CN102283677B - Production method of ultrasound array sound head - Google Patents
Production method of ultrasound array sound head Download PDFInfo
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- CN102283677B CN102283677B CN 201110194007 CN201110194007A CN102283677B CN 102283677 B CN102283677 B CN 102283677B CN 201110194007 CN201110194007 CN 201110194007 CN 201110194007 A CN201110194007 A CN 201110194007A CN 102283677 B CN102283677 B CN 102283677B
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Abstract
The invention relates to an ultrasound array sound head and a production method thereof. The ultrasound array sound head comprises a piezoelectric piece, a radiator and a backing block, wherein the radiator comprises a basal body, one end of the basal body is provided with a cooling fin, and the other end of the basal body is provided with a heat transfer piece which is adjacent to the piezoelectric piece; and the backing block is arranged between the piezoelectric piece and the heat transfer piece, the heat transfer piece is inserted into the backing block, and the backing block is made from insulation heat conduction materials. The ultrasound array sound head has the advantage of higher heat radiation efficiency.
Description
[technical field]
The present invention relates to a kind of supersonic array sound head and preparation method thereof.
[background technology]
Because the critical material of medical ultrasonic array probe is piezoelectric.Piezoelectric existence sound, electricity when work transform incomplete situation, and energy is transformed into heat energy so have greatly.If heat energy not as soon as possible, will be produced several disadvantageous results by dissipating effectively: the surface temperature that causes on the one hand the probe acoustic lens raises, allow the patient feel under the weather even scald, on the other hand, can cause that internal temperature sharply rises, gently then cause the distortion of matching layer and backing piece, heavy then cause between matching layer and piezoelectric, come unstuck between backing piece and piezoelectric, and probe performance is descended, the lost of life.Medical ultrasound linear array and protruding array ultrasonic probe same time of array element are part array element participation work, and their fever phenomenon is also not obvious.Yet each array element of phased array supersonic probe and acoustic radiation force ultrasonic array probe will participate in simultaneously for a long time emission and receive.Therefore their heatings when work are very serious.Therefore the manufacturer of ultrasonic probe develops various supersonic array sound heads one after another in order that heat energy is dissipated, and to guarantee that surface temperature of probe in use is no more than 43 ℃, prolongs sound head service life.
The structure of traditional supersonic array sound head comprises backing piece and the radiating block of being located on the piezoelectric.Radiating block is that metal material is made, and it has thermal conductive resin.Yet itself is not Heat Conduction Material for the backing piece, thereby affects conduction velocity and the efficient of heat.In addition, if be simple contacting between backing piece and the radiating block, then will have air to exist and the two between, and air is the non-conductor of heat, this also can affect the conduction efficiency of heat energy between backing piece and the radiating block.
[summary of the invention]
Based on this, be necessary to provide higher supersonic array sound head of a kind of radiating efficiency and preparation method thereof.
A kind of supersonic array sound head comprises:
Piezoelectric patches;
Radiator, described radiator comprises matrix, and an end of described matrix is provided with fin, and the other end of described matrix is provided with the heat transfer sheet adjacent with described piezoelectric patches; And
The backing piece, described backing piece is located between described piezoelectric patches and the described heat transfer sheet, and described heat transfer sheet is inserted into the inside of described backing piece, and described backing piece is made by insulating heat-conduction material.
In a preferred embodiment, described backing piece comprises epoxy resin and the non-metal powder filler that is dispersed in the described epoxy resin.
In a preferred embodiment, to account for the mass percent of the mixture of epoxy resin and non-metal powder filler be 40%～80% to described non-metal powder filler.
In a preferred embodiment, described non-metal powder filler is at least a in alumina powder, aluminum nitride powder, beryllium oxide powder, boron nitride powder, carborundum powder, magnesia powder, oxide powder and zinc, the powdered quartz powder.
In a preferred embodiment, described fin is grid shape.
In a preferred embodiment, the quantity of described heat transfer sheet is two, and described two heat transfer sheets are parallel to each other.
In a preferred embodiment, the terminal distance with described piezoelectric patches of described heat transfer sheet greater than 3mm less than 10mm.
