CN101724873A

CN101724873A - Functional electroplating process of copperplates of crystallizers

Info

Publication number: CN101724873A
Application number: CN200810228447A
Authority: CN
Inventors: 戚克新; 孙凤国; 齐盛文; 王玲
Original assignee: Angang Heavy Machinery Co Ltd
Current assignee: Angang Heavy Machinery Co Ltd
Priority date: 2008-10-31
Filing date: 2008-10-31
Publication date: 2010-06-09
Anticipated expiration: 2028-10-31
Also published as: CN101724873B

Abstract

The invention relates to a functional electroplating process of copperplates of crystallizers of conticasters. The process is characterized by comprising the processes of chemical degreasing, insulating treatment, electrolytic degreasing, concentrated acid leaching eroding, rundowntank electroplating and out-tank; iron salt and cobalt salt are added to a sulfate plating solution main salt system at the same time; a combination additive is adopted; and the sand spraying process can be omitted in the plating pre-treatment so that the process is optimized. The invention has the advantages of small stress, less process, short manufacturing period and low cost.

Description

A kind of functional electroplating process of copperplates of crystallizers

Technical field

The present invention relates to field of chemical engineering, be specifically related to the functional electroplating process of continuous caster crystallizer copperplate.

Background technology

Copper plate of crystallizer is the continuous caster vitals, and steel flow is crossed conticaster crystallizer and formed steel billet through overcooling.In continuous casting throwing production process, steel billet and copper coin surface are in contact with one another and produce friction, the copper coin surface produces wearing and tearing, usually adopt the functional electric coating technology at the well attrition resistant again material of its coating surface one deck heat conductivility, alleviate the copper coin surface abrasion to reach, improve copper coin reparation number of times, prolong the copper coin purpose in work-ing life.Develop with continuous casting technology, the fast development of copper plate electroplating technology: coating material is developed to alloy material by elemental metals, by chromium to nickel to ferronickel, the nickel cobalt (alloy) development, the coating form is developed to individual layer by composite bed, this functional plating is different from common plating, coating is thicker, usually thickness 0.2mm-2mm unavoidably brings the coating internal stress to accumulate than big problem, and copper coin is in continuous casting is produced, the coating working face is in high-temperature molten steel and the water coolant environment, it is frequent to cold and heat succeed each other, and induces coating to crack, and obscission appears in coating sometimes, influence copper coin throwing steel transportation amount, influence continuous caster production efficiency.And electroplating work procedure is many, the production cycle is long.

Notification number is that the application for a patent for invention " method of electroformed nickel-cobalt alloy " of CN1239752C discloses a kind of electroplating technology, and its electroplate liquid is by NiSO ₄7H ₂O, NiCl ₂6H ₂O, FeSO ₄7H ₂O, CoSO ₄7H ₂O, NaCl, H ₃BO ₃, C ₁₂H ₂₅SO ₄Na, additive are formulated by a certain percentage, and this patent application efficiently solves the problem of coating and basal body binding force difference, have improved the work-ing life of copper plate of crystallizer.

Summary of the invention

The purpose of this invention is to provide the functional electroplating process of copperplates of crystallizers that a kind of stress is little, operation is few, the manufacturing cycle is short, cost is low, adopt vitriol to electroplate system, added molysite, cobalt salt simultaneously; Guarantee to electroplate out the permivar coating that satisfies steel mill's continuous casting throwing service requirements, shorten the plating cycle, reduced technology cost and material cost.

For achieving the above object, the present invention is achieved through the following technical solutions:

A kind of functional electroplating process of copperplates of crystallizers, this technology is carried out electrochemical deoiling, insulation processing, electrolytic degreasing, concentrated acid pouring erosion, goes into the groove plating, is gone out each operation of groove copper coin before comprising plating, it is characterized in that, at sulfate bath master salt system, molysite, cobalt salt have been added simultaneously, the employing combined additive is finished, and can omit the sandblast operation in pre-electroplating treatment, optimizes technical process.

