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CN109564634A - 用于交易卡的经包覆模制的电子部件及其制造方法 - Google Patents

用于交易卡的经包覆模制的电子部件及其制造方法 Download PDF

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Publication number
CN109564634A
CN109564634A CN201780046491.5A CN201780046491A CN109564634A CN 109564634 A CN109564634 A CN 109564634A CN 201780046491 A CN201780046491 A CN 201780046491A CN 109564634 A CN109564634 A CN 109564634A
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molding
electronic component
method described
transactional cards
card
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亚当·勒韦
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Composecure LLC
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Composecure LLC
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D19/00—Casting in, on, or around objects which form part of the product
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
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    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
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    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07794—Antenna details the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/006—Memory cards, chip cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

一种用于制造交易卡的方法包括：在交易卡的卡本体中形成开口；将电子部件插入开口中；以及对电子部件周围的模制材料进行模制。交易卡包括模制的电子部件。

Description

用于交易卡的经包覆模制的电子部件及其制造方法
相关申请的交叉引用
本申请涉及并且要求于2016年7月27日提交的题为“OVERMOLDED ELECTRONICCOMPONENTS FOR TRANSACTION CARDS AND METHODS OF MAKING THEREOF”的美国临时申请第62/367,362号的优先权权益，其全部内容通过引用并入本文用于所有目的。
技术领域
本发明涉及具有电子部件的交易卡及其制造方法。
背景技术
金属支付卡在包括诸如电感耦合支付模块、RF电子器件以及独立电子嵌体的电子部件时面临独特的挑战。为了容纳这些部件，将金属加工成各种几何形状，然后将部件放置在腔中并且使其暴露或隐藏在印刷的塑料片或其他装饰元件下面。可以通过诸如压板层压、接触粘合剂、可固化粘合剂、或“推入装配”或本领域已知的任何接合方法的各种工艺将装饰元件固定在卡上。在腔中通常需要RF屏蔽，这在保持卡的所需美观的同时进一步使卡组装复杂化。
这些所需的加工几何形状中的一些去除了大量的金属或留下穿过卡的狭缝或孔，这减弱了卡的强度并且在美学上是不期望的。为了加强卡并且提供所需的表面，已经开发出包覆模制和插入模制技术以将电子嵌体封装在卡内并且加强卡的几何形状。此外，这种开发已经改善了优于现有设计的RF性能，因为这种开发能够在关键的RF传输和接收区域中去除更多的金属，同时保持结构的刚性和所期望的外观。
发明内容
本发明的各方面涉及交易卡、用于制造交易卡的工艺以及根据所公开的方法生产的交易卡。
根据一方面，本发明提供了一种用于制造交易卡的方法以及由此生产的交易卡。该方法包括在交易卡的卡本体中形成用于接纳电子部件的开口；将电子部件插入开口中；以及对电子部件周围的模制材料进行模制。
在另一方面，本发明提供了一种交易卡。交易卡包括模制的电子部件。
需要理解的是，前面的一般性描述和以下的详细描述都是本发明的示例性的而非限制性的描述。
附图说明
当结合附图阅读时，根据以下详细描述可以最好地理解本发明，其中，相同的元件具有相同的附图标记。当存在多个相似元件时，可以将单个附图标记分配给多个相似元件，其中，小写字母标记指代特定元件。当共同地指代元件或指代非特定的一个或更多个元件时，可以删除小写字母标记。这强调了根据惯例，除非另有说明，否则附图的各种特征未按比例绘制。相反，为了清楚起见，可以扩展或减小各种特征的尺寸。附图中包括以下图：
