CN101222025B - Novel packaging device of organic EL device and its packaging method - Google Patents
Novel packaging device of organic EL device and its packaging method Download PDFInfo
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- CN101222025B CN101222025B CN2008100452319A CN200810045231A CN101222025B CN 101222025 B CN101222025 B CN 101222025B CN 2008100452319 A CN2008100452319 A CN 2008100452319A CN 200810045231 A CN200810045231 A CN 200810045231A CN 101222025 B CN101222025 B CN 101222025B
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Abstract
The invention discloses a novel packaging device for an organic electroluminescent device, comprising a cover plate, a locating plate and a packaging holding apparatus, wherein, a groove which corresponds to a substrate is arranged on the cover plate and the substrate contact face of the organic electroluminescent device; hygroscopic agents are arranged inside the groove; the locating plate is provided with a locating hole the size of which is consistent with that of the substrate and arranged above the cover plate; the side face of the substrate which is provided with an organic electroluminescent layer faces towards and passes through the locating hole and is led into the groove; the packaging holding apparatus is arranged above the substrate which is closely connected with the cover plate. The packaging device of the invention can solve substrate slippage and deviation due to unequal stress during the packaging process, thereby packaging precision is guaranteed; packaging efficiency is improved; equipment requirements and production cost are reduced. Particularly, the invention has strong maneuverability on packaging of small and medium-sized substrates and large-sized cover plates and meets actual requirements.
Description
Technical field
The present invention relates to technical field of organic electroluminescence in the electronic devices and components, be specifically related to a kind of novel novel encapsulated device of organic electroluminescence device and based on the method for packing of this device.
Background technology
Organic electroluminescence device (organic light-emitting diode, OLED) be the device that electric energy is directly changed into organic molecule luminous energy, its luminous mechanism is: jumped in opposite directions under electric field action by negative electrode injected electrons and anode injected holes and transmit, when two kinds of electric charges arrival luminescent layers meet, just may form the excitation state (exciton) of molecule.Exciton is got back to ground state radiation inactivation from excitation state, and the form of energy difference with photon discharged.OLED has that driving voltage is low, luminosity and efficient height, the visual angle is wide, response speed is fast, power consumption is low, manufacture craft is simple, can relatively easily realize the advantage that full color flat panel display and flexible display device etc. are outstanding, so it has a extensive future.Through the development of recent two decades, it has become one of research focus of dull and stereotyped field of information display, is considered to the emerging application technology of follow-on flat-panel screens, and therefore the whole world has how tame manufacturer to drop into research and development at present, is described as " star of following demonstration ".On the other hand, because its high luminosity and efficient that has, the OLED device can be used as lighting source.
People start from the 1950's to the research of organic electroluminescent, see the exploration of human organic material making electroluminescent devices such as A.Bernanose about the report the earliest of organic EL.But early stage organic EL device driving voltage very high (＞100V), cause correlative study progress very slow.People such as the C.W.Tang of U.S. Kodak (Kodak) company in 1987 and S.V.Slyke have found the luminescence technology of low molecule organic material at first, and the said firm has at first applied for patent and licensed to 11 companies proceeding deep research.This breakthrough has remotivated the enthusiasm of people for organic EL, makes people see the hope of organic electroluminescence device as flat-panel display device of new generation.Nineteen ninety, researchers such as the Cavendish laboratory R.H.Friend of univ cambridge uk declare, the organic polymer thin film of being made up of the inferior ethene of polyparaphenylene has similar luminescent properties, shocked whole demonstration circle at that time, so researchers such as R.H.Friend have obtained patent, and have set up Cambridge Display Technique (CDT) company.The same with the micromolecule technology, existing at present other numerous polymeric material is utilized.If can be made into effective OLED, in the electronic display technology application, has powerful competitiveness undoubtedly.At present, the R﹠D institution of many developed countries and team have dropped into exploration and the experimental study that great effort carries out correlation theory, in the hope of making a breakthrough.Each big display giant has in the world successively released oneself OLED product as Kodak, Samsung, Philip etc.
