CN101617448B - Methods and systems for generating pulse trains for material processing - Google Patents
Methods and systems for generating pulse trains for material processing Download PDFInfo
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- 239000000463 material Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000013077 target material Substances 0.000 claims abstract description 18
- 230000003287 optical effect Effects 0.000 claims abstract description 11
- 238000007493 shaping process Methods 0.000 claims description 24
- 230000001052 transient effect Effects 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 claims description 11
- 230000008878 coupling Effects 0.000 claims description 9
- 238000010168 coupling process Methods 0.000 claims description 9
- 238000005859 coupling reaction Methods 0.000 claims description 9
- 230000005284 excitation Effects 0.000 claims description 9
- 238000005286 illumination Methods 0.000 claims description 8
- 230000008859 change Effects 0.000 claims description 4
- 238000003672 processing method Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 5
- 239000012634 fragment Substances 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- 238000002679 ablation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 238000013532 laser treatment Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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Abstract
Systems and methods generate laser pulse trains for material processing. In one embodiment, stable laser pulse trains at high repetition rates are generated from a continuous wave (CW) or quasi-CW laser beams. One or more laser pulses in the laser pulse train may be shaped to control energy delivered to a target material. In another embodiment, multiple laser beams are distributed to multiple processing heads from a single laser pulse, CW laser beam, or quasi-CW laser beam. In one such embodiment, a single optical deflector distributes multiple laser beams among respective processing heads.
Description
Technical field
The present invention relates generally to laser treatment.In particular, the present invention relates to produce the stable shaped pulse of row, and laser beam is delivered to a plurality of processing heads from single lasing light emitter with high pulse repetition frequency.
Background technology
Can use various laser that the workpiece of number of different types is carried out laser treatment to realize kinds of processes.Laser can be used for forming hole and/or the blind path in (for example) single or multiple lift workpiece.Semiconductor wafer processing can comprise various types of laser micro machineries to be handled, and comprise (for example) and rule, cut, hole, remove semiconductor links (fuse), thermal annealing, and/or the thick or film assembly of finishing passivity.
Conventional laser boring or ruling comprise (for example) and use the CO2 laser of wavelength in the far infrared scope.Yet this type of laser can need high-energy some integrated circuits (IC) of ablating to handle material usually.
In addition, this type of treatment technology uses long pulse usually, and the slow rising in the pulse and the timing that descends reach about 50 microseconds.Therefore, long pulse can allow too much heat diffusion, thereby causes heat affected zone, double teeming oxide skin(coating), too much fragment, chip and break.In addition, the CO2 laser of chopping tends to have the interpulse energy unsteadiness of high magnitude usually, and this possibly influence the consistency of handling quality unfriendly.
Conventional CO2 boring or scoring system use radio frequency (RF) pulse CO 2 laser usually, and the typical relaxation time of its excitation state is between about 50 microseconds and about 100 microseconds.In order to produce discrete laser pulses, common acceptable pulse repetition frequency (PRF) is about the inverse of the twice in relaxation time.Therefore, CO2 laser is provided at the maximum PRF between about 5 KHzs and about 10 KHzs usually.When treating capacity that needs increase, these low PRF values can reduce to handle quality.For instance, when it moved the speed of laser beam with respect to workpiece when the scoring system increase, the structure along otch that causes owing to the separation between the pulse became remarkable under low PRF.This class formation in the otch reduces handles quality.
Summary of the invention
The embodiment that this paper discloses is provided for producing the stable shaped pulse of row and laser beam being delivered to a plurality of system and methods of handling head from single lasing light emitter with high pulse repetition frequency.
In one embodiment, a kind of laser processing system that is used at full speed producing stable pulse train comprises: handle head, it is through being configured to the target location with the pulse train illuminating material; Lasing light emitter, it is through being configured to produce continuous wave (CW) or accurate CW laser beam.Said system also comprises optical gate, and it receives control signal through being configured to receive CW or accurate CW laser beam from lasing light emitter, produces pulse train based on control signal from CW or accurate CW laser beam, and the pulse train guiding is handled head.
In another embodiment, a kind of laser processing method comprises: produce CW or accurate CW laser beam; The part of instantaneous cutting CW or accurate CW laser beam is to produce pulse train; And with the target location of pulse train guide material.
In another embodiment, a kind of system comprises the member that is used to produce CW or accurate CW laser beam, is used for producing the member of pulse train from CW or accurate CW laser beam, and is used for the member with the target location of pulse train guide material.
In another embodiment, a kind ofly be used to use the laser processing system of a plurality of laser beam treatment materials to comprise: first handles head, and it is through being configured to the primary importance with the first pulse train illumination target material; Second handles head, and it is through being configured to the second place with the second pulse train illumination target material; Lasing light emitter, it is through being configured to produce laser beam; And optical gate, it handles head through being configured to receive laser beam from lasing light emitter with first pulse train guiding first, and second pulse train guiding second is handled head.
