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CN101447543B - Light-emitting device and lighting device - Google Patents

Light-emitting device and lighting device Download PDF

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Publication number
CN101447543B
CN101447543B CN2008101797631A CN200810179763A CN101447543B CN 101447543 B CN101447543 B CN 101447543B CN 2008101797631 A CN2008101797631 A CN 2008101797631A CN 200810179763 A CN200810179763 A CN 200810179763A CN 101447543 B CN101447543 B CN 101447543B
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CN
China
Prior art keywords
light
transmission portion
light transmission
emitting component
mentioned
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Expired - Fee Related
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CN2008101797631A
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Chinese (zh)
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CN101447543A (en
Inventor
田渊智也
三宅彻
作本大辅
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Kyocera Corp
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Kyocera Corp
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Priority claimed from JP2005016054A external-priority patent/JP3898721B2/en
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN101447543A publication Critical patent/CN101447543A/en
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Publication of CN101447543B publication Critical patent/CN101447543B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Abstract

The invention discloses a light-emitting device and a lighting device. The light-emitting device comprises a base where a wiring conductor is formed over the top to bottom surfaces or over the top to side surfaces, a light-emitting element mounted on the top surface of the base and electrically connected to the wiring conductor, a first light-transmitting section covering the light-emitting element, a second light-transmitting section disposed over the first light-transmitting section, covering the first light-transmitting element, and made of a light-transmitting material containing a phosphor for converting the wavelength of the light emitted from the light-emitting element and a third light-transmitting section interposed between the first and second light-transmitting sections. The following relations are satisfied: n3<n1 and n3<n2 where n1 is the refractive index of the first light-transmitting section, n2 is that of the second light-transmitting section, and n3 is that of the third light-transmitting section. With this constitution, a high light extraction efficiency, a high radiated light intensity, a high axial direction luminous intensity, and a high luminance can be realized.

Description

Light-emitting device and lighting device
The application's application number that to be the applicant proposed on 07 27th, 2005 be 200580048431.4 (international application no PCT/JP2005/013749), denomination of invention is the dividing an application of international application of light-emitting device and lighting device, the date that this application enters country's stage is on 08 17th, 2007.
Technical field
The present invention relates to a kind ofly utilize fluorophor that the light that is sent by light-emitting component is carried out conversion and be transmitted into outside light-emitting device and the lighting device that uses this.
Background technology
Figure 18 shows the light-emitting device 211 that is used to place light-emitting diode light-emitting components 214 such as (LED) in the past.As shown in Figure 18, light-emitting device has the 212a of mounting portion at the central portion mounting light-emitting component 214 of upper surface, and mainly be made of following device: promptly matrix 212, it is made of the insulator that is formed with distribution conductor (not shown), and described distribution conductor is made of lead terminal that conducts connection inside and outside reaching the 212a of mounting portion from its periphery to light-emitting device or metallization distribution etc.; And housing 213, it is adhesively fixed on the upper surface of matrix 212, and is formed with the through hole that is used to place light-emitting component 214 at central portion, and is made of metal, number fat or pottery etc.
Matrix 212, it is made of resins such as pottery such as aluminum oxide sintered body (aluminium oxide ceramics) or aluminium nitride based sintered material, mullite (system ラ イ ト) based sintered material, glass ceramics or epoxy resin.Under the situation that matrix 212 is made of pottery, the surface forms the metallization wiring layer by high-temperature firing by the metal thickener of tungsten (W), molybdenum (Mo)-manganese formations such as (Mn) thereon.And under the situation that matrix 212 is made of resin, when matrix 212 being carried out die casting (モ-Le De) moulding, the mode that the lead terminal that is made of copper (Cu) or iron (Fe)-nickel (Ni) alloy protrudes with an end is fixed in the inside of matrix 212.
In addition, housing 213 is made of resins such as pottery such as metals such as aluminium (Al) or Fe-Ni-Co alloy, aluminum oxide sintered body or epoxy resin, and by cut or formation such as mould molding, extrusion molding.And, form at the central portion of housing 213: be accompanied by towards the top and the through hole of expansion laterally, cover metals such as cloth Al at this inner peripheral surface by evaporation or plating method under the situation that the reflection of light rate of inner peripheral surface of through hole improves making.And, housing 213 is incorporated into the upper surface of matrix 212 by flux materials such as scolding tin, silver soldering agent or resin adhesive etc.
And, by connecting line (bonding wire) the distribution conductor (not shown) of matrix 212 surface formation and the electrode of light-emitting component 214 are electrically connected, then, after the surface of light-emitting component 214 forms luminescent coating 217, fill transparent resin 215 and thermmohardening by inboard at housing 213, can be constructed as follows such light-emitting device: promptly come the light of self-emission device 214 to carry out wavelength conversion, and will have the light taking-up of the wavelength spectrum of hoping by 217 pairs of luminescent coatings.In addition,, select emission wavelength to comprise the material of the ultraviolet region of 300～400nm, and tone is freely designed by the blending ratio of adjusting comprise in the luminescent coating 217 red, blue, green this trichromatic fluorophor particle as light-emitting component 214.
In addition, fluorophor particle is a powder usually, is difficult to form luminescent coating 217 separately by fluorophor, and the therefore common surface of sneaking into fluorophor particle and be applied to light-emitting component 214 in transparent components such as resin or glass forms luminescent coating 217.
Patent documentation 1: specially permit communique No. 3065263
Patent documentation 2: the spy opens communique 2003-No. 110146
For the situation of in the past light-emitting device 211, there are the following problems point: promptly carry out behind the wavelength conversion light that the downside to luminescent coating 217 sends by luminescent coating 217 and from the luminous back of light-emitting component by the upper surface of luminescent coating 217 light to the downside emission, reflect repeatedly in the inboard of housing 213 and decay, and absorbed by matrix 212 or light-emitting component 214, as a result, light loss significantly increases.
In addition, there are the following problems point: promptly from light-emitting component 214 obliquely upward to the light that sends, and can't help housing 213 and reflect, and in the outside of light-emitting device 211 with bigger emission angle emission, so emission angle is big and axle to go up luminosity lower.
Therefore, the present invention finishes in view of the problem points of above-mentioned conventional art, and its purpose is taken out efficient for a kind of raising light is provided, and luminous intensity and high light-emitting device and the lighting device of brightness on the emitted luminescence intensity, axle.
Summary of the invention
Light-emitting device involved in the present invention has: matrix; Light-emitting component, it is installed on the above-mentioned matrix; Reflecting surface, it centers on above-mentioned light-emitting component, and is arranged on the above-mentioned matrix; The 1st light transmission portion, it coats above-mentioned light-emitting component, and is arranged on the inboard of above-mentioned reflecting surface; The 2nd light transmission portion, it is arranged on the top of above-mentioned the 1st light transmission portion, and the light wavelength that above-mentioned light-emitting component radiated is carried out conversion; And gas blanket, it is arranged between above-mentioned the 1st light transmission portion and above-mentioned the 2nd light transmission portion, the lower surface of above-mentioned the 2nd light transmission portion has the face shape along the upper surface of above-mentioned the 1st light transmission portion, on the whole above-mentioned upper surface of above-mentioned the 1st light transmission portion, the distance between the above-mentioned lower surface of the above-mentioned upper surface of above-mentioned the 1st light transmission portion and above-mentioned the 2nd light transmission portion all is identical.
Light-emitting device involved in the present invention has:
Matrix, it extends and formation distribution conductor to lower surface or side from upper surface;
Light-emitting component, its mounting be in the upper surface of described matrix, and be electrically connected with described distribution conductor;
The 1st light transmission portion, it coats described light-emitting component;
The 2nd light transmission portion, it is located at the top of the 1st light transmission portion in the mode that covers described the 1st light transmission portion, and by in translucent material, contain to described light-emitting component the luminous light fluorophor that carries out wavelength conversion constitute;
The 3rd light transmission portion, it is located between described the 1st light transmission portion and described the 2nd light transmission portion, and, the refractive index of described the 1st light transmission portion is made as n1, the refractive index of the 2nd light transmission portion is made as n2, when the refractive index of the 3rd light transmission portion is made as n3, satisfies the relation of n3＜n1 and n3＜n2.
In addition, in invention, be preferably, described the 3rd light transmission portion is made of gas blanket.
In addition, in invention, be preferably, with the lower surface of described the 2nd light transmission portion mutually in succession mode form the 4th light transmission portion with refractive index n 4, and refractive index n 2, n4 satisfy n2 the relation of n4.
In addition, in invention, be preferably, the 1st light transmission portion is made of silicones.
In addition, in invention, be preferably, the 2nd light transmission portion is made of the silicones that contains fluorophor.
In addition, in invention, be preferably, the upper surface peripheral part at described matrix has: the reflecting member that engages in the mode that holds described light-emitting component, this reflecting member has the inner peripheral surface of light reflective.
In addition, in invention, be preferably, the shape of the upper surface of described the 1st light transmission portion is a concave shape.
In addition, in invention, be preferably, the shape of the upper surface of described the 1st light transmission portion is a convex-shaped.
In addition, in invention, be preferably, only form the 1st light transmission portion in the upper surface and the side of described light-emitting component.
In addition, in invention, be preferably, described light-emitting component is emitted in the light that near ultraviolet region or ultraviolet region have main glow peak.
In addition, in invention, with above-mentioned each light-emitting device of being put down in writing of invention as light source.
According to the present invention, the 2nd permeability portion of containing fluorophor, with low the 3rd light transmission portion of refractive index ratio the 2nd permeability portion mutually in succession, therefore, after the fluorophor that contains in utilizing the 2nd light transmission portion carries out wavelength conversion, the light that sends from the downward side direction of fluorophor and by the lower surface total reflection of the light of the downward side direction reflection of the upper surface of the 2nd light transmission portion by the 2nd light transmission portion, and light is advanced towards the top.Therefore, emitted luminescence intensity improves.
In addition, to the light of the inner incident of light-emitting device,, therefore can suppress the deterioration of the member that causes by exterior light, for example the deterioration of the intensity of the 1st light transmission portion or transmitance, adhesive strength from the outside by the interface institute total reflection of the 2nd light transmission portion and the 3rd light transmission portion.
In addition, because covering the 2nd light transmission portion that all mode settings of the 1st light transmission portion are contained fluorophor, therefore the light that penetrates from light-emitting component does not leak and incides the 2nd light transmission portion and by wavelength conversion diffusingly, so the luminous efficiency raising.In addition, and then, owing to not only utilize the part of the 2nd light transmission portion that light is carried out wavelength conversion, and the light after comprehensive emission wavelength conversion of the 2nd light transmission portion, therefore can in light-emitting area, suppress the look inequality.
In addition, as the 3rd light transmission portion, being preferably by refractive index is that about 1.0 gas blanket constitutes, with filling refractive index is that the situation of about 1.5 resin etc. is compared, after carrying out wavelength conversion by the fluorophor that contains in the 2nd light transmission portion, the light that sends from the downward side direction of fluorophor and by the light of the downward side direction reflection of the upper surface of the 2nd light transmission portion can be more by the lower surface institute total reflection of the 2nd light transmission portion, and light is advanced upward.
In addition, by between from the external environment condition to the light-emitting component, gas blanket being set, can access insulation effect.For this reason, can suppress to be delivered to light-emitting component from the heat of external environment condition.As a result, suppress the wavelength variation that the temperature change by light-emitting component causes, thereby can suppress the look change of the light that sends from light-emitting device.
In addition, form the 4th light transmission portion by mode with refractive index n 4 with the lower surface of the 2nd light transmission portion of containing fluorophor in succession, even the lower surface in the 2nd light transmission portion exposes fluorophor particle, this fluorophor particle that exposes is also covered by the 4th light transmission portion.Therefore, the light from fluorophor sends by the reflection well of the interface of the 4th light transmission portion and the 3rd light transmission portion institute, can prevent light loss.
