock Substances 0.000 description 3
- 238000005034 decoration Methods 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007873 sieving Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
- B07B1/00—Sieving, screening, sifting, or sorting solid materials using networks, gratings, grids, or the like
- B07B1/28—Moving screens not otherwise provided for, e.g. swinging, reciprocating, rocking, tilting or wobbling screens
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
- B07B1/00—Sieving, screening, sifting, or sorting solid materials using networks, gratings, grids, or the like
- B07B1/42—Drive mechanisms, regulating or controlling devices, or balancing devices, specially adapted for screens
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/033—Other grinding machines or devices for grinding a surface for cleaning purposes, e.g. for descaling or for grinding off flaws in the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to the technical field of laser cutting machines, and discloses a laser cutting machine with a byproduct removing function, which comprises a box body, wherein a supporting column is arranged at the rear part of the box body, a workbench is fixedly connected at the front part of the supporting column, a serrated plate is fixedly connected on the inner wall of the workbench, a rotating shaft is rotatably connected on the inner wall of the serrated plate, a limiting strip is fixedly connected on the surface of the rotating shaft, a polishing disc is slidably connected on the surface of the rotating shaft, a telescopic rod is fixedly connected at the front end of the polishing disc, a gear set is fixedly connected at the front end of the rotating shaft, a collecting device is arranged on the inner wall of the box body, and a laser cutter is arranged at the top of the supporting column, thereby eliminating the by-products of laser cutting.
Description
Technical Field
The invention relates to the technical field of laser cutting machines, in particular to a laser cutting machine with a byproduct removing function and a laser cutting method.
Background
The laser cutting machine is characterized in that laser emitted from a laser device is focused into a laser beam with high power density through an optical path system, the metal plate can be cut through the laser beam, different shapes can be cut on the plate through laser cutting, and the laser cutting machine is very convenient.
At present, some byproducts can be generated when the laser cutting machine is used, the most byproducts are waste residues, and due to the high temperature, the waste residues can be cooled and fixed on the surface of a cut plate, so that the subsequent processing and use of the plate are influenced, and the laser cutting machine with the byproduct removing function and the laser cutting method are provided to solve the problems.
Disclosure of Invention
The present invention provides a laser cutting machine and a laser cutting method with a function of removing by-products, aiming at the deficiencies in the prior art.
In order to solve the technical problems, the invention adopts the technical scheme that: the utility model provides a laser cutting machine with get rid of accessory substance function, the power distribution box comprises a box body, the support column is installed at the box rear portion, the anterior fixedly connected with workstation of support column, the inner wall fixedly connected with serration plate of workstation, the inner wall of serration plate rotates and is connected with the pivot, the fixed surface of pivot is connected with spacing, the sliding surface of pivot is connected with the polishing dish, the front end fixedly connected with telescopic link of polishing dish, the front end fixedly connected with gear train of pivot, the inner wall of box is provided with collection device, the top of support column is provided with laser cutting ware.
Preferably, the inner wall of the workbench is rotatably connected with the surface of the rotating shaft, the inner wall of the polishing disc is slidably connected with the surface of the limiting strip, a spring is arranged between the polishing disc and the serrated plate, and one end, far away from the polishing disc, of the telescopic rod is movably connected with the inner wall of the serrated plate.
Preferably, the collection device is including the sieve, the bottom of sieve is provided with vibrating device, the inner wall sliding connection of box has the baffle, the lower surface of baffle and the upper surface of connecting plate contact each other, one side fixedly connected with driving plate of baffle is kept away from to the connecting plate.
Preferably, the lower surfaces of the transmission plate and the connecting plate are in mutual contact with the inner wall of the box body, the vibration device comprises a push rod, the surface of the push rod is in mutual contact with the surface of the transmission plate, the surface of the sieve plate is in sliding connection with the inner wall of the box body, and the top of the push rod is fixedly connected with the bottom of the sieve plate.
Preferably, the inner wall of the bottom of the push rod is rotatably connected with a roller, the surface of the roller is in contact with the surface of the sphere, and the surface of the sphere is fixedly connected with a cleaning rod.