图1是根据本发明的各方面的用于制造交易卡的工艺的选定步骤的流程图；
图2A是描绘根据本发明的各方面的包覆模制之前的电子部件的照片；
图2B是描绘根据本发明的各方面的包覆模制之后的电子部件的照片；
图3A是根据本发明的各方面的插入模制之前的交易卡的正面的示意图；
图3B是根据本发明的各方面的插入模制之前的交易卡的背面的示意图；
图3C是根据本发明的各方面的插入模制之后的交易卡的正面的示意图；以及
图3D是根据本发明的各方面的插入模制之后的交易卡的背面的示意图。
图4A和图4B是根据本发明的各方面的用于制造交易卡的包覆模制工艺的选定步骤的示意图。
具体实施方式
本发明的各方面涉及交易卡、用于制造交易卡的工艺以及根据所公开的方法生产的交易卡。
在图1中，示出了描绘根据本发明的各方面的用于生产交易卡的工艺100的选定步骤的流程图。应当注意的是，关于本文描述的工艺，根据本文的描述将理解可以省略一个或更多个步骤和/或脱离所描述的工艺顺序执行一个或更多个步骤，同时仍然实现所期望的结果。
在步骤110中，在交易卡的卡本体中形成开口。开口的尺寸可以设计成容纳一个或更多个经模制的电子部件。开口可以部分地延伸穿过卡本体(由此形成例如凹处)或完全地延伸穿过卡本体(由此形成孔)。在一些实施方式中，然后可以在一侧上例如利用所施加的材料如粘附地粘结的塑料材料例如图3D中示出的元件307c完全地或部分地覆盖形成为穿过卡本体的孔。如图3D所描绘的，元件307c与围绕孔的区域交叠，以形成由卡本体中的孔的边缘限定外围且由所施加的材料307c限定底部的凹处。所施加的材料可以是与要填充在凹处中的模制材料相同或兼容的材料。在一些实施方式中，如图3D中示出，与围绕卡本体中的孔的区域交叠的所施加的材料307c可以具有通孔308，该通孔308的面积小于卡本体中的孔的面积，以便在卡本体中的在孔的外围内侧提供所施加的材料的“凸缘”309。
本发明的卡本体可以由包括任意合适金属的任意合适的材料构成，例如不锈钢、青铜、铜、钛、碳化钨、镍、钯、银、金、铂、铝或给出卡卡的本体(结构)和重量的大部分的任意合金。另外地或可替选地，本文所描述的卡本体可以由任意合适的聚合物(例如聚碳酸酯、聚酯)或无机(例如玻璃、陶瓷)材料或前述材料中任意材料的任意组合组成。
在步骤120中，将电子部件插入卡本体的开口中。
在步骤130中，对电子部件周围的模制材料进行模制。应当注意的是，步骤120和130的顺序可以根据具体应用而变化。
在一个实施方式中，步骤130包括包覆模制工艺。在包覆模制工艺期间，在电子部件周围(并且通常在电子部件上方)对模制材料进行模制，使得模制材料覆盖电子部件的表面的至少一部分。电子部件的包覆模制可以使用常规和商业上可获得的设备例如ENGLE插件(恩格尔公司(Engel Austria GmbH)，澳大利亚)和Cavist MoldManTM(里诺(Reno)，内华达州(NV))来完成。
示出了在包覆模制工艺之前(在图2A中)和之后(在图2B中)的电子部件201。虽然经包覆模制的部件200被描绘为具有完全覆盖电子部件201的模制材料205，但是本领域普通技术人员将理解的是不同程度的包覆模制可以实现交易卡的所需的结构刚性、功能性和美感。具体地，如图2A和图2B所示，以线210和220的形式连接至部件200的电接触各自具有未封装的端部，该端部从包覆模制突出以允许至部件的电连接。应该理解的是，尽管在图2A和图2B中描绘为线，但是电接触或不限于电接触的其他未封装部分可以采用任意形状或形式。还应理解的是在某些实施方式中，例如在可以通过封装层实现在未封装部件与封装部件之间技术上所需的耦合程度的实施方式中，部件可以完全封装。
回到图1中，在采用包覆模制工艺的情况下，可以在执行步骤120之前执行步骤130。也就是说，可以在插入卡本体的开口之前单独包覆模制电子部件。在插入经包覆模制的电子部件之前，还可以对经包覆模制的部件进行机械加工以去除多余的模制材料和/或在模制材料中产生可用于将经包覆模制的电子部件固定到卡本体的开口中的部件。例如，参考图2B，可以将唇缘机械加工到模制材料205中以使得经包覆模制的部件200可以固定在卡本体的开口中。
可替选地，可以在执行步骤120之后执行步骤130中的包覆模制。在该实施方式中，将电子部件插入到卡本体的开口中。随后，迫使模制材料流入卡本体的开口中并且形成在电子部件的包括至少顶表面的一个或更多个暴露表面上方。本领域普通技术人员将理解的是当模制材料流入卡本体的开口中时，可以将卡本体材料选择成以便承受与包覆模制相关的压力和热而基本上不变形。
在采用插入模制工艺的情况下，可以在执行步骤120之前执行步骤130。常规的插入模制工艺包括将电子部件插入模具中，然后将模制材料注入模具中以形成经模制的电子部件。在插入模制工艺之后，经模制的电子部件可以通过模制材料完全地或部分地封装。