A kind of preparation method of supersonic array sound head is characterized in that, may further comprise the steps:
Anchor clamps are provided, and described anchor clamps comprise: base plate, front apron, backboard, right baffle-plate and right baffle plate, and described base plate, front apron, backboard, right baffle-plate and right baffle rings are around forming a host cavity;
Described piezoelectric patches is placed on the base plate in the described host cavity;
Described radiator is fixed on the described anchor clamps, and makes described heat transfer sheet adjacent with described piezoelectric patches;
Back lining materials is poured in the described host cavity, and make described back lining materials wrap up described heat transfer sheet, solidify described back lining materials and form described backing piece; And
Dismantle described anchor clamps, obtain described supersonic array sound head.
In a preferred embodiment, described back lining materials is formed by epoxy resin and the mixing of non-metal powder uniform filling.
In a preferred embodiment, to account for the mass percent of described back lining materials be 40%～80% to described non-metal powder filler.
In a preferred embodiment, described non-metal powder filler is at least a in alumina powder, aluminum nitride powder, beryllium oxide powder, boron nitride powder, carborundum powder, magnesia powder, oxide powder and zinc, the powdered quartz powder.
In a preferred embodiment, the preparation method of described back lining materials comprises the steps:
The mass percent that accounts for the mixture of epoxy resin and non-metal powder filler according to the non-metal powder filler is that 40%～80% ratio takes by weighing epoxy resin and non-metal powder filler;
Described non-metal powder filler is joined in the above-mentioned epoxy resin, fully mix, described non-metal powder uniform filling is scattered in the described epoxy resin;
Said mixture is poured in the container, put into the vacuum tank evacuation.
In a preferred embodiment, described piezoelectric patches is sticked on the base plate in the described host cavity by wax.
Above-mentioned supersonic array sound head has the backing piece of being made by insulating heat-conduction material, thereby it is more more remarkable than generally not having the capacity of heat transmission of back lining materials of heat conduction function.In addition, the above-mentioned heat transfer sheet that is positioned at radiator one end is deep into the inside of backing piece, can be directly delivered to heat energy inner in the sound head on the fin of radiator to dissipate.Thereby it is not high that this invention can solve in the prior art radiating efficiency effectively, the problem that radiating rate is fast not.
[description of drawings]
By the more specifically explanation of the preferred embodiments of the present invention shown in the accompanying drawing, above-mentioned and other purpose of the present invention, Characteristics and advantages will be more clear.Reference numeral identical in whole accompanying drawings is indicated identical part.Deliberately do not draw accompanying drawing by actual size equal proportion convergent-divergent, focus on illustrating purport of the present invention.
Fig. 1 is the schematic perspective view of the supersonic array sound head of an embodiment;
Fig. 2 is the schematic perspective view of radiator among Fig. 1;
Fig. 3 is the piezoelectric patches of an embodiment and the schematic perspective view of base plate;
Schematic diagram when Fig. 4 is the assembling of the anchor clamps of an embodiment and radiator;
Fig. 5 is schematic diagram after the assembling of the anchor clamps of an embodiment and radiator;
Fig. 6 is the schematic diagram when pouring back lining materials into after the assembling of the anchor clamps of an embodiment and radiator.
[specific embodiment]
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with accompanying drawing the specific embodiment of the present invention is described in detail.A lot of details have been set forth in the following description so that fully understand the present invention.But the present invention can implement much to be different from alternate manner described here, and those skilled in the art can be in the situation that do similar improvement without prejudice to intension of the present invention, so the present invention is not subjected to the restriction of following public implementation.
Secondly, the present invention utilizes schematic diagram to be described in detail, when the embodiment of the invention is described in detail in detail; for ease of explanation; the profile of expression device architecture can be disobeyed general ratio and be done local the amplification, and described schematic diagram is example, and it should not limit the scope of protection of the invention at this.The three-dimensional space that in actual fabrication, should comprise in addition, length, width and the degree of depth.
See also Fig. 1, the supersonic array sound head 100 of an embodiment comprises radiator 10, piezoelectric patches and backing piece 30.
See also Fig. 2, radiator 10 is made by metal material, and it comprises matrix 11, fin 13 and heat transfer sheet 15.
See also Fig. 3, piezoelectric patches 20 is roughly square plate, and it is made by piezoelectric.The distance of the end of piezoelectric patches 20 and heat transfer sheet 15 is greater than 3mm and less than 10mm.If less than 3mm, may there be electrical safety hidden danger.Because the Voltage Peak peak value that adds between the electrode of ultrasonic probe can reach 200 volts, and the array element surface is generally conductive electrode, conducting strip is by also conducting electricity that metallic aluminium is made, and in order to prevent voltage breakdown, is greater than 3mm.