In addition, because the refractive index n 4 of refractive index n 2 to the 4 light transmission portions of the 2nd light transmission portion is big, thereby tail off the taking-up efficient raising of light in the reflection of light of advancing the upward at the interface loss of the 2nd light transmission portion and the 4th light transmission portion.
In addition, by refractive index ratio the 2nd light transmission portion is little, the 4th big light transmission portion of refractive index ratio the 3rd light transmission portion is arranged at the lower surface of the 2nd light transmission portion, can make a part at the light that is undertaken by the 2nd light transmission portion advancing behind the wavelength conversion downwards, the interface institute of can't help to contain the 2nd light transmission portion of fluorophor and the 4th light transmission portion advances to the 4th light transmission portion reflectingly.Therefore can relax the diffuse reflection that is enclosed in the light in the 2nd light transmission portion.
For this reason, the light after the diffuse reflection does not concentrate on the 2nd light transmission portion, has suppressed the light deterioration (deteriorations of moisture-proof and transmitance, adhesive strength etc.) of the 2nd light transmission portion.And, incide the wavelength conversion light of the 4th light transmission portion from the 2nd light transmission portion, with gas blanket at the interface by more highland reflection of efficient, therefore, for example, can more effectively wavelength conversion light be fetched into the light-emitting device outside by circumferential arrangement reflecting member in the 2nd light transmission portion and the 4th light transmission portion.
In addition, be preferably, the 1st light transmission portion is formed by silicones etc.Because silicones is difficult to deterioration with respect to ultraviolet ray, so sealing reliability improves, thus can suppress luminous efficiency along with time lapse deterioration.
In addition, be preferably, the 2nd light transmission portion is made of the silicones that contains fluorophor.Because silicones is difficult to deterioration for ultraviolet ray, so sealing reliability improves, thus can suppress luminous efficiency along with time lapse deterioration.
In addition, be preferably,, have the reflecting member that engages in mode, and be preferably the inner peripheral surface that this reflecting member has light reflective around described light-emitting component at the upper surface peripheral part of substrate.Thus, the light that sends from light-emitting component is reflected by light reflection surface, and advances to the light-emitting device top, and therefore luminous directive property improves.
In addition, be preferably, reflecting member is formed by heat conducting material, and the heating area of matrix increases thus, thereby makes the thermal diffusivity of light-emitting device improve.
In addition, be preferably, the upper surface shape of the 1st light transmission portion is a concave.Thus, function is brought into play as the concavees lens that light is spread in the interface of the 1st light transmission portion and the 3rd light transmission portion.For this reason, come the light of self-emission device equably the 2nd light transmission portion all to be shone, the luminescence distribution of light-emitting device is by homogenization.
In addition, be preferably, the upper surface shape of the 1st light transmission portion is a convex-shaped.Thus, function is brought into play as the convex lens that light is focused in the interface of the 1st light transmission portion and the 3rd light transmission portion.For this reason, come the optical efficiency of self-emission device more to incide the 2nd light transmission portion in the highland, the luminous intensity of light-emitting device improves.
In addition, be preferably, only the 1st light transmission portion be set in the upper surface and the side of described light-emitting component.Owing to come the major part of the light of self-emission device to send from the upper surface and the side of light-emitting component, therefore can suppress the reflection of upper surface and side, the taking-up efficient of light improves.
In addition, be preferably, described light-emitting component has main glow peak near ultraviolet region or ultraviolet region.Thus, be issued to outside visible light, all from having been carried out the light behind the wavelength conversion by the fluorophor that is contained in the 2nd light transmission portion.As a result, when the colour mixture ratio of design light, come the influence of the light of self-emission device to diminish, only the composition adjustment by fluorophor gets final product.
Therefore in addition,, provide a kind of light to take out efficient and raise owing to lighting device involved in the present invention uses above-mentioned light-emitting device as light source, and luminosity and the high lighting device of brightness on the emitted luminescence intensity, axle.
Description of drawings
Figure 1A is the profile of expression the 1st execution mode of the present invention.
Figure 1B is the profile of expression the 1st execution mode of the present invention.
Fig. 2 is the profile of expression the 2nd execution mode of the present invention.
Fig. 3 A is the profile of expression the 3rd execution mode of the present invention.
Fig. 3 B is the profile of expression the 3rd execution mode of the present invention.
Fig. 4 is the profile of expression the 4th execution mode of the present invention.
Fig. 5 is that expression the 1st light transmission portion is the profile of hemispheric example.
Fig. 6 is the example of mounting is carried out in expression to lentiform lid a profile.
Fig. 7 is the profile of thin example of expression the 3rd light transmission portion.
Fig. 8 is the profile of expression the 5th execution mode of the present invention.
Fig. 9 is that expression light transmission member is the profile of hemispheric example.
Figure 10 is that expression light transmission member is the profile of the example of curve form.
Figure 11 is the profile of expression the 6th execution mode of the present invention.
Figure 12 dissects stereogram to each light transmission portion abridged of light-emitting device shown in Figure 11.
Figure 13 is illustrated in the profile of example that the matrix lower surface is provided with the lead terminal of L font.
Figure 14 is the vertical view of expression with an example of the lighting device of array-like arrangement light-emitting device involved in the present invention.
Figure 15 is the cutaway view of the described lighting device of Figure 14.
Figure 16 represents the vertical view with other examples of the lighting device of toroidal arrangement light-emitting device involved in the present invention.
Figure 17 is the profile of lighting device shown in Figure 16.
Figure 18 is a profile of representing an example of light-emitting device in the past.
Among the figure: 1-light-emitting device, 2-matrix, 3-housing, 3a-reflecting surface, 3b-grooving portion, 4-light-emitting component, 5-the 1 light transmission portion, 6-the 4 light transmission portion, 7-the 2 light transmission portion, G-the 3rd light transmission portion, 9-reflection instrument, 10-light emitting device drive circuit substrate, 14-elastic component, 17-conductivity connecting elements, 18-conductive path, 21-lead terminal.
Execution mode
(the 1st execution mode)
Figure 1A and Figure 1B are the profiles of expression the present invention the 1st execution mode.At first, shown in Figure 1A like that, light-emitting device 1 is made of matrix 2, the 7, the 3rd G of light transmission portion of the 5, the 2nd light transmission portion of light-emitting component the 4, the 1st light transmission portion etc.
On matrix 2, be formed extended at both sides the distribution conductor that is used for to light-emitting component 4 supplying electric currents to lower surface or side from upper surface.
Light-emitting component 4, according to the mode that is electrically connected with the distribution conductor of matrix 2, mounting is in the upper surface of matrix 2.
The 1st light transmission portion 5 is formed by translucent material, and light-emitting component 4 is covered.
The 2nd light transmission portion 7, by contain to light-emitting component 4 the luminous light translucent material that carries out the fluorophor of wavelength conversion formed, and be arranged at the top of the 1st light transmission portion 5 in the mode that covers the 1st light transmission portion 5.
The 3rd G of light transmission portion is set between the 1st light transmission portion 5 and the 2nd light transmission portion 7.
The 5, the 2nd light transmission portion 7 of the 1st light transmission portion and the 3rd G of light transmission portion, forming with light-emitting component 4 is the curved surface shape at center.
In the present embodiment, the refractive index of the 1st light transmission portion 5 is made as n1, the refractive index of the 2nd light transmission portion 7 is made as n2, when the refractive index of the 3rd G of light transmission portion is made as n3, with selected the 5, the 2nd light transmission portion 7 of the 1st light transmission portion of mode of the relation that satisfies n3＜n1 and n3＜n2 and the material of the 3rd G of light transmission portion.
Specifically, 1.41～1.52), epoxy resin (refractive index: 1.55～1.61), acrylic resin (refractive index: about 1.48), fluororesin (refractive index: about 1.31), polycarbonate resin (refractive index: about 1.59), poly-(acyl) imide resin (refractive index: about 1.68) etc. as the 1st light transmission portion 5, can use silicones (refractive index:.
In addition, as the 2nd light transmission portion 7,1.41～1.52), epoxy resin (refractive index: 1.55～1.61), acrylic resin (refractive index: about 1.48), fluororesin (refractive index: about 1.31), polycarbonate resin (refractive index: about 1.59) etc. can use silicones (refractive index:, and the fluorophor as being contained in the 2nd light transmission portion 7 can use: La 2O 2S:Eu, LiEuW 2O 8, ZnS:Ag, SrAl 2O 4: Eu, ZnS:Cu, Al, ZnCdS:Ag, ZnS:Cu, (BaMgAl) 10O 12: Eu, SrCaS:Eu, (Sr, Ca, Ba, Mg) 10(PO 4) 6Cl 2: Eu etc.
In addition, as the 3rd G of light transmission portion, can use silicones or epoxy resin, fluororesin etc., perhaps the institutes such as gas blanket that are made of air etc. constitute.Under any circumstance, with the mode selected material of the relation that satisfies n3＜n1 and n3＜n2.For example, have from the ultraviolet region to the near ultraviolet region at the light that sends from light-emitting component under the situation of main glow peak, can use the silicones of from ultraviolet region to the near ultraviolet region transmitance higher and difficult generation xanthochromia or strength deterioration, this moment is as the 1st and the 2nd light transmission portion 5,7, can use refractive index is 1.52 silicones, as the 3rd light transmission portion, the use refractive index is 1.41 silicones.Thus, can constitute light-emitting device of the present invention.
By this structure, the 2nd light transmission portion 7 of containing fluorophor, in succession in the 3rd lower G of light transmission portion of refractive index ratio the 2nd light transmission portion 7, utilize the fluorophor that contains in the 2nd light transmission portion 7 to carry out behind the wavelength conversion light that sends from the downward side direction of fluorophor thus and by the major part of the light of the downward side direction reflection of the upper surface of the 2nd light transmission portion 7, by means of total reflection etc. and reflected, and light is advanced towards the top by the lower surface of the 2nd light transmission portion 7.
In addition, from the outside to the major part of the light of the inner incident of light-emitting device, reflected by the interface of the 2nd light transmission portion 7 and the 3rd G of light transmission portion by means of total reflection, the deterioration that therefore can suppress the member that causes by exterior light, for example, the deterioration of the intensity of the 1st light transmission portion 5, transmitance, adhesive strength.
Therefore in addition, owing to the 2nd light transmission portion 7 of containing fluorophor with the mode setting that covers the 1st light transmission portion 5 integral body, the light that sends from light-emitting component 4 does not leak and incides the 2nd light transmission portion 7 diffusingly and carry out wavelength conversion, so the luminous efficiency raising.
In addition, as the 3rd G of light transmission portion, being preferably by refractive index is that about 1.0 gas blanket constitutes, with filling refractive index is that the situation of about 1.5 resin etc. is compared, behind the fluorophor wavelength conversion that in by the 2nd light transmission portion 7, contains, the light that sends from the downward side direction of fluorophor and reflected by the lower surface of the 2nd light transmission portion 7 more by the major part of the light of the downward side direction reflection of the upper surface of the 2nd light transmission portion 7, and light is advanced upward.
In addition, by from the external environment condition to the light-emitting component, as the 3rd G of light transmission portion gas blanket being set between 4, and can access insulation effect.For this reason, can suppress to be delivered to light-emitting component 4 from the heat of external environment condition.As a result, the wavelength variation that is caused by the temperature change of light-emitting component 4 is suppressed, thereby suppresses the look change of the light that sends from light-emitting device.