Consisting of of sulfate bath master salt system:

NiSO ₄·7H ₂O 100-400g/l

NiCl ₂·6H ₂O 30-50g/l

FeSO ₄·7H ₂O 10-20g/l

CoSO ₄·7H ₂O 30-60g/l

NaCl 50-80g/l

H ₃BO ₃ 40-50g/l

C ₁₂H ₂₅SO ₄Na 1.0-1.8g/l

Additive A 1,20-80ml/l, additive A 1 is the aqueous solution of benzene sulfinic acid sodium salt and asccharin, and wherein the benzene sulfinic acid sodium salt mass percent is 10-40%, and the asccharin mass percent is 30-45%, and all the other are water;

Additive A 2:60-100ml/l, additive A 2 is the aqueous solution of butynediol, the mass percent of butynediol is 30-60%.

Described electroplating parameter is:

Temperature: 35-70 ℃ cathode area: annode area=1: 2

PH value: 1.5-5.0 current density: 1.0-5.0 ampere/decimetre ²

Advantage of the present invention is: adopt sulfate bath master's salt and additive system, the sulfate bath system is little than the disposable input cost of systems such as sulfamate; Additive A 1 can make the coating stress increase, and by adding additive A 2, reduces the stress that is produced by A1, control coating internal stress, and A1 has the effect of the coating of raising leveling ability simultaneously, and A2 has the coating of raising luminance brightness, improves the ductility of electrodeposited film effect; By regulating cobalt salt and molysite content in the plating bath, control nickel, cobalt, iron level in the coating, thickness of coating can reach 0.2mm-4mm; In the continuous casting throwing was produced, nickel ferro-cobalt coating hot tearing quantity reduced, and the coating probability that comes off reduces; Can omit the sandblast operation in the pre-electroplating treatment, can reduce cost of equipment inputs such as air compressor machine, the materials consumptions such as brown corundum of having avoided sandblast to use reduce material cost; Shorten the Electroplating Production cycle, reduce the technology cost.

The present invention adopts the combination electroplating additive to realize by control plating bath master salt system.The additive that adds is A1:20-80ml/l, A2:60-100ml/l.

Embodiment

Be described in detail technological process of the present invention below.

Embodiment 1

1, technical process:

Electrochemical deoiling → insulation → electrolytic degreasing → concentrated acid pouring is lost → is gone into groove and electroplates → go out groove

2, consisting of of sulfate bath master salt system:

NiSO ₄·7H ₂O 300g/l

NiCl ₂·6H ₂O 40g/l

FeSO ₄·7H ₂O 15g/l

CoSO ₄·7H ₂O 50g/l

NaCl 60g/l

H ₃BO ₃ 45g/l

C ₁₂H ₂₅SO ₄Na 1.5g/l

Additive A 1,30ml/l, additive A 1 is the aqueous solution of benzene sulfinic acid sodium salt and asccharin, and wherein the benzene sulfinic acid sodium salt mass percent is 10%, and the asccharin mass percent is 30%, and all the other are water;

Additive A 2:80ml/l, additive A 2 is the aqueous solution of butynediol, the mass percent of butynediol is 32%.

Electroplating parameter is:

Temperature: 35-70 ℃ cathode area: annode area=1: 2

PH value: 1.5-5.0 current density: 1.0-5.0 ampere/decimetre ²

Embodiment 2

Consisting of of sulfate bath master salt system:

NiSO ₄·7H ₂O 100g/l

NiCl ₂·6H ₂O 30g/l

FeSO ₄·7H ₂O 20g/l

CoSO ₄·7H ₂O 60g/l

NaCl 50g/l

H ₃BO ₃ 40g/l

C ₁₂H ₂₅SO ₄Na 1.0g/l

Additive A 1,20ml/l, additive A 1 is the aqueous solution of benzene sulfinic acid sodium salt and asccharin, and wherein the benzene sulfinic acid sodium salt mass percent is 20%, and the asccharin mass percent is 35%, and all the other are water;

Additive A 2:70ml/l, additive A 2 is the aqueous solution of butynediol, the mass percent of butynediol is 35%.