Described non-metal powder filler is at least a in alumina powder, aluminum nitride powder, beryllium oxide powder, boron nitride powder, carborundum powder, magnesia powder, oxide powder and zinc, the powdered quartz powder.
The formulation selection principle of backing piece 30 is as follows: in the situation that flowability allows, the shared ratio of non-metal powder filler should be large as much as possible, the heat conduction particle is contacted with each other and forms the heat conduction chain.If the amount of the non-metal powder filler that adds very little, but not metal powder filler is evenly distributed in the epoxy resin and does not contact each other.Do not work the effect that increases heat conduction with regard to being difficult to form the heat conduction chain.When constantly adding powder filler to some values, the filler interaction forms chain and netted form in system, just greatly improve the heat conductivility of system when the differently-oriented directivity of these heat conduction network chains is parallel with direction of heat flow.So, in the situation that flowability allows, increase as much as possible the ratio of non-metal powder filler with formation heat conduction chain, and then increase the heat-conducting effect of system.
Preferably, to account for the mass percent of the mixture of epoxy resin and non-metal powder filler be 40%～80% to the non-metal powder filler.
Above-mentioned supersonic array sound head 100 has the backing piece 30 of being made by insulating heat-conduction material, thereby it is more more remarkable than generally not having the capacity of heat transmission of back lining materials of heat conduction function.In addition, the above-mentioned heat transfer sheet 15 that is positioned at radiator 10 1 ends is deep into the inside of backing piece 30, can be directly delivered to heat energy inner in the sound head on the fin 13 of radiator 10 to dissipate.And the lattice-shaped fin 13 that the present invention proposes can be larger than the area of dissipation of general radiator.Thereby it is not high that this invention can solve in the prior art radiating efficiency effectively, the problem that radiating rate is fast not.
The application also provides the preparation method of the supersonic array sound head 100 of an embodiment, comprises the steps.
Step S101, provide the anchor clamps 200 of a special use.
See also Fig. 4, anchor clamps 200 comprise base plate 201, front apron 202, backboard 203, right baffle-plate 204 and right baffle plate 205.Base plate 201, front apron 202, backboard 203, right baffle-plate 204 and right baffle plate 205 are around forming a host cavity 206.
Please again consult Fig. 3, base plate 201 is roughly square, and its surface is provided with a square fixed block 211.The size of fixed block 211 is identical with piezoelectric patches 20.
Step S102, piezoelectric patches 20 is placed on the base plate 201 in the host cavity 206.
In the present embodiment, can piezoelectric patches 20 be sticked on the fixed block 211 of base plate 201 by wax.
Step S103, radiator 10 is fixed on the anchor clamps, and makes heat transfer sheet 15 adjacent with piezoelectric patches 20.
See also Fig. 5, in the present embodiment, radiator 10 can be fixed on front apron 202 and the backboard 203 by two pressing plates 207.At this moment, the distance of the end of heat transfer sheet 15 and piezoelectric patches 20 is greater than 3mm and less than 10mm.
Step S104, see also Fig. 6, back lining materials 31 is poured in the host cavity 206, and make back lining materials 31 parcel heat transfer sheets 15, then solidify back lining materials 31 and form backing pieces 30.
Wherein, the back lining materials 31 that is the mucus attitude is accounted for back lining materials take the non-metal powder filler by epoxy resin and non-metal powder filler mass percent is uniformly mixed to form as 40%～80% ratio.Described non-metal powder filler is at least a in alumina powder, aluminum nitride powder, beryllium oxide powder, boron nitride powder, carborundum powder, magnesia powder, oxide powder and zinc, the powdered quartz powder.
Concrete, the preparation method of back lining materials 31 comprises the steps:
Step S1041, the mass percent that accounts for the mixture of epoxy resin and non-metal powder filler according to the non-metal powder filler are that 40%～80% ratio takes by weighing epoxy resin and non-metal powder filler.
Step S1042, described non-metal powder filler is joined in the epoxy resin, fully mix, the non-metal powder uniform filling is scattered in the epoxy resin.
Described epoxy resin can be single-component epoxy glue, also can be bi-component epoxy, and it both can be normal temperature cure, also can be the epoxy resin of hot setting.If two component epoxy glue must mix first rear abundant stirring, two components are fully evenly mixed.