In another embodiment, a kind of laser processing method comprises: laser beam is provided to first sound-optic modulator (AOM), and a said AOM is through being configured to produce first pulse train and second pulse train from laser beam; Drive a said AOM with first frequency, said first frequency is through being configured to along the first optical path deflection, first pulse train, so that the primary importance of illumination target material; And driving a said AOM with second frequency, said second frequency is through being configured to along the second optical path deflection, second pulse train, so that the second place of illumination target material.
In another embodiment; A kind of laser processing system comprises: be used to produce laser beam member, be used for producing the member of first pulse train and second pulse train from laser beam; And member, it is used for the first deflection angle deflection, first pulse train, so that with the primary importance on the first pulse train illumination target material; And be used for the second deflection angle deflection, second pulse train, so that with the second place on the second pulse train illumination target material.
From the following detailed description of the preferred embodiment of carrying out, will understand additional aspect and advantage referring to accompanying drawing.
Description of drawings
Fig. 1 and 2 illustrative is used for drive laser so that to hang down the sequential chart that pulse recurrence rate produces the RF signal out of the ordinary of the respective laser output that comprises discrete pulse relatively.
Fig. 3,4 and 5 illustrative are used for drive laser so that produce the sequential chart of the RF signal of respective laser output by the pulse recurrence rate that increases.
Fig. 6 illustrative is according to the sequential chart of the output laser pulse row of the acousto-optic modulator (AOM) that is driven by the RF triggering signal of an embodiment.
Fig. 7 A and 7B illustrative comprise the time profile of at least one shaped pulse with the pulse train of optimizing the laser/material thermal coupling according to some embodiment's.
Fig. 8 illustrative is according to the time profile of the pulse train shown in Fig. 7 A of the variation that comprises pulse height of an embodiment.
Fig. 9 illustrative is according to the time profile of the pulse train shown in Fig. 7 A of the variation that comprises transient pulse width and pulse recurrence rate of an embodiment.
Figure 10 A uses the groove of conventional CW CO 2 laser incision plastic material with picture specification.
Figure 10 B uses the groove of the stabilized lasers spike train incision plastic material of the high-repetition-rate that is provided by the AOM that drives with the RF triggering signal according to an instance embodiment with picture specification.
Figure 11 A and 11B use the cross section of the path that the stabilized lasers spike train of the high-repetition-rate that is provided by the AOM with the driving of RF triggering signal gets out in printed circuit board (PCB) according to some instance embodiment with picture specification.
The sequential chart of the instantaneous laser beam that produces by conventional RF pulse pump laser that Figure 12 illustrative handles that the gained laser beam of first pulse of head, second pulse that guiding second is handled head and pilot beam gatherer shows with respect to guiding first.
The sequential chart of the instantaneous laser beam that produces by RF pulse pump laser that Figure 13 illustrative is showed with respect to the waveform of guiding first, second, the 3rd and beam trap according to an embodiment.
Figure 14 is the block diagram that is used for producing from single RF pulse laser the instance system of a plurality of beams according to an embodiment.
The sequential chart of the instantaneous CW laser beam that produces by the CW laser that Figure 15 illustrative is showed with respect to the waveform of first, second, the 3rd of guiding, four-head and beam trap according to an embodiment.
Figure 16 is the block diagram that is used for producing from single CW or accurate CW laser the instance system of a plurality of beams according to an embodiment.
Figure 17 is used to use less AOM to produce the block diagram of the instance system of a plurality of beams according to an embodiment.
Figure 18 is according to the block diagram of an embodiment by the instance AOM of two RF signals drivings.
Figure 19 is a block diagram of showing the CW laser that AOM illustrated in fig. 18 and RF power supply are arranged according to an embodiment.
Embodiment
The present invention is provided for producing with high-repetition-rate the one or more system and method for the pulse in stable pulse train and the shaped laser pulses row.Some embodiment also is delivered to a plurality of processing heads to improve treating capacity with a plurality of laser beams from single chopping continuous wave (CW) or accurate CW laser.In this type of embodiment, single light deflector is through being configured to that a plurality of laser beams are assigned to a plurality of processing heads.
Existing referring to graphic, wherein same reference numerals is represented similar elements.For the purpose of clear, first indication counter element of reference number is by the graphic numbering of using first.In following description content, a large amount of specific detail are provided so that thoroughly understand embodiments of the invention.Yet, be understood by those skilled in the art that not have the one or more of said specific detail or to utilize under the situation of other method, assembly or material and put into practice the present invention.In addition, in some cases, detail or describe well-known structure, material or operation not in order to avoid obscure each side of the present invention.In addition, in one or more embodiment, described characteristic, structure or characteristic can any suitable mode make up.
