CN101988908A - Method and system for distinguishing fault of substrate - Google Patents
Method and system for distinguishing fault of substrate Download PDFInfo
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- CN101988908A CN101988908A CN2009101611073A CN200910161107A CN101988908A CN 101988908 A CN101988908 A CN 101988908A CN 2009101611073 A CN2009101611073 A CN 2009101611073A CN 200910161107 A CN200910161107 A CN 200910161107A CN 101988908 A CN101988908 A CN 101988908A
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Abstract
The invention relates to a system and a method for distinguishing a fault of a substrate. The system comprises at least one lighting unit, at least one first imaging unit, at least one second imaging unit, at least one image construction module and at least one image processing module, wherein the lighting units are arranged at the outer side of one surface of a transparent or semi-transparent substrate and used for irradiating light to the substrate; the first imaging units and the second imaging units are arranged at the outer sides of the other opposite surface of the substrate and respectively used for sensing the irradiation of the lighting units and transmitting the light passing through the substrate to shoot images, and the inclined angles between the optical axes of the first imaging units and the second imaging units are larger than zero; the image construction modules are used for respectively constructing two images of the substrate according to images shot by the first imaging units and the images shot by the second imaging units; and the image processing modules are used for detecting whether fault is on the surface of the substrate or in the substrate according to the correlation of the fault in the two constructed images when the substrate has fault. By utilizing the method and the system, the fault of the transparent or semi-transparent substrate can be distinguished to be on the surface of the substrate or in the substrate.
Description
Technical field
The present invention relates to a kind of method and system that the defective of substrate is distinguished of being used for.
Background technology
At present, transparent or semitransparent substrate is all used in many fields, for example, in the solar energy module industry, is used for the patterning or the structured substrate of photovoltaic cell or photovoltaic module.In manufacture process, transparent or semitransparent substrate can produce various defectives, remain silent bubble and the calculus (calculus that comprises black stone, white stone or other colors) etc. that for example are positioned at the scuffing of substrate surface, dirty mark and open bubble etc. and are positioned at substrate inside.Prior art has proposed the defective that many defects detection schemes are used for detecting transparent or semitransparent substrate.
Yet,, need take different quality control standards at dissimilar defectives along with the requirement to the quality of transparent or semitransparent substrate is more and more higher.In this case, not only need to detect the existing defective of transparent or semitransparent substrate, but also need the detected defective in district office to be positioned at the defective of substrate surface or be positioned at the defective of substrate inside.
Summary of the invention
Embodiments of the invention provide a kind of method and system that the defective of substrate is distinguished of being used for, and utilize this method and system, and the defective that can distinguish transparent or semitransparent substrate is positioned at the defective of substrate surface or is positioned at the defective of substrate inside.
According to a kind of system that the defective of substrate is distinguished of being used for of the present invention, comprising: at least one lighting unit, be arranged on transparent or semitransparent substrate one of them surface the outside and be used for to described substrate irradiates light; At least one first image-generating unit and at least one second image-generating unit, be arranged on described substrate another apparent surface the outside and be respectively applied for by the described illumination unit of sensing and the transmission light by described substrate and come photographic images, the angle between the optical axis of the optical axis of wherein said first image-generating unit and described second image-generating unit is greater than zero; At least one image construction module is used for captured according to described first image-generating unit respectively image and the captured image of described second image-generating unit, makes up two images of described substrate; And, at least one image processing module, be used for when there is defective in described substrate,, detect the defective that described defective is positioned at the lip-deep defective of described substrate or is positioned at the inside of described substrate according to the mutual relationship of the position of described defective in two images of described structure.