In addition, in the present embodiment, be preferably the thickness almost fixed of the 3rd G of light transmission portion.The thickness of the 3rd G of light transmission portion is equivalent to the distance between the lower surface of the upper surface of the 1st light transmission portion 5 and the 2nd light transmission portion 7, is preferably, and is in as a whole ± 5% error.
Suppose to exist at the upper surface of the 3rd G of light transmission portion or lower surface concavo-convex etc., and hypothesis thickness almost fixed not then produces refraction in upper and lower surface, and has the possibility of light intensity distributions change.For this reason, by the thickness that makes the 3rd G of light transmission portion is almost fixed, because incide the light intensity distribution of the 2nd light transmission portion 7 does not change from the 1st light transmission portion 5, therefore in the 2nd light transmission portion 7 by the light quantity distribution of wavelength conversion also homogeneous roughly, it is or look uneven to suppress look discrete in the light-emitting area.
Next, in Figure 1B, the shape of matrix 2 is worked hard, the upper surface of the matrix 2 of mounting light-emitting component 4 is smooth, and forms the taper seat that tilts upward to periphery from the upper surface of the substrate 1 of mounting light-emitting component 4.By such inclined plane is set, and make the light points upwards of launching, so the utilization ratio of light improves from light-emitting component 4.
(the 2nd execution mode)
Fig. 2 is the profile of expression the 2nd execution mode of the present invention.Light-emitting device 1 is made of matrix 2, housing 3, the 7, the 3rd G of light transmission portion of the 5, the 2nd light transmission portion of light-emitting component the 4, the 1st light transmission portion etc.
On matrix 2, from the upper surface to the lower surface or to the side, dispose the distribution conductor that is used for to light-emitting component 4 supplying electric currents.
Light-emitting component 4, in the mode that is electrically connected with the distribution conductor of matrix 2, mounting is in the upper surface of matrix 2.
Housing 3 is fixed on the matrix 2, and has with around the acclivitous inner face of the mode of light-emitting component 4.About the inner face of housing 3, the viewpoint from the light utilization ratio is preferably, and has light reflective.
The 1st light transmission portion 5 is formed by translucent material, and light-emitting component 4 is coated.
The 2nd light transmission portion 7, by contain to light-emitting component 4 the luminous light translucent material that carries out the fluorophor of wavelength conversion formed, and above the 1st light transmission portion 5, be provided with in the mode that covers the 1st light transmission portion 5.
The 3rd G of light transmission portion is located between the 1st light transmission portion 5 and the 2nd light transmission portion 7.
The 5, the 2nd light transmission portion 7 of the 1st light transmission portion and the 3rd G of light transmission portion are can access the mode with the sandwich construction of the upper surface almost parallel of matrix 2, the interface with level.
In the present embodiment, the refractive index of the 1st light transmission portion 5 is made as n1, the refractive index of the 2nd light transmission portion 7 is made as n2, when the refractive index of the 3rd G of light transmission portion is made as n3, in the mode of the relation that satisfies n3＜n1 and n3＜n2, select the material of the 5, the 2nd light transmission portion 7 of the 1st light transmission portion and the 3rd G of light transmission portion.Concrete material can use above-mentioned execution mode cited, by these materials are carried out appropriate combination, can satisfy the relation of n3＜n1 and n3＜n2.
By this formation, the 2nd light transmission portion 7 of containing fluorophor, with low the 3rd G of light transmission portion of the refractive index of refractive index ratio the 2nd light transmission portion 7 mutually in succession, therefore the light of launching from the downward side direction of fluorophor after the fluorophor that contains in by the 2nd light transmission portion 7 carries out wavelength conversion and by the major part of the light of the downward side direction reflection of the upper surface of the 2nd light transmission portion 7, by means of total reflection, light is advanced towards the top.
In addition, from the outside to the major part of the light of the inner incident of light-emitting device, by means of total reflection etc. and by being radiated at the interface of the 2nd light transmission portion 7 and the 3rd light transmission portion, the deterioration that therefore can suppress the member that caused by exterior light for example can suppress the deterioration of the intensity of the 1st light transmission portion 5 or refractive index, adhesive strength.
In addition, owing in the mode that covers the 1st light transmission portion 5 integral body the 2nd light transmission portion 7 being set, therefore the light that sends from light-emitting component 4 does not leak and incides the 2nd light transmission portion 7 and by wavelength conversion diffusingly, so the luminous efficiency raising.
In addition, as the 3rd G of light transmission portion, being preferably by refractive index is that about 1.0 gas blanket constitutes, with filling refractive index is that the situation of about 1.5 resin etc. is compared, after the fluorophor that contains in by the 2nd light transmission portion 7 carries out wavelength conversion, can be by the lower surface of the 2nd light transmission portion 7, reflect to the light that sends from the downward side direction of fluorophor with by the most of of light of the downward side direction reflection of the upper surface of the 2nd light transmission portion 7 morely, thereby light is advanced upward.
In addition, by from the external environment condition to the light-emitting component, as the 3rd light transmission portion gas blanket being set between 4, can access insulation effect.Can suppress to be delivered to light-emitting component 4 from the heat of external environment condition for this reason.As a result, the wavelength variation that the temperature change by light-emitting component 4 causes can be suppressed, thereby the look change of the light that sends from light-emitting device can be suppressed.
In addition, in the present embodiment, be preferably, the thickness of the 3rd G of light transmission portion is almost fixed.Be preferably, the thickness of the 3rd G of light transmission portion is equivalent to the distance between the lower surface of the upper surface of the 1st light transmission portion 5 and the 2nd light transmission portion 7, and integral body is in ± 5% error range.
Suppose that it is concavo-convex etc. that the upper surface of the 3rd G of light transmission portion or lower surface exist, and thickness almost fixed not then might produce refraction and make the light intensity distributions change because upper and lower surface.For this reason, by the thickness that makes the 3rd G of light transmission portion is almost fixed, therefore the light intensity distributions that incides the 2nd light transmission portion 7 from the 1st light transmission portion 5 does not change, and by the homogeneous roughly of the light quantity distribution behind 7 wavelength conversions of the 2nd light transmission portion, thereby it is or look uneven to suppress look discrete in the light-emitting area.
(the 3rd execution mode)
Fig. 3 A and Fig. 3 B are the profiles of expression the 3rd execution mode of the present invention.At first, such as shown in Figure 3A, light-emitting device 1 is made of matrix 2, housing 3, the 7, the 3rd G of light transmission portion of the 5, the 2nd light transmission portion of light-emitting component the 4, the 1st light transmission portion etc.
On matrix 2, be formed extended at both sides the distribution conductor that is used for to the light-emitting component supplying electric current to lower surface from upper surface.
Light-emitting component 4, in the mode that is electrically connected with the distribution conductor of matrix 2, mounting is in the upper surface of matrix 2.
Housing 3 is fixed on the matrix 2, and has with the acclivitous inner face of mode around light-emitting component 4.About the inner face of housing 3, the viewpoint from the light utilization ratio is preferably, and has light reflective.
The 1st light transmission portion 5 is formed by translucent material, and light-emitting component 4 is coated.
The 2nd light transmission portion 7, by contain to light-emitting component 4 the luminous light translucent material that carries out the fluorophor of wavelength conversion formed, and above the 1st light transmission portion 5, be provided with in the mode that covers the 1st light transmission portion 5.
The 3rd G of light transmission portion is located between the 1st light transmission portion 5 and the 2nd light transmission portion 7.
In the present embodiment, the refractive index of the 1st light transmission portion 5 is made as n1, the refractive index of the 2nd light transmission portion 7 is made as n2, when the refractive index of the 3rd G of light transmission portion is made as n3, in the mode of the relation that satisfies n3＜n1 and n3＜n2, select the material of the 5, the 2nd light transmission portion 7 of the 1st light transmission portion and the 3rd G of light transmission portion.Concrete material can be used the cited material of above-mentioned execution mode, by these materials are carried out appropriate combination, can satisfy the relation of n3＜n1 and n3＜n2.
In addition, such as shown in Figure 3A, the interface of the upper surface of the lower surface of the 1st light transmission portion 5, the 2nd light transmission portion 7, the 2nd light transmission portion 7 and the 3rd G of light transmission portion has the interface with the upper surface almost parallel of matrix 2, the upper surface shape of the 1st light transmission portion 5, being preferably is concave shape.Thus, function is brought into play as the concavees lens that light is spread in the interface between the 1st light transmission portion 5 and the 3rd G of light transmission portion.For this reason, come the light of self-emission device 4, the 2nd light transmission portion 7 integral body are shone equably, the homogenization that becomes of the luminescence distribution of light-emitting device 1.
Substitute as this, be preferably, like that, the upper surface shape of the 1st light transmission portion 5 is convex-shaped shown in Fig. 3 B.Function is brought into play as the convex lens that light is focused in the interface of the 1st light transmission portion 5 and the 3rd G of light transmission portion thus.For this reason, come the light of self-emission device 4, incide the 2nd light transmission portion 7 effectively, the luminous intensity of light-emitting device 1 improves.
Below, describe at specific embodiment.
(embodiment 11)
Preparation has the upper surface of the matrix of light-emitting component to be formed extended at both sides the tabular aluminium oxide ceramic substrate of the width 15mm * depth 15mm * thickness 1mm of distribution conductor to the outer surface of matrix from mounting.
In addition, mounting has the matrix of light-emitting component, has a pair of circular pad that is connected with the electrode of light-emitting component on upper surface, and by means of by metal layer that Mo-the Mn powder obtains being set and moulding.
In addition, on the surface of this a pair of circular pad, form the Ni coating of thickness 3 μ m and the Au coating of thickness 3 μ m by electroplating method.
And at the upper surface of aforesaid substrate, with around the mode of light-emitting component, by the bonding material that is formed by acrylic resin, adhesion is by the reflecting member of the shelly that the surface of 15mm * 15mm * thickness 5mm is carried out Al (aluminium) formation behind the chemical grinding.In addition, this reflecting member has following such through hole: i.e. the interior week footpath φ of bottom 1Be 5mm, the footpath φ of interior week of upper end 2Be 10mm, and inner peripheral surface forms along with to the upper end and the inclined plane of the linearity of broadening.
Next, on above-mentioned circular pad, utilize silver-colored thickener and the electrode of fixing following a pair of light-emitting component like that: promptly send the black light that the wavelength of 405nm is had peak value, be of a size of 0.35mm * 0.35mm * thickness 0.1mm, and constitute by nitride-based compound semiconductor.
Use the 1st light transmission portion 5 of refractive index n 1=1.41 that coating machine (dispenser) will silicones be made of drip, thereby in the mode of covering luminous element in the inboard of reflecting member reach thickness 2.5mm thereafter.
On the other hand, form: in epoxy resin, contain La 2O 2S:E U(red-emitting phosphors), ZnS:Cu, Al (green-emitting phosphor), (BaMgAl) 10O 12: the refractive index n 2=1.55 of Eu (blue emitting phophor), thickness are the 2nd tabular light transmission portion 7 of 0.5mm.And in the mode that covers the 1st light transmission portion 5 integral body the 2nd light transmission portion is disposed at the top of the 1st light transmission portion 5, and by with the bonding light-emitting device that forms of reflecting member.At this moment, the 1st light transmission portion 5 and the 2nd light transmission portion 7, in the mode in the gap of vacating 2mm and be provided with, this gap is as the 3rd G of light transmission portion of refractive index n 3=1 and bring into play function.Also be same in following embodiment.
(embodiment 12)
Except being the 4th tabular light transmission portion 6 0.5mm, that be formed at refractive index n=1.41 that constitute by silicones with thickness, be close to beyond the lower surface of the 2nd light transmission portion 7, similarly to Example 11, form light-emitting device.Here, the refractive index n 4 of the 4th light transmission portion 6 is compared less with the refractive index of the 2nd light transmission portion 7, but different with embodiment 11.