A. stable spike train
Such as preceding text argumentation, conventional RF pumping CO2 laser does not produce the discrete laser pulses that is higher than some PRF, and has between the pulse energy unsteadiness of height usually.Therefore, this type of laser can not produce consistent processing quality.In addition, be not that all energy that are applied to target material are all through changing to be used for thermal ablation technology.Difference between the dosage of the energy that is applied to the energy of material and is used for ablating can be used as heat energy and partly is retained in material.This too much heat energy can cause (for example) too much fusion, layering, heat affected zone, double teeming oxide skin(coating), too much fragment, chip and break.
Therefore, some embodiment that discloses according to this paper, the stable pulse of rectangular laser pulse is listed as with between the control impuls and the laser/material interaction in the single pulse on the generation time.To between the row pulse and the meticulous adjusting of inner pulse energy of single pulse and transient pulse width can minimize through the adverse side effect that makes thermal ablation or reduce to optimize thermal ablation.Therefore, for instance, can realize hand work control for path Drilling or line.
In one embodiment, for example the optical gate of acousto-optic modulator (AOM) or electrooptic modulator (EOM) or apparatus for fast switching receive CW or accurate CW laser beam and under very high PRF, produce stable spike train.For instance, in one embodiment, under up to the PRF of about 1 MHz, produce the stable rectangular laser pulse of row.PRF can be depending on (for example, AOM) the factor of rising/fall time and/or the size of laser beam etc. of apparatus for fast switching for example.For instance, big laser beam can need long relatively rising/fall time.The higher PRF that the system and method that this paper discloses produces provides the stable rectangular pulse train of the level and smooth otch that can be used for producing in the target material.
In one embodiment, optionally regulate the duration that the RF of laser beam excites, so that modulating pulse energy and/or transient pulse width are realized the processing quality of the best or increase.This embodiment allows meticulous adjusting so that handle the material in printed circuit board (PCB) (PCB) industry, handles the light polarizing film in the flat panel display industry, and/or handles the metal and the metal/plastic of other industry (for example, auto industry).
Such as preceding text argumentation, the conventional RF pulse CO 2 laser with relaxation time of the excitation state between about 50 microseconds and about 100 microseconds can provide discrete laser pulses under the PRF that is lower than about 10 KHzs.For instance, Fig. 1 and 2 illustrative is used for drive laser so that to hang down the sequential chart that pulse recurrence rate produces the RF signal out of the ordinary 110,210 of the respective laser output 112,212 that comprises discrete pulse relatively.Laser output 112,212 shown in Fig. 1 and 2 has approximately identical pulse recurrence rate.Yet; Because the cause of the difference of the duration that the relaxation time of the excitation state of laser and the RF that is provided by RF signal 110 shown in Figure 1 (duty cycle with wide relatively pulse and about 50%) and RF signal 210 (duty cycle with narrow relatively pulse and about 25%) shown in Figure 2 excite, the pulse in the laser output 112 has the variform shape of exporting the pulse in 212 with laser.
Yet, when laser than when output under the high pulse repetition rate, pulse train begins to comprise the CW component of increase.For instance, Fig. 3,4 and 5 illustrative are used for drive laser so that produce the sequential chart of the RF signal 310,410,510 of respective laser output 312,412,512 with the pulse recurrence rate that increases.The instantaneous width of the pulse of RF signal 310 shown in Figure 3 is identical in fact with the instantaneous width of the pulse of RF signal 110 shown in Figure 1.Yet RF signal 310 shown in Figure 3 has the duty cycle (about 66.6%) higher than the duty cycle of RF signal 110 shown in Figure 1 (about 50%).Laser output 312 shown in Figure 3 has than laser shown in Figure 1 exports corresponding higher pulse recurrence rate.Yet, because the cause in the relaxation time of the excitation state of laser is introduced skew or CW component between the pulse of the higher duty cycle of RF signal 310 shown in Figure 3 in laser output 312 shown in Figure 3.
Similarly, the instantaneous width of the pulse in the instantaneous width of the pulse in the RF signal shown in the Figure 4 and 5 410,510 and the RF signal 210 shown in Figure 2 is identical in fact.Yet RF signal 410 shown in Figure 4 has the duty cycle (about 50%) higher than the duty cycle of RF signal shown in Figure 2 (about 25%).Therefore, laser shown in Figure 4 output 412 has than laser shown in Figure 2 and exports corresponding higher pulse recurrence rate.Yet, because the cause in the relaxation time of the excitation state of laser is introduced skew or CW component between the pulse of the higher duty cycle of RF signal 410 shown in Figure 4 in laser output 412 shown in Figure 4.Therefore, the pulse recurrence rate that increases laser can reduce the ability that laser provides stable discrete pulse.
Along with duty cycle continues to increase (for example, as shown in Figure 5, wherein the duty cycle of RF signal 510 is about 83.3%), laser output 512 is near the laser output of CW laser.This laser output 512 can be described as accurate CW laser output 512 in this article.According to an embodiment,, accurate CW laser output 512 (or the output of CW laser) is provided to AOM in order to produce the stable pulse row with high PRF.The stability of the spike train that provides by AOM along with laser output near the laser output of CW laser and improve.