According to a kind of method that the defective of substrate is distinguished of being used for of the present invention, comprise step: at least one lighting unit is arranged on the outside on one of them surface of transparent or semitransparent substrate, and wherein said lighting unit is used for to described substrate irradiates light; At least one first image-generating unit and at least one second image-generating unit are arranged on described substrate another apparent surface the outside and make the optical axis of described first image-generating unit and the optical axis of described second image-generating unit between angle greater than zero, wherein said first and second image-generating units are respectively applied for by the described illumination unit of sensing and the transmission light by described substrate and come photographic images; At least one image construction module is set, and wherein said image construction module is used for respectively making up two images of described substrate according to described first image-generating unit and the captured image of described second image-generating unit; And, at least one image processing module is set, wherein said image processing module is used for when there is defective in described substrate, according to the mutual relationship of the position of described defective in two images of described structure, detect the defective that described defective is positioned at the lip-deep defective of described substrate or is positioned at the inside of described substrate.
Description of drawings
Above and other feature, characteristics and advantage of the present invention will become more apparent by the detailed description below in conjunction with accompanying drawing.Wherein:
Figure 1A-1K is the schematic diagram that is used for technical scheme that the defective of substrate is distinguished that illustrates according to one embodiment of the invention;
Fig. 2 is the structural representation that is used for system that the defective of substrate is distinguished that illustrates according to one embodiment of the invention;
Fig. 3 illustrates according to the lighting unit of one embodiment of the invention and the work schedule synoptic diagram of image-generating unit; And
Fig. 4 illustrates according to the lighting unit of another embodiment of the present invention and the work schedule synoptic diagram of image-generating unit.
Embodiment
Below, will describe each embodiment of the present invention in conjunction with the accompanying drawings in detail.
Figure 1A-1G is the schematic diagram that is used for technical scheme that the defective of substrate is distinguished that illustrates according to one embodiment of the invention.
At first, shown in Figure 1A, at the arranged outside lighting unit L of one of them surperficial B1 of transparent or semitransparent substrate S with to substrate S irradiates light, and, at arranged outside two linear array imaging unit M1 and the M2 of another apparent surface B2 of substrate S, be respectively applied for by sensing lighting unit L and take the one dimension image by the light of substrate S to substrate S irradiation and projection.The angle of the optical axis of the optical axis of linear array imaging unit M1 and linear array imaging unit M2 is α.For the ease of narration, suppose surperficial B1 and the B2 of the optical axis of linear array imaging unit M1 here, perpendicular to substrate S.When substrate S when the z direction moves, linear array imaging unit M1 and M2 respectively according to certain time interval constantly sensing lighting unit L take by the light of substrate S to substrate S irradiation and projection and obtain a plurality of one dimension images, then, utilize a plurality of one dimension images of the captured acquisition of linear array imaging unit M1 can make up the image that obtains substrate S, equally, utilize a plurality of one dimension images of the captured acquisition of linear array imaging unit M2 also can make up the image that obtains substrate S.
Shown in Figure 1B, suppose with the left side of substrate S at a distance of z1 and perpendicular to the position of substrate S, substrate S exists two defective D1 and D2, wherein, defective D1 is positioned on the surperficial B2 of the linear array imaging unit M1 of substrate S and M2 place one side, and defective D2 is positioned at substrate S inside, and the distance of the linear array imaging unit M1 of itself and substrate S and the surperficial B2 of M2 place one side is h.
Linear array image-generating unit M1 and M2 respectively according to certain time interval constantly sensing lighting unit L take in the process of one dimension image by the light of substrate S to substrate S irradiation and projection, when substrate S when the z direction moves to position shown in Fig. 1 C, linear array imaging unit M1 takes in the one dimension image that obtains and comprises defective D1 and D2; When substrate S when the z direction moves to position shown in Fig. 1 D, linear array imaging unit M2 takes in the one dimension image that obtains and comprises defective D1; And, when substrate S when the z direction moves to position shown in Fig. 1 E, linear array imaging unit M2 takes in the one dimension image that obtains and comprises defective D2.
The image X1 of the constructed substrate S that obtains of one dimension image that utilizes the captured acquisition of linear array imaging unit M1 is shown in Fig. 1 F, and the image X2 of the constructed substrate S that obtains of one dimension image that utilizes the captured acquisition of linear array imaging unit M2 is shown in Fig. 1 G.