(comparative example 11)
The 1st light transmission portion 5 is filled in the inside of the light-emitting device that is surrounded except inner peripheral surface and the 2nd light transmission portion 7 at reflecting member, and is not provided with outside the 3rd G of light transmission portion and the 4th light transmission portion 6, forms light-emitting device similarly to Example 12.
When the full amount of beam of each embodiment 11,12 and comparative example 11 is measured, the full amount of beam of embodiment 11, with respect to comparative example 11 approximately more 3% degree, the full amount of beam of embodiment 12, with respect to comparative example 11, approximately more 7% degree.Therefore, can confirm that embodiment 11 compares with comparative example 11 with embodiment 12, luminous efficiency is good.
(the 4th execution mode)
Fig. 4 is the profile of expression the present invention the 4th execution mode.Light-emitting device 1 is made of matrix 2, housing 3, light-emitting component the 4, the 1st the 7, the 3rd G of light transmission portion of the 5, the 2nd light transmission portion of light transmission portion and the 4th light transmission portion 6 etc.
Matrix 2 is made of resin such as pottery, epoxy resin such as aluminium oxide ceramics, aluminium nitride based sintered material, mullite (system ラ イ ト) based sintered material, glass ceramics or metal, and brings into play function as the supporting member that light-emitting component 4 is supported.
Matrix 2 is under the situation of pottery, is used to be electrically connected upper surface or its periphery formation of the distribution conductor (not shown) of light-emitting component 4 at matrix 2.This distribution conductor exports to the outer surface of matrix 2 and is connected in external circuit substrate 4, and light-emitting component 4 and external circuit substrate are realized being electrically connected thus.
As the method that light-emitting component 4 is connected with the distribution conductor, can use the method that connects by means of lead connects (not shown) or the method for the flip chip that connects by scolding tin pad (not shown) at the lower surface of light-emitting component 4.Be preferably, can connect by flip-chip (flip chip) connected mode.Thus and since can light-emitting component 4 the distribution conductor is set just down, so the upper surface of the matrix 2 of unnecessary periphery at light-emitting component 4 is provided for setting the space of distribution conductor.Therefore, can suppress effectively to be absorbed with the space by the distribution conductor of matrix 2 and make the reduction of luminous intensity, and can make light-emitting device 1 miniaturization from the light that light-emitting component 4 sends.
This distribution conductor is under the situation that matrix 2 is formed by pottery, for example by the metal layer of the metal dust of W, Mo, Cu, silver (Ag) etc. and form.Perhaps, be connected in the through hole that on matrix 2, is provided with by being formed with the input and output terminal that constitutes by insulator of distribution conductor, and embedding, and be provided with.In addition, under the situation that matrix 2 is made of resin, form by burying Fe-Ni-lead terminals such as Co alloy underground.
In addition, also can on the surface that the distribution conductor exposes, cover thick Ni of cloth 1～20 μ m or the gold good metals of corrosion resistance such as (Au), and prevent the oxide etch of distribution conductor effectively, obtain being connected of light-emitting component 4 and distribution conductor simultaneously strongly.Therefore, at the exposing surface of distribution conductor, cover the Ni coating of about 1～10 μ m of cloth thickness and the Au coating of about 0.1～3 μ m of thickness in turn by electroplating method or electroless plating method.
In addition, housing 3 is formed by resins such as potteries such as Al or Fe-Ni-metals such as Co alloy, aluminium oxide ceramics or epoxy resin, and forms by cut, mould molding, extrusion molding etc.
In addition, be preferably, on the surface of the inner peripheral surface of housing 3, its surperficial arithmetic mean roughness Ra is below the 0.1 μ m.The light of light-emitting component 4 can be reflexed to well the upside of light-emitting device 1 thus.Under Ra surpasses the situation of 0.1 μ m, be difficult to reflect light to upside, and reflected by the inside of light-emitting device 1 easily with the inner peripheral surface of the housing 3 of light-emitting component 4.As a result, it is big that the transmission loss of the light of the inside of light-emitting device 1 becomes easily, and be difficult to light is shone with the emission angle of being hoped the outside of light-emitting device 1.
In addition, by in light transmission portions such as epoxy resin, silicones, acrylic resin or glass, sneaking into for example red, blue, green this trichromatic fluorophor, and form the 2nd light transmission portion 7 by coating or mounting at the upper surface of the 2nd light transmission portion.As fluorophor, can use various materials, for example, red can use La 2O 2S:Eu (mixes the La of Eu 2O 2S) fluorophor, green can use ZnS:Cu, Al fluorophor, blue use (BaMgAl) 10O 12: granular materials such as the fluorophor of Eu.In addition, this fluorophor is not limited to a kind of, can cooperate with ratio arbitrarily a plurality of, the luminous wave spectrum of thus can output device hoping to some extent and the light of color.
In addition, the thickness that is preferably the 2nd light transmission portion 7 is 0.1～1mm.Thus, can carry out wavelength conversion expeditiously to the light that sends from light-emitting component 4.If the not enough 0.1mm of the thickness of luminescent coating 7, then from the light that light-emitting component 4 sends, the ratio that does not see through luminescent coating 7 via luminescent coating 7 wavelength conversion ground uprises, and wavelength conversion efficient reduces easily.In addition, if surpass 1mm, then the light that is undertaken behind the wavelength conversion by luminescent coating 7 is absorbed by luminescent coating 7 easily, and emitted luminescence intensity reduces easily.
In addition, the 1st light transmission portion 5 forms in the mode of covering luminous element 4.The 1st light transmission portion 5, can be by less with the refringence of light-emitting component 4 and constitute for the higher material of the light transmission rate from the ultraviolet range to the visible region, for example, the 1st light transmission portion 5, by transparent resins such as silicones, epoxy resin, or formations such as low-melting glass, colloidal sol-gel (ゾ Le-ゲ Le) glass.Thus, can suppress to cause the generation of reflection of light loss because of the refringence of light-emitting component 4 and the 1st light transmission portion 5.
Be preferably, the 1st light transmission portion 5 is made of silicones.Silicones is difficult to deterioration with respect to the light such as ultraviolet light that send from light-emitting component 4, therefore can provide a kind of sealing reliability high light-emitting device.
In addition, be preferably, as shown in Figure 5, the 1st light transmission portion 5 is hemispherical.Thus, the direct of travel of the light that sends from light-emitting component 4 can be vertically formed and the upper surface of the 1st light transmission portion 5 between angle, therefore can take out light expeditiously not by the upper surface total reflection of the 1st light transmission portion 5 ground, and can be as the high light-emitting device 1 of emitted luminescence intensity.
In addition,, can use silicones or epoxy resin, fluororesin etc., perhaps can utilize the gas blanket of forming by air etc. and constitute as the 3rd G of light transmission portion.Under any circumstance, all according to the mode selected material of the relation that satisfies n3＜n1 and n3＜n2.For example, have at exterior domain under the situation of main glow peak, can use in from the ultraviolet region to the near ultraviolet region transmitance higher, and be difficult for producing the silicones of xanthochromia or strength deterioration at the light that sends from light-emitting component.In this case, as the 1st and the 2nd light transmission portion 5,7, the use refractive index is 1.52 silicones, and as the 3rd light transmission portion, the use refractive index is 1.41 silicones.Thus, can constitute light-emitting device of the present invention.
Be preferably, form the 4th light transmission portion 6 at the lower surface of the 2nd light transmission portion 7.Thus,,, can utilize the lower surface of the 4th light transmission portion 6 that the light that sends from fluorophor is carried out total reflection well, and the light skidding that makes progress is advanced by covering these fluorophor that expose with the 4th light transmission portion 6 even fluorophor is exposed to the 2nd light transmission portion 7 lower surfaces.Therefore, can become following such light-emitting device 1: thus promptly light is directly sent by the gap from fluorophor and can prevent that light from being absorbed by matrix 2 and light-emitting component 4, and further improve light and take out efficient.
This 4th light transmission portion 6, also can, according to and the 1st light transmission portion 5 between cover the mode of the 1st light transmission portion 5 across the gap and be provided with, and constitute by the material high with respect to the light transmission rate from the ultraviolet region to the visible region.Like this, owing to the 4th light transmission portion 6 with and the 1st light transmission portion between cover the 1st light transmission portion across the gap mode be provided with, therefore, make when the upper surface of the 1st light transmission portion 5 incides the lower surface of the 4th light transmission portion 6 with the light of wider range outgoing, can be to advancing with respect to the last side direction at matrix 2 right angles.Therefore, in the 2nd light transmission portion 7 integral body, make the optical path length in the 2nd light transmission portion 7 of seeing through approaching, thereby can prevent look inequality effectively by the difference generation of wavelength conversion efficient, launch light well by making 1 of light-emitting device go up directive property, can improve luminosity and brightness on emitted luminescence intensity, the axle.
In addition, because the lower surface of the 4th light transmission portion 6 and the 3rd G of light transmission portion that is made of the lower air layer of refractive index etc. are mutually in succession, the lower surface that therefore can utilize the 4th light transmission portion 6 is to carrying out total reflection by the light of the downward side direction reflection of the upper surface of the 2nd light transmission portion 7 than many parts, can suppress light effectively and be decayed by the inboard interreflection of housing 3 or absorbed, take out efficient and reduce thereby can suppress light effectively by matrix 2 or light-emitting component 4.
In addition, the 3rd G of light transmission portion i.e. gap between the 1st light transmission portion 5 and the 2nd light transmission portion 7 or the gap between the 1st light transmission portion 5 and the 4th light transmission portion 6, as long as the refractive index of the 2nd light transmission portion 7 of ratio the 1st light transmission portion 5 or the 4th light transmission portion 6 or formation luminescent coating is littler, might not be air layer.For example, also can be other gas blankets, also can be the layer of the light transmission portion of low-refraction.
The 4th light transmission portion 6, can constitute by less with the refringence of the 2nd light transmission portion 7 and higher material with respect to the transmitance of the light from the ultraviolet range to the visible region, for example, the 4th light transmission portion 6 is by formations such as transparent resins such as silicones, epoxy resin, low-melting glass, colloidal sol-gel glass.Be preferably, the 4th light transmission portion 6 is and the 2nd light transmission portion 7 identical materials that constitute luminescent coating.Thus, can make light transmission well and further reduce light loss at the interface of the 2nd light transmission portion 7 and the 4th light transmission portion 6, and can prevent effectively: the stress that causes because of the coefficient of thermal expansion differences between the 2nd light transmission portion 7 and the 4th light transmission portion 6 causes peeling off of they.
In addition, be preferably, make the 1st light transmission portion 5 be silicones.Because silicones is difficult to deterioration with respect to the light such as ultraviolet light that send from light-emitting component 4, therefore can provide a kind of sealing reliability high light-emitting device.
In addition, about the thickness of the 1st light transmission portion 5 or the interval (width in gap) of interval (width in gap), the 1st light transmission portion 5 and the 4th light transmission portion 6 between the 1st light transmission portion 5 and the 2nd light transmission portion 7, the thickness of the 4th light transmission portion 6, can suitably select based on the reflection efficiency at the interface of the interface of the 1st light transmission portion 5 and the 2nd light transmission portion 7 or the 1st light transmission portion 5 and the 4th light transmission portion 6 by considering.
In addition, under the identical situation of the thickness of supposition light-emitting device, be preferably, as shown in Figure 7, the thickness of the 3rd G of light transmission portion is the upper surface of the 1st light transmission portion 5 and the interval (width in gap) of the 2nd light transmission portion 7, or the interval of the upper surface of the 1st light transmission portion 5 and the 4th light transmission portion 6 (width in gap), also can be littler than the thickness of the 1st light transmission portion 5.Thus, the thermal coefficient of expansion by dwindling the gap also absorbs the stress that is caused by the thermal expansion between the crack fully by the 1st light transmission portion 5, and can prevent from well to change because of the characteristics of luminescence that produces the light-emitting component 4 that stress causes in the light-emitting component 4.