If the non-metal powder filler is single can directly joining in the above-mentioned epoxy resin.If the non-metal powder filler is comprised of several different materials, then to fully mix after out by the prescription scale.And then join in the epoxy resin, fully stir, powder filler is evenly spread in the epoxy resin.
Step S1043, said mixture is poured in the container, put into the vacuum tank evacuation.
The homogeneous mixture that contains epoxy resin and non-metal powder filler is poured in the larger clean container of opening, put into the vacuum tank evacuation.The glass that sees through vacuum tank hopes into when the bubble that can see mix surface is for a long time just emerged, and can think that mixture inside is close to vacuum during the negligible amounts of emerging.
The mixture of the epoxy resin that exhausts vacuum and non-metal powder filler (being back lining materials 31) is gently poured in the anchor clamps, until the position of appointment.As shown in Figure 6.Then place at normal temperatures and solidify, want long enough hardening time, so that epoxy resin solidifies fully, form backing piece 30.In the solidification process, back lining materials 31 can fill up the gap between piezoelectric patches 20 and the heat transfer sheet 15, and can make radiator 10, piezoelectric patches and backing piece 30 form inseparable one state.
Step S105, clamper for disassembling 200 obtain supersonic array sound head 100.
By rotating a plurality of screws, base plate 201, front apron 202, backboard 203, right baffle-plate 204 and right baffle plate 205 are separated, thereby obtain supersonic array sound head 100 as shown in Figure 1.Because piezoelectric patches 20 is to stick on the fixed block 211 of base plate 201 by wax, therefore can adopt heating or additive method that piezoelectric patches 20 is separated with base plate 201.
The advantages such as above-mentioned preparation method has easy to operate, and cost is lower.
What be appreciated that radiator 10 can also be provided with heat pipe on every side.Can also pass into recirculated cooling water in the heat pipe and strengthen heat radiation.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (6)
1. the preparation method of a supersonic array sound head, the supersonic array sound head comprises piezoelectric patches; Radiator, described radiator comprises matrix, and an end of described matrix is provided with fin, and the other end of described matrix is provided with the heat transfer sheet adjacent with described piezoelectric patches; Matrix also outwards vertically extends to form four spacers near the position of heat transfer sheet, and backing piece, described backing piece is located between described piezoelectric patches and the described heat transfer sheet, and described heat transfer sheet is inserted into the inside of described backing piece, described backing piece is made by insulating heat-conduction material, it is characterized in that, may further comprise the steps:
Anchor clamps are provided, and described anchor clamps comprise: base plate, front apron, backboard, right baffle-plate and right baffle plate, and described base plate, front apron, backboard, right baffle-plate and right baffle rings are around forming a host cavity; Base plate is square, backplate surface is provided with a square fixed block, fixedly block size is identical with piezoelectric patches, front apron, backboard, right baffle-plate and four baffle plates of right baffle plate all are fixed by screws on the base plate, right baffle-plate has relative inclined plane with right baffle plate, anchor clamps also comprise two pressing plates, and the effect of pressing plate is that four spacers with matrix are fixed by screws on front apron and the backboard;
Described piezoelectric patches is placed on the base plate in the described host cavity, piezoelectric patches is sticked on the fixed block of base plate by wax;
Described radiator is fixed on the described anchor clamps, and makes described heat transfer sheet adjacent with described piezoelectric patches;
Back lining materials is poured in the described host cavity, and make described back lining materials wrap up described heat transfer sheet, solidify described back lining materials and form described backing piece; And
Dismantle described anchor clamps, obtain described supersonic array sound head.
2. the preparation method of supersonic array sound head as claimed in claim 1 is characterized in that: described back lining materials is mixed by epoxy resin and non-metal powder uniform filling and forms.
3. the preparation method of supersonic array sound head as claimed in claim 2, it is characterized in that: the mass percent that described non-metal powder filler accounts for described back lining materials is 40% ~ 80%.
4. the preparation method of supersonic array sound head as claimed in claim 2 is characterized in that: described non-metal powder filler is at least a in alumina powder, aluminum nitride powder, beryllium oxide powder, boron nitride powder, carborundum powder, magnesia powder, oxide powder and zinc, the powdered quartz powder.
5. the preparation method of supersonic array sound head as claimed in claim 1, it is characterized in that: the preparation method of described back lining materials comprises the steps:
The mass percent that accounts for the mixture of epoxy resin and non-metal powder filler according to the non-metal powder filler is that 40% ~ 80% ratio takes by weighing epoxy resin and non-metal powder filler;
Described non-metal powder filler is joined in the above-mentioned epoxy resin, fully mix, described non-metal powder uniform filling is scattered in the described epoxy resin;
Said mixture is poured in the container, put into the vacuum tank evacuation.