Two image X1 and X2 by the substrate S shown in comparison diagram 1F and the 1G can find: in these two image X1 and X2 of substrate S, the position that is positioned at the defective D1 on the surperficial B2 of substrate S is identical, and the position of defective D2 that is positioned at the inside of substrate S is inequality but has side-play amount d '.Side-play amount d ' is directly proportional with the d shown in Fig. 1 E,
Wherein, n is the refractive index of substrate S, and α is the angle (also being the angle of the optical axis of the optical axis of linear array imaging unit M2 and linear array imaging unit M1 here) of the surface normal of the optical axis of linear array imaging unit M2 and substrate S.As can be seen, along with the increase of h and α, d increases, and side-play amount d ' also increases.
In addition, when defective D2 reaches maximal value with distance h at the surperficial B2 of substrate S, when promptly defective D2 was positioned on another apparent surface B 1 of substrate S, the position of defective D2 in image X1 and X2 was inequality and its side-play amount is maximum.
Top description has disclosed following rule: have under the situation of optical axis perpendicular to the surface of substrate S of certain angle and linear array imaging unit M1 at the optical axis of linear array image-generating unit M2 and the optical axis of linear array imaging unit M1, in two images of the constructed substrate S that obtains of one dimension image that utilizes linear array imaging unit M1 and M2 to take respectively, the position that is positioned at the lip-deep defective of substrate S is identical or its side-play amount is maximum, is arranged in inequality and its side-play amount in the position of defective of inside of substrate S less than the side-play amount of the defective on the surperficial B1 of substrate S in the position of image X1 and X2.
In fact, as long as the optical axis of linear array imaging unit M2 and the optical axis of linear array imaging unit M1 have certain angle, do not need the surface of the optical axis of linear array imaging unit M1 or M2 perpendicular to substrate S, in the image of constructed two the substrate S that obtain of one dimension image that utilize linear array imaging unit M1 and M2 to take respectively, the position that is positioned at the lip-deep defective of substrate S is identical or its side-play amount is maximum, is arranged in inequality and its side-play amount in the position of defective of inside of substrate S less than the side-play amount of the defective on the surperficial B1 of substrate S in the position of image X1 and X2.
Above disclosed rule be that the situation of linear array imaging unit is suitable for not only for image-generating unit, and be that the situation of two-dimensional imaging unit also is suitable for for image-generating unit.
But, at image-generating unit is under the situation of two-dimensional imaging unit, if the two-dimensional imaging unit is tilted placement with respect to substrate S, be the optical axis of two-dimensional imaging unit and the angle between the substrate S normal to a surface greater than zero, captured image had compression deformation when then the captured image in Ci Shi two-dimensional imaging unit equalled zero with respect to the angle between its optical axis and the substrate S normal to a surface.For example, for the shown square of Fig. 1 H, when the optical axis of two-dimensional imaging unit and the angle between the substrate S normal to a surface equal zero, the captured image in two-dimensional imaging unit is shown in Fig. 1 J, and when the optical axis of two-dimensional imaging unit and the angle between the substrate S normal to a surface greater than zero the time, the captured image in two-dimensional imaging unit is shown in Fig. 1 K.In Fig. 1 J, the captured image that obtains is a square, and in Fig. 1 K, the captured image that obtains is trapezoidal.As can be seen, with respect to the image of Fig. 1 J, the base of the image of Fig. 1 K does not change, but top margin and highly all being compressed.And along with the optical axis and the angle between the substrate S normal to a surface of two-dimensional imaging unit are big more, the captured image in two-dimensional imaging unit has big more compression deformation.
Therefore, at image-generating unit is under the situation of two-dimensional imaging unit, make up at the image that utilizes the two-dimensional imaging unit photographs before the image of substrate S, if the angle between the optical axis of two-dimensional imaging unit and the substrate S normal to a surface is greater than zero, then need earlier the stretch top margin and the height of image of two-dimensional imaging unit photographs of length according to the base of the image of two-dimensional imaging unit photographs, with the compression deformation of the image of eliminating the two-dimensional imaging unit photographs.