For instance, Fig. 6 illustrative is according to the sequential chart of an embodiment by the output laser pulse row 610,612 of the AOM of RF triggering signal 614 drivings.In the instance corresponding to pulse train 610, AOM receives by the laser beam that comprises the CW component (not shown) that produces with 40% duty cycle drive laser.As shown in Figure 6, this impels the pulse train 610 that is provided by AOM to comprise the tangible interpulse variation of pulse height.This pulse train 610 can cause relatively poor kerf quality.
In the instance corresponding to pulse train 612, AOM receives by the accurate CW laser beam (not shown) that produces with 99% duty cycle drive laser.Pulse train 614 is highly stable and in target material, produce the high-quality otch.The technical staff will understand from the disclosure of this paper, depend on the relaxation time of the excitation state of laser, can be through producing stable pulse train 614 with other duty cycle drive laser.For instance, in one embodiment, use the duty cycle drive laser between about 80% and about 100%.For the accurate CW laser beam of realizing suiting, the RF source is through being configured to than relaxation time of the excitation state of laser drive laser in fact quickly.
In one embodiment, the RF triggering signal 614 that is used to drive AOM has the frequency in the scope between about 100 KHzs and about 250 KHzs.Yet the frequency of RF triggering signal 614 can be higher than 250 KHzs in fact.For instance, in another embodiment, RF triggering signal 614 has the frequency up to about 1 MHz.In certain embodiments, the frequency of RF triggering signal is based on rising/fall time of AOM.
B. shaping pulse
Except producing stable pulse train, or in other embodiments, the pulse in AOM (or another apparatus for fast switching, for example EOM) the shaped laser pulses row one or more are to improve the laser treatment quality.When material experience heating that is exposed to laser beam or the phase transformation from solid-state to liquid state, the absorption cross section of material can change.Through regulating one or more characteristics of laser beam, can realize than efficient laser/material coupling.
For instance, Fig. 7 A and 7B illustrative comprise the time profile of at least one shaped pulse with pulse train 700 that the laser/material thermal coupling is provided according to some embodiment.For illustration purposes, pulse train 700 is shown as first series of pulses 710 and second series pulse 712.In these instances embodiment, last pulse 714 in each series 710,712 of AOM shaping is to increase coupling efficiency.In addition, or in other embodiments, but one or more other pulses in each series 710,712 of AOM shaping.Can select the number of the pulse in each series 710,712, the number of the shaped pulse 714 in each series 710,712, and/or the given shape of shaped pulse 714 is applied to the dosage of the laser energy of target material with control.
In one embodiment, the given shape of shaped laser pulses 714 is based on the shape of RF triggering signal 614 (see figure 6)s that are applied to AOM.For instance, RF generator (not shown) can be used for producing RF triggering signal 614, to have the time profile of the required time profile that is similar to pulse train 700 in fact.Therefore, for instance, the RF generator can be through being configured to switch to triangular pulse from rectangular pulse, or with rectangular pulse and triangular pulse combination, to produce the shaped pulse 714 shown in Fig. 7 A and the 7B.
In instance embodiment, first series of pulses 710 can be applied to the material that is in first target location (for example, first via positions), and second series pulse 712 can be applied to the material that is in second target location (for example, alternate path position).Certainly, the technical staff will understand from the disclosure of this paper, and pulse train 700 is not limited to first series of pulses 710 and second series pulse 712.In addition, the technical staff will understand from the disclosure of this paper, and first series of pulses 710 need not comprise the pulse with second series pulse 712 similar numbers, and arbitrary serial 710,712 can comprise any number pulse.
Except at least one laser pulse 714 of shaping, or in another embodiment, optionally change the CW component of spike train 700.For instance, Fig. 8 illustrative comprises the time profile of the pulse train 700 shown in Fig. 7 A of variation of pulse height according to an embodiment.During pulse train 700 remains on the time cycle 808 of deviant (illustrated like dotted line 810) when above; Skew laser energy (for example, laser energy does not turn back to the minimum value between the pulse) illumination target material consistently with the total heat state that is added to target material.Therefore, pulse train 700 shown in Figure 8 will than the heat energy of sending by the pulse train 700 shown in Fig. 7 A more the heat energy of high dose be delivered to target material.Such as preceding text argumentation, the RF generator can be through being configured to RF triggering signal 614 that shaping is provided to AOM so that required skew optionally to be provided.
In addition, or in another embodiment, the duty cycle value of the pulse in the regulating impulse row 700 optionally.For instance, Fig. 9 illustrative comprises the time profile of the pulse train 700 shown in Fig. 7 A of variation of transient pulse width and pulse recurrence rate according to an embodiment.Once more, can realize this type of adjusting through the RF triggering signal 614 that shaping is provided to AOM.For instance, the RF generator is optionally controlled the RF value and/or the transient pulse width of RF triggering signal 610, in pulse train 610, to produce change.