Preferably, the surface of the roller is in contact with the inner wall of the box body, the surface of the cleaning rod is rotatably connected with the inner wall of the push rod, and the surface of the ball is in contact with the inner wall of the push rod.
Preferably, the inner wall of the push rod is connected with a sliding block in a sliding mode, the inner wall of the push rod is fixedly connected with an elastic sheet, and the upper surface of the elastic sheet is fixedly connected with a push rod.
Preferably, the top and the bottom of the sliding block are fixedly connected with protruding blocks, pits matched with the protruding blocks are formed in one side, close to the sliding block, of the ball body, the surface of the sliding block is in mutual contact with the inner wall of the ball body, the sliding block is located below the elastic piece, and the length of the push rod below the sieve plate is gradually decreased from back to front.
A laser cutting method of a laser cutting machine with a function of removing by-products comprises the following steps:
the method comprises the following steps: firstly, a plate to be cut is placed on a sawtooth plate of a workbench, and then a laser cutter is started and descends to cut the plate to be cut circularly according to a previously programmed graph;
step two: the cut round plate materials lose balance under the support of the saw-toothed plate and enter between the grinding disks;
step three: at the moment, the gear set is driven to rotate by the arranged motor, the gear set can drive the two rotating shafts to rotate in opposite directions, and the rotating shafts can drive the polishing disc to rotate;
step four: the plate material can move downwards under the action of the two pairs of rotating polishing disks, and the plate material can open the two polishing disks so as to polish the two polishing disks, so that waste residues are removed
By adopting the technical scheme, the invention can bring the following beneficial effects:
1. according to the laser cutting machine with the byproduct removing function and the laser cutting method, after the laser cutting machine finishes cutting a plate, the cut plate falls between the sawtooth plates, the gear set is driven to rotate by the motor, the gear set drives the rotating shaft to rotate, the rotating shaft drives the polishing disks to rotate, the two pairs of polishing disks can polish the plate, the plate can move downwards under the action of the two pairs of rotating polishing disks, the two polishing disks are stretched by the plate, and then polishing is carried out between the two polishing disks, so that waste residues generated in laser cutting can be polished and cleaned, and the byproduct waste residues generated in laser cutting are further cleaned.
2. According to the laser cutting machine with the byproduct removing function and the laser cutting method, when the polished plate falls into the box body, the sieve plate is pushed to reset through the arranged cylinder, the plate falling on the sieve plate and waste residues are sieved, the waste residues generated after laser cutting are conveniently collected, the plate can be separated independently to discharge, subsequent processing is facilitated, and meanwhile, the plate can be promoted to slide out.
3. When the plate slides down through the sieve plate, the plate can be blocked by the baffle plate, the plate is stopped at the baffle plate, the sieve plate which reciprocates at the moment can drive the push rod to move, the push plate can push the transmission plate to move, the transmission plate can drive the baffle plate to move upwards through the connecting plate, when the push rod continues to move, the push rod is not in contact with the transmission plate, the baffle plate can slide down under the action of gravity, the baffle plate can reciprocate up and down under the reciprocating movement of the sieve plate, the reciprocating movement of the baffle plate can push the plate to shake, waste residues on the surface of the plate can be vibrated down, the waste residues adhered on the plate are prevented from being discharged together, and the baffle plate reciprocates to push the plate and the inclined sieve plate, so that the plate slowly slides out, and discharging is realized.
4. This laser cutting machine and laser cutting method with get rid of accessory substance function, the sieve can drive the push rod when rocking and remove, because gyro wheel and box contact, the removal of push rod can drive the gyro wheel rotatory at this moment, and the gyro wheel can drive the spheroid rotatory, and the spheroid can drive the clearance pole and swing, and the clearance pole can promote the waste residue of box inside collection, prevents that it from piling up to can increase the inside quantity of collecting the waste residue of box, increase space utilization.