Just being based on top disclosed rule according to the method and system that is used for that the defective of substrate is distinguished of embodiments of the invention designs.
Fig. 2 is the structural representation that is used for system that the defective of substrate is distinguished that illustrates according to one embodiment of the invention.As shown in Figure 2, the system 200 that is used for the defective of substrate is distinguished comprises lighting unit 210, first image-generating unit 220, second image-generating unit 230, image construction module 240 and image processing module 250.
First image-generating unit 220 and second image-generating unit 230 are arranged on the outside of another apparent surface B2 of substrate 260, are respectively applied for by sensing lighting unit 210 to come photographic images to substrate 260 irradiation and the transmission light by substrate 260.Has angle α between the optical axis of the optical axis of first image-generating unit 220 and second image-generating unit 230 greater than zero.First image-generating unit 220 and lighting unit 210 form first passage, and second image-generating unit 230 and lighting unit 210 formation second channels.At system's 200 duration of works, when substrate 260 when the z direction moves, first image-generating unit 220 and second image-generating unit 230 come photographic images by sensing lighting unit 210 to substrate 260 irradiations and the transmission light by substrate 260 with predetermined time interval respectively.
First image-generating unit 220 and second image-generating unit 230 can be made of linear array imaging element or face battle array image-forming component, wherein, the linear array imaging element for example comprises that (Charge CoupledDevice: charge-coupled image sensor) (Complementary MetalOxide Semiconductor: the linear array imaging element of linear array imaging element or other type complementary metal oxide semiconductor (CMOS)), face battle array image-forming component comprise for example face battle array image-forming component of CCD face battle array image-forming component, CMOS face battle array image-forming component or other type to CCD for linear array imaging element, CMOS.When first image-generating unit 220 and second image-generating unit 230 are the linear array imaging unit, first image-generating unit 220 and second image-generating unit 230 can comprise one or more linear array imaging elements separately, these one or more linear array imaging elements can be according to line spread, be staggered on these straight line both sides along a straight line, perhaps become to be scheduled to angle preset distance arrangement at interval with a straight line.When first image-generating unit 220 and second image-generating unit 230 are the two-dimensional imaging unit, first image-generating unit 220 and second image-generating unit 230 can comprise one or more linear array imaging elements or face battle array image-forming component separately, these one or more linear array imaging elements or face battle array image-forming component can be according to arranged, according to line spread, be staggered on these straight line both sides along a straight line, perhaps become to be scheduled to angle preset distance arrangement at interval with a straight line.
Wherein, when first image-generating unit 220 and second image-generating unit 230 are the two-dimensional imaging unit, if the image that first image-generating unit 220 and/or second image-generating unit 230 are taken has compression deformation, then utilizing respectively before first image-generating unit 220 and second image-generating unit, 230 captured images make up two images of substrate 260, image construction module 240 elder generations are according to the length on the base of the image of first image-generating unit 220 and/or 230 shootings of second image-generating unit, the stretch top margin and the height of the image that first image-generating unit 220 and/or second image-generating unit 230 take have compression deformation to eliminate the image that first image-generating unit 220 and/or second image-generating unit 230 take.
Here, Flame Image Process 250 both can use that same applicant is that submit on February 27th, 2009, exercise question determines as the disclosed technical scheme of the Chinese patent application of 200910117993.X whether substrate 260 exists defective for " method and system that is used for the defective of check pattern substrate " and application number, also can use existing and later propose various that image is handled to determine whether substrate exists the technology of defective to determine whether substrate 260 exists defective.
Maximum offset ZL be defective on the surperficial B1 of substrate 260 utilizing first image-generating unit 220 and/or second image-generating unit, 230 captured picture construction respectively two images of substrate 260 in the bias of position.Here, can be being placed on the surperficial B1 of substrate 260 by a plurality of equally spaced scaling boards that constitute such as such figures such as circle or polygons, the bias of the position in two images of the substrate 260 that identical figure gets utilizing first image-generating unit 220 and/or second image-generating unit, 230 captured picture construction respectively in the calculating scaling board is as maximum offset ZL.Obviously, also can use other technology known in those skilled in the art to obtain maximum offset ZL.