The technical staff will understand from the disclosure of this paper, and pulse train 700 is not limited to Fig. 7 A, 7B, the pulse shape shown in 8 and 9 and other spike train and revises.In fact, can AOM be used for optionally providing multiple difformity and modification so that control is provided to the dosage of the laser energy of target material to pulse train 700.In addition, one or more (for example, pulse shape, CW skew, transient pulse width, pulse height and the duty cycle) of said modification are capable of being combined in single spike train and/or single series of pulses.
C. use the instance of the stable pulse train of high-repetition-rate
Only for illustration purposes but not with the restriction mode following instance is provided.The different disposal quality that Figure 10 A and 10B realize when the stable spike train that uses conventional CW CO2 laser and provided by AOM with picture specification.Figure 10 A uses the groove 1000 of conventional CW CO2 laser incision plastic material with picture specification.Figure 10 B is with the groove 1001 of the stabilized lasers spike train incision plastic material of the high-repetition-rate that picture specification uses according to some embodiment as the AOM by driving with the RF triggering signal disclosed herein provides.
As shown in the figure, the groove of being processed by conventional CW CO2 laser 1000 has cutout regions and the more significant thermal effect wideer than the groove of being processed by the stabilized lasers spike train 1001.For instance, for the groove 1000 that uses conventional CW CO2 laser to process, corner width 1004 is through being viewed as about 314.02 microns, and top width 1002 is through being viewed as about 201.18 microns, and side width 1006 is through being viewed as about 207.23 microns.The corresponding measured value that uses the groove 1001 that CO2 laser processes is comprised about 245.61 microns corner width 1014, about 159.23 microns top width 1012 and about 172.48 microns side width 1016.In addition, as comparing 1018 proofs of less fusion shown in Figure 10 B and fragment with fragment 1008, reduced thermal effect through using AOM with the fusion shown in Figure 10 A.
By another instance, Figure 11 A and 11B use the cross section of the path 1102,1112 that the stabilized lasers spike train of the high-repetition-rate that is provided by the AOM with the driving of RF triggering signal gets out in printed circuit board (PCB) according to some embodiment with picture specification.In this example, the institute's cutting material among Figure 11 A is that the institute's cutting material among GX-3 and Figure 11 B is GX-13, and it is the electronic package material that generally uses that can buy from Ajinomoto company.As shown in the figure, reduced peak pulse power although use AOM to compare with conventional RF pulse laser, the system and method that this paper discloses is used under higher repetition rate relatively, producing stable pulse train produces the path of good quality.
D. produce a plurality of beams from pulse laser
For the laser that does not have enough peak powers, the division laser beam is not the method for optimizing that beam is delivered to a plurality of course of the beams.Therefore, in one embodiment,, laser beam improves process throughput through being delivered to a plurality of processing heads from single pulse or CWCO2 laser.Traditionally, the single part of different pulses in the spike train or different pulses is by the different disposal heads that lead along different course of the beams.For instance, the sequential chart of Figure 12 illustrative first pulse 1212, guiding second of handling head (1) with respect to guiding first instantaneous laser beam 1210 that produces by conventional RF pulse pump laser of handling that the gained laser beam 1216 of second pulse 1214 and the pilot beam gatherer of head (2) shows.As shown in the figure, from first pulse 1218 instantaneous " cutting " of laser beam 1210 down guiding first handle first pulse 1212 of head, and from second pulse, the 1220 instantaneous cuttings of laser beam 1210 down guiding second handle second pulse 1214 of head.
In one embodiment, through increasing pulse recurrence rate from a plurality of pulse guiding head of handling out of the ordinary under the instantaneous cutting of single laser pulse.For instance, the sequential chart showed with respect to guiding first (1), second (2), the 3rd (3) and the waveform of beam trap according to an embodiment of Figure 13 illustrative by the instantaneous laser beam 1310 of RF pulse pump laser generation.Laser beam 1310 comprises first pulse 1312 and second pulse 1314.
AOM in this instance is through being configured to more than first pulse 1316,1318,1320 under first pulse, the 1312 instantaneous cuttings of laser beam, and with each guiding head of handling out of the ordinary of more than first pulse 1316,1318,1320.AOM is also through being configured to more than second pulse 1322,1324,1326 under second pulse, the 1314 instantaneous cuttings of laser beam, and with each guiding head of handling out of the ordinary of more than second pulse 1322,1324,1326.Therefore, use more instantaneous width from each of first pulse 1312 and second pulse 1314.Yet, be provided to each pulse recurrence rate of handling head and be excited the pulse recurrence rate restriction of light beam 1310.Such as preceding text argumentation, along with pulse recurrence rate increases (for example, more than 5 KHzs), pulse laser beam becomes unstable usually and begins to comprise the CW component.Therefore, laser beam (shown in figure 13) possibly be inappropriate for some application (for example, film is handled) under the instantaneous cutting of pulse laser.