5. This laser cutting machine and laser cutting method with get rid of accessory substance function, the spheroid can come the bellying of extrusion slider bottom through pit department when rotatory, and the extrusion force that the slider was produced by the cylinder thrust at this moment can shift up, makes the slider striking shell fragment, and shell fragment deformation drives ejector pin striking sieve and makes it vibrate, can further promote the screening of sieve, can strike the spheroid and make its vibration when the slider falls simultaneously, and the spheroid can drive the vibration of clearance pole, and then realizes the automatically cleaning of clearance pole.
6. According to the laser cutting machine with the byproduct removing function and the laser cutting method, the length of the push rod is gradually reduced along the front part of the sieve plate, so that the distance between the sliding block and the elastic sheet is smaller and smaller, the sliding block impacts the elastic sheet to enable the vibration strength generated by the sieve plate to be larger and larger, the vibration of the part of the sieve plate closer to the front part is larger, the part of waste residues at the rear part of the sieve plate is small in shaking and less in quantity passing through the sieve plate, the friction force of the waste residues existing between the plate and the sieve plate can be reduced, the sliding of the plate can be promoted, the waste residues pressed by the plate can be sieved by the sieve plate larger in vibration of the sieve plate closer to the front part, the waste residues pressed by the plate can be cleaned, and meanwhile the sliding discharging of the plate is promoted.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of a worktable according to the present invention;
FIG. 3 is a schematic view of a serration plate according to the present invention;
FIG. 4 is a half sectional view of the case structure of the present invention;
FIG. 5 is a schematic view of a collection device according to the present invention;
FIG. 6 is a half sectional view of the vibration device of the present invention.
In the figure: 1. a box body; 2. a work table; 21. a serrated plate; 22. a rotating shaft; 23. a limiting strip; 24. grinding disc; 25. a telescopic rod; 26. a gear set; 3. a collection device; 31. a sieve plate; 32. a vibrating device; 321. a push rod; 322. a roller; 323. a sphere; 324. cleaning the rod; 325. a slider; 326. a spring plate; 327. a top rod; 33. a baffle plate; 34. a connecting plate; 35. a drive plate; 4. a support pillar; 5. and (3) laser cutter.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
A laser cutting machine and a laser cutting method with a function of removing by-products, as shown in fig. 1-6, comprising a case 1, characterized in that: the rear part of the box body 1 is provided with a supporting column 4, the front part of the supporting column 4 is fixedly connected with a workbench 2, the inner wall of the workbench 2 is fixedly connected with a sawtooth plate 21, the inner wall of the sawtooth plate 21 is rotatably connected with a rotating shaft 22, the surface of the rotating shaft 22 is fixedly connected with a limiting strip 23, the surface of the rotating shaft 22 is slidably connected with a polishing disc 24, the front end of the polishing disc 24 is fixedly connected with a telescopic rod 25, the front end of the rotating shaft 22 is fixedly connected with a gear set 26, the inner wall of the box body 1 is provided with a collecting device 3, the top of the supporting column 4 is provided with a laser cutter 5, when the laser cutter finishes cutting the plate, the cut plate falls between the sawtooth plates 21, at the moment, the gear set 26 is driven to rotate by a motor, the gear set 26 drives the rotating shaft 22 to rotate, the rotating shaft 22 drives the polishing disc 24 to rotate, two pairs of polishing discs 24 can polish the plate, and the plate can move downwards under the action of the two pairs of rotating polishing discs 24, at this moment, the plate material can prop open the two polishing disks 24, and then the polishing is carried out between the two polishing disks, so that waste residues generated during laser cutting can be polished and cleaned, and then byproduct waste residues generated during laser cutting are cleaned.
In this embodiment, the inner wall of the worktable 2 is rotatably connected with the surface of the rotating shaft 22, the inner wall of the polishing disc 24 is slidably connected with the surface of the limiting strip 23, a spring is arranged between the polishing disc 24 and the serrated plate 21, one end of the telescopic rod 25 far away from the polishing disc 24 is movably connected with the inner wall of the serrated plate 21, and the telescopic rod 25 is arranged to prevent the plate from entering the spring and guide the plate to enter between the two polishing discs 24 instead of between the polishing disc 24 and the serrated plate 21.