Below being image processing module 250 detects the example of defective that defective Q is positioned at the lip-deep defective of substrate 260 or is positioned at the inside of substrate 260 according to the mutual relationship of the position of defective Q in image T1 and T2.At first, image processing module 250 calculates the position coordinates WZ1 of defective Q in image T1 and the position coordinates WZ2 in image T2.Then, the absolute value JZ of the difference of calculating location coordinate WZ1 and position coordinates WZ2.Then, whether the JZ that relatively calculated of image processing module 250 equals zero or maximum offset ZL.If comparative result shows that the JZ that is calculated equals zero or maximum offset ZL, then image processing module 250 detection defective Q are the lip-deep defectives that are positioned at substrate 260, and, if comparative result shows that the JZ that is calculated neither equals zero and also be not equal to maximum offset ZL, then to detect defective Q are the defectives that are positioned at the inside of substrate 260 to image processing module 250.
Fig. 3 illustrates according to the lighting unit of one embodiment of the invention and the work schedule synoptic diagram of image-generating unit.As shown in Figure 3, lighting unit 210 each pulse (T1, T2, T3 ..., Tn) shine once light to substrate 260, the lasting duration of irradiation is a pulse width.First image-generating unit 220 and second image-generating unit 230 all are to take an image with the time interval of per two pulses, wherein, the be separated by time span of a pulse width of the moment of the moment of second image-generating unit, 230 photographic images and first image-generating unit, 220 photographic images, promptly second image-generating unit 230 be numbered the pulse of even number (T2, T4, T6 ...) in photographic images, and first image-generating unit 220 be numbered the pulse of odd number (T1, T3, T5 ..., Tn) in photographic images.
Other modification
Though it will be appreciated by those skilled in the art that among the embodiment that describes in the above, 240 constructed image T1 and T2 handle with definite substrate 260 whether have defective by 250 pairs of image construction module of image processing module, yet the present invention is not limited thereto.In some other embodiment of the present invention, also can determine whether substrate 260 exists defective by other module outside the system 200 rather than image processing module 250.In this case, image processing module 250 only is used for being determined when having defective Q when substrate 260, whether identical with the position among the T2 according to defective Q at image T1, detect the defective that defective Q is positioned at the lip-deep defective of substrate 260 or is positioned at the inside of substrate 260.
Those skilled in the art are to be understood that, though in the above among each embodiment of Miao Shuing, lighting unit 210 each pulse (T1, T2, T3 ..., Tn) shine once light to substrate 260, the lasting duration of irradiation is a pulse width, yet the present invention is not limited thereto.In some other embodiment of the present invention, also can be at system's 200 duration of works, lighting unit 210 is always constantly to substrate 260 irradiates lights.
Though it will be appreciated by those skilled in the art that among each embodiment that describes in the above, first image-generating unit 220 and second image-generating unit 230 all are to take an image with the time interval of per two pulses, yet the present invention is not limited thereto.In some other embodiment of the present invention, first image-generating unit 220 and second image-generating unit 230 also can be taken an image with each or greater than time interval of two pulses.
Those skilled in the art are to be understood that, though in the above among each embodiment of Miao Shuing, the be separated by time span of a pulse width of the moment of the moment of second image-generating unit, 230 photographic images and first image-generating unit, 220 photographic images, however the present invention is not limited thereto.In some other embodiment of the present invention, the moment of the moment of second image-generating unit, 230 photographic images and first image-generating unit, 220 photographic images also can be a synchronization, the length At All Other Times except a pulse width of perhaps being separated by.