The unique features of OLED makes that making color flat panel display with it becomes its topmost application.In addition, OLED self is the desirable alternative source of light of a kind of incandescent lamp.OLED is mainly used in colored the demonstration, phone, digital camera, indicator light, the environmental protection light source, industrial lighting, semaphore, transportation, financial circles, commercial, the road direction board, electronic newspaper, office automation (OA) equipment, PDA, the clock and watch backlight, household electrical appliance, the high end audio system, consumer products such as portable information device, Vehicular display device, the building luminous ornament, light-emitting workmanship, translating machine, audio-visual equipment, wall-hanging colour TV, high definition TV (HDTV), aerospace equipment, military hardware, medicine equipment, measuring and controlling equipment, industrial series products such as terminal demonstration, hand-held product demonstration and other high-tech sector etc.2004～2005 years OLED of Stanford Resource prediction can challenge LCD on cost, 2005 will be a year of OLED development in an all-round way, and this year, the color OLED screen was with the main screen of overall application in mobile phone and PDA.OLED had the cost advantage to LCD in 2005～2007 years, and the large tracts of land demonstration puts goods on the market beginning.OLED may be used for notebook computer in 2006～2007 years.But, the coming into the market on a large scale unlikely of OLED before 2008.DisplaySearch predicts that global OLED product sales will be from 1.12 hundred million dollars of 3,100,000,000 dollars of rising to 2007 in 2002.
Although the OLED display has had rather considerable scientific achievement, more research and development still need be proceeded.On performance, useful life is shorter as existing OLED material, and following research direction is to manage to prolong the useful life of OLED display, and it is most important especially to develop the long-life encapsulation.Another biggest obstacle that exists is how to set up the perfect technological process of production and the production model of global standardsization at present.The OLED display does not have the production procedure and the testing equipment of standard as yet so far, and also among building, manufacturing process technology awaits further to improve the production line of standard.What need be worth emphasizing a bit is the OLED display is entered produce in batches to be still a rather difficult task.
For improving the performance of organic electroluminescent (OLED) device, popular at present research mainly concentrates on the following aspects: 1) improve luminosity and luminous efficiency; 2) life-span and the stability of increase device; 3) R and D advanced luminescent material and novel carrier transport material; 4) research of relevant luminescence mechanism; 5) explore new device preparation technology and device architecture.Wherein, device preparing process and good device architecture are the most critical factors that is related to luminosity and efficient, life-span and stability, and the encapsulation of device is the another important step after the device preparation.Yet up to the present, all there is certain problem in the method for packing of OLED device, and the packaging system of existing flat panel display and illuminating device all can not satisfy or compatible OLED device technology.Therefore, researching and developing novel device package device and technology thereof, is one of approach that addresses the above problem.
Summary of the invention
Technical problem to be solved by this invention is novel encapsulated device and the method for packing thereof how a kind of organic electroluminescence device is provided, this packaging system can solve in the device encapsulation process because sliding position of substrate that discontinuity causes and skew, guaranteed encapsulation precision, improved packaging efficiency, requirement and production cost have been reduced to equipment, encapsulation at small-medium size substrate and large scale cover plate has stronger operability especially, satisfies actual requirement.
First technical problem proposed by the invention is to solve like this: construct a kind of novel encapsulated device of organic electroluminescence device, it is characterized in that:
2. comprise cover plate, location-plate and encapsulation hold down gag;
2. the substrate contact-making surface with organic electroluminescence device on the described cover plate is provided with and the corresponding groove of described substrate, is placed with hygroscopic agent in the described groove; Described location-plate is provided with location hole, and the size dimension of described location hole is consistent with described substrate;
3. be installed in the cover plate top on the described location-plate, a side that described substrate is provided with organic electro luminescent layer is towards importing by location hole in the described groove, and described encapsulation hold down gag is installed in the substrate top, and substrate and cover plate are combined closely.
Novel encapsulated device according to organic electroluminescence device provided by the present invention is characterized in that, described cover plate is a kind of in ultra-thin glass, organic film, inorganic thin film and the metal forming or their compound system.
Novel encapsulated device according to organic electroluminescence device provided by the present invention is characterized in that, described encapsulation hold down gag is the compound system of a kind of or their respective material in glass, organic material plate, film and the metallic plate.
Novel encapsulated device according to organic electroluminescence device provided by the present invention is characterized in that, described encapsulation hold down gag is monolithic or the cover plate corresponding monolithic structure corresponding with substrate.
