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CN102237371A - Semiconductor device comprosing a field-effect transistor in a silicon-on-insulator structure - Google Patents

Semiconductor device comprosing a field-effect transistor in a silicon-on-insulator structure Download PDF

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CN102237371A
CN102237371A CN2011100994634A CN201110099463A CN102237371A CN 102237371 A CN102237371 A CN 102237371A CN 2011100994634 A CN2011100994634 A CN 2011100994634A CN 201110099463 A CN201110099463 A CN 201110099463A CN 102237371 A CN102237371 A CN 102237371A
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dielectric
semiconductor
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seoi
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CN102237371B (en
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卡洛斯·马祖拉
理查德·费朗
比什-因·阮
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Soitec SA
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Soitec SA
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    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/823462—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate insulating layers, e.g. different gate insulating layer thicknesses, particular gate insulator materials or particular gate insulator implants
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    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
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    • H01L21/823481—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type isolation region manufacturing related aspects, e.g. to avoid interaction of isolation region with adjacent structure
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    • H01L21/8232—Field-effect technology
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    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
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    • H01L27/1207—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI combined with devices in contact with the semiconductor body, i.e. bulk/SOI hybrid circuits
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    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
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Abstract

The present invention relates to a semiconductor device, comprising a semiconductor-on-insulator, SeOI, structure comprising a substrate, an oxide layer on the substrate and a semiconductor layer on the oxide layer; with a field-effect-transistor, FET, wherein the FET comprises a channel region in the substrate; a dielectric being at least a part of the oxide layer of the SeOI structure; and a gate at least partially being a first part of the semiconductor of the SeOI structure.

Description

The semiconductor device that comprises the field-effect transistor in the silicon on insulated substrate body
Technical field
The present invention relates to the manufacturing of the field-effect transistor in the silicon on insulated substrate body, but in particular to the System on Chip/SoC (system-on-chip) of the field-effect transistor of the intensive assembling that comprises the sharing functionality district.
Background technology
Semiconductor-on-insulator (SeOI), particularly silicon-on-insulator (SOI) semiconductor device is in the current and following semiconductor is made, and is for example in the situation of CMOS (Complementary Metal Oxide Semiconductor) (CMOS) technology, more and more noticeable.In modern integrated circuits, on the single-chip zone, form the many separate circuit elements of numbers of poles, for example field-effect transistor, resistor and the capacitor etc. of CMOS, NMOS, PMOS element form.Usually, along with the introducing of the circuit of each Dai Xin, the characteristic size of these circuit elements constantly reduces, thus the existing integrated circuit of the performance improvement of the speed of being provided at and/or energy consumption aspect.Reducing of transistor size is an importance of constantly improving in the device performance of complicated integrated circuit (as CPU).The minimizing of size brings the raising of break-make speed usually, thus the enhancing signal handling property.
Utilize the CMOS technology to make in the process of complicated integrated circuit, millions of transistors (that is, n-channel transistor and p-channel transistor) are formed on the substrate that comprises crystalline semiconductor layer.Transistor unit is the main circuit element in the high complexity integrated circuit, and the high complexity integrated circuit has determined the overall performance of these devices substantially.
No matter considered it is n-channel transistor or p-channel transistor, MOS transistor all comprises so-called pn knot, and described pn knot is formed by the drain electrode of high doped and the source area interface with the channel region that is arranged on contra-doping mutually between drain region and the source area or weak doping.The conductivity of channel region, that is, the current drive capability of conductive channel is by forming near channel region and controlling with the gate electrode that thin dielectric layer separates with it.Owing to gate electrode being applied suitable control voltage and forms conductive channel, the conductivity of channel region depends on the mobility of concentration of dopant, most of charge carriers, and for the given extension of channel region in the transistor width direction, described conductivity also depends on the distance between source area and the drain region, and this distance is also referred to as passage length.
Owing to the reduction of size of circuit, not only can increase the performance of each transistor unit, can also improve its packaging density, thereby the possibility of introducing greater functionality in given chip area is provided.For this reason, developed the circuit of high complexity, the circuit of this high complexity can comprise dissimilar circuit, for example analog circuit and digital circuit etc., thus whole system (SoC) is provided on single-chip.
Yet constantly dwindling of transistor size related to a plurality of relative problems, must address these problems the benefit that can exceedingly not offset constantly reducing of MOS transistor passage length and obtain.A subject matter of this respect provides low lamella and the contact resistance rate (low sheet and contact resistivity) in drain region and source area and the connected any contact, and keeps the passage controllability.For example, the electric capacity coupling that reducing passage length may increase between grid and the channel region joins, and this may need the gate insulation layer of littler thickness.Current, the thickness of silica-based gate insulation layer is 1 nanometer～2 nanometers, and wherein further reducing thickness may be more undesirable with regard to leakage of current, and leakage of current is the index rising usually when gate dielectric thickness reduces.
Yet, be usually used in making the gate dielectric of gate electrode and the interface feature of polysilicon is to influence even dopant distribution and causes relatively poor tack and the crystal boundary of reliability variation.In addition, although consider constantly reducing and engineering science progress to some extent recently of size of circuit, still need the transistor unit with different performance of tightr structure.