6. the preparation method of supersonic array sound head as claimed in claim 1 is characterized in that: described piezoelectric patches is sticked on the base plate in the described host cavity by wax.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110194007 CN102283677B (en) | 2011-07-12 | 2011-07-12 | Production method of ultrasound array sound head |
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|---|---|---|---|
| CN 201110194007 CN102283677B (en) | 2011-07-12 | 2011-07-12 | Production method of ultrasound array sound head |
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| CN102283677A CN102283677A (en) | 2011-12-21 |
| CN102283677B true CN102283677B (en) | 2013-04-17 |
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| CN 201110194007 Expired - Fee Related CN102283677B (en) | 2011-07-12 | 2011-07-12 | Production method of ultrasound array sound head |
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Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103565493B (en) * | 2012-07-26 | 2015-08-12 | 纳米新能源（唐山）有限责任公司 | Nanoscale ultrasonic vibrator |
| WO2014069500A1 (en) | 2012-10-31 | 2014-05-08 | 日立アロカメディカル株式会社 | Ultrasonic probe |
| CN103300889B (en) * | 2013-05-17 | 2015-04-29 | 深圳市理邦精密仪器股份有限公司 | Ultrasonic array probe signal acquisition component and preparation method thereof, and probe |
| CN104551510B (en) * | 2013-10-12 | 2016-04-13 | 深圳先进技术研究院 | Wide-angle piezoelectric ceramic piece spot welding processing jig |
| CN104972259B (en) * | 2014-04-10 | 2017-01-25 | 深圳先进技术研究院 | Spot welding machining fixture for large-angle piezoelectric ceramic piece |
| CN105632482B (en) * | 2014-12-01 | 2019-08-09 | 中科绿谷（深圳）医疗科技有限公司 | Deep brain stimulation and neuromodulation ultrasound face array transducer heat dissipation backing and preparation method |
| CN106039603B (en) * | 2016-06-30 | 2019-01-22 | 深圳先进技术研究院 | Cooling means, ultrasonic transducer and its system of ultrasonic transducer |
| CN106821415A (en) * | 2016-12-27 | 2017-06-13 | 吴中区穹窿山德毅新材料技术研究所 | A kind of High Precision Automatic ultrasonic probe of electric motor type |
| CN111067564B (en) * | 2018-10-19 | 2024-03-19 | 深圳迈瑞生物医疗电子股份有限公司 | Backing block of ultrasonic area array probe, ultrasonic area array probe and ultrasonic diagnostic imaging equipment |
| CN109513598B (en) * | 2018-12-28 | 2023-09-19 | 深圳先进技术研究院 | Backing structure, manufacturing method of backing structure and ultrasonic transducer |
| CN111135485A (en) * | 2020-02-24 | 2020-05-12 | 南京广慈医疗科技有限公司 | Heat dissipation backing for high-power focusing probe and manufacturing method thereof |
| CN111867324B (en) * | 2020-06-30 | 2023-04-14 | 北京卫星制造厂有限公司 | Heat radiation structure suitable for spacecraft high-power device |
| CN112957069A (en) * | 2021-01-29 | 2021-06-15 | 中科绿谷（深圳）医疗科技有限公司 | Ultrasonic transducer |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU544464B2 (en) * | 1982-12-27 | 1985-05-30 | Tokyo Shibaura Denki Kabushiki Kaisha | Ultrasonic transducer |
| JP3420954B2 (en) * | 1998-12-14 | 2003-06-30 | 松下電器産業株式会社 | Ultrasonic probe |
| JP4624659B2 (en) * | 2003-09-30 | 2011-02-02 | パナソニック株式会社 | Ultrasonic probe |
| CN1969763A (en) * | 2004-06-15 | 2007-05-30 | 株式会社东芝 | Acoustic backing composition, ultrasonic probe, and ultrasonic diagnostic apparatus |
| US7105986B2 (en) * | 2004-08-27 | 2006-09-12 | General Electric Company | Ultrasound transducer with enhanced thermal conductivity |
| JP4171038B2 (en) * | 2006-10-31 | 2008-10-22 | 株式会社東芝 | Ultrasonic probe and ultrasonic diagnostic apparatus |
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