Figure 14 is the block diagram that is used for producing from single RF pulse laser 1410 instance system 1400 of a plurality of beams according to an embodiment.System shown in Figure 14 can be used for (for example) and produces waveform shown in Figure 13.The laser beam that RF pulse laser 1410 produces through the AOM 1412,1414,1416 of arranged in tandem.System 1400 uses AOM 1412,1414,1416 to produce in the transient pulse and cuts so that send a plurality of beams shown in Figure 13.In other words, the appropriate section of each AOM 1412,1414,1416 along path out of the ordinary towards a processing deflection first pulse 1312 and second pulse 1314.The deflection angle that is provided by each AOM 1412,1414,1416 is confirmed by the frequency of the RF signal that is used to drive AOM 1412,1414,1416 (for example, shown in Figure 6 RF triggering signal 614).In certain embodiments, also can use the combination of EOM or AOM and EOM.
E. produce a plurality of beams from CW or accurate CW laser
In another embodiment, CW or accurate CW laser and beam distribution/time apparatus for shaping (for example, AOM and/or EOM) are used with dispense-pulse between a plurality of processing heads together.The system and method that this paper discloses allows to send a plurality of beams quickly than the sending of a plurality of beams of being undertaken by conventional method.In certain embodiments, the number of the beam distribution/time apparatus for shaping in the multimachine tool system of processing also reduces.Therefore, process throughput increases.
The sequential chart that Figure 15 illustrative is showed with respect to guiding first (1), second (2), the 3rd (3), four-head (4) and the waveform of beam trap according to an embodiment by the instantaneous CW laser beam 1510 of CW laser generation.CW laser beam 1510 for timesharing and be delivered to the different optical path.In other embodiments, accurate CW laser also can be used for producing laser beam 1510 (for example, seeing Fig. 5).
Because use CW or accurate CW lasing light emitter, so the pulse recurrence rate that is provided to each path is by being used to produce the AOM of respective waveforms and/or the speed of EOM is confirmed.Such as preceding text argumentation, in one embodiment, AOM can switch up to the speed of about 1 MHz.If handle instantaneous extraction laser beam 1510 between the head at four, shown in Figure 15 like (by instance), the pulse recurrence rate that is provided to each waveform of handling head so can be up to about 1/4th of the switching rate of AOM.
Figure 16 is used for from the block diagram of the instance system 1600 of single CW or a plurality of beams of accurate CW laser 1610 generations according to an embodiment.System 1600 shown in Figure 16 can be used for (for example) and produces waveform shown in Figure 15.The laser beam that CW or accurate CW laser 1610 produce through the AOM 1612,1614,1616,1618 of arranged in tandem.Each AOM 1612,1614,1616,1618 is along the corresponding momentary partial of respective paths towards a processing deflection laser bundle 1510.Such as preceding text argumentation, the deflection angle that is provided by AOM 1612,1614,1616,1618 is confirmed by the frequency of the RF signal that is used to drive AOM 1612,1614,1616,1618.
Instance system 1600 shown in Figure 16 uses an AOM to each course of the beam.In this embodiment, laser beam is influenced by the diffraction efficiency of each AOM.In addition, the number of employed AOM increases the cost of system 1600.Therefore, in one embodiment, single AOM is through being configured to the part out of the ordinary along a plurality of course of the beam deflection laser bundles.Therefore, can reduce the number of AOM.
For instance, Figure 17 is used to use less AOM 1710,1712 to produce the block diagram of the instance system 1700 of a plurality of beams according to an embodiment.Each AOM 1710,1712 is driven by two RF signals.Such as preceding text argumentation, the deflection angle of each AOM 1710,1712 and the frequency of RF signal are proportional.In this example, drive each AOM 1710,1712 down at first frequency (RF frequency 1) and second frequency (RF frequency 2).Be applied to the RF frequency of AOM 1710,1712 through switching, each AOM1710,1712 can be with beam deflection to the different optical path.Total angular deviation can be confirmed by RF frequency, wavelength and material behavior.Compare with system 1600 shown in Figure 16, system 1700 shown in Figure 17 uses the AOM of half number laser beam to be provided to the head of similar number.In addition, or in other embodiments, each AOM 1710,1712 can be through the transient pulse width that is configured to provide different, pulse recurrence rate and/or to each shaping pulse of its laser beam, such as preceding text argumentation.
Figure 18 is according to the block diagram of an embodiment by the instance AOM 1810 of two RF signals drivings.In this example, AOM 1810 comprises can be from the Virginia, Springfield (Virginia, high power acousto-optic modulator/deflector that Yi Suomente Springfield) (Isomet) company buys.AOM1810 is driven by RF power supply 1812.In this example, RF power supply 1812 comprises also the RF driver/amplifier RFA4060-2 that can buy from Yi Suo Mentor Corp..
Figure 19 is a block diagram of showing the CW laser 1910 that AOM 1810 illustrated in fig. 18 and RF power supply 1812 are arranged according to an embodiment.Shown in figure 19, through input being switched to the RF controller, according to selecting frequency RF1, RF2 with different angles guided laser bundle.