Further, collection device 3 is including sieve 31, the bottom of sieve 31 is provided with vibrating device 32, the inner wall sliding connection of box 1 has baffle 33, the lower surface of baffle 33 and the upper surface of connecting plate 34 contact each other, one side fixedly connected with driving plate 35 of baffle 33 is kept away from to connecting plate 34, when the sheet material after polishing falls into box 1, promote sieve 31 reset motion through the cylinder that sets up, and then sieve the sheet material and the waste residue that fall on sieve 31, the waste residue that produces after the convenient laser cutting is collected, can separate the sheet material alone simultaneously and carry out the ejection of compact, make things convenient for subsequent processing, rock the roll-off that also can promote the sheet material simultaneously.
Furthermore, the lower surfaces of the transmission plate 35 and the connecting plate 34 are both contacted with the inner wall of the box body 1, the vibration device 32 comprises a push rod 321, the surface of the push rod 321 is contacted with the surface of the transmission plate 35, the surface of the screen plate 31 is connected with the inner wall of the box body 1 in a sliding manner, the top of the push rod 321 is fixedly connected with the bottom of the screen plate 31, when the plate slides down through the screen plate 31, the plate is blocked by the baffle 33, so that the plate stops at the baffle 33, at this time, the screen plate 31 which moves in a reciprocating manner drives the push rod 321 to move, the push plate 321 drives the transmission plate 35 to move, the transmission plate 35 drives the baffle 33 to move upwards through the connecting plate 34, when the push rod 321 continues to move, the push rod 321 is not contacted with the transmission plate 35, at this time, the baffle 33 slides down under the action of gravity, at this time, the baffle 33 reciprocates up and down under the reciprocating movement of the screen plate 31, the baffle 33 pushes the plate to rock, the waste residues on the surface of the plate material are vibrated to fall, the plate material is prevented from being adhered with the waste residues and then discharged together, and the baffle plate 33 pushes the plate material and the inclined sieve plate 31 in a reciprocating mode, so that the plate material can slowly slide out, and discharging is achieved.
In addition, the inner wall of push rod 321 bottom rotates and is connected with gyro wheel 322, the surface of gyro wheel 322 and spheroid 323 surface contaction each other, spheroid 323's fixed surface is connected with clearance pole 324, can drive push rod 321 and remove when sieve 31 rocks, because gyro wheel 322 and box 1 contact, at this moment, the removal of push rod 321 can drive gyro wheel 322 rotatory, gyro wheel 322 can drive spheroid 323 rotatory, spheroid 323 can drive clearance pole 324 swing, clearance pole 324 can promote the inside waste residue of collecting of box 1, prevent that it from piling up, thereby can increase the inside quantity of collecting the waste residue of box 1, the utilization ratio is increased.
In addition, the surface of the roller 322 is in contact with the inner wall of the box body 1, the surface of the cleaning rod 324 is rotatably connected with the inner wall of the push rod 321, the surface of the ball 323 is in contact with the inner wall of the push rod 321, the ball 323 can extrude the bulge at the bottom of the sliding block 325 through the concave pit when rotating, at this time, the sliding block 325 moves upwards under the extrusion force generated by the thrust of the air cylinder, so that the sliding block 325 impacts the elastic sheet 326, the elastic sheet 326 deforms to drive the push rod 327 to impact the sieve plate 31 to vibrate, and the sieving of the sieve plate 31 can be further promoted.
It is worth noting that the inner wall of the push rod 321 is slidably connected with a sliding block 325, the inner wall of the push rod 321 is fixedly connected with an elastic sheet 326, the upper surface of the elastic sheet 326 is fixedly connected with a push rod 327, when the sliding block 325 falls down, the sliding block 323 can be impacted and vibrated, the ball 323 can drive the cleaning rod 324 to vibrate, and therefore self-cleaning of the cleaning rod 324 is achieved.