Based on foregoing, the disclosure relates to the manufacture method of semiconductor device and wherein transistor can be with the formation of space effective and efficient manner and at the improved semiconductor device of character aspect gate dielectric-gate electrode interface.
Summary of the invention
In order to achieve the above object, provide a kind of semiconductor device as claimed in claim 1, described semiconductor device comprises
Semiconductor-on-insulator, particularly silicon-on-insulator soi structure body, described structure contain semiconductor layer, the particularly monocrystalline silicon layer on substrate, described on-chip oxide skin(coating) (BOX layer) and the described oxide skin(coating); And
Field-effect transistor FET, wherein said FET comprises
Channel region in the described substrate;
Dielectric as at least a portion of the described oxide skin(coating) of described semiconductor-on-insulator structure body; With
At least in part as the grid of the first of the semiconductor layer of described semiconductor-on-insulator structure body.
In an embodiment, described dielectric is a gate dielectric, and the gate electrode of the polysilicon layer that described grid are gate electrodes, particularly can also comprise, described polysilicon layer is in the first of semiconductor layer (for example, monocrystalline silicon layer) of the semiconductor-on-insulator structure body (for example soi structure body) that forms described grid at least in part.
Hereinafter, the soi structure body that description is comprised single crystalline layer.But, it should be understood that the present invention can contain any semiconductor-on-insulator structure body that is not limited to silicon.
Therefore according to the present invention, provide the FET that has gate dielectric, the form of described gate dielectric is the part of the initial BOX layer of soi structure body, and described in addition FET has at least in part the gate electrode that the part by the monocrystalline silicon layer of soi structure body forms.Thus, the electrode characteristic (in this area, only polysilicon being used for grid material usually) of the improvement that causes owing to monocrystalline silicon is provided, and has significantly improved the material character at interface between dielectric and the gate electrode.In this area, between gate electrode and gate dielectric, polysilicon-oxide interface is set.According to the present invention, between gate electrode and gate dielectric, monocrystalline silicon-oxide interface is set, the crystal boundary of having avoided causing non-homogeneous dopant distribution thus and having influenced the transistorized long-time running reliability of high-performance, and help the VT variability.Therefore, the transistor that is provided is very suitable for high voltage applications, for example uses in the situation of RF equipment and Electrostatic Discharge protection.
In another embodiment, FET is floating grid FET, and dielectric is that tunnel dielectric and grid are floating grids.Floating grid FET can also comprise gate dielectric on the floating grid and the gate electrode on the gate dielectric (particularly polysilicon make gate electrode).Equally, can be provided with monocrystalline silicon-oxide interface this moment between floating grid and tunnel dielectric.Compare with conventional polysilicon-oxide interface, monocrystalline silicon-oxide interface causes the improvement to electric charge/data maintenance.Therefore, this execution mode is particularly suitable for making high voltage FLASH memory device.The manufacturing of floating grid FET is compatible with the manufacturing of following FET: this FET comprises as the part of the BOX layer of gate dielectric and the gate electrode made by above-mentioned monocrystalline silicon at least in part.
Should be noted that in above-mentioned example for example, the substrate of soi structure body can be that polycrystalline silicon substrate and BOX layer can provide with the silicon dioxide layer form.The soi structure body can pass through SMARTCUT
Figure BDA0000056388070000031
Technology obtains.
The above-mentioned example of FET of the present invention is particularly suitable for being incorporated into SOI altogether with conventional bulk crystals pipe and goes up (MOSFET).Therefore, can also comprise another FET according to the semiconductor device of an example in the above-mentioned example, described FET comprises the channel region and the source electrode-drain region of making by the second portion of the silicon layer of soi structure body.In addition, other FET can be included in the dielectric layer that forms on the channel region, particularly contain the dielectric layer of low-k materials and be formed on grid metal level on this gate dielectric layer, and described channel region is arranged in the monocrystalline silicon layer of SOI.
According to an execution mode, the first of the silicon layer of soi structure body is different from the second portion of the silicon layer of soi structure body, and insulator region, particularly shallow channel isolation area are set divide with other FET that comprise the channel region made by the second portion of the monocrystalline silicon layer of soi structure body and source electrode-drain region and open comprising dielectric FET of being made by the part of the oxide skin(coating) of soi structure body.As selection, the second portion of the monocrystalline silicon layer of the first of the monocrystalline silicon layer of soi structure body and soi structure body is overlapped at least in part.Particularly, the first of the monocrystalline silicon layer of soi structure body (serve as and be used for the transistorized grid of the present invention) can form source electrode or the drain region of other (routines) FET at least in part.
In both cases, the technological process of transistor manufacturing all is easy to two kinds of transistor devices are integrated altogether.When the first of the monocrystalline silicon layer of soi structure body formed the source electrode of his FET or drain region at least in part, the minimized structure very closely of requisite space just appearred making.