Though it will be appreciated by those skilled in the art that among each embodiment that describes in the above, first image-generating unit 220 uses identical lighting unit 210 with second image-generating unit 230, yet the present invention is not limited thereto.In some other embodiment of the present invention, lighting unit 210 can comprise the first lighting unit 210-1 and the second lighting unit 210-2, wherein, first image-generating unit, 220 sensings, first lighting unit 210-1 irradiation and transmission come photographic images by the light of substrate 260, and second image-generating unit, 230 sensings, second lighting unit 210-2 irradiation and transmission come photographic images by the light of substrate 260.Fig. 4 illustrates according to the lighting unit of another embodiment of the present invention and the work schedule synoptic diagram of image-generating unit.As shown in Figure 4, per two pulses of the first lighting unit 210-1 and the second lighting unit 210-2 are shone once light to substrate 260, the lasting duration of irradiation is a pulse width, wherein, the first lighting unit 210-1 to moment of substrate 260 irradiates lights and the second lighting unit 210-2 to the be separated by time span of a pulse width of the moment of substrate 260 irradiates lights.First image-generating unit 220 is taken an image at the first lighting unit 210-1 to each impulse duration of substrate 260 irradiates lights, and second image-generating unit 220 is taken an image at the second lighting unit 210-2 to each impulse duration of substrate 260 irradiates lights.The first lighting unit 210-1 and the second lighting unit 210-2 can comprise one or more light sources separately, and these one or more light sources can be arranged according to the form of straight line or matrix as required.
Except situation illustrated in fig. 4, it will be appreciated by those skilled in the art that the first lighting unit 210-1 also can be the identical moment with the second lighting unit 210-2 to the moment of substrate 260 irradiates lights to the moment of substrate 260 irradiates lights.The first lighting unit 210-1 and the second lighting unit 210-2 also can shine once light to substrate 260 with the time interval greater than two pulses.
Though it will be appreciated by those skilled in the art that among each embodiment that describes in the above, when system's 200 work, substrate 260 moves, first image-generating unit 220, second image-generating unit 230 and lighting unit 210 transfixions, however the present invention is not limited thereto.In some other embodiment of the present invention, when system 200 work, also can substrate 260 transfixions, first image-generating unit 220, second image-generating unit 230 and lighting unit 210 move.
It will be appreciated by those skilled in the art that the substrate among top each embodiment can be included in the solar energy module industry, is used for the patterning or the structured substrate of photovoltaic cell or photovoltaic module.
The quantity that it will be appreciated by those skilled in the art that first image-generating unit and second image-generating unit can be determined according to the expectation maximum quantity and the minimum detection size of the defective of width, imaging numerical aperture, accuracy of detection and the substrate of substrate.
It will be appreciated by those skilled in the art that image construction module 240 and image processing module 250 can utilize software, hardware or way of hardware and software combination to realize.
It will be appreciated by those skilled in the art that each embodiment of the present invention can make various modification and change under the situation that does not depart from invention essence, and these modification all should fall into protection scope of the present invention with changing.Therefore, protection scope of the present invention is defined by appending claims.
Claims (23)
1. one kind is used for system that the defective of substrate is distinguished, comprising:
At least one lighting unit, be arranged on transparent or semitransparent substrate one of them surface the outside and be used for to described substrate irradiates light;
At least one first image-generating unit and at least one second image-generating unit, be arranged on described substrate another apparent surface the outside and be respectively applied for by the described illumination unit of sensing and the transmission light by described substrate and come photographic images, the angle between the optical axis of the optical axis of wherein said first image-generating unit and described second image-generating unit is greater than zero;
At least one image construction module is used for captured according to described first image-generating unit respectively image and the captured image of described second image-generating unit, makes up two images of described substrate; And
At least one image processing module, be used for when there is defective in described substrate, according to the mutual relationship of the position of described defective in two images of described structure, detect the defective that described defective is positioned at the lip-deep defective of described substrate or is positioned at the inside of described substrate.
2. the system as claimed in claim 1, wherein
When described image processing module is further used for when the position in two images of described defective at described structure that identical or its side-play amount equals maximum offset, detecting described defective is the lip-deep defective that is positioned at described substrate, wherein, described maximum offset described one of them lip-deep defective of equaling described substrate is in the side-play amount of the position in two images of the constructed described substrate of the captured image of captured image and described second image-generating unit according to described first image-generating unit respectively.
