CN103441082B

CN103441082B - A kind of brand-new technique of integrated circuit packaging

Info

Publication number: CN103441082B
Application number: CN201310349295.9A
Authority: CN
Inventors: 王功杰
Original assignee: Individual
Current assignee: Individual
Priority date: 2013-08-12
Filing date: 2013-08-12
Publication date: 2016-06-08
Anticipated expiration: 2033-08-12
Also published as: CN103441082A

Abstract

The invention discloses a kind of brand-new technique of integrated circuit packaging, the process of the present invention can adopt the equipment of paster lamp bead to be packaged, without equipment is had carry out big technical improvement can be directly general, and the support of available existing lamp bead (support such as 5050 can directly encapsulate the specification within COB8, the support of 5050 in China lamp bead market a large amount of using for many years, technology maturation, low price). In sum, this technique is the available sealed in unit of paster lamp bead production line, material not only, and each side such as processing technique without do big change just can encapsulated circuit chip, accomplish the price advantage on raw material, product is made to have more price and technical advantage, cost is substantially reduced, and can be that country saves writing foreign exchange every year, accomplishes that part of filling of resource utilizes.

Description

A kind of brand-new technique of integrated circuit packaging

Technical field

The present invention relates to a kind of integrated circuit, particularly a kind of brand-new technique of integrated circuit packaging.

Background technology

Integrated antenna package not only acts as bonding point and the outside effect carrying out and being electrically connected in IC chip; also a reliable and stable working environment is provided for IC chip; IC chip is played the effect of machinery or environmental conservation; thus the function that IC chip can be brought into normal play, and ensure that it has high stability and reliability. Being generally integrated circuit package (COBIC) and include following step: take crystalline substance, die bond, bonding wire, plastic packaging, some glue, rib cutting etc., above-mentioned each flow process has its special various equipment and raw material to realize.

And mostly development and the differentiation in Discrete device packaging technical foundation of LED encapsulation technology, there is very big particularity. Generally, the tube core of discrete device is sealed in packaging body, and the effect of encapsulation is mainly protected tube core and completes electric interconnection. LED encapsulation has been then the output signal of telecommunication, protects tube core normal operation, output: the function of visible ray, existing electrical quantity, has again design and the technology requirement of optical parameter.

Now, the production line of encapsulation paster lamp bead domestic through the several years develop, there is serious production capacity surplus in product, thus idle also very many of product facility, and the said equipment is almost import equipment entirely.

But, the design people is through demonstration and test, the encapsulation that the packing producing line of paster lamp bead carries out integrated circuit is creatively adopted (to be particularly suitable for the less integrated circuit that goes between, lead-in wire is within 12), the equipment adopting this type of paster lamp bead carries out the encapsulation of integrated circuit, without equipment is had carry out big technical improvement can be directly general, and the support of available existing lamp bead: (support such as 5050 can directly encapsulate the specification within COB8, the support of 5050 in China lamp bead market a large amount of using for many years, technology maturation, low price).

In sum, this technique is the available sealed in unit of production line of paster lamp bead, material not only, and each side such as processing technique just can encapsulate IC chip without doing big change, accomplish the price advantage on raw material, product is made to have more price and technical advantage, can be that country saves writing foreign exchange every year, accomplish making full use of of resource.

Summary of the invention

In order to overcome the deficiencies in the prior art, the present invention provides a kind of brand-new technique of integrated circuit packaging.

The technical solution adopted for the present invention to solve the technical problems is:

A kind of brand-new technique of integrated circuit packaging, it is characterised in that: include

Step 1: get the raw materials ready, gets out IC chip and lamp bead support,

Step 2: die bond, puts into bonder by IC chip and lamp bead support, is fixed in support by bonder after IC chip base point glue,

Step 3: baking one, puts into the IC chip after die bond and lamp bead support baking box baking and makes adhesive curing,

Step 4: bonding wire, puts into welding machine carry out bonding wire by the IC chip after baking and lamp bead support,

Step 5: some glue, puts into the IC chip after bonding wire and lamp bead support point gum machine and carries out a hot glue encapsulation, form the IC granule plate of molding,

Step 6: baking two, puts into IC granule plate baking box baking and makes adhesive curing,

Step 7: the demoulding, becomes the IC granule of many by ingot stripper by IC granule plate threshing,

Step 8: test, is tested IC granule by test equipment,

Step 9: braid, by braider by IC granule braid, forms the IC granule band of finished product.