In addition, semiconductor device can comprise and contain the dielectric FET, the conventional MOSFET that separates with this FET that are made by the part of the oxide skin(coating) of soi structure body and the other conventional MOSFET with source electrode or drain region, and source electrode or the drain region of described other conventional MOSFET is shared with the grid that contain the dielectric FET of the present invention that is made by the part of the oxide skin(coating) of soi structure body.
In order to achieve the above object, the present invention also provides the manufacture method of semiconductor device, and described method comprises:
Silicon-on-insulator soi structure body is provided, and described structure contains the monocrystalline silicon layer on substrate, described on-chip oxide skin(coating) and the described oxide skin(coating);
Thereby form the polysilicon on the polysilicon layer acquisition soi structure body on the described monocrystalline silicon layer; With
Polysilicon on the described soi structure body is carried out etching, thereby form FET, gate dielectric that described FET comprises channel region in the described substrate, made by the part of the oxide skin(coating) of soi structure body and the gate electrode of making by the part of the polysilicon layer that forms on the first of the monocrystalline silicon layer of soi structure body and the monocrystalline silicon layer at least in part.Can carry out etching based on formation and patterned photoresist on the polysilicon layer on the soi structure body.
And hereinafter,, the execution mode of the inventive method has been described, the semi-conducting material that can use any other to be fit in principle with reference to the soi structure body that on buried-oxide layer, comprises monocrystalline silicon layer.Therefore, should be understood that, the present invention includes the semiconductor-on-insulator structure body, for example, on oxide skin(coating), comprise the semiconductor-on-insulator structure body of germanium or silicon-germanium, and be not limited to the soi structure body.
Described method can also may further comprise the steps:
On described soi structure body, form mask layer;
By extending to substrate and the described mask layer that the second area of the first area of soi structure body and soi structure body separates being formed shallow channel isolation area;
Remove described mask layer from the second area of described soi structure body;
On the second area of described soi structure body, form dielectric layer subsequently;
On described dielectric layer, form metal level; With
Remove described mask layer from the first area of described soi structure body; With
Described metal level in the described second area of etching, described dielectric layer and described soi structure body, thus MOSFET in the second area of described soi structure body formed; And wherein
Form polysilicon layer on the described monocrystalline silicon layer in the first area of described soi structure body, thereby obtaining polysilicon on the soi structure body He on the described metal level.
Can easily realize common integration with conventional MOSFET.Therefore, can also comprise the manufacturing of the MOSFET on the soi structure body according to the method for above-mentioned example, described manufacturing may further comprise the steps:
On the monocrystalline silicon layer of described soi structure body, form gate dielectric;
On described gate dielectric, form gate electrode; With
Form source area and drain region, thereby one of source area and drain region are formed by at least a portion of described gate electrode at least in part, at least a portion of described gate electrode is made by the first of the monocrystalline silicon layer of described soi structure body at least in part.
In addition, provide a kind of method of making semiconductor device, described method comprises:
Silicon-on-insulator soi structure body is provided, and described structure contains the monocrystalline silicon layer on substrate, described on-chip oxide skin(coating) and the described oxide skin(coating);
On described monocrystalline silicon layer, form dielectric layer;
On described dielectric layer, form polysilicon layer, thereby obtain multilayer structure making; With
Described multilayer structure making is carried out etching, thereby form floating grid FET, the tunnel dielectric that described floating grid FET comprises channel region in the described substrate, made by the part of the oxide skin(coating) of described soi structure body, the floating grid of making by the first of the monocrystalline silicon layer of described soi structure body, the gate dielectric of making by a part that is formed at the dielectric layer on the described monocrystalline silicon layer and the gate electrode that comprises a part that is formed at the polysilicon layer on the described dielectric layer.
Equally, can carry out etching step based on formation and patterned photoresist on the polysilicon layer on the soi structure body.
Comprise that forming transistorized this method of floating grid can also may further comprise the steps:
On described soi structure body, form mask layer;
Form shallow channel isolation area by the described mask layer that extends to substrate and the second area of the first area of soi structure body and soi structure body is separated;
Remove described mask layer from the second area of described soi structure body;
On the second area of described soi structure body, form dielectric layer subsequently;
Form metal level at other dielectric layers;
Remove described mask layer from the first area of described soi structure body; With
Described metal level in the described second area of etching, described other dielectric layers and described soi structure body, thus MOSFET in the second area of described soi structure body formed; And wherein
On described monocrystalline silicon layer, form dielectric layer, and on described dielectric layer, form polysilicon layer, thus the multilayer structure making in the first area of acquisition soi structure body.
Equally, can easily realize common integration with conventional MOSFET.Therefore, according to the relating to the transistorized method of floating grid and can also be included on the soi structure body and make MOSFET of above-mentioned example, described manufacturing may further comprise the steps:
On the monocrystalline silicon layer of described soi structure body, form gate dielectric;
On described gate dielectric, form gate electrode; With
Form source area and drain region, thereby one of source area and drain region are formed by at least a portion of described floating grid at least in part, at least a portion of described floating grid is made by the first of the monocrystalline silicon layer of described soi structure body at least in part.