转到图3A至图3D，描绘了根据本发明的各方面的用于制造交易卡的插入模制工艺的选定步骤的示意图。在附图中，图3A至图3D中的区域305和308表示穿过卡的孔。图3A中的区域307a,b以及图3B和图3D中的区域307c表示卡本体中的用于使模制材料接合并且束紧的被部分地覆盖的孔(凹处)。图3B描绘了完成的模制卡，其中，模制部件310的插入模制材料是可见的。尽管为了说明的目的，插入模制材料显示与背景卡材料形成对比，但是模制部件不限于相对于背景卡的着色或阴影中的任何特定对比度，并且可以包括与卡的正面相同的材料或可以包括具有选择为卡的正面的着色或阴影相匹配以便使其在完成的卡中的可见度最小化的着色或阴影的材料。例如，在包括与模制材料不同的材料(例如，金属或陶瓷体和热塑性树脂模制材料)的卡本体中，可以将模制材料的着色选择为具有与本体的材料尽可能地相匹配的颜色和色调，包括在模制材料中使用与卡本体材料相同或相似的成分(例如，在模制材料中包含与本体的金属相同的粉末金属)。在其他实施方式中，可以使用与卡的本体形成对比的模制材料。图3A描绘了包括完全地延伸穿过卡本体302的开口305的交易卡300的正面。多个固定部件307a,b提供了模制材料可以粘附或以其他方式接合的区域。在所示实施方式中，固定部件307a,b是盲孔(例如，凹处)。在图3B中的交易卡300的相反的背面上发现了一组类似的固定部件307c。将开口305和固定部件307a,b,c的几何形状选择成改善金属交易卡300的RF性能。固定部件307a,b,c可以包括与模制材料相同或以其他方式兼容并且与卡本体材料不同的材料，使得模制材料和固定部件的材料熔化或以其他方式与粘结剂连接在一起，粘结剂比模制材料与卡本体之间产生的任何粘结都强。
图3C描绘了在已经将插入模制电子部件310放置到开口305中之后的交易卡300的正面。在所示的实施方式中，经模制的电子部件310在交易卡300上将是可见的。经模制的电子部件310的几何形状允许经模制的电子部件310通过固定部件307a,b,c产生的偏置动作固定到交易卡300上。可替选地或另外地，经模制的电子部件310可通过诸如双酚、酚醛清漆、脂族和二缩水甘油胺的环氧树脂粘附到交易卡300的开口305。
可以(通过例如铣削或机械加工)从经模制的电子部件310中去除过量的模制材料以并入附加的电子部件或其他所需的部件。
图4A描绘了示例性包覆模制工艺，其中，将凹处403机械加工到卡本体402中用于接纳电子部件405。在所示实施方式中，电子部件405是印刷电路板(PCB)，具体是RFID模块。虽然凹处403被描绘为横穿卡本体402的背面的大部分，但是本领域普通技术人员将理解的是根据要并入的电子部件，不同几何形状的较小开口可能是合适的。
凹处403的尺寸可以设计成接纳电子部件405并且固定到电子部件405的位置，或者它的尺寸可以设计成允许在凹处403的内唇缘和电子部件405的外边缘之间有多余的模制材料。电子部件405可以使用如上所述的环氧树脂另外地或可替选地粘附至凹处403。
经包覆模制的面板410创建交易卡400的背面。经包覆模制的面板410可以完全地或部分地封装电子部件405。可以单独制备经包覆模制的面板410，然后将其附接至凹处403(使用例如如上所述的合适的环氧树脂)，或者它可以通过将模制材料层直接包覆模制在凹处403中而形成。
在示例性实施方式中，在经包覆模制的面板中使用的模制材料是可以增强RF传输的塑料材料，其中，交易卡400由金属或其他RF干扰材料构成。
如本领域所公知的，具有RFID模块的交易卡通常还具有耦合到RFID模块的天线结构。因此，在RFID模块是封装或部分封装的部件(或如本文所述处理的多个电子部件之一)的示例性实施方式中，可以以任何数目的方式提供天线结构。在一个实施方式中，天线结构可以嵌入到在本文所述的模制工艺之后施加到卡的层中。可以利用非加热工艺(例如用粘合剂)、在不会再熔化、变形或以其他方式对电子元件上方的模制造成不利地干扰的温度、压力和持续时间下进行的热层压工艺将天线方位层层压至卡，或者在这种热层压步骤期间可以提供背板(包括金属或一些不受热层压影响的其他材料)以防止模制的任何再熔化或变形从正在进行层压步骤的相对表面突出。在另一个实施方式中，模制步骤可以包括包覆模制步骤，该包覆模制步骤不仅覆盖如本文所述的电子部件，而且至少覆盖卡表面的稍后将被设置在其中的天线结构的部分。例如，可以进行溢流包覆模制步骤，其除了封装或部分封装RFID模块之外，还可以覆盖卡的在具有所需厚度的层中的至少一个完整表面(通常是背面，但也可以是正面或代替正面)。然后，可以例如使用本领域已知的超声波处理将天线嵌入到该包覆模制层中。要印刷在卡的表面上的任何内容也可以印刷在包覆模制层表面上，或者可以例如经由粘合剂或层压来附接附加的印刷层。在其他实施方式中，天线可以被印刷在模制表面上，或者作为例如用粘合剂或通过层压附接在模制表面上方的另一层的一部分被施加。前述是非限制性示例，并且应当理解的是对于用于在卡中提供经模制的电子部件的本文所述工艺的所得产品的下游处理存在无限可能性，并且本发明的某些方面是不以任何方式受限于后工艺步骤。
本领域普通技术人员将理解的是合适的模制材料将取决于步骤130中使用的模制工艺的类型。例如，在采用插入或包覆模制的情况下，可以使用诸如可熔粘合剂(Henkel)的热塑性材料和诸如玻璃纤维增强聚酯、聚氨酯、酚醛塑料、硬质塑料、三聚氰胺、邻苯二甲酸二烯丙酯和聚酰亚胺的热固性材料，热塑性材料可以包括由以下材料构成的组中的一个或更多个：EVA、茂金属聚α-烯烃、包括无规聚α-烯烃的聚烯烃、嵌段共聚物、聚氨酯热熔体，以及聚酰胺。本领域普通技术人员将理解的是也可以使用可以在包覆模制工艺或插入模制工艺中变得可流动的其他材料，这些其他材料包括但不限于粉末金属，诸如铑、铝、钛、镁、铜、黄铜、镍、蒙乃尔铜-镍合金、铬镍铁合金、钢及其合金。
在另一个实施方式中，在包覆模制工艺或插入模制工艺中使用的模制材料是具有约150℃至约300℃的模制温度范围的塑料材料。
尽管本文参考具体实施方式说明和描述了本发明，但是本发明并不限于示出的细节。相反，可以在权利要求的等同物的范围内且在不脱离本发明的情况下对细节作出各种修改。