Technical process and electroplating parameter are with embodiment 1.

Embodiment 3

Consisting of of sulfate bath master salt system:

NiSO ₄·7H ₂O 400g/l

NiCl ₂·6H ₂O 50g/l

FeSO ₄·7H ₂O 20g/l

CoSO ₄·7H ₂O 60g/l

NaCl 80g/l

H ₃BO ₃ 50g/l

C ₁₂H ₂₅SO ₄Na 1.8g/l

Additive A 1,40ml/l, additive A 1 is the aqueous solution of benzene sulfinic acid sodium salt and asccharin, and wherein the benzene sulfinic acid sodium salt mass percent is 30%, and the asccharin mass percent is 40%, and all the other are water;

Additive A 2:90ml/l, additive A 2 is the aqueous solution of butynediol, the mass percent of butynediol is 40%.

Technical process and electroplating parameter are with embodiment 1.

Embodiment 4

Consisting of of sulfate bath master salt system:

NiSO ₄·7H ₂O 150g/l

NiCl ₂·6H ₂O 35g/l

FeSO ₄·7H ₂O 12g/l

CoSO ₄·7H ₂O 35g/l

NaCl 70g/l

H ₃BO ₃ 45g/l

C ₁₂H ₂₅SO ₄Na 1.0g/l

Additive A 1,50ml/l, additive A 1 is the aqueous solution of benzene sulfinic acid sodium salt and asccharin, and wherein the benzene sulfinic acid sodium salt mass percent is 15%, and the asccharin mass percent is 32%, and all the other are water;

Additive A 2:60ml/l, additive A 2 is the aqueous solution of butynediol, the mass percent of butynediol is 50%.

Technical process and electroplating parameter are with embodiment 1.

Embodiment 5

Consisting of of sulfate bath master salt system:

NiSO ₄·7H ₂O 200g/l

NiCl ₂·6H ₂O 45g/l

FeSO ₄·7H ₂O 15g/l

CoSO ₄·7H ₂O 40g/l

NaCl 75g/l

H ₃BO ₃ 50g/l

C ₁₂H ₂₅SO ₄Na 1.8g/l

Additive A 1,60ml/l, additive A 1 is the aqueous solution of benzene sulfinic acid sodium salt and asccharin, and wherein the benzene sulfinic acid sodium salt mass percent is 40%, and the asccharin mass percent is 42%, and all the other are water;

Additive A 2:100ml/l, additive A 2 is the aqueous solution of butynediol, the mass percent of butynediol is 60%.

Technical process and electroplating parameter are with embodiment 1.

Claims

1. functional electroplating process of copperplates of crystallizers, this technology is carried out electrochemical deoiling, insulation processing, electrolytic degreasing, concentrated acid pouring erosion, goes into the groove plating, is gone out each operation of groove copper coin before comprising plating, it is characterized in that, adopt sulfate bath master salt system, add molysite, cobalt salt simultaneously, adopted combined additive to finish;

Consisting of of sulfate bath master salt system:

NiSO ₄·7H ₂O 100-400g/l

NiCl ₂·6H ₂O 30-50g/l

FeSO ₄·7H ₂O 10-20g/l

CoSO ₄·7H ₂O 30-60g/l

NaCl 50-80g/l

H ₃BO ₃ 40-50g/l

C ₁₂H ₂₅SO ₄Na 1.0-1.8g/l

Additive A 1,20-80ml/l, additive A 1 is the aqueous solution of benzene sulfinic acid sodium salt and asccharin;

2. functional electroplating process of copperplates of crystallizers according to claim 1 is characterized in that, in the described additive A 1: the benzene sulfinic acid sodium salt mass percent is 10-40%, and the asccharin mass percent is 30-45%, and all the other are water;

3. functional electroplating process of copperplates of crystallizers according to claim 1 is characterized in that, its electroplating parameter is:

Temperature: 35-70 ℃ cathode area: annode area=1: 2

PH value: 1.5-5.0 current density: 1.0-5.0 ampere/decimetre ²