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CN101325843B - 制造印刷电路板用浆料凸块的方法 - Google Patents

制造印刷电路板用浆料凸块的方法 Download PDF

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Publication number
CN101325843B
CN101325843B CN2007103060856A CN200710306085A CN101325843B CN 101325843 B CN101325843 B CN 101325843B CN 2007103060856 A CN2007103060856 A CN 2007103060856A CN 200710306085 A CN200710306085 A CN 200710306085A CN 101325843 B CN101325843 B CN 101325843B
Authority
CN
China
Prior art keywords
paste bump
mask
electrocondution slurry
substrate
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007103060856A
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English (en)
Chinese (zh)
Other versions
CN101325843A (zh
Inventor
睦智秀
朴俊炯
金起换
金成容
朴象铉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN101325843A publication Critical patent/CN101325843A/zh
Application granted granted Critical
Publication of CN101325843B publication Critical patent/CN101325843B/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/532—Conductor
    • Y10T29/53243—Multiple, independent conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN2007103060856A 2007-06-12 2007-12-28 制造印刷电路板用浆料凸块的方法 Expired - Fee Related CN101325843B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020070057370 2007-06-12
KR10-2007-0057370 2007-06-12
KR1020070057370A KR100871034B1 (ko) 2007-06-12 2007-06-12 인쇄회로기판의 페이스트 범프 형성 방법

Publications (2)

Publication Number Publication Date
CN101325843A CN101325843A (zh) 2008-12-17
CN101325843B true CN101325843B (zh) 2010-06-16

Family

ID=40131008

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007103060856A Expired - Fee Related CN101325843B (zh) 2007-06-12 2007-12-28 制造印刷电路板用浆料凸块的方法

Country Status (4)

Country Link
US (1) US7841074B2 (ja)
JP (1) JP4637893B2 (ja)
KR (1) KR100871034B1 (ja)
CN (1) CN101325843B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101214730B1 (ko) * 2010-03-22 2012-12-21 삼성전기주식회사 세라믹 그린시트 제조장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5950908A (en) * 1995-12-25 1999-09-14 Mitsubishi Denki Kabushiki Kaisha Solder supplying method, solder supplying apparatus and soldering method
US6264097B1 (en) * 1999-09-06 2001-07-24 Micro-Tec Company, Ltd. Method for forming a solder ball
CN1968577A (zh) * 2005-11-16 2007-05-23 三星电机株式会社 使用浆料凸块的印刷电路板及其制造方法

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JP2794731B2 (ja) * 1988-11-30 1998-09-10 富士通株式会社 はんだバンプの形成方法
JP2788694B2 (ja) * 1992-09-25 1998-08-20 ローム株式会社 電子部品におけるバンプ電極の形成方法
JPH07336019A (ja) * 1994-06-10 1995-12-22 Sumitomo Metal Ind Ltd 導体パターンの形成方法
JPH08316601A (ja) * 1995-05-15 1996-11-29 Tokuyama Corp 回路基板及びその製造方法
KR0172000B1 (ko) * 1995-08-11 1999-05-01 이대원 전도성 잉크를 이용한 반도체 패키지용 기판의 제조방법
JP3180041B2 (ja) * 1996-10-09 2001-06-25 住友金属工業株式会社 接続端子及びその形成方法
JP3423239B2 (ja) 1998-01-22 2003-07-07 リコーマイクロエレクトロニクス株式会社 バンプ電極形成方法
JP2000133145A (ja) * 1998-10-30 2000-05-12 Mitsubishi Electric Corp 面放電型プラズマディスプレイパネル用基板及びその製造方法、面放電型プラズマディスプレイパネル及びその製造方法、並びに面放電型プラズマディスプレイ装置
JP3831179B2 (ja) * 1999-06-29 2006-10-11 株式会社東芝 半導体装置の製造方法およびパターン形成方法
DE60030743T2 (de) * 1999-07-12 2007-09-06 Ibiden Co., Ltd., Ogaki Verfahren zum Herstellen einer Leiterplatte
JP2001230537A (ja) * 2000-02-17 2001-08-24 Ngk Spark Plug Co Ltd ハンダバンプの形成方法
JP4000743B2 (ja) * 2000-03-13 2007-10-31 株式会社デンソー 電子部品の実装方法
JP4587571B2 (ja) * 2001-01-12 2010-11-24 イビデン株式会社 多層プリント配線板の製造方法
JP2003298215A (ja) * 2002-04-01 2003-10-17 Cmk Corp プリント配線板の製造方法
JP3925283B2 (ja) * 2002-04-16 2007-06-06 セイコーエプソン株式会社 電子デバイスの製造方法、電子機器の製造方法
JP2005286166A (ja) * 2004-03-30 2005-10-13 Nec Electronics Corp コイニング装置およびコイニング方法
JP4308716B2 (ja) * 2004-06-09 2009-08-05 新光電気工業株式会社 半導体パッケージの製造方法
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KR100657406B1 (ko) * 2006-02-15 2006-12-14 삼성전기주식회사 다층 인쇄회로기판 제조방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5950908A (en) * 1995-12-25 1999-09-14 Mitsubishi Denki Kabushiki Kaisha Solder supplying method, solder supplying apparatus and soldering method
US6264097B1 (en) * 1999-09-06 2001-07-24 Micro-Tec Company, Ltd. Method for forming a solder ball
CN1968577A (zh) * 2005-11-16 2007-05-23 三星电机株式会社 使用浆料凸块的印刷电路板及其制造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2002-192688A 2002.07.10

Also Published As

Publication number Publication date
JP2008311614A (ja) 2008-12-25
US7841074B2 (en) 2010-11-30
JP4637893B2 (ja) 2011-02-23
CN101325843A (zh) 2008-12-17
US20080307641A1 (en) 2008-12-18
KR100871034B1 (ko) 2008-11-27

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Granted publication date: 20100616

Termination date: 20121228