Second technical problem provided by the present invention is to solve like this: a kind of method for packing based on above-mentioned organic electroluminescence device novel encapsulated device is provided, may further comprise the steps:
1. substrate for preparing the organic electroluminescent working lining and cover plate are put into the glove box that is full of inert gas, on the cover board be coated with uv-exposure glue, in groove, put into hygroscopic agent according to the dimensional requirement of substrate;
2. will coat the substrate and the cover plate of uv-exposure glue and put into the vacuum sealing system that is full of inert gas, and location-plate will be positioned on the cover plate;
3. then with the vacuum sealing system vacuum pumping, regulate the position of cover plate and location-plate, make the location hole of the groove of cover plate and location-plate corresponding overlapping, fit together;
4. a side that substrate is provided with organic electroluminescent layer imports in the groove of cover plate to the location hole of groove by location-plate, makes substrate and location-plate fine registration;
5. the size requirements according to sizes of substrate adopts corresponding full wafer or monolithic encapsulation hold down gag, makes the closely evenly combination of substrate and cover plate;
6. carry out follow-up encapsulation step, finish whole encapsulation flow process;
7. take out step in 6. device and test its photoelectric characteristic parameter.
The novel encapsulated device of organic electroluminescence device provided by the present invention, simple in structure, easy and simple to handle, the employing of location-plate has solved in the encapsulation process because sliding position of substrate that discontinuity causes and skew, guaranteed the accurate contraposition of substrate and cover plate, simultaneously also guarantee substrate and even combine tight, improved the precision and the efficient of encapsulation, reduced the technology cost with cover plate.And the encapsulation hold down gag adopts full wafer or monolithic form according to the big I of sizes of substrate, has improved the flexibility of operation, is particularly suitable for encapsulating with large cover the situation of little substrate.
Description of drawings
Fig. 1 is the cross-sectional view of the novel encapsulated device of organic electroluminescence device of the present invention;
Fig. 2 is the floor map of cover plate;
Fig. 3 is the floor map of encapsulation alignment device.
Wherein, 1, cover plate, 2, location-plate, 3, substrate, 4, the encapsulation pressure strip, 5, hygroscopic agent, 6, the cover plate groove, 7, location hole.
Embodiment
The present invention is further illustrated below in conjunction with accompanying drawing and embodiment.
The novel encapsulated device (as shown in Figure 1) of organic electroluminescence device provided by the present invention, comprise cover plate 1, location-plate 2 and encapsulation hold down gag 4, substrate 3 contact-making surfaces with organic electroluminescence device on the cover plate 1 are provided with and substrate 3 corresponding grooves 6 (as shown in Figure 2), be placed with hygroscopic agent 5 in the groove 6, location-plate 2 is provided with location hole 7 (as shown in Figure 3), the size dimension of location hole 7 is consistent with described substrate 1, be installed in cover plate 1 top on the location-plate 2, described substrate 3 is provided with organic electro luminescent layer, and (wherein organic electro luminescent layer comprises anode layer, hole transmission layer, electron transfer layer and metal electrode) a side towards importing in the described groove 6 by location hole 7, described encapsulation hold down gag 4 is installed in substrate 3 tops, and substrate 3 and cover plate 1 are combined closely.Cover plate 1 can be a kind of in ultra-thin glass, organic film, inorganic thin film and the metal forming, encapsulation hold down gag 4 is compound systems of a kind of or their respective material in glass, organic material plate, thin-film material and the metal material, and encapsulation hold down gag 4 can adopt full wafer or monolithic form according to substrate 3 sizes.
Execution mode 1-5
The basic structure of organic electroluminescence device (OLED) package system as shown in Figure 1, device substrate is the glass substrate of 50mm * 50mm, encapsulation cover plate adopts the soda-lime glass etching.The entire device structrual description is: glass substrate/ITO/PS:TPD (x%: y%) (x%: y%=0%: 100%, 10%: 90%, 20%: 80%, 30%: 70%, 50%: 50%)/Alq
3(200
)/LiF (10
)/Al (1000
).