On the other hand, from reducing the viewpoint of light loss, under the identical situation of the thickness of supposition light-emitting device, also can be, the total of the thickness of the 1st light transmission portion 5 and the 2nd light transmission portion 6 (being the thickness of the 1st light transmission portion 5 in the absence of the 2nd light transmission portion 6) is littler than the width between the crack (interval between the interval of the 1st light transmission portion 5 and the 2nd light transmission portion 6 or the 1st light transmission portion 5 and the 2nd light transmission portion 7).Thus, from light-emitting component 4 the luminous light that goes out be issued to outside before and the path passed through, can increase the ratio of the high air layer of transmitance, and it is interior or because of carrying out the transmission loss of the light that diffuse reflection produces repeatedly to suppress to be sealed to light-emitting device.
In addition, also can be as shown in Figure 6 at the upper surface of housing 3, mounting is also fixed the lid 8 that is made of resin transparent components such as (plastics) such as glass, sapphire, quartz or epoxy resin, silicones, acrylic resin, polycarbonate resin, poly-(acyl) imide resins.At this moment, can protect light-emitting component 4, distribution conductor, connection lead, 1st light transmission portion 5, the 4th light transmission portion 6 of mounting, and can carry out hermetic seal, light-emitting component 4 is worked for a long time and stably light-emitting device 1 inside in housing 3 inboards.In addition, by lid being formed the function that lenticular is added optical lens, can make light be fetched into the outside of light-emitting device 1 with the angle of departure, the intensity distributions of being hoped by light being focused on or dispersing.
In addition, the light-emitting device 1 of present embodiment, use by the mode setting that makes 1 device become the configuration of regulation, perhaps with majority with for example clathrate or sawtooth (stagger) shape, radial configuration, perhaps be provided with and use: promptly form the round shape that constitutes by a plurality of light-emitting devices or polygon-shaped light-emitting device group, can become lighting device of the present invention thus with the most groups of concentric shape ground as light source in the mode of the configuration that becomes following such regulation.Thus, can provide a kind of light that improved to take out efficient, and luminosity and the high lighting device of brightness on the emitted luminescence intensity, axle.
In addition, owing to the electronics that utilizes the light-emitting component 4 that constitutes by semiconductor be coupled again and cause luminous, therefore can make and compare low consumpting power and long-life, and can become the small lighting device of heating with the lighting device of in the past use discharge.The result, can suppress the change of the centre wavelength of the light that takes place from light-emitting component 4, and can be, and can become the look inequality that suppressed shadow surface or the lighting device that departs from of Illumination Distribution with light across shining with stable emitted luminescence intensity and emission optic angle degree (luminous intensity distribution distributions) between long-term.
In addition, lighting device of the present invention, not only the mode with the configuration that becomes regulation is provided with a plurality of light-emitting devices 1, also can 1 light-emitting device 1 be set in the mode of the configuration that becomes regulation.
Specific embodiment below is described.
(embodiment 21)
At first, prepare to become the aluminium oxide ceramic substrate of matrix 2.Substrate 2 is the cuboid of wide 8mm * depth 8mm * thickness 0.5mm.
In addition, form the distribution conductor from the outer surface ground that mounting has the upper surface of the matrix 2 of light-emitting component 4 to extend to matrix 2.Mounting has the distribution conductor of upper surface of the matrix 2 of light-emitting component 4, and the metal layer that is made of the Mo-Mn powder and be shaped to the circular pad (pad) of diameter 0.1mm covers the Ni coating of cloth thickness 3 μ m on its surface.In addition, the distribution conductor of the inside of matrix 2 is that so-called through hole forms by the electrical connection section that is formed by the perforation conductor.About this through hole, the also metallised conductors that forms by the Mo-Mn powder and forming.
In addition, connect matrix 2 and housing 3 by bonding agent, then in the mode of covering luminous element 4, and become the hemispheric mode that radius is 0.4mm with inside at housing 3, mounting is that 1.61 epoxy is the 1st light transmission portion 5 that resin constitutes by refractive index, and, to short transverse the gap of 1.1mm is set from the top, sky of this semi-spherical shape, and is that 1.41 silicones constitute, thickness be the tabular 4th light transmission portion 6 of 0.1mm at the interior side bonds of housing 3 by refractive index in the mode that covers the 1st light transmission portion 5 above it.And the upper surface in the 4th light transmission portion 6 is covered the 1st light transmission portion 7 and constitutes light-emitting device 1 of the present invention, and described the 2nd light transmission portion 7 is La by contain redness in the light transmission member that is made of silicones 2O 2S:Eu, green are ZnS:Cu, and Al, blueness are (BaMgAl) 10O 12: the fluorophor that Eu constitutes and forming.
(comparative example 21)
On the other hand, as a comparative example 21, except in the inside of housing 3, outside filling the 1st light transmission portion 5 and constitute with thickness 1.5mm, constitute device with embodiment 21 identical lens.
For so and embodiment 21 and the comparative example 21 made are measured each full amount of beam, the full amount of beam of embodiment 21, with respect to comparative example 21 approximately many 10% the degree that becomes, the method for embodiment 21 is comparatively good as can be known.
(the 5th execution mode)
Fig. 8～Figure 10 is the profile of expression the 5th execution mode of the present invention.Light-emitting device 1 is made of matrix 2, light-emitting component the 5, the 2nd light transmission portion 7 of the 4, the 1st light transmission portion and the 3rd G of light transmission portion.
Matrix 2 is made of resin such as pottery, epoxy resin such as aluminium oxide ceramics, aluminium nitride based sintered material, mullite (system ラ イ ト) based sintered material, glass ceramics or metal, and brings into play function as the supporting member that supports light-emitting component 4.
At matrix 2 is under the situation of pottery, in the upper surface and the peripheral distribution conductor (not shown) that is formed for being electrically connected light-emitting component thereof of matrix 2.This distribution conductor is exported to the outer surface of matrix 2 and is connected with external circuit substrate, thereby realizes the electrical connection of light-emitting component 4 and external circuit substrate.
The 1st light transmission portion 5 is formed by translucent material, and the upper surface of light-emitting component 4 is covered.
The 2nd light transmission portion 7, by contain to light-emitting component 4 the luminous light translucent material that carries out the fluorophor of wavelength conversion formed, and be arranged on the top of the 1st light transmission portion 5 in the mode that covers the 1st light transmission portion 5.
The 3rd G of light transmission portion is located between the 1st light transmission portion 5 and the 2nd light transmission portion 7.
In the present embodiment, the refractive index of the 1st light transmission portion 5 is made as n1, the refractive index of the 2nd light transmission portion 7 is made as n2, when the refractive index of the 3rd G of light transmission portion is made as n3, with selected the 5, the 2nd light transmission portion 7 of the 1st light transmission portion of mode of the relation that satisfies n3＜n1 and n3＜n2 and the material of the 3rd G of light transmission portion.Concrete material can be used the cited material of above-mentioned execution mode, and by these materials are suitably made up, and can satisfy the relation of n3＜n1 and n3＜n2.By satisfying the relation of so setting, can improve the light utilization ratio as described above.
In addition, in Fig. 8～Figure 10, matrix 2 the surface and inner, be formed for making light-emitting device 1 inside and outside conduct the conductive path 18 of metallization connection, that use metal dusts such as W, Mo, Mn etc., this conductive path 18, at the position that the upper surface of matrix 2 exposes, be electrically connected the electrode of light-emitting component 4.In addition, the position that this conductive path 18 exposes in the outside of the lower surface of matrix 2 etc., the lead terminal that constitutes by metals such as Cu, Fe-Ni alloys and being connected with external circuit.Thus, light-emitting component 4 is electrically connected with external circuit by conductive path 18.
In addition, about conductive path 18, also can cover the good metal of thick Ni of about 1～20 μ m of cloth or gold corrosion resistances such as (Au) etc. on its surface of exposing, and can prevent conductive path 18 oxide etches effectively, and can strong conductive path 18 and light-emitting component 4 between electrical connection and the connection between conductive path 18 and the conductivity adhesive member 17.Therefore, be preferably,, cover the Ni coating of about 1～10 μ m of cloth thickness or the Au coating of about 0.1～3 μ m of thickness in turn by electroplating method or electroless plating method at the exposing surface of conductive path 18.
Housing 3 is made of resins such as pottery such as metal, aluminum oxide sintered bodies such as aluminium (Al) or Fe-Ni-cobalt (Co) alloy or epoxy resin, and forms shelly by forming techniques such as cut or mould molding, extrusion moldings.In addition, the central portion of housing 3 forms the through hole that enlarges along with towards the top and laterally, and the inner peripheral surface of through hole is as light reflection surface.
About this light reflection surface,, and cover metals such as cloth Al by utilizing evaporation or galvanoplastic at inner peripheral surface and form by forming techniques such as cut or mould molding, extrusion moldings and with the inner peripheral surface smoothing.And housing 3 by solder material or resin adhesives such as scolding tin, silver solders, and is connected the upside interarea of matrix 2.
Light-emitting component 4 of the present invention connects by flip-chip by means of conductivity connecting elementss 17 such as Au-Sn SnPb63s as Fig. 8～shown in Figure 10, and by means of being connected with the conductive path 18 of the upper surface that is formed at matrix 2 mounting in matrix 2.Perhaps, install by organic adhesives such as inorganic adhesive such as scolding tin or sol-gel glass, low-melting glass or epoxy resin at the upper surface of matrix 2, the electrode of light-emitting component 4 is electrically connected with circuit paths 18 by connecting lead.
And, as Fig. 8～shown in Figure 10, light-emitting component 4 flip-chips are installed under the situation of conductive path 18, also can, there is not the 1st light transmission portion 5 in lower face side at light-emitting component 4, and forms the 3rd G of light transmission portion have the refractive index littler than the 1st light transmission portion 5, to be made of silicones.Thus, the light that sends from light-emitting component 4, advance to the 3rd G of light transmission portion with the bigger lower surface from light-emitting component 4 of refringence and to compare, advancing to the 1st light transmission portion 5 in less upper surface or the side from light-emitting component 4 of refringence, advances more or less freely to the 3rd G of light transmission portion.The result, can prevent following situation effectively: i.e. the light that sends from light-emitting component 4 is positioned at the electrode of light-emitting component below and conductivity connecting elementss 17 such as the scolding tin material that contains Au conductive path 18, that for example Au-Sn alloy is such by connection and is absorbed and make the luminous efficiency reduction.
In addition, among Fig. 8, the 1st light transmission portion 5 is set, above the 1st light transmission portion, the 2nd light transmission portion is set in the mode that covers the 1st light transmission portion integral body at the upper surface of light-emitting component 4.Thus, the light that sends from light-emitting component 4 is advanced well to the top of light-emitting component 4, thereby can the absorption of conductivity connecting elements 17 be suppressed, and by satisfying the relation of n3＜n1 and n3＜n2, can efficient more the highland in the future the light of self-emission device 4 send.
In addition, in Fig. 9 and Figure 10, the upper surface of light-emitting component 4 and side are covered by the 1st light transmission member 5.Thus, can make the light that sends from light-emitting component 4 advance to the top and the side of light-emitting component 4 well, therefore can the absorption of conductivity connecting elements 17 be suppressed, and by satisfying the relation of n3＜n1 and n3＜n2, can efficient more the highland in the future the light of self-emission device 4 send.