The baking time of described step 2 is 1-2 hour, and oven temperature is 100C^o-200C^o��

The baking time of described step 6 is 3-5 hour, and oven temperature is 100C^o-200C^o��

Sizing material used by the glue of described step 5 midpoint have employed silicones.

The invention has the beneficial effects as follows: the process of the present invention can adopt the equipment of paster lamp bead to be packaged, without equipment is had carry out big technical improvement can be directly general, and the support of available existing lamp bead (support such as 5050 can directly encapsulate the specification within COB8, the support of 5050 in China lamp bead market a large amount of using for many years, technology maturation, low price).

In sum, this technique is the available sealed in unit of paster lamp bead production line, material not only, and each side such as processing technique just can encapsulate IC chip without doing big change, accomplish the price advantage on raw material, product is made to have more price and technical advantage, cost is substantially reduced, and can be that country saves writing foreign exchange every year, accomplish making full use of of resource.

Detailed description of the invention

The invention discloses a kind of brand-new technique of integrated circuit packaging, including

Step 1: get the raw materials ready, gets out IC chip and lamp bead support,

Step 3: baking one, puts into the IC chip after die bond and lamp bead support baking box baking and makes adhesive curing, and baking time is 1-2 hour, and oven temperature is 100C^o-200C^o,

Step 4: bonding wire, IC chip after baking and lamp bead support are put into welding machine and carried out bonding wire, weld the turnover line end of IC chip, and it is the gold wire bonder welding adopting LED chip field general, it is possible not only to welding gold thread or silver wire, also solderable copper cash, alloy wire etc., thus selecting materials of welding is wider

Step 5: some glue, IC chip after bonding wire and lamp bead support are put into point gum machine and carries out a hot glue encapsulation, can tightly seal IC chip does not allow it aoxidize, form the IC granule plate of molding, glue material have employed silicones, because epoxy resin etc. compared by silicones, has heat conductivity good, expansion and contraction unconspicuous characteristic, it is to avoid glue chemical reaction in the process solidified is too fierce and the shortcoming that causes internal stress and deformation senior general's bonding wire to be broken.

Step 6: baking two, puts into IC granule plate baking box baking and makes adhesive curing, and baking time is 3-5 hour, and oven temperature is 100C^o-200C^o,

Step 7: the demoulding, is become the IC granule of many, contains the step of the rib cutting in integrated antenna package process and clubfoot in the process by ingot stripper by IC granule plate threshing, adopts ingot stripper once to complete in this step,

Step 8: test, is tested IC granule by test equipment, it is ensured that product quality,

Step 9: braid, by braider by IC granule braid, forms the IC granule band of finished product, thus conveniently transporting, packing and check quantity.

A kind of brand-new the technique of integrated circuit packaging above embodiment of the present invention provided, it is described in detail, principles of the invention and embodiment are set forth by specific case used herein, and the explanation of above example is only intended to help to understand method and the core concept thereof of the present invention; Simultaneously for one of ordinary skill in the art, according to the thought of the present invention, all will change in specific embodiments and applications, in sum, this specification content should not be construed as limitation of the present invention.

Claims

1. a brand-new technique of integrated circuit packaging, it is characterized in that: include step 1: get the raw materials ready, get out IC chip and lamp bead support, step 2: die bond, IC chip and lamp bead support are put into bonder, it is fixed in support by bonder after IC chip base point glue, step 3: baking one, IC chip after die bond and lamp bead support are put into baking box baking and makes adhesive curing, step 4: bonding wire, IC chip after baking and lamp bead support are put into welding machine and carried out bonding wire, step 5: some glue, IC chip after bonding wire and lamp bead support are put into point gum machine and carries out a hot glue encapsulation, form the IC granule plate of molding, step 6: baking two, IC granule plate is put into baking box baking and makes adhesive curing, step 7: the demoulding, by ingot stripper, IC granule plate threshing is become the IC granule of many, step 8: test, by test equipment, IC granule is tested, step 9: braid, by braider by IC granule braid, form the IC granule band of finished product.

2. the brand-new technique of integrated circuit packaging of one according to claim 1, it is characterised in that: the baking time of described step 3 is 1-2 hour, and oven temperature is 100 DEG C-200 DEG C.

3. the brand-new technique of integrated circuit packaging of one according to claim 1, it is characterised in that: the baking time of described step 6 is 3-5 hour, and oven temperature is 100 DEG C-200 DEG C.

4. the brand-new technique of integrated circuit packaging of one according to claim 1, it is characterised in that: the sizing material used by the glue of described step 5 midpoint have employed silicones.