CN109406012