In addition, in above-mentioned Fig. 8～Figure 10, be preferably, making the 3rd G of light transmission portion is gas blanket.That is to say, dispose the situation of the transparent material that is made of resin etc. compares as the 3rd G of light transmission portion with downside at light-emitting component 4, do not exist the heat that is produced because of light-emitting component 4 to make the 3rd G of light transmission portion of formation below light-emitting component 4 produce thermal expansion, thus, can suppress to make light-emitting component 4 peel off from conductive path 18 by the stress that thermal expansion produced of the 3rd G of light transmission portion, thereby make to conduct well, and can make the light-emitting device operate as normal.
The 2nd light transmission portion 7, form in the mode that covers the 1st light transmission portion 5 integral body, as its method to set up, can utilize following such method etc. and carry out: will be by after in transparent material, containing the 2nd light transmission portion 7 that fluorophor constitutes and being shaped to the shape of being hoped in advance, across the gap and mounting on the 1st light transmission portion 5, the silicones etc. that perhaps will become the 3rd G of light transmission portion on the 1st light transmission portion 5 is applied to the thickness of being hoped and can carries out thermmohardening in turn, after this, with fluorophor and transparent material mixing after, state with aqueous Wavelength conversion member presoma, use coating machine and form the 2nd light transmission portion 7, and make it sclerosis by baking oven.
In addition, before light-emitting component 4 is connected in matrix 2, the 1st light transmission portion 5 covered and be distributed in light-emitting component 4, can form comparatively simply, therefore more preferred.For example, go up the semiconductor that molecular beam epitaxy (エ ピ) growth is used to form luminescent layers such as n type gallium nitride and p type gallium nitride, after this, can form electrode and obtain the disk of light-emitting component 4 at the disk (ウ エ Ha) of transparency carriers such as sapphire.Then, be coated with the aqueous light transmission member presoma of the 1st light transmission portion 5 that becomes to utilize spin-coating method or spraying process in the state that on supporting members such as UV cured film, attaches the sapphire disk, and can once on a large amount of light-emitting component 4, cover cloth the 1st light transmission portion 5., the sapphire disk is cut to single sheet, and is arranged at matrix 2 by wafer saw thereafter, thus can be easily, at low cost and reproducibility obtain having formed the light-emitting component 4 of the 1st light transmission portion 5 well at upper surface.
Perhaps, the disk of above-mentioned light-emitting component 4 is being cut off and to be separated in the state of single light-emitting component 4 across the compartment of terrain mutually, the 1st light transmission portion 5 once had been located at each light-emitting component 4, thus can be easily, low cost and reproducibility be well with upper surface or upper surface and the side of the 1st light transmission portion 5 around light-emitting component 4.
So before light-emitting component 4 is incorporated into matrix 2, the 1st light transmission portion 5 covered and be distributed in light-emitting component 4, can prevent following situation thus: as with single light-emitting component 4 mountings in light-emitting component places when forming the 1st light transmission portion 5 with encapsulation back, the thickness of the 1st light transmission portion 5 does not become the thickness of being hoped and becomes defective products, and not only light-emitting component 4 even light-emitting component place also becomes useless with encapsulation.Can improve fabrication yield thus.
In addition, in the present embodiment, the 1st light transmission portion 5 is preferably, and as shown in Figure 9, at least a portion that comprises the surface in the zone on the light-emitting component 4 is the curved surface shape.More preferably, the global shape of the 1st light transmission portion 5 is that the center of gravity with the illuminating part of light-emitting component 4 is the hemispherical of center.Thus, can make from light-emitting component 4 and be issued to the direct of travel of light of the 1st light transmission portion 5 and the interface angulation of the 1st light transmission portion 5 and the 3rd G of light transmission portion is similar to 90 degree, thereby can reduce the probability of this interface light reflex significantly.
This hemispheric the 1st light transmission portion 5, extend covering aqueous translucent material presoma in ground from the upper surface of light-emitting component 4 to the side, and act on the surface tension in the bight of light-emitting component 4 by utilization, can realize easily that with light-emitting component 4 be the hemispherical of center, and by becoming the 1st light transmission portion 5 to this sclerosis.In addition, the cube shaped that the shape of the 1st light transmission portion 5 is similar to light-emitting component 4 as far as possible gets final product, the so-called here hemispherical curve form that hemisphere is crooked that also comprises as shown in Figure 10.
In addition, light-emitting device 1 of the present invention, be provided with by the mode that makes 1 device become the configuration of regulation, and light-emitting device 1 of the present invention used as light source, perhaps with majority with for example clathrate or zigzag, radial configuration, perhaps be provided with and light-emitting device 1 of the present invention is used as light source: promptly form the round shape that constitutes by a plurality of light-emitting devices or polygon-shaped light-emitting device group, can become lighting device of the present invention thus with the most groups of concentric shape ground in the mode of the configuration that becomes following such regulation.Therefore by this, owing to utilized luminous that the coupling again of the electronics of the light-emitting component 4 that is made of semiconductor causes, can make than the lighting device of in the past use discharge more low consumption electric power and long-life more, and can access the small lighting device of heating.The result, can become following such lighting device, promptly can suppress the change of the centre wavelength of the light that produces from light-emitting component 4, and can be with across long-term and stable emitted luminescence intensity and emission optic angle degree (luminous intensity distribution distribution) irradiates light, and can suppress the look inequality of shadow surface or departing from of Illumination Distribution.
(the 6th execution mode)
Figure 11 is the profile of expression the 6th execution mode of the present invention.Light-emitting device 1 is made of matrix 2, housing 3, light-emitting component the 4, the 1st the 7, the 3rd G of light transmission portion of the 5, the 2nd light transmission portion of light transmission portion and elastic component 14 etc., constitutes light-emitting component as a whole and places encapsulation.
Housing 3 is installed on the upper surface of matrix 2, has the reflecting surface 3a around light-emitting component 4.Between the outer peripheral face and lower surface of housing 3, form the grooving 3b of portion.
Elastic component 14 is the annular components with section of the word of falling L shape, and the top of elastic component 14 is embedded in the 3b of grooving portion, and the bottom of elastic component 14 is disposed at the side of matrix 2.
The 1st light transmission portion 5 is formed by translucent material, and illuminated component 4 is covered.
The 2nd light transmission member 7, by contain to light-emitting component 4 the luminous light translucent material that carries out the fluorophor of wavelength conversion formed, and above the 1st light transmission portion 5, be provided with in the mode that covers the 1st light transmission portion 5.
The 3rd G of light transmission portion is located between the 1st light transmission portion 5 and the 2nd light transmission portion 7.
In the present embodiment, the refractive index of the 1st light transmission portion 5 is made as n1, the refractive index of the 2nd light transmission portion 7 is made as n2, when the refractive index of the 3rd G of light transmission portion is made as n3, in the mode of the relation that satisfies n3＜n1 and n3＜n2, select the material of the 5, the 2nd light transmission portion 7 of the 1st light transmission portion and the 3rd G of light transmission portion.Concrete material can be used material cited in the above-mentioned execution mode, and by these materials are carried out appropriate combination, can satisfy the relation of n3＜n1 and n3＜n2.By satisfying such relation, as described above, the utilization ratio of light increases.
Matrix 2, as be used to support and the supporting member of element mounted 4 and being used to make light-emitting component 4 exothermic heat the heat release member and bring into play function.At the upper surface of matrix 2, light-emitting component 4 is set by low-melting scolder materials such as resin adhesive or tin (Sn)-lead (Pb) scolding tin, Au-Sn etc.And the heat of light-emitting component 4 is delivered to matrix 2 by resin adhesive or eutectic solder material, and by to outside bulk storage efficiently, can keep the workability of light-emitting component 4 well.In addition, from the light of light-emitting component 4 outgoing, reflected by reflecting surface 3a and be transmitted into the outside.
In addition, matrix 2 is made of potteries such as aluminum oxide sintered body (aluminium oxide ceramics), aluminium nitride based sintered material, glass ceramics.In addition, be formed with near the upper surface of the matrix 2 of mounting light-emitting component 2, extend to that the light-emitting component element places the outside of encapsulation and the distribution conductor of deriving.
In addition, about being formed at the distribution conductor of matrix 2, form by for example metal layers such as W, Mo, Mn, Cu, for example with the metal thickener that in the powder of W etc., adds mixed organic solvents, solvent and obtain, printing is coated with into the pattern of regulation and burns till, and forms on matrix 2 thus.Be preferably,, be used for the connection lead (not shown) that oxidation prevents and cover the Ni layer of cloth thickness 0.5～9 μ m and the metal levels such as Au layer of thickness 0.5～5 μ m by the plating method in order to connect strongly in this distribution surface of conductors.
In addition, housing 3, with at the upper surface of matrix 2 around the mode of light-emitting component 4 and form, and between the lower surface and outer peripheral face of housing 3, form the grooving 3b of portion.And, housing 3 is by metal or formations such as resin, pottery such as Al, stainless steel (SUS), Ag, iron (Fe)-Ni-cobalt (Co) alloy, Fe-Ni alloys, under the situation that housing 3 is made of metal, methods such as utilization grinding are carried out mirror-polishing to inner peripheral surface, therefore can make inner peripheral surface become the reflecting surface 3a that the visible light that sends from light-emitting component 4 can be reflected well.
In addition, under the situation that housing 3 is made of resin or pottery, form metal level at inner peripheral surface, can make inner peripheral surface become the reflecting surface 3a that the visible light that sends from light-emitting component 4 can be reflected well thus by plating or evaporation etc.From the viewpoint of the high reflecting surface 3a of the reflection efficiency of the visible light that can make self-emission device 4 more simply, and can prevent that the viewpoint of corrosion of being caused by oxidation etc. etc. from setting out, be preferably that housing 3 is made of Al or SUS.
In addition, under the situation that this housing 3 is made of metal, apply cut, calendering processing, pull out known in the past metal processing such as drawing processing, can form the shape of afore mentioned rules by billet (ingot) to this material.
Elastic component 14 of the present invention, the material littler than the vertical spring rate of housing 3 by its vertical spring rate constitutes.Be preferably, the vertical spring rate of elastic component 14 be housing 3 vertical spring rate below 1/5 times better.By having the vertical spring rate littler than housing 3, even the heat that produces when on matrix 2 and housing 3, applying light-emitting component 4 work repeatedly or the variations in temperature of external environment condition etc. and matrix 2 and housing 3 are expanded or shrink, also can utilize elastic component 14 to relax the stress that produces by distortion effectively, thereby can reduce the influence that housing 3 is applied significantly.
In addition, about elastic component 14, by top being imbedded the 3b of grooving portion of housing 3, and the bottom is disposed at the side of matrix 2, and be installed on housing 3, and constitute by for example epoxy resin or the contour stable on heating thermosetting resin of liquid crystal polymer (LCP) or thermoplastic resin, the vertical spring rate of elastic component 14 can keep 10[MPa]～20[MPa] value.This is because following cause: promptly by keeping going into the value of vertical spring rate as described above, elastic component 14 becomes fender, even the heat of the generation during light-emitting component 4 work or the variations in temperature of external environment condition etc. repeat to put on matrix 2, also can suppress to produce bigger thermal stress, therefore can suppress to crack on the matrix 2, and can suppress matrix 2 and housing 3 is peeled off.
The result, can be suppressed at bad phenomenon such as electrical connection such as generation broken string grade such as distribution conductor, send and certain from light-emitting component 4 by the pattern of 3 beam reflected of housing (light beam), the emission angle that can realize light is certain, and can make single light beam or be become value and the pattern of being hoped (pattern) by the expressed light intensity distributions of their aggregate.