It is worth to be noted that the top and the bottom of the sliding block 325 are both fixedly connected with a convex block, one side of the spherical body 323 close to the sliding block 325 is provided with a concave pit matched with the convex block, the surface of the sliding block 325 is in contact with the inner wall of the spherical body 323, the sliding block 325 is positioned below the elastic sheet 326, the length of the push rod 321 below the screen plate 31 is gradually decreased from back to front, because the length of the push rod 321 is gradually decreased along the front part of the screen plate 31, the distance between the sliding block 325 and the elastic sheet 326 is smaller and smaller, so that the sliding block 325 impacts the elastic sheet 326 to make the vibration strength of the screen plate 31 larger and larger, the vibration of the screen plate 31 closer to the front part is larger, when the waste residue at the rear part of the screen plate 31 is small in shaking and passes through the screen plate 31, the friction force between the waste residue between the plate and the screen plate 31 can be reduced, the sliding of the plate can be promoted, and the waste residue pressed by the screen plate 31 closer to the front part is larger in vibrating, thereby cleaning the waste slag pressed by the plate and promoting the sliding discharge of the plate.
A laser cutting method of a laser cutting machine with a function of removing by-products comprises the following steps:
the method comprises the following steps: firstly, a plate to be cut is placed on a sawtooth plate 21 of a workbench 2, and when a laser cutter 5 is started, the laser cutter 5 descends and performs circular cutting on the plate to be cut according to a previously programmed graph;
step two: the cut round plate materials lose balance under the support of the sawtooth plates 21 and enter between the grinding disks 24;
step three: at this time, the gear set 26 is driven to rotate by the arranged motor, the gear set 26 drives the two rotating shafts 22 to rotate in opposite directions, and the rotating shafts 22 drive the polishing disc 24 to rotate;
step four: the plate material moves downwards under the action of the two pairs of rotating grinding disks 24, and the plate material can open the two grinding disks 24 and further grind the two grinding disks so as to realize the removal of waste residues
According to the working principle, after the laser cutting machine finishes cutting the plate, the cut plate falls between the sawtooth plates 21, the gear set 26 is driven to rotate by the motor, the gear set 26 drives the rotating shaft 22 to rotate, the rotating shaft 22 drives the polishing discs 24 to rotate, the two pairs of polishing discs 24 polish the plate, the plate moves downwards under the action of the two pairs of rotating polishing discs 24, the two polishing discs 24 are stretched by the plate, and then the plate is polished between the two polishing discs 24, so that waste residues generated in laser cutting can be polished and cleaned, and the waste residues generated in laser cutting are cleaned; when the polished plate falls into the box body 1, the sieve plate 31 is pushed to reset through the arranged air cylinder, so that the plate and waste residues falling on the sieve plate 31 are sieved, the waste residues generated after laser cutting are conveniently collected, the plate can be separated independently for discharging, subsequent processing is facilitated, and the plate can be promoted to slide out by shaking; when the plate material slides down through the sieve plate 31, the plate material is blocked by the baffle plate 33, so that the plate material is stopped at the baffle plate 33, at this time, the sieve plate 31 which moves in a reciprocating manner drives the push rod 321 to move, the push plate 321 can push the transmission plate 35 to move, the transmission plate 35 can drive the baffle plate 33 to move upwards through the connecting plate 34, when the push rod 321 continues to move, the push rod is not in contact with the transmission plate 35 any more, at this time, the baffle plate 33 can slide down under the action of gravity, at this time, the baffle plate 33 can reciprocate up and down under the reciprocating movement of the sieve plate 31, the plate material can be pushed to shake by the reciprocating movement of the baffle plate 33, so that the waste residue on the surface of the plate material is prevented from vibrating down, the waste residue adhered to the plate material is prevented from being discharged together, and the baffle plate material and the inclined sieve plate 31 are pushed in a reciprocating manner, so that the plate material slowly slides out, thereby realizing discharging; however, when the sieve plate 31 shakes, the push rod 321 is driven to move, and because the roller 322 is in contact with the box body 1, at this time, the