Claims (14)

1.一种用于制造交易卡的方法，包括以下步骤：
在所述交易卡的卡本体中形成开口；
将电子部件插入所述开口中；以及
对所述电子部件周围的模制材料进行模制。
2.根据权利要求1所述的方法，其中，模制步骤包括将所述电子部件插入所述开口中，然后，用所述模制材料填充所述开口。
3.根据权利要求1所述的方法，其中，模制步骤包括将所述电子部件放置到模具中，以及将所述模制材料注入所述模具中。
4.根据权利要求3所述的方法，其中，插入步骤发生在所述模制步骤之后。
5.根据权利要求1所述的方法，还包括在所述卡本体中形成一个或更多个固定部件以用于将所述模制材料固定至所述卡本体的步骤。
6.根据权利要求5所述的方法，其中，所述固定部件包括所述卡本体中的凹处。
7.根据权利要求1所述的方法，其中，所述开口部分地或完全地延伸穿过所述卡本体。
8.根据权利要求1所述的方法，其中，所述模制材料是具有约150℃至约300℃的模制温度范围的塑料。
9.根据权利要求1所述的方法，其中，所述聚合物模制材料为以下中的一种或更多种：EVA、茂金属聚α-烯烃、包括无规聚α-烯烃的聚烯烃、嵌段共聚物、聚氨酯热熔体、聚酰胺、玻璃纤维增强聚酯、聚氨酯、酚醛塑料、硬质塑料、三聚氰胺、邻苯二甲酸二烯丙酯以及聚酰亚胺。
10.根据权利要求1所述的方法，其中，金属模制材料为以下中的一种或更多种：铑、铝、钛、镁、铜、黄铜、镍、蒙乃尔铜-镍合金、铬镍铁合金、钢及其合金。
11.根据权利要求1所述的方法，还包括在模制步骤之后，从模制的电子部件中去除多余的模制材料的步骤。
12.根据权利要求1所述的方法，其中，所述开口是所述卡本体中的凹处，以及模制步骤包括将模制材料模制到所述电子部件的至少顶表面上。
13.一种包括模制的电子部件的交易卡。
14.一种根据权利要求1所述的方法制造的交易卡。
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US20190291316A1 (en) 2019-09-26
BR112019001543A8 (pt) 2023-04-11
PL3491584T3 (pl) 2022-11-07
AU2019361988A1 (en) 2021-05-20
KR20190034597A (ko) 2019-04-02
JP7247086B2 (ja) 2023-03-28
US20210138705A1 (en) 2021-05-13
US11267172B2 (en) 2022-03-08
US20190050706A1 (en) 2019-02-14
BR112021007410A2 (pt) 2021-08-03
US20190160717A1 (en) 2019-05-30
CA3116226A1 (en) 2020-04-23
EP3867816B1 (en) 2024-08-28
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WO2018022755A1 (en) 2018-02-01
EP3491584A1 (en) 2019-06-05

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