In addition, if the vertical spring rate of elastic component 14 is than 70[MPa] big value, then be difficult to relax the stress that is produced in light-emitting component 4 adstante febre matrixes 2 and the housing 3, thereby have inappropriate tendency that becomes.In addition, if the vertical spring rate of elastic component 14 is than 5[MPa] little value, then exist 14 pairs of housing 3 support effects of elastic component to diminish, housing 3 stably can not be fixed in the tendency on the matrix 2.Therefore, the vertical spring rate of elastic component 14 is preferably 5[MPa]～70[MPa], 10[MPa more preferably]～20[MPa] value.
In addition, be preferably, such as described in Figure 11, elastic component 14 is being bonded in the upper surface of matrix 2 and is using under the situation of the low elastic component 14 of thermal conductivity ratio housing 3, can utilize the lower elastic component of pyroconductivity to suppress from the heat conduction of matrix 2 to housing 3.For example,, also can relax the stress that produces by distortion, the influence that housing 3 is produced can be reduced significantly by the elastic component 14 that matrix 2 is connected with housing 3 even owing to the heat of light-emitting component 4 makes matrix 2 be out of shape.Therefore, can place from light-emitting component that the light intensity that sends of encapsulation distributes or shadow surface Illumination Distribution in do not produce under the uneven situation, export stable light, and can across between for a long time high reliability and stably make light-emitting device work.
In addition, light-emitting component is being placed encapsulation with outside when being connected the substrate connection, lower surface at matrix 2, external connection terminals is set and connects to observe the mode of protruding to foreign side from matrix 2 from an end, be provided with directly on the connection pads that the lower surface of matrix 2 forms perhaps that conductivity connects material and situation about connecting is more.This wherein is because following cause: promptly for for example as shown in Figure 13, as external connection terminals and be provided with under the situation of L font lead terminal 21 at the lower surface of matrix 2 and elastic component 14, even for example the stress that produces because of the adstante febre of light-emitting component 4 makes the lead terminal 21 of L font touch with matrix 2, the lead terminal 21 of L font contacts with the elastic component 14 of the side that is formed at matrix 2 and can prevent and the contacting of matrix 2, even perhaps touch, its stress also can be cushioned by elastic component 14, therefore can effectively prevent by the lead terminal 21 of L font and the breach that contacts caused matrix of matrix 2, crackle and cracking.As a result, can accommodate light-emitting component 4 airtightly, and can normally and stably make light-emitting component 4 work for a long time.
In addition, under the situation of the lower surface of so lead terminal 21 of L font being located at matrix 2, be preferably, as shown in Figure 13, from the central portion of matrix 2, in the mode of connecting portion in the top of lead terminal 21 stage portion is set, and connects the lead terminal 21 of L font in this stage portion.By the lead terminal 21 of L font is set in stage portion, can suppress the outside short circuit that connects the lead terminal 21 of substrate and L font.
In addition, conductivity directly is set on the connection pads that the lower surface of matrix 2 forms to be engaged material and installs that light-emitting component places encapsulation and the outside is connected under the situation of substrate, even when conductivity is engaged the material fusion, place and extrude conductivity between the encapsulation and engage material from for example outside substrate and the light-emitting component of connecting, and it is upwards soaring along matrix 2, because there is elastic component 14 in the present invention in the part that is housing 3 in the past, so housing 3 is difficult to contact with conductivity joint material.Therefore, even housing 3 is made of metal etc., is not easy contact because housing 3 and conductivity engage material, so can prevents electrical short effectively.
Under the situation that matrix 2 is made of pottery etc., be disposed at the side of matrix 2 and be installed on housing 3 by bottom elastic component 14, by means of the bottom of the elastic component 14 that is positioned at the side, leak the advancing of light of loosing from the side of ceramic matrix 2 to the outside and hindered, can prevent to spill to the outside.As a result, even light-emitting device of the present invention is used as display unit, light also can not thicken, and can access good visibility.
In addition, be preferably between the side of the bottom of elastic component 14 and matrix 2 gap is set, and owing to can make the heat that produces from light-emitting component 4 be delivered to matrix 2, and the gap of heat from matrix 2 and elastic component 14 emitted, therefore better.In addition,, therefore also can further prevent to place the distortion of encapsulation effectively by the light-emitting component that heat causes by improving the deterioration that exothermicity can prevent light-emitting component 4, therefore comparatively preferred.
In addition, more preferably, the 3b of grooving portion of housing 3 also can be along the outer peripheral face of housing 3 and week establishes annularly.Thus, between matrix 2 and housing 3, before establishing the 3b of grooving portion annularly week, there is exosphere capacious, can prevents that the heat that produces is delivered to housing 3 from matrix 2 when light-emitting component 4 work.As a result, can suppress, can prevent effectively that matrix 2 from producing cracking and crackles from the bending moment (bent げ モ-メ Application ト) of housing 3 to matrix 2 transmission.
In addition, and then, the volume of housing 3 can be reduced, and can with matrix 2 and housing 3 mutually in succession area reduce, thereby suppress: the heat that is produced because of light-emitting component 4 when light-emitting device is worked, and the stress of concentrating at the junction surface of matrix 2 and housing 3.As a result, can further suppress matrix 2, or the cracking at matrix 2 and the junction surface of housing 3 and peeling off.
In addition, if establish elastic component 14 annularly week along the outer peripheral face of housing 3, then the lower surface at matrix 2 is provided with external connection terminals in the mode that an end face protrudes from matrix 2 with overlooking, and being placed encapsulation, light-emitting component carries out under the situation of outside connection substrate joint, even the stress that produces because of the adstante febre of for example light-emitting component 4 etc. makes external connection terminals from which location dislocation, elastic component 14 touches matrix 2 and the stress of generation, be cushioned by means of the elastic component 14 that forms ring-type, thus more preferred.As a result, can more effectively prevent breach and crackle in the peripheral part generation of matrix 2 or matrix 2, the generation of cracking etc., and, light-emitting component normally and is stably worked for a long time by light-emitting component 4 is hermetic placed.
In addition, about housing 3, be preferably, only the upper surface of the 3b of grooving portion engages with elastic component 14.Thus, housing 3 is moderately distortion easily, and can be moderately to opening based on the contained of elastic component 12.As a result, even elastic component 14 or matrix 2 are crooked, also can suppress effectively to make housing 3 also crooked because of this is crooked.In addition, also can, between the upper surface of the position of the ratio elastic component 14 more close inboards of the lower surface of housing 3 and matrix 2, form the gap.Can make heat be difficult to transmit to reflecting surface 3a thus from matrix 2, therefore comparatively preferred.
In addition, be preferably, reflecting surface 3a with respect to the upper surface of matrix 2 with 35～70 angle tilt.Thus, can utilize the reflecting surface 3a of inclination that the light of mounting in the light-emitting component 4 of the upper surface of matrix 2 is reflected well, and can with interior scope light be transmitted into the outside well, and can improve to heavens and use light-emitting component of the present invention to place luminous efficiency, brightness and the luminosity of the light-emitting device of encapsulation with emission angle 45 degree.In addition, the emission angle of so-called light, be by light-emitting component 4 the center and perpendicular to the expanded-angle of the light on the plane of matrix 2, if the opening shape in the cross section of housing 3 is a toroidal, then emission angle was fixed across the full week of reflecting surface 3a.In addition, the opening shape in the cross section of housing 3 exists under the situation about departing from of elliptical shape etc., and emission angle is its maximum.
In addition, if the upper surface angulation deficiency of reflecting surface 3a and matrix 2 35 degree, then reflection angle surpasses 45 degree and broadening, and the quantitative change of the light of dispersion is many, the easy step-down of the brightness of light and luminosity.On the other hand, if angle surpasses 70 degree, the light of light-emitting component 4 is not transmitted into the outside that light-emitting component places encapsulation well, and carries out diffuse reflection easily in light-emitting component places encapsulation.
In addition, under the situation that is shaped as inverted cone-shaped of reflecting surface 3a, being preferably across the full upper surface angulation that makes reflecting surface 3a and matrix 2 allly is 35～70 degree.In addition, under the situation that is shaped as tetrapyamid shape of reflecting surface 3a, be preferably, the inner face of facing mutually of at least one pair of tilts with 35～70 degree with respect to the upper surface of matrix 2.Comprehensive upper surface with respect to matrix 2 by means of inner face tilts with 35～70 degree, can improve luminous efficiency significantly.
In addition, be preferably, the arithmetic average roughness Ra of reflecting surface 3a is 0.004～4 μ m.Promptly surpass under the situation of 4 μ m at the arithmetic average roughness Ra of reflecting surface 3a, be difficult to place the light positive reflection that places the light-emitting component 4 in the encapsulation in light-emitting component and shine the top that light-emitting component places encapsulation by making, light intensity decays, and be easy to generate and depart from.In addition, under the situation of calculating mean roughness less than 0.004 μ m of reflecting surface 3a, be difficult to stablize and form this efficiently, the goods cost uprises easily.In addition, for the Ra with reflecting surface 3a places above-mentioned scope, can utilize known in the past electrolytic abrasive polishing, chemical grinding processing or cut and form.In addition, also can adopt: the method that forms by means of the transfer printing processing of the surface accuracy that utilizes mould.
In addition, the joint of the joint of housing 3 and elastic component 14 or housing 3 and matrix 2 can be undertaken by brazing metal material such as resin adhesive, Ag-Cu scolders such as silicon system or epoxy system or scolding tin such as Pb-Au-Sn-Au-Sn-silicon (Si), Sn-Ag-Cu etc.In addition, the bonding material of this binding agent or scolding tin etc. is not as long as material by considering matrix 2 and elastic component 14 and housing 3 and thermal coefficient of expansion etc. and selected are aptly done special qualification.In addition, under the situation of the high reliability of the joint that needs matrix 2 and elastic component 14 and elastic component 14 and housing 3, be preferably, engage better by brazing metal material and scolding tin.
In addition, under the situation of the characteristic of paying attention to light-emitting device, in order to prevent also can to engage thus by riveted joint (か め) method by housing 3 that causes in conjunction with material and elastic component 14 dislocation.In clinching method, can carry out the position of housing 3 at all and determine, and can suppress the location dislocation or the inclination of the housing 3 in the manufacturing process that light-emitting component places encapsulation, and can make the central shaft of elastic component 14 and housing 3 consistent accurately and engage.As a result, it is consistent accurately to place the central shaft of the optical axis that can make light-emitting component 4 in the package fabrication process accurately and catoptrical housing 3 at light-emitting component.Therefore, can make the light-emitting device that has obtained the light intensity distributions of being hoped, Illumination Distribution, illuminant colour.
In addition, the relational expression about the thermal coefficient of expansion of elastic component 14 and housing 3 is made as α 1 at the thermal coefficient of expansion with elastic component 14, when the thermal coefficient of expansion of housing 3 is made as α 2, can be α 1＜α 2.Thus, can relax the coefficient of thermal expansion differences of housing 3 and matrix 2, produce the stress that causes by thermal expansion difference between matrix 2 and housing 3 and the elastic component 14 and be suppressed at effectively by utilizing elastic component 14.Therefore, can relax that light-emitting component places the manufacturing process of encapsulation and by making the light-emitting device stress that thermal expansion, heat absorption produced in when work, and can suppress the inclination and the distortion of housing 3.