movement of the push rod 321 drives the roller 322 to rotate, the roller 322 drives the ball 323 to rotate, the ball 323 drives the cleaning rod 324 to swing, and the cleaning rod 324 pushes the waste residues collected in the box body 1 to prevent the waste residues from being accumulated, so that the quantity of the waste residues collected in the box body 1 can be increased, and the utilization rate is increased; when the ball 323 rotates, the convex part at the bottom of the sliding block 325 is extruded through the concave part, at the moment, the sliding block 325 moves upwards under the extrusion force generated by the thrust of the air cylinder, so that the sliding block 325 impacts the elastic sheet 326, the elastic sheet 326 deforms to drive the ejector rod 327 to impact the sieve plate 31 to vibrate, the sieving of the sieve plate 31 can be further promoted, meanwhile, when the sliding block 325 falls down, the ball 323 can be impacted and vibrate, and the ball 323 can drive the cleaning rod 324 to vibrate, so that the self-cleaning of the cleaning rod 324 is realized; because the length of the push rod 321 gradually decreases along the front part of the screen plate 31, the distance between the sliding block 325 and the elastic sheet 326 is smaller and smaller, so that the sliding block 325 impacts the elastic sheet 326 to enable the vibration strength generated by the screen plate 31 to be larger and larger, the vibration of the part of the screen plate 31 closer to the front part is larger, when the part of the waste residue at the rear part of the screen plate 31 is small in shaking and less in passing through the screen plate 31, the friction force of the waste residue existing between the plate and the screen plate 31 can be reduced, the sliding of the plate can be promoted, the waste residue pressed by the plate can be screened when the part of the waste residue at the rear part of the screen plate 31 closer to the front part is larger in vibration, the waste residue pressed by the plate can be cleaned, and the sliding discharging of the plate is promoted.
The present invention provides a laser cutting machine and a laser cutting method with a function of removing by-products, and a plurality of methods and ways for implementing the technical solution, the above description is only a preferred embodiment of the present invention, it should be noted that, for those skilled in the art, a plurality of modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention. All the components not specified in the present embodiment can be realized by the prior art.
Claims (9)
1. The utility model provides a laser cutting machine with get rid of accessory substance function, includes box (1), its characterized in that: support column (4) are installed at box (1) rear portion, anterior fixedly connected with workstation (2) of support column (4), inner wall fixedly connected with serration plate (21) of workstation (2), the inner wall of serration plate (21) rotates and is connected with pivot (22), the fixed surface of pivot (22) is connected with spacing (23), the sliding surface of pivot (22) is connected with grinds dish (24), the front end fixedly connected with telescopic link (25) of grinds dish (24), the front end fixedly connected with gear train (26) of pivot (22), the inner wall of box (1) is provided with collection device (3), the top of support column (4) is provided with laser cutter (5).
2. The laser cutting machine with the byproduct removing function according to claim 1, wherein: the inner wall of workstation (2) is connected with the surperficial rotation of pivot (22), the inner wall of make mill dish (24) and the surperficial sliding connection of spacing strip (23), be provided with the spring between make mill dish (24) and serration plate (21), the one end of making mill dish (24) and the inner wall swing joint of serration plate (21) are kept away from in telescopic link (25).
3. The laser cutting machine with the byproduct removing function according to claim 1, wherein: collection device (3) are including sieve (31), the bottom of sieve (31) is provided with vibrating device (32), the inner wall sliding connection of box (1) has baffle (33), the lower surface of baffle (33) and the upper surface of connecting plate (34) contact each other, one side fixedly connected with driving plate (35) of baffle (33) are kept away from in connecting plate (34).
4. The laser cutting machine with the byproduct removing function according to claim 3, wherein: the lower surface of driving plate (35) and connecting plate (34) all contacts with the inner wall of box (1) each other, vibrating device (32) are including push rod (321), the surface of push rod (321) and the surface of driving plate (35) contact each other, the surface of sieve (31) and the inner wall sliding connection of box (1), the top of push rod (321) and the bottom fixed connection of sieve (31).