The preparation method is as follows:
1. utilize washing agent, ethanolic solution and deionized water that the transparent conduction base sheet ito glass is carried out ultrasonic cleaning successively, clean the back and dry up with drying nitrogen.Wherein the ITO film above the glass substrate is as the anode layer of device, and the square resistance of ITO film is 10-15 Ω/, and thickness is 1500
2. the transparent substrates after will handling places the spin coating of carrying out doping film (hole transmission layer) PS:TPD on the photoresist spinner, by controlling the thickness of rough control of different solution concentration ratios, photoresist spinner rotating speed and time spin-coating film;
3. the spin coating substrate being moved into high vacuum chamber, is under the oxygen atmosphere of 20Pa ito glass to be carried out low energy oxygen plasma preliminary treatment 10 minutes at air pressure, and sputtering power is～20W;
4. substrate is transferred to the organic vacuum vaporization chamber, treats that room pressure is 3 * 10
-4Pa begins to carry out the evaporation of organic film.According to the luminous double electron transfer layer of device architecture evaporation: Alq as mentioned above
3(500
).Evaporation speed 1
/ s, evaporation speed and thickness are by near the film thickness gauge monitoring that is installed in the substrate;
5. after the organic layer evaporation finishes, substrate is sent to the preparation of carrying out metal electrode in the metal vacuum vaporization chamber.Its air pressure is 3 * 10
-3Pa, evaporation speed is～3
/ s, Al thicknesses of layers are 100nm.Evaporation speed and thickness are by near the film thickness gauge monitoring that is installed in the substrate;
6. substrate for preparing the organic electroluminescent working lining and cover plate are put into the glove box that is full of inert gas, on the cover board be coated with uv-exposure glue, in groove, put into hygroscopic agent according to the dimensional requirement of substrate;
7. will coat the substrate and the cover plate of uv-exposure glue and put into the vacuum sealing system that is full of inert gas, and will encapsulate alignment device and be positioned on the cover plate, regulate the position of cover plate and alignment device, make both short slot corresponding overlapping, fit together;
8. a side that substrate is provided with organic electroluminescent layer imports in the big groove of cover plate by the encapsulation alignment device to groove, make substrate and alignment device fine registration, size requirements according to sizes of substrate adopts corresponding full wafer or monolithic encapsulation hold down gag then, makes the closely evenly combination of substrate and cover plate;
9. carry out follow-up encapsulation step, finish whole encapsulation flow process;
10. the photoelectric characteristic parameter of test component.
Execution mode 6-14
The basic structure of organic electroluminescence device (OLED) package system as shown in Figure 1, device substrate is the glass substrate of 100mm * 100mm, encapsulation cover plate adopts the soda-lime glass etching.The entire device structrual description is: glass substrate/ITO/CuPc (200
)/α-NPD (600
)/Alq
3(400
): C545T (2%)/Alq
3(200
)/LiF (10
)/Al (1000
).
The preparation method is as follows:
1. utilize washing agent, ethanolic solution and deionized water that the transparent conduction base sheet ito glass is carried out ultrasonic cleaning, clean the back and dry up with drying nitrogen.Wherein the ITO film above the glass substrate is as the anode layer of device, and the square resistance of ITO film is 10-15 Ω/, and thickness is 1500
2. dried substrate being moved into high vacuum chamber, is under the oxygen of 20Pa and the ar gas environment ito glass to be carried out low energy oxygen plasma preliminary treatment 10 minutes at air pressure, and sputtering power is 20w;
3. the substrate after will handling is transferred to the organic vacuum vaporization chamber, treats that room pressure is 4 * 10
-4Pa begins to carry out the evaporation of organic film.According to the device architecture as mentioned above hole injection layer of evaporation: CuPc successively is 200
, transport layer: α-NPD is 600
, luminescent layer: Alq3 (400
): C545T (2%), electron transfer layer: Alq3 (200
), the evaporation speed 1 of each organic layer
/ s, evaporation speed and thickness are by near the film thickness gauge monitoring that is installed in the substrate;
4. after the organic layer evaporation finishes, substrate is sent to the preparation of carrying out metal electrode in the metal vacuum vaporization chamber.Its air pressure is 3 * 10
-3Pa, evaporation speed is 3
/ s, AL thicknesses of layers are 100nm.Evaporation speed and thickness are by near the film thickness gauge monitoring that is installed in the substrate;
5. ready-made device is sent to glove box and encapsulates, glove box is the high purity inert gas atmosphere, and method for packing is identical with embodiment 1-5;
6. the photoelectric characteristic parameter of test component.
Execution mode 15-20
The basic structure of organic electroluminescence device (OLED) package system as shown in Figure 1, device substrate adopt flexible base, board (as PET etc.), and encapsulation cover plate adopts metal cover board.The entire device structrual description is: glass substrate/ITO/CuPc (200
)/α-NPD (600
)/Alq
3(400
): C545T (2%)/Alq
3(200
)/LiF (10
)/Al (1000
).
The preparation of devices flow process is similar to execution mode 6-14.