In the above-mentioned example of semiconductor device of the present invention and method, relate to the soi structure body.Described soi structure body can have the BOX layer that thickness changes to some extent.Especially, can change the thickness of BOX layer, with the dielectric layer that is suitable for high-performance fet or the tunnel dielectric of floating grid FET.
Can obtain to have the soi structure body of the BOX layer that thickness changes to some extent by following steps:
Provide soi layer to fold body, described duplexer comprises first (two) silicon oxide layer on substrate layer, the described substrate layer and the monocrystalline silicon layer on described first (two) silicon oxide layer;
Form second oxide skin(coating) on the described monocrystalline silicon layer and the mask layer on described second oxide skin(coating);
Thereby described second oxide skin(coating) and described mask layer are carried out the first that patterning exposes described monocrystalline silicon layer;
Resulting structure is carried out annealing operation, the part of first (two) silicon oxide layer under the first that is exposed of described monocrystalline silicon layer is partly dissolved, thereby obtain thinning (two) silicon oxide layer; With
Remove described second oxide skin(coating) and described mask layer.
Thinning (two) silicon oxide layer can serve as dielectric layer or the tunnel dielectric in the above-mentioned example of the present invention subsequently, be the oxide skin(coating) part of described soi structure body, the described gate dielectric or the dielectric of floating are made by at least a portion of described thinning (two) silicon oxide layer.
Can contain Ar and/or N 900 ℃～1200 ℃ temperature 2Anneal environment in carry out the high annealing operation, the part of first oxide skin(coating) under the described first thinning silicon layer is partly dissolved, thereby obtains the first thinning silicon oxide layer.
Therefore, provide following advantage synergistically: obtain to have the soi structure body of the BOX layer that thickness changes to some extent, thereby thickness that can appropriate change BOX layer is constructed in accordance respectively at the gate dielectric of FET or floating grid FET or the standard of tunnel dielectric to satisfy.
In addition, can adjust the thickness of monocrystalline silicon layer respectively at the concrete needs of reliability service gate electrode or floating grid.Especially, can form the soi structure body in the above-mentioned example, the formation of described soi structure body may further comprise the steps:
Provide soi layer to fold body, described duplexer comprises first oxide skin(coating) on substrate layer, the described substrate layer and the monocrystalline silicon layer on described first oxide skin(coating);
Form second oxide skin(coating) on the described monocrystalline silicon layer and the mask layer on described second oxide skin(coating);
Thereby described second oxide skin(coating) and described mask layer are carried out the first that patterning exposes described monocrystalline silicon layer;
Thereby make the monocrystalline silicon layer thermal oxidation that is exposed be formed on the monocrystalline silicon layer of exposure before this and the silicon oxide layer on the first thinning monocrystalline silicon layer; With
Remove described second oxide skin(coating) and described mask layer and the described silicon oxide layer that form on the monocrystalline silicon layer that exposes before this;
And the first of the silicon layer of wherein said soi structure body is at least a portion of the described first thinning monocrystalline silicon layer.
Can be at the oxygen atmosphere (O that particularly comprises 2/ H 2Or O 2/ H 2/ HCl or O 2The oxygen atmosphere of/HCl) and/or 800 ℃～1000 ℃ temperature carry out thermal oxidation processing.
Mask layer can be nitride layer, particularly silicon nitride layer, also can be the duplexer of oxide/nitride layer.The step that is used to adjust the above-mentioned example of BOX layer thickness or monocrystalline silicon layer thickness can repeat.Therefore, the method that comprises the annealing operation that is used to make the thinning of BOX layer can also may further comprise the steps: form trioxide layer and another mask layer in the first of the exposure of described monocrystalline silicon layer; Thereby the second portion of monocrystalline silicon layer is exposed described trioxide layer and other mask layer patternings; With resulting structure is carried out another annealing operation, the first thinning silicon oxide layer under the second portion that is exposed of described monocrystalline silicon layer is partly partly dissolved, thereby obtains the second thinning silicon oxide layer.
Similarly be, the method that comprises the step of thermal oxidation that is used to form the thinning monocrystalline silicon layer can also may further comprise the steps: form second mask layer on the part of silicon oxide layer, be positioned at not by a part of thermal oxidation of the first thinning silicon layer under the silicon oxide layer part of second mask layer covering with making, form another silicon oxide layer and the second thinning monocrystalline silicon layer thus.
Should be noted that especially,, carry out the dissolving that is embedded into oxide in the soi structure body comprising that STI forms and dopant injects and the further first being processed that spreads.Transition region band between the BOX layer that STI is arranged on the BOX layer of dissolving and provides at first.
Description of drawings
Additional features of the present invention and advantage will be described with reference to the accompanying drawings.In described description, with reference to the accompanying drawing that is used to explain the preferred embodiment for the present invention.It should be understood that these execution modes do not represent four corner of the present invention.
Fig. 1 a to 1g illustrates the example of method, semi-conductor device manufacturing method of the present invention, wherein forms the FET comprise as the part of the BOX layer of the soi structure body of gate dielectric.
Fig. 2 a to 2g illustrates other example of method, semi-conductor device manufacturing method of the present invention, wherein forms the floating grid FET comprise as the part of the BOX layer of the soi structure body of tunnel dielectric.