Like this, light-emitting component of the present invention places encapsulation, and at the upper surface mounting light-emitting component 4 of matrix 2, and the external circuit that makes light-emitting component 4 and light-emitting component place the outside of encapsulation by connection lead such as Au or Al and distribution conductor conducts.And, by filling translucent material such as transparent resin in the inboard of housing 3 and make it sclerosis, and with the side and the upper surface of covering luminous element 4, or light-emitting component 4 all modes form the 1st light transmission portion 5.And, vacate with the 1st light transmission portion 5 and to form the 2nd light transmission portion 7 with gap, and utilize scolding tin or resin adhesive to engage the lid (not shown) of light transmission at the upper surface of housing 3, thereby form light-emitting device of the present invention according to necessity.Perhaps, after forming the 1st light transmission portion 5, the 3rd G of light transmission portion that formation is made of silicones etc., and it is surperficial thereon, form the 2nd light transmission portion 7 in the mode that covers the 1st light transmission portion 5 integral body, and, on the upper surface of housing 3, utilize scolding tin or resin adhesive etc. to engage the lid of light transmission according to necessity, can utilize fluorophor that the light of light-emitting component 4 is carried out wavelength conversion thereby become, and take out the light-emitting device of light with wavelength spectrum of being hoped.
In addition, light-emitting device of the present invention, be provided with by the mode that makes 1 device become the configuration of regulation, perhaps with majority with for example clathrate or zigzag, radial configuration, perhaps the mode with the configuration that becomes following such regulation is provided with: promptly form the round shape that is made of a plurality of light-emitting devices or polygon-shaped light-emitting device group with the most groups of concentric shape ground, can become lighting device thus.By this, compare with conventional illuminating device, can the inhibition strength inequality.
In addition, light-emitting device of the present invention is provided with the configuration of stipulating as light source, and reflection instrument or optical lens, the light diffusing sheet etc. of optical design are set with shape arbitrarily around these light-emitting devices, can become the lighting device of launching the light that luminous intensity distribution arbitrarily distributes thus.
In addition, the invention is not restricted to above-mentioned execution mode, in the scope that does not break away from main idea of the present invention, do all changes and also do not have any obstacle.For example, optical lens or flat light transmission lid by being used for joints such as scolding tin or resin adhesives the light from the light-emitting device outgoing is at random focused on and spreads can take out light with the emission angle of being hoped, and can improve long-term reliability.In addition, in order to suppress, also can be following such light-emitting device: promptly on matrix 1, form the metallization distribution, and the flip-chip of implementing to be electrically connected light-emitting component 3 by scolding tin on this metallization distribution is installed based on the light loss that connects lead.
The light-emitting device 1 that the respective embodiments described above are related, configuration with regulation is provided with as light source, but by reflection instrument or optical lens, the light diffusing sheet etc. of optical design are set, can become the lighting device that to launch the light that luminous intensity distribution arbitrarily distributes with shape arbitrarily around these light-emitting devices 1.
For example, plane graph as shown in figure 14 and profile shown in Figure 15 are such, for a plurality of light-emitting devices 1 of most row ground configuration on light emitting device drive circuit substrate 10, and around light-emitting device 1, the reflection instrument 9 of optical design is set and constitutes the situation of lighting device with shape arbitrarily, be preferably, list in a plurality of light-emitting devices 1 of configuration in one of adjacency, the interval that becomes with adjacent light-emitting device 1 is not the shortest such configuration, promptly so-called zigzag.
Promptly, with clathrate configuration light-emitting device 1 time, arrange with linearity by the light-emitting device 1 that becomes light source, dazzle (グ レ ア) grow, the vision that this lighting device enters into the people causes discomfort easily, and is relative therewith, by becoming zigzag, dazzling property is suppressed, even also can reduce sense of discomfort to human eye.
In addition, by distance lengthening with 1 of adjacent light-emitting device, can effectively suppress the interference of the heat of 1 of adjacent light-emitting device, and vexed the closing (こ も Ru) that can suppress to be equipped with the heat in the light emitting device drive circuit substrate 10 of light-emitting device 1, the outside that heat can be diffused efficiently light-emitting device 1.As a result, can be produced as follows such lighting device: promptly human eye is not being produced under the situation of unplessantness displeasure for a long time stable and long-life lighting device of optical characteristics.
In addition, such for lighting device vertical view and profile shown in Figure 17 as shown in figure 16, on light emitting device drive circuit substrate 10, form the situation of lighting device of the group of the round shape that constitutes by a plurality of light-emitting devices 1 or polygon-shaped light-emitting device 1 with the most groups of concentric shape ground, be preferably, make the configurable number of the light-emitting device 1 in a round shape or the polygon-shaped light-emitting device group, more at the outer circumferential side of lighting device than center side.Thus, can when light-emitting device 1 interval is each other moderately kept, dispose light-emitting device 1 more, and can further improve the illumination of lighting device.
In addition, the density of the light-emitting device 1 of the central portion by reducing lighting device can suppress vexed the closing (こ も Ru) of the heat in the central portion of light emitting device drive circuit substrate 10.Therefore, the Temperature Distribution in the light emitting device drive circuit substrate 10 becomes equally, the heat efficiency more can be delivered to external circuit substrate or heat sink (the heat sink) that is used to be provided with lighting device in the highland.As a result, light-emitting device 1 can be across stably carrying out work between long-term, and can make long-life lighting device.
As this lighting device, the general lighting utensil that can for example use at indoor or outdoors, chandelier (シ ヤ Application デ リ ア) illumination utensil, the dwelling house ligthing paraphernalia, office's ligthing paraphernalia, the shop, show and use ligthing paraphernalia, the street ligthing paraphernalia, avigation light utensil and signalling, the ligthing paraphernalia of stage and film studio (studio) usefulness, advertising lamp, illuminator lamp bar (pole), illuminator lamp in the water, flash of light (ス ト ロ ボ) lamp, on-the-spot (ス Port Star ト) lamp, the delinquency prevention of imbedding in the electric pole etc. is with throwing light on, non-common ligthing paraphernalia, electric light in the bosom, the electric light bulletin board, or dimmer, automatic flasher, the backlight of display etc., animating means, ornament, illuminated switch, optical sensor, medical lamp, vehicle-mounted lamp etc.
In addition, the invention is not restricted to the example and the embodiment of above-mentioned execution mode,, then do all changes also without any obstacle if be in the scope that does not break away from purport of the present invention.
According to the present invention, can provide a kind of light-emitting device and lighting device that high light takes out luminosity and brightness on efficient, emitted luminescence intensity, the axle that have.

Claims (6)

1. light-emitting device is characterized in that having:
Matrix;
Light-emitting component, it is installed on the above-mentioned matrix;
Reflecting surface, it centers on above-mentioned light-emitting component, and is arranged on the above-mentioned matrix;
The 1st light transmission portion, it coats above-mentioned light-emitting component, and is arranged on the inboard of above-mentioned reflecting surface;
The 2nd light transmission portion, it is arranged on the top of above-mentioned the 1st light transmission portion, and the light wavelength that above-mentioned light-emitting component radiated is carried out conversion; With
Gas blanket, it is arranged between above-mentioned the 1st light transmission portion and above-mentioned the 2nd light transmission portion,
The lower surface of above-mentioned the 2nd light transmission portion has the face shape along the upper surface of above-mentioned the 1st light transmission portion,
On the whole above-mentioned upper surface of above-mentioned the 1st light transmission portion, the distance between the above-mentioned lower surface of the above-mentioned upper surface of above-mentioned the 1st light transmission portion and above-mentioned the 2nd light transmission portion all is identical.
2. light-emitting device according to claim 1 is characterized in that,
The above-mentioned upper surface of above-mentioned the 1st light transmission portion is a convex surface, and the above-mentioned lower surface of above-mentioned the 2nd light transmission portion is a concave curved surface.
3. light-emitting device according to claim 1 is characterized in that,
The above-mentioned upper surface of above-mentioned the 1st light transmission portion is smooth face, and the above-mentioned lower surface of above-mentioned the 2nd light transmission portion is smooth face.
4. light-emitting device according to claim 1 is characterized in that,
Above-mentioned reflecting surface more has tilting zone by upside at the downside of above-mentioned gas layer and in the installation site than above-mentioned light-emitting component.
5. light-emitting device according to claim 4 is characterized in that,
Above-mentioned the 1st light transmission portion has smooth upper surface in inboard all scopes of above-mentioned reflecting surface.
6. a lighting device is made light source with each described light-emitting device in the claim 1～5.
CN2008101797631A 2004-12-24 2005-07-27 Light-emitting device and lighting device Expired - Fee Related CN101447543B (en)

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Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008053621A (en) * 2006-08-28 2008-03-06 Matsushita Electric Works Ltd Led package
JP5081418B2 (en) * 2006-08-28 2012-11-28 パナソニック株式会社 LED package
US20090273002A1 (en) * 2008-05-05 2009-11-05 Wen-Chih Chiou LED Package Structure and Fabrication Method
CN101338865A (en) * 2008-05-23 2009-01-07 段永成 Low attenuation high light efficiency LED illuminating apparatus and preparation method
KR100992778B1 (en) 2008-05-23 2010-11-05 엘지이노텍 주식회사 Light emitting device package and method for manufacturing the same
JP2010177329A (en) * 2009-01-28 2010-08-12 Sharp Corp Resin composite lead frame, manufacturing method thereof, and package thereof
JP2010199183A (en) * 2009-02-24 2010-09-09 Sanyo Electric Co Ltd Package for light emitting device and method of manufacturing the same
JP5047264B2 (en) * 2009-12-22 2012-10-10 株式会社東芝 Light emitting device
JP5050045B2 (en) * 2009-12-22 2012-10-17 株式会社東芝 Light emitting device
JP5287747B2 (en) * 2010-01-29 2013-09-11 豊田合成株式会社 Linear light source device
CN101872829B (en) * 2010-06-21 2012-07-25 深圳雷曼光电科技股份有限公司 White light LED (Light Emitting Diode) with high luminous efficiency and encapsulation method thereof
JP5701523B2 (en) 2010-06-22 2015-04-15 日東電工株式会社 Semiconductor light emitting device
JP5395761B2 (en) * 2010-07-16 2014-01-22 日東電工株式会社 LIGHT EMITTING DEVICE COMPONENT, LIGHT EMITTING DEVICE, AND ITS MANUFACTURING METHOD
CN102130279A (en) * 2010-12-30 2011-07-20 陕西科技大学 LED device with improved LED color rendering index (CRI) and manufacturing method thereof
JP2012199497A (en) * 2011-03-23 2012-10-18 Panasonic Corp Light emitting device
JP6275399B2 (en) * 2012-06-18 2018-02-07 エルジー イノテック カンパニー リミテッド Lighting device
JP5738257B2 (en) * 2012-10-16 2015-06-17 株式会社エルム Light emitting device
JP6582754B2 (en) * 2015-08-31 2019-10-02 日亜化学工業株式会社 Composite substrate, light emitting device, and method of manufacturing light emitting device
TW201921739A (en) * 2016-06-23 2019-06-01 億光電子工業股份有限公司 Light emitting diode
CN106324905A (en) * 2016-08-31 2017-01-11 张家港康得新光电材料有限公司 Quantum-dot light-emitting device and backlight module
JP6769449B2 (en) * 2018-01-30 2020-10-14 日亜化学工業株式会社 Lighting equipment
CN108803142A (en) * 2018-06-28 2018-11-13 武汉华星光电技术有限公司 Light source and preparation method thereof, backlight module, display panel
JP7308475B2 (en) * 2019-01-25 2023-07-14 パナソニックＩｐマネジメント株式会社 color conversion element

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1465106A (en) * 2001-07-26 2003-12-31 松下电工株式会社 Light emitting device using led
WO2004068597A2 (en) * 2003-01-27 2004-08-12 3M Innovative Properties Company Phosphor based light sources utilizing total internal reflection

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1465106A (en) * 2001-07-26 2003-12-31 松下电工株式会社 Light emitting device using led
WO2004068597A2 (en) * 2003-01-27 2004-08-12 3M Innovative Properties Company Phosphor based light sources utilizing total internal reflection

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