The zero degree and the angle of departure between the first time are:
The optics rise time of Gauss's incoming beams is about:
Wherein: λ=wavelength; Fc=centre frequency (for example, 40 MHzs/60 MHzs); The velocity of sound of v=reciprocation material (for example, 5.5 millimeters/microsecond (Ge)); And d=1/e2 beam diameter.Be understood by those skilled in the art that, can under the situation that does not break away from basic principle of the present invention, make many variations the details of the foregoing description.Therefore, scope of the present invention should only be confirmed by appended claims.
Claims (21)
1. laser processing system that is used for producing stable pulse train with high-repetition-rate, said system comprises:
Handle head, it is through being configured to the target location with the first pulse train illuminating material;
Lasing light emitter, it is through being configured to produce continuous wave CW or accurate CW laser beam; And
Optical gate, it is through being configured to:
Receive said CW or accurate CW laser beam from said lasing light emitter;
Receive control signal;
Produce said pulse train based on said control signal from said CW or accurate CW laser beam; Said pulse train through producing comprises the first serial laser pulse and second series laser pulse;
To become the laser pulse with remaining said first serial laser pulse and remaining second series laser pulse with at least one shaping for laser pulse in the second series laser pulse at each said first serial laser pulse is different shapes, with the coupling efficiency of first target location that increases the said first serial laser pulse and said material and the coupling efficiency of second target location that increases said second series laser pulse and said material; And
Said pulse train guiding is handled said first target location with the said first serial laser pulse and handled the said processing head of said second target location with said second series laser pulse.
2. system according to claim 1; Wherein said lasing light emitter comprises the radio frequency pulse laser; Said system further comprises the RF source, and said RF source is through being configured to drive said RF pulse laser in fact quickly so that produce said CW or accurate CW laser beam than the relaxation time of the excitation state of said RF pulse laser.
3. system according to claim 2, wherein said RF source is further through being configured to drive said RF pulse laser with the RF signal with the duty cycle between 80% and 100%.
4. system according to claim 1; Wherein said optical gate comprises acousto-optic modulator AOM; And said control signal comprises the RF triggering signal, and said AOM is through being configured to produce said pulse train through a plurality of momentary partial of selecting said CW or accurate CW laser beam based on the transient pulse width and the pulse recurrence rate of said RF triggering signal with the said processing head that leads.
5. system according to claim 4, wherein said pulse recurrence rate is in the scope up to 1 MHz.
6. system according to claim 4, wherein said AOM are further through being configured to come based on the pulse shape of said RF triggering signal at least one different shaped laser pulses of each said first serial laser pulse of shaping and said second series laser pulse.
7. system according to claim 6; Wherein said shaping comprises the transient pulse width of said at least one different shaped laser pulses of each the said first serial laser pulse that changes said pulse train and said second series laser pulse, and wherein the transient pulse width of said at least one different shaped laser pulses of each said first serial laser pulse and said second series laser pulse is to compare with the transient pulse width of remaining said first serial laser pulse and remaining said second series laser pulse.
8. system according to claim 6; Wherein said shaping is included in the predetermined period of time CW component of remaining said first serial laser pulse of said pulse train and remaining said second series laser pulse changed into and is higher than threshold value, and the CW component of said at least one different shaped laser pulses of each said first serial laser pulse and said second series laser pulse is reduced to said threshold value.
9. system according to claim 6, wherein said shaping further comprises the said first serial laser pulse and the interior duty cycle of said second series laser pulse that optionally is adjusted in said pulse train.
10. system according to claim 1, wherein said optical gate comprises electrooptic modulator.
11. a laser processing method, it comprises:
Produce continuous wave CW or accurate CW laser beam;
The part of said CW of instantaneous cutting or accurate CW laser beam comprises the pulse train of the first serial laser pulse and second series laser pulse with generation;
To become with remaining said first serial laser pulse and remaining second series laser pulse in each said first serial laser pulse and at least one shaping for laser pulse in the second series laser pulse be different shapes, with the coupling efficiency of first target location that increases the said first serial laser pulse and said material and the coupling efficiency of second target location that increases said second series laser pulse and said material; And
The said first serial laser pulse of said pulse train is directed to said first target location of said material and the said second series laser pulse of said pulse train is directed to said second target location of said material.
12. method according to claim 11 wherein produces said CW or accurate CW laser beam and comprises that the relaxation time than the excitation state of laser drives said pulse laser in fact quickly.
13. method according to claim 12 wherein drives said pulse laser and comprises with the said pulse laser of radio frequency signals drive with the duty cycle between 80% and 100%.
14. method according to claim 11, the part of said CW of wherein instantaneous cutting or accurate CW laser beam comprises:
With said CW or accurate CW laser beam direction acousto-optic modulator AOM; And
Drive said AOM with the radio frequency triggering signal, said RF triggering signal comprises having corresponding to the instantaneous width of said pulse train and the pulse of pulse recurrence rate.