Fig. 3 illustrates the example of semiconductor device of the present invention, and described semiconductor device comprises MOSFET and is in the more FET of lower position, and wherein the described more grid of the FET of lower position that are in are also served as in the drain electrode of MOSFET.
Fig. 4 a, 4b and 4c illustrate the example of method, semi-conductor device manufacturing method of the present invention, wherein form the floating grid FET comprise as the part of the BOX layer of the soi structure body of tunnel dielectric.
Embodiment
Each stage that has shown semiconductor device manufacturing execution mode of the present invention among Fig. 1 a to 1g.The soi structure body that comprises polycrystalline silicon substrate 1, oxide skin(coating) 2 (BOX layer) (for example oxide skin(coating) of being made by silicon dioxide 2) and monocrystalline silicon layer 3 is provided.Shown in Fig. 1 b, at the grown on top or the deposited hard mask layer 4 of silicon layer 3.In the example shown, described hard mask layer comprises thin oxide layer 5 and silicon nitride layer 6.On hard mask layer 4, deposit photoresist, and this photoresist is carried out patterning to form shallow channel isolation area 7.For this reason, hard mask layer 4, silicon layer 3 and BOX layer 2 are carried out etching, extend in the substrate 1 to the gained trench portions.Then, with one or more dielectric substances (for example silicon dioxide) filling groove, and excessive dielectric is removed from the surface of mask layer 5 by chemical-mechanical graduation method.
Shown in Fig. 1 c, thereby the monocrystalline silicon layer 1 these zones is exposed from regional A and C removal hard mask layer 4.Then, on the exposure of the monocrystalline silicon layer 3 of area B and silicon nitride layer 6 and the top of shallow channel isolation area 7 (for example form high-k dielectric layer 8, electric medium constant k is greater than 3.9 dielectric layer), form metal level 9 (seeing Fig. 1 d) at the top of high-k dielectric layer 8 subsequently.For example, high-k dielectric layer 8 can be by silicon nitride or composite material (SiON, Al 2O 3, HfO 2Deng) make, metal level 9 can be made by TiN, W, TaN and ternary component (Ti-Ta-N) etc.
In the stage shown in Fig. 1 e, remove layer 8 and 9 from the area B between the shallow channel isolation area 7 and from shallow channel isolation area 7, and remove remaining mask layer 4 from the area B between the shallow channel isolation area 7.Then, shown in Fig. 1 f, deposit spathic silicon layer 10.Form the photoresist (not shown) at the top of resulting structures body, thereby and patterned in regional A, B and C etching form gate electrode (seeing Fig. 1 g).In this example, 3 FET shown in Fig. 1 g have been formed.In regional A and C, obtain the conventional MOSFET 20 on the SOI.The channel region of conventional MOSFET20 is arranged under the gate dielectric 8 of silicon layer 3.Forming source area and drain region by n known in the art or p current-carrying subtype dopant with the channel region adjacent.The gate electrode of MOSFET 20 is formed by metal level 9, and comprises through etched polycrystalline silicon material 10 ".
Form the FET of the present invention 30 that separates by channel separating zone 7 with conventional MOSFET 20.FET 30 of the present invention is characterised in that initial BOX layer 2 formed gate dielectric that are provided with in the soi structure body shown in Fig. 1 a and the gate electrode that comprises monocrystalline silicon 3 ', and described monocrystalline silicon 3 ' is formed by the initial monocrystalline silicon layer 3 that is provided with in the soi structure body shown in Fig. 1 a.Also form polysilicon layer 10 ' as the part of gate electrode.N or the P dopant adjacent with the channel region that is provided with in the substrate 1 under the gate dielectric provide source area and drain region.Compare with MOSFET 20 among Fig. 1 g with prior art, in FET of the present invention, with the BOX layer of soi structure body as gate dielectric, and with the monocrystalline silicon of soi structure body a part as gate electrode.Therefore, compared with prior art, obtained the better interface between gate dielectric (silicon dioxide) and the gate electrode (monocrystalline silicon).Thereby, can make the transistorized operation of high voltage high-performance more reliable.Should be noted in the discussion above that required character, can be arranged on the thickness BOX layer 2 littler in the area B than the thickness among regional A and the C according to gate dielectric.
Fig. 2 a and 2b illustrate another example of method, semi-conductor device manufacturing method of the present invention.According to this example, formed floating grid FET, described floating grid FET comprises as the part of the BOX layer of the soi structure body of tunnel dielectric with as the part of the monocrystalline silicon layer of the soi structure body of floating grid.Can be from the structure shown in Fig. 1 e.The exposed surface of monocrystalline silicon layer 3 carries out thermal oxidation at about 700 ℃～900 ℃, thereby for example grow oxide dielectric layer 11 (is seen Fig. 2 a).As selection, can on the exposed surface of monocrystalline silicon layer 3, grow or dielectric layer deposition 11 (for example silicon oxide layer).Then, on the metal level in regional A and C 9 and dielectric layer 11 on deposit spathic silicon layer 10.
, tectosome shown in Fig. 2 a is carried out etching, thereby form 2 MOSFET 20 among regional A and the B with reference to as described in the figure 1g as above.In addition, form the floating grid FET 40 that separates by shallow channel isolation area 7 with MOSFET 20.By above-mentioned procedure of processing, the floating grid FET 40 in the area B comprises the channel region in the substrate 1 under the tunnel dielectric 2 '.In the both sides of channel region, the suitable doping by to substrate 1 is provided with source area and drain region.In addition, floating grid FET 40 also comprises the floating grid 3 ' on the tunnel dielectric 2 '.Floating grid 3 ' is separated by gate dielectric 11 ' mutually with gate electrode 10 '.Compare with conventional floating grid FET, better monocrystalline silicon-oxide (floating grid-tunnel dielectric) interface makes that the maintenance of data can improve when this floating grid FET is used as memory device.Thereby can provide reliable high voltage FLASH device.Should be noted that the required character according to tunnel dielectric, the thickness that the BOX layer in can initial soi structure body is set in area B is lower than its thickness in regional A and C.
Fig. 2 c to 2g illustrates the alternate examples of the manufacture method of semiconductor device of the present invention.Technological process is from the structure shown in Fig. 1 c.Growth or deposition high-k dielectric layer 8 on the monocrystalline silicon layer 3 in regional A and C.Form metal gate layer 9 (seeing Fig. 2 c) at the top of high-k dielectric layer 8.Then, form thin polysilicon layer 13 on the metal gate layer 9 in regional A and C.The formation of the layer 8,9 and 13 on zone A and the C comprises: form layer and the lithographic printing step (lithographic step) by utilizing the patterned photoresist mask (not shown) of distinguishing overlay area A and C that described layer is removed from area B (with insulation layer 7) on regional A, B and the C continuously.To after area exposed is carried out etching by the photoresist mask, obtained the structure shown in Fig. 2 c.
Then, shown in Fig. 2 d, from area B, remove hard mask (5 and 6).In area B, with crystallizing silicon layer 3 oxidations that so expose, to obtain the oxide layer 11 shown in Fig. 2 e.As selection, on the crystallizing silicon layer 3 that is exposed, form dielectric layer 11.Then, shown in Fig. 2 f, deposition is used to form the polysilicon layer 10 of gate electrode.Thus, obtained similar but comprised the structure of thin polysilicon layer 13 to structure shown in Fig. 2 a.
Similar to the example shown in Fig. 2 b, photoresist mask and etching by suitable patterning obtain the structure shown in Fig. 2 f.The grid structure that is used for circuit among this structure inclusion region A, B and the C.Particularly, described grid structure comprise gate dielectric 8, grid metal level 9 and all in regional A and C through etching polysilicon gate material 10 " with through etched thin polysilicon layer 13.
As described in reference to figure 1a～1g and Fig. 2 a～2g, make transistor device of the present invention, itself and conventional SOI transistorlike are integrated altogether.Yet self-evident is to be the mode that forms conventional MOSFET 20 that do not comprise with the above-mentioned instance modification of method, semi-conductor device manufacturing method.
It is feasible not only device of the present invention and conventional bulk crystals pipe being incorporated on the SOI altogether, but also the combination of the new intensive assembling of different crystal pipe can be arranged.Shown in Figure 3 as another example according to the present invention provides the structure that comprises conventional SOI MOSFET and FET of the present invention with ad hoc fashion.According to example illustrated,, formed and comprised the gate electrode 100 that is used to form source area and drain region and the conventional MOSFET of sidewall spacers 110 according to the SOI technology.Source area and the drain region of this MOSFET is called " top source electrode " 120 and " top drain electrode " 130.Described top source area 120 and drain region 130, top form in the monocrystalline silicon layer 230 of soi structure body.Contiguous source/drain regions is provided with insulation layer 140.Make gate electrode 100 and the channel region 150 between the drain region 130 separates at top source area 120 and top by gate dielectric 160.In the example shown, in another dielectric substance 180 that covers MOSFET, form contact 170.Contact 170 for example provides and being connected of the metal interconnection body of metal layer.MOSFET marks with oval dotted outline.
Monocrystalline silicon layer 230 is positioned at the top of BOX layer 190.BOX layer 190 is positioned on the substrate 200 (for example, silicon chip 200).Yet according to example illustrated, the gate electrode that is called " low grid " of the FET that is positioned partially under the MOSFET is also served as in the drain electrode 130 of the MOSFET that is marked by oval dotted outline.The FET that is marked by oval dotted outline comprises the part of the drain electrode of serving as MOSFET 130 of monocrystalline silicon layer 230, the part of serving as gate dielectric of BOX layer 190 and drain region 210 and the source area 220 that is provided with by the suitable dopant in the substrate 200 of soi structure body.2 transistorized all source areas and drain region (thereby, and the FET bottom gate of lower position) be connected with contact 170.So, can obtain to comprise MOSFET on the SOI and the semiconductor device very closely of FET, shown in FET comprise BOX layer dielectric and monocrystalline silicon gate electrode.
Fig. 4 a to 4c illustrates the example of method, semi-conductor device manufacturing method of the present invention, has wherein formed the floating grid FET and the SOI transistor that comprise as the part of the BOX layer of the soi structure body of tunnel dielectric.
The starting point of the inventive method that this is exemplary is the duplexer shown in Fig. 1 a.Growth or dielectric layer deposition 11 on crystallizing silicon layer 3, and formation polysilicon layer 12 (is seen Fig. 4 a) on this dielectric layer 11.Thin polysilicon layer 12 serves as the protective layer of dielectric layer 11 in the further course of processing.Then, on polysilicon layer 12, form dielectric layer 5, and on this dielectric layer 5 nitride layer 6.Limit shallow channel isolation area by the lithographic printing method, groove is by layer 2,3,11,12,5 and 6 etchings and extend to polycrystalline silicon substrate 1, and fills with some dielectric substances, thereby obtains shallow trench isolation from 7.In the operation process of etched trench, layer 5 and 6 serves as hard mask.Make the dielectric substance graduation that is filled in the groove by nitride layer 6.The structure that so obtains is shown in Fig. 4 b.
The further processing similar to the processing of describing with reference to figure 1c to 1g obtains the structure shown in Fig. 4 c.Fig. 4 c with the mesozone by shallow trench isolation formation MOSFET 20 in the Zuo Qu He You districts that 7 isolate.Yet, in the mesozone, formed the floating grid FET30 of the floating grid 3 ' that is included on the tunnel dielectric 2, wherein floating grid 3 ' separates with gate electrode 10 ' with thin polysilicon layer 12 ' by gate dielectric 11 '.
And processing to the soi structure body has been described in description of drawings, generally can be according to described the inventive method processing semiconductor-on-insulator structure body.For example, in the semiconductor-on-insulator structure body, can use germanium, silicon-germanium, strained silicon, strained silicon-germanium etc., and unconventional silicon.
All above-mentioned execution modes are not used in qualification the present invention, but as the example of explaining feature and advantage of the present invention.It should be understood that part or all of above-mentioned feature also can make up by different way.

Claims (16)

1. semiconductor device, described semiconductor device comprises
Semiconductor-on-insulator SeOI structure, particularly silicon-on-insulator soi structure body, described structure contain semiconductor layer, the particularly monocrystalline silicon layer on substrate, described on-chip oxide skin(coating) and the described oxide skin(coating); And
Field-effect transistor FET, wherein said FET comprises
Channel region in the described substrate;
Dielectric, described dielectric are at least a portion of the described oxide skin(coating) of described semiconductor-on-insulator structure body; With
Grid, described grid are the first of the semiconductor layer of described semiconductor-on-insulator structure body at least in part.
2. semiconductor device as claimed in claim 1, wherein said dielectric are that gate dielectric and described grid are gate electrodes, and described gate electrode also comprises the polysilicon layer in the first of semiconductor layer of described semiconductor-on-insulator structure body especially.
3. semiconductor device as claimed in claim 1, wherein said FET are floating grid FET, and described dielectric is tunnel dielectric, and described grid are floating grids.
4. each described semiconductor device in the claim as described above, described semiconductor device also comprises another FET, and described another FET comprises channel region and the source area and the drain region of being made by the second portion of the semiconductor layer of described semiconductor-on-insulator structure body.
5. semiconductor device as claimed in claim 4, the second portion of the semiconductor layer of the first of the semiconductor layer of wherein said SeOI structure and described SeOI structure is overlapped at least in part.
6. semiconductor device as claimed in claim 5, the first of the semiconductor layer of wherein said SeOI structure forms source area or the drain region of described other FET at least in part.
7. each described semiconductor device in the claim as described above, described semiconductor device also comprises other FET, and described other FET comprises channel region and the source area and the drain region of being made by the third part of the semiconductor layer of described semiconductor-on-insulator structure body.
8. semiconductor device as claimed in claim 7, the first of the semiconductor layer of wherein said semiconductor-on-insulator structure body is different from the third part of the semiconductor layer of described semiconductor-on-insulator structure body, and described first also comprises contains insulator region, the particularly shallow channel isolation area that dielectric FET separates with described other FET with described, and described dielectric is made by the part of the oxide skin(coating) of described semiconductor-on-insulator structure body.
9. method of making semiconductor device, described method comprises
Semiconductor-on-insulator SeOI is provided structure, and described structure contains the semiconductor layer on substrate, described on-chip oxide skin(coating) and the described oxide skin(coating);
Thereby form the polysilicon on the polysilicon layer acquisition SeOI structure on the described semiconductor layer; With
Polysilicon on the described SeOI structure is carried out etching, thereby form FET, gate dielectric that described FET comprises channel region in the described substrate, made by the part of the oxide skin(coating) of described SeOI structure and the gate electrode of making by the part of the polysilicon layer that forms on the first of the semiconductor layer of SeOI structure and the described semiconductor layer at least in part.
10. method of making semiconductor device, described method comprises
Semiconductor-on-insulator SeOI is provided structure, and described structure contains the semiconductor layer on substrate, described on-chip oxide skin(coating) and the described oxide skin(coating);
On described semiconductor layer, form dielectric layer;
Thereby on described dielectric layer, form polysilicon layer and obtain multilayer structure making; With
Described multilayer structure making is carried out etching, thereby form floating grid FET, the tunnel dielectric that described floating grid FET comprises channel region in the described substrate, made by the part of the oxide skin(coating) of described SeOI structure, the floating grid of making by the first of the semiconductor layer of described SeOI structure, the gate dielectric of making by a part that is formed at the dielectric layer on the described semiconductor layer and the gate electrode that comprises a part that is formed at the polysilicon layer on the described dielectric layer.
11. method as claimed in claim 9, described method is further comprising the steps of
On described SeOI structure, form mask layer;
Form the shallow channel isolation area by described mask layer, described shallow channel isolation area extends to substrate and the first area of described SeOI structure and the second area of described SeOI structure is separated;
Remove described mask layer from the second area of described SeOI structure;
On the second area of described SeOI structure, form dielectric layer subsequently;
On described dielectric layer, form metal level; With
Remove described mask layer from the first area of described SeOI structure; With
Described metal level in the described second area of etching, described dielectric layer and described SeOI structure, thus MOSFET in the second area of described SeOI structure formed; And wherein
Form polysilicon layer on the described semiconductor layer in the first area of described SeOI structure, thereby obtaining polysilicon on the SeOI structure He on the described metal level.
12. method as claimed in claim 10, described method is further comprising the steps of
On described SeOI structure, form mask layer;
Form shallow channel isolation area by the described mask layer that extends to substrate and the second area of the first area of described SeOI structure and described SeOI structure is separated;
Remove described mask layer from the second area of described SeOI structure;
On the second area of described SeOI structure, form another dielectric layer subsequently;
On described other dielectric layers, form metal level;
Remove described mask layer from the first area of described SeOI structure; With
Described metal level in the described second area of etching, described other dielectric layers and described SeOI structure, thus MOSFET in the second area of described SeOI structure formed; And wherein
On described semiconductor layer, form dielectric layer, and on described dielectric layer, form polysilicon layer, thereby in the first area of described SeOI structure, obtain multilayer structure making.
13. method as claimed in claim 9, described method also are included on the described SeOI structure and make MOSFET, the manufacturing of described MOSFET may further comprise the steps
On the monocrystalline silicon layer of described SeOI structure, form gate dielectric;
On described gate dielectric, form gate electrode; With
Form source area and drain region, thereby one of described source area and drain region are formed by at least a portion of described gate electrode at least in part, and at least a portion of described gate electrode is made by the first of the semiconductor layer of described SeOI structure at least in part.
14. method as claimed in claim 10, described method also are included on the described SeOI structure and make MOSFET, the manufacturing of described MOSFET may further comprise the steps
On the monocrystalline silicon layer of described SeOI structure, form gate dielectric;
On described gate dielectric, form gate electrode; With
Form source area and drain region, thereby one of described source area and drain region are formed by at least a portion of described floating grid at least in part, at least a portion of described floating grid is made by the first of the silicon layer of described SeOI structure at least in part.
15., wherein provide the step of described SeOI structure to comprise as each described method in the claim 9 to 14
Provide the silicon-on-insulator soi layer to fold body, described duplexer comprises first (two) silicon oxide layer on substrate layer, the described substrate layer and the monocrystalline silicon layer on described first (two) silicon oxide layer;
Form second oxide skin(coating) on the described monocrystalline silicon layer and the mask layer on described second oxide skin(coating);
Thereby described second oxide skin(coating) and described mask layer are carried out the first that patterning exposes described monocrystalline silicon layer;
Resulting structure is carried out annealing operation, the part of first (two) silicon oxide layer under the first that is exposed of described monocrystalline silicon layer is partly dissolved, thereby obtain thinning (two) silicon oxide layer; With
Remove described second oxide skin(coating) and described mask layer;
And wherein, the part of the oxide skin(coating) of described soi structure body is at least a portion of described thinning (two) silicon oxide layer.
16., wherein provide the step of described SeOI structure to comprise as each described method in the claim 9 to 15
Provide the silicon-on-insulator soi layer to fold body, described duplexer comprises first oxide skin(coating) on substrate layer, the described substrate layer and the monocrystalline silicon layer on described first oxide skin(coating);
Form second oxide skin(coating) on the described monocrystalline silicon layer and the mask layer on described second oxide skin(coating);
Thereby described second oxide skin(coating) and described mask layer are carried out the first that patterning exposes described monocrystalline silicon layer;
Thereby make the monocrystalline silicon layer thermal oxidation that is exposed on the monocrystalline silicon layer that exposes before this and the first thinning monocrystalline silicon layer, form silicon oxide layer; With
Described second oxide skin(coating) and described mask layer and described silicon oxide layer that removal forms on the monocrystalline silicon layer that exposes before this;
And the first of the silicon layer of wherein said soi structure body is at least a portion of the described first thinning monocrystalline silicon layer.
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