Embodiment 21-30
The basic structure of organic electroluminescence device (OLED) package system as shown in Figure 1, device substrate adopt flexible base, board (as PET etc.), and encapsulation cover plate adopts the polymer organic film.The entire device structrual description is: flexible substrate/ITO/PVK:PFC (100nm)/BCP (10nm)/Alq
3(15nm)/Mg:Ag (300nm).
The preparation of devices flow process is similar to execution mode 1-5.
Embodiment 30-35
The basic structure of organic electroluminescence device (OLED) package system as shown in Figure 1, device substrate adopt flexible base, board (as PET etc.), and encapsulation cover plate adopts flexible base, board (as PET etc.).The entire device structrual description is: flexible substrate/ITO/APC:NPB (100nm)/DCJTB (50nm)/Bepp
2(15nm)/Mg:Ag (100nm).
The preparation of devices flow process is similar to execution mode 6-14.
Claims (5)
1. the packaging system of an organic electroluminescence device is characterized in that:
1. comprise cover plate, location-plate and encapsulation hold down gag;
2. the substrate contact-making surface with organic electroluminescence device on the described cover plate is provided with and the corresponding groove of described substrate, is placed with hygroscopic agent in the described groove; Described location-plate is provided with location hole, and the size dimension of described location hole is consistent with described substrate;
3. be installed in the cover plate top on the described location-plate, a side that described substrate is provided with organic electro luminescent layer is towards importing by location hole in the described groove, and described encapsulation hold down gag is installed in the substrate top, and substrate and cover plate are combined closely.
2. the packaging system of organic electroluminescence device according to claim 1 is characterized in that, described cover plate is a kind of in ultra-thin glass, organic film, inorganic thin film and the metal forming or their compound system.
3. the packaging system of organic electroluminescence device according to claim 1 is characterized in that, described encapsulation hold down gag is the compound system of a kind of or their respective material in glass, organic material plate, film and the metallic plate.
4. the packaging system of organic electroluminescence device according to claim 1 is characterized in that, described encapsulation hold down gag is monolithic or the cover plate corresponding monolithic structure corresponding with substrate.
5. the method for packing of an organic electroluminescence device may further comprise the steps:
1. substrate for preparing the organic electroluminescent working lining and cover plate are put into the glove box that is full of inert gas, on the cover board be coated with uv-exposure glue, in groove, put into hygroscopic agent according to the dimensional requirement of substrate;
2. will coat the substrate and the cover plate of uv-exposure glue and put into the vacuum sealing system that is full of inert gas, and location-plate will be positioned on the cover plate;
3. then with the vacuum sealing system vacuum pumping, regulate the position of cover plate and location-plate, make the location hole of the groove of cover plate and location-plate corresponding overlapping, fit together;
4. a side that substrate is provided with organic electroluminescent layer imports in the groove of cover plate to the location hole of groove by location-plate, makes substrate and location-plate fine registration;
5. the size requirements according to sizes of substrate adopts corresponding full wafer or monolithic encapsulation hold down gag, makes the closely evenly combination of substrate and cover plate;
6. carry out follow-up encapsulation step, finish whole encapsulation flow process;
7. take out step in 6. device and test its photoelectric characteristic parameter.
Priority Applications (1)
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|---|---|---|---|
| CN2008100452319A CN101222025B (en) | 2008-01-22 | 2008-01-22 | Novel packaging device of organic EL device and its packaging method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100452319A CN101222025B (en) | 2008-01-22 | 2008-01-22 | Novel packaging device of organic EL device and its packaging method |
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| CN101222025B true CN101222025B (en) | 2010-08-04 |
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Cited By (1)
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| WO2014127565A1 (en) * | 2013-02-22 | 2014-08-28 | 京东方科技集团股份有限公司 | Electrochromic display device and manufacturing method thereof |
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| CN101807667B (en) * | 2010-03-18 | 2011-11-16 | 电子科技大学 | Encapsulating device of organic photoelectronic device and encapsulating method thereof |
| CN101859872B (en) * | 2010-03-18 | 2012-07-18 | 电子科技大学 | Packing alignment device for organic optoelectronic device and packing method thereof |
| KR101201697B1 (en) * | 2010-09-20 | 2012-11-15 | 에스엔유 프리시젼 주식회사 | Cold trap for adhering monomer and Apparatus for depositing monomer using the same |
| KR101494317B1 (en) * | 2013-08-30 | 2015-02-23 | 엠에스티코리아(주) | pressing apparatus and method for manufacturing flexible display apparatus using the same |
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