3. the system as claimed in claim 1, wherein
When described image processing module is further used for when the position in two images of described defective at described structure that inequality and its side-play amount is less than maximum offset, detecting described defective is the defective that is positioned at the inside of described substrate, wherein, described maximum offset described one of them lip-deep defective of equaling described substrate is in the side-play amount of the position in two images of the constructed described substrate of the captured image of captured image and described second image-generating unit according to described first image-generating unit respectively.
4. the system as claimed in claim 1, wherein
Described lighting unit comprises first lighting unit and second lighting unit, wherein
Described first image-generating unit is used for coming photographic images by described first illumination unit of sensing and the transmission light by described substrate, and
Described second image-generating unit is used for coming photographic images by described second illumination unit of sensing and the transmission light by described substrate.
5. the system as claimed in claim 1, wherein
Described lighting unit is to the only diffused light of described substrate irradiation.
6. the system as claimed in claim 1, wherein
Described first image-generating unit and described second image-generating unit be used for preset time at interval by side by side or be separated by the schedule time length ground described illumination unit of sensing and the transmission light by described substrate come photographic images.
7. the system as claimed in claim 1, wherein
Described first image-generating unit and described second image-generating unit are the linear array imaging unit, wherein, described linear array imaging unit comprises one or more linear array imaging elements, and described one or more linear array imaging elements are staggered according to line spread, on straight line both sides or become to be scheduled to angle preset distance arrangement at interval with a straight line.
8. the system as claimed in claim 1, wherein
Described first image-generating unit and described second image-generating unit are the two-dimensional imaging unit, and
Image construction module is further used for when described first image-generating unit and/or the captured image of described second image-generating unit have compression deformation, described first image-generating unit and/or the captured image of described second image-generating unit stretch, and, after described first image-generating unit and/or the captured image of described second image-generating unit are stretched, captured according to described first image-generating unit respectively image and the captured image of described second image-generating unit make up described two images of described substrate.
9. system as claimed in claim 8, wherein
Described first image-generating unit and described second image-generating unit comprise one or more linear array imaging elements or face battle array image-forming component, and described one or more linear array imaging elements or face battle array image-forming component are staggered according to arranged, according to line spread, on straight line both sides or become to be scheduled to angle preset distance arrangement at interval with a straight line.
10. the system as claimed in claim 1, wherein
Described substrate comprises patterning or the structured substrate that is used for photovoltaic cell or photovoltaic module.
11. the system as claimed in claim 1, wherein
Described lighting unit comprises one or more light sources.
12. the system as claimed in claim 1, wherein
The quantity of described first image-generating unit and described second image-generating unit is determined according to the expectation maximum quantity and the minimum detection size of the defective of width, imaging numerical aperture, accuracy of detection and the substrate of described substrate.
13. one kind is used for method that the defective of substrate is distinguished, comprises step:
At least one lighting unit is arranged on the outside on one of them surface of transparent or semitransparent substrate, and wherein said lighting unit is used for to described substrate irradiates light;
At least one first image-generating unit and at least one second image-generating unit are arranged on described substrate another apparent surface the outside and make the optical axis of described first image-generating unit and the optical axis of described second image-generating unit between angle greater than zero, wherein said first and second image-generating units are respectively applied for by the described illumination unit of sensing and the transmission light by described substrate and come photographic images;
At least one image construction module is set, and wherein said image construction module is used for respectively making up two images of described substrate according to described first image-generating unit and the captured image of described second image-generating unit; And
At least one image processing module is set, wherein said image processing module is used for when there is defective in described substrate, according to the mutual relationship of the position of described defective in two images of described structure, detect the defective that described defective is positioned at the lip-deep defective of described substrate or is positioned at the inside of described substrate.
14. method as claimed in claim 13, wherein
When described image processing module is further used for when the position in two images of described defective at described structure that identical or its side-play amount equals maximum offset, detecting described defective is the lip-deep defective that is positioned at described substrate, wherein, described one of them lip-deep defective that described maximum offset equals described substrate is in the side-play amount of the position in two images of the constructed described substrate of the captured image of captured image and described second image-generating unit according to described first image-generating unit respectively, and, when inequality and its side-play amount was less than described maximum offset when the position in two images of described defective at described structure, detecting described defective was the defective that is positioned at the inside of described substrate.