5. The laser cutting machine with the byproduct removing function according to claim 4, wherein: the inner wall of the bottom of the push rod (321) is rotatably connected with a roller (322), the surface of the roller (322) is in contact with the surface of the ball body (323), and the surface of the ball body (323) is fixedly connected with a cleaning rod (324).
6. The laser cutting machine with the byproduct removing function according to claim 5, wherein: the surface of the roller (322) is contacted with the inner wall of the box body (1), the surface of the cleaning rod (324) is rotationally connected with the inner wall of the push rod (321), and the surface of the ball body (323) is contacted with the inner wall of the push rod (321).
7. The laser cutting machine with the byproduct removing function according to claim 5, wherein: the inner wall of the push rod (321) is connected with a sliding block (325) in a sliding mode, the inner wall of the push rod (321) is fixedly connected with an elastic sheet (326), and the upper surface of the elastic sheet (326) is fixedly connected with an ejector rod (327).
8. The laser cutting machine with the byproduct removing function according to claim 7, wherein: the top and the bottom of the sliding block (325) are fixedly connected with protruding blocks, one side, close to the sliding block (325), of the ball body (323) is provided with a pit matched with the protruding blocks, the surface of the sliding block (325) is in contact with the inner wall of the ball body (323), the sliding block (325) is located below the elastic sheet (326), and the length of the push rod (321) below the sieve plate (31) is gradually reduced from back to front.
9. A laser cutting method of a laser cutting machine with a byproduct removing function is characterized in that: the method comprises the following steps:
the method comprises the following steps: firstly, a plate to be cut is placed on a sawtooth plate (21) of a workbench (2), and when a laser cutter (5) is started, the laser cutter (5) descends and performs circular cutting on the plate to be cut according to a previously programmed graph;
step two: the cut round plate materials lose balance under the support of the sawtooth plates (21) and enter between the grinding disks (24);
step three: at the moment, the gear set (26) is driven to rotate by the arranged motor, the gear set (26) can drive the two rotating shafts (22) to rotate in opposite directions, and the rotating shafts (22) can drive the polishing disc (24) to rotate;
step four: the plate material can move downwards under the action of the two pairs of rotating grinding discs (24), and at the moment, the plate material can open the two grinding discs (24) so as to grind between the two grinding discs and realize the removal of waste residues.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111547660.8A CN114160993A (en) | 2021-12-16 | 2021-12-16 | Laser cutting machine with byproduct removing function and laser cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111547660.8A CN114160993A (en) | 2021-12-16 | 2021-12-16 | Laser cutting machine with byproduct removing function and laser cutting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114160993A true CN114160993A (en) | 2022-03-11 |
Family
ID=80487196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111547660.8A Withdrawn CN114160993A (en) | 2021-12-16 | 2021-12-16 | Laser cutting machine with byproduct removing function and laser cutting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114160993A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114589400A (en) * | 2022-03-16 | 2022-06-07 | 江苏绿人半导体有限公司 | Semiconductor laser cutting equipment |
| CN114799556A (en) * | 2022-05-05 | 2022-07-29 | 龙雕智能装备(山东)有限公司 | Special laser cutting machine of dirt panel is pressed down in cooling of aqueous vapor convolution |
| CN115069540A (en) * | 2022-07-28 | 2022-09-20 | 江苏科翔制泵有限公司 | Three-step type gravel prevention and control type screening equipment for landscaping construction |
| CN116787003A (en) * | 2023-08-10 | 2023-09-22 | 广州沃图自动化科技有限公司 | Laser cutting equipment and method for processing electronic product |