15. method according to claim 14, wherein said pulse recurrence rate is in the scope up to 1 MHz.
16. method according to claim 14, it further comprises through an above pulse in the said RF triggering signal of shaping and comes each said first serial laser pulse and at least one different shaped laser pulses of said second series laser pulse in the said pulse train of shaping.
17. method according to claim 16; Wherein shaping comprise change said pulse train the transient pulse width of said at least one different shaped laser pulses of each said first serial laser pulse and said second series laser pulse, wherein the transient pulse width of said at least one different shaped laser pulses of each said first serial laser pulse and said second series laser pulse is to compare with the transient pulse width of remaining said first serial laser pulse and remaining said second series laser pulse.
18. method according to claim 16; Wherein shaping is included in the predetermined period of time CW component of the remaining said first serial laser pulse of said pulse train and remaining said second series laser pulse changed into and is higher than threshold value, and the CW component of said at least one different shaped laser pulses of each said first serial laser pulse and said second series laser pulse is reduced to said threshold value.
19. method according to claim 16, wherein shaping further comprises the said first serial laser pulse and the interior duty cycle of said second series laser pulse that optionally is adjusted in said pulse train.
20. a laser processing system, it comprises:
Be used to produce first member of continuous wave CW laser beam;
Be used for producing second member of the remainder of first pulse train, second pulse train and said continuous wave CW laser beam from said continuous wave CW laser beam;
Be used for the 3rd member with said first pulse train and the said second pulse train shaping, the shaping of wherein said first pulse train comprises:
According to of a plurality of first shapings for laser pulse of first shape with said first pulse train; And
According to second shaping for laser pulse of second shape with said first pulse train, wherein said first shape is different from said second shape to increase the coupling efficiency to the said pulse train of the primary importance on the target material; And
The 4th member; It is used for said first pulse train of the first deflection angle deflection; So that with the primary importance on the said first pulse train illumination target material; And be used for said second pulse train of the second deflection angle deflection, so that with said second pulse train second place on the said target material of throwing light on.
21. system according to claim 20, it further comprises the 5th member that is used for producing from the remainder of said continuous wave CW laser beam the 3rd pulse train and the 4th pulse train.
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| US88688107P | 2007-01-26 | 2007-01-26 | |
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| US11/949,534 | 2007-12-03 | ||
| US11/949,534 US7817685B2 (en) | 2007-01-26 | 2007-12-03 | Methods and systems for generating pulse trains for material processing |
| PCT/US2007/086790 WO2008091446A1 (en) | 2007-01-26 | 2007-12-07 | Methods and systems for generating pulse trains for material processing |
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| TWI594828B (en) | 2009-05-28 | 2017-08-11 | 伊雷克托科學工業股份有限公司 | Acousto-optic deflector applications in laser processing of features in a workpiece, and related laser processing method |
| JP5552373B2 (en) * | 2010-06-02 | 2014-07-16 | 浜松ホトニクス株式会社 | Laser processing method |
| KR102253017B1 (en) * | 2010-10-22 | 2021-05-20 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | Laser processing systems and methods for beam dithering and skiving |
| DE102010044128A1 (en) * | 2010-11-18 | 2012-05-24 | Bundesdruckerei Gmbh | Laser apparatus and method for processing objects with a controllable in the pulse energy laser |
| TWI473373B (en) | 2012-11-30 | 2015-02-11 | Ind Tech Res Inst | The apparatus of generating pulse train with tunable spacing time |
| CN104332809B (en) * | 2014-08-25 | 2015-08-26 | 深圳市创鑫激光股份有限公司 | Based on the adjustable pulse width pulse optical fiber of acoustooptic switch |
| JP6682148B2 (en) * | 2016-12-13 | 2020-04-15 | 住友重機械工業株式会社 | Laser pulse cutting device and cutting method |
| EP3650805A1 (en) * | 2018-11-07 | 2020-05-13 | Universität Bayreuth | Method and device for in situ process monitoring |
| CN111525385B (en) * | 2020-07-02 | 2020-12-18 | 武汉华锐超快光纤激光技术有限公司 | High-precision pulse POD control method and circuit of femtosecond fiber laser |
| CN111999958B (en) * | 2020-08-25 | 2022-09-16 | 华中科技大学 | Laser beam splitting device and method based on cascade acousto-optic deflection |
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| US5909278A (en) * | 1996-07-29 | 1999-06-01 | The Regents Of The University Of California | Time-resolved fluorescence decay measurements for flowing particles |
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| US5191466A (en) * | 1991-08-26 | 1993-03-02 | Optrotech Ltd. | High resolution two-directional optical scanner |
| US5909278A (en) * | 1996-07-29 | 1999-06-01 | The Regents Of The University Of California | Time-resolved fluorescence decay measurements for flowing particles |
| US6521866B1 (en) * | 1999-01-14 | 2003-02-18 | Hitachi Via Mechanics, Ltd. | Laser beam machining and laser beam machine |
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