15. method as claimed in claim 13, wherein
Described lighting unit comprises first lighting unit and second lighting unit, wherein
Described first image-generating unit is used for coming photographic images by described first illumination unit of sensing and the transmission light by described substrate, and
Described second image-generating unit is used for coming photographic images by described second illumination unit of sensing and the transmission light by described substrate.
16. method as claimed in claim 13, wherein
Described lighting unit is to the only diffused light of described substrate irradiation.
17. method as claimed in claim 13, wherein
Described first image-generating unit and described second image-generating unit be used for preset time at interval by side by side or be separated by the schedule time length ground described illumination unit of sensing and the transmission light by described substrate come photographic images.
18. method as claimed in claim 13, wherein
Described first image-generating unit and described second image-generating unit are the linear array imaging unit, wherein, described linear array imaging unit comprises one or more linear array imaging elements, and described one or more linear array imaging elements are staggered on described straight line both sides or become to be scheduled to angle interval preset distance with a straight line according to line spread, along a straight line and arrange.
19. method as claimed in claim 13, wherein
Described first image-generating unit and described second image-generating unit are the two-dimensional imaging unit, and
Image construction module is further used for when described first image-generating unit and/or the captured image of described second image-generating unit have compression deformation, go dilatation to handle to described first image-generating unit and/or the captured image of described second image-generating unit, and, after described first image-generating unit and/or the captured image of described second image-generating unit being gone dilatation handle, captured according to described first image-generating unit respectively image and the captured image of described second image-generating unit make up described two images of described substrate.
20. method as claimed in claim 19, wherein
Described first image-generating unit and described second image-generating unit comprise one or more linear array imaging elements or face battle array image-forming component, and described one or more linear array imaging elements or face battle array image-forming component are staggered on described straight line both sides or become to be scheduled to angle interval preset distance with a straight line according to arranged, according to line spread, along a straight line and arrange.
21. as the described method of any one claim among the claim 13-20, wherein
Described substrate comprises patterning or the structured substrate that is used for photovoltaic cell or photovoltaic module.
22. as the described method of any one claim among the claim 13-20, wherein
Described lighting unit comprises one or more light sources.
23. as the described method of any one claim among the claim 13-20, wherein
The quantity of described first image-generating unit and described second image-generating unit is determined according to the expectation maximum quantity and the minimum detection size of the defective of width, imaging numerical aperture, accuracy of detection and the substrate of described substrate.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101611073A CN101988908A (en) | 2009-07-31 | 2009-07-31 | Method and system for distinguishing fault of substrate |
| KR1020127005244A KR20120040257A (en) | 2009-07-31 | 2010-02-26 | Method and system for detecting and classifying defects of substrate |
| US13/384,909 US20120133762A1 (en) | 2009-07-31 | 2010-02-26 | Method and system for detecting and classifying a defect of a substrate |
| EP10803821.7A EP2459989A4 (en) | 2009-07-31 | 2010-02-26 | Method and system for detecting and classifying defects of substrate |
| PCT/CN2010/070791 WO2011011988A1 (en) | 2009-07-31 | 2010-02-26 | Method and system for detecting and classifying defects of substrate |
| JP2012521936A JP2013501211A (en) | 2009-07-31 | 2010-02-26 | Method and system for detecting and classifying defects in a substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101611073A CN101988908A (en) | 2009-07-31 | 2009-07-31 | Method and system for distinguishing fault of substrate |
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| CN101988908A true CN101988908A (en) | 2011-03-23 |
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| CN2009101611073A Pending CN101988908A (en) | 2009-07-31 | 2009-07-31 | Method and system for distinguishing fault of substrate |
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| CN107153071A (en) * | 2017-04-25 | 2017-09-12 | 武汉华星光电技术有限公司 | The detection means and detection method of a kind of glass substrate |
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