| CN117733361A (en) * | 2023-10-18 | 2024-03-22 | 四川交通职业技术学院 | Intelligent laser cutting device for automobile sheet metal process and control method thereof |
-
2021
- 2021-12-16 CN CN202111547660.8A patent/CN114160993A/en not_active Withdrawn
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114589400A (en) * | 2022-03-16 | 2022-06-07 | 江苏绿人半导体有限公司 | Semiconductor laser cutting equipment |
| CN114589400B (en) * | 2022-03-16 | 2023-05-12 | 泗洪明芯半导体有限公司 | Semiconductor laser cutting equipment |
| CN114799556A (en) * | 2022-05-05 | 2022-07-29 | 龙雕智能装备(山东)有限公司 | Special laser cutting machine of dirt panel is pressed down in cooling of aqueous vapor convolution |
| CN114799556B (en) * | 2022-05-05 | 2024-04-26 | 龙雕智能装备(山东)有限公司 | Special laser cutting machine of moisture combination formula cooling dust suppression panel |
| CN115069540A (en) * | 2022-07-28 | 2022-09-20 | 江苏科翔制泵有限公司 | Three-step type gravel prevention and control type screening equipment for landscaping construction |
| CN116787003A (en) * | 2023-08-10 | 2023-09-22 | 广州沃图自动化科技有限公司 | Laser cutting equipment and method for processing electronic product |
| CN116787003B (en) * | 2023-08-10 | 2023-12-29 | 广州沃图自动化科技有限公司 | Laser cutting equipment and method for processing electronic product |
| CN117733361A (en) * | 2023-10-18 | 2024-03-22 | 四川交通职业技术学院 | Intelligent laser cutting device for automobile sheet metal process and control method thereof |
| CN117733361B (en) * | 2023-10-18 | 2024-04-30 | 四川交通职业技术学院 | Intelligent laser cutting device for automobile sheet metal process and control method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114160993A (en) | Laser cutting machine with byproduct removing function and laser cutting method | |
| CN113083433B (en) | Smashing waste recycling device for hardware processing | |
| CN211070355U (en) | Material screening structure suitable for food processing | |
| CN210336534U (en) | Cable material granulating device with dustproof function | |
| CN112916398A (en) | Material powder separation device based on centrifugal motion | |
| CN115646580A (en) | Calcium carbonate raw materials reducing mechanism | |
| CN113649925B (en) | Reinforcing bar rust cleaning device for building | |
| CN117697579A (en) | Grinding device for processing breaking hammer shell | |
| CN113426509B (en) | Catalyst particle recycling comprehensive treatment system | |
| CN113019931A (en) | Material powder separation device based on centrifugal motion | |
| CN113679056A (en) | Peanut sheller | |
| CN211103472U (en) | Circuit board edging piece collection device | |
| CN115555737A (en) | Efficient integration laser cutting machine | |
| CN114310612A (en) | Steel surface paint removal treatment equipment | |
| CN111528738B (en) | Silica sand recovery unit | |
| CN216988567U (en) | Sorting unit is used in glass recovery with collect function | |
| CN215277870U (en) | Sundry cleaning device for machine-made sand | |
| CN221580852U (en) | Ore sorting and crushing device | |
| CN214562217U (en) | Electrolytic capacitor's plastics recovery breaker for electrical machinery | |
| CN212238126U (en) | Sieve material device for building material machinery production | |
| CN218342593U (en) | Sponge crusher | |
| CN221157557U (en) | Rotary vibrating screen for abrasive production | |
| CN215612011U (en) | Crusher hammer cleaning device | |
| CN214289786U (en) | Scrap cleaning device for seat accessories | |
| CN216459371U (en) | Stable safe double-sliding-plate silicone rubber selecting machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220523 Address after: 335000 No. 11, No. 7 Road, high tech Industrial Development Zone, Yingtan City, Jiangxi Province Applicant after: Xiong Fumei Applicant after: Shenzhen chengruixing Laser Technology Co.,Ltd. Address before: 518000 Room 502, building 6, Wanyan Industrial Zone, Qiaotou community, Fuyong street, Bao'an District, Shenzhen, Guangdong Province Applicant before: Shenzhen chengruixing Laser Technology Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20220311 |
|
| WW01 | Invention patent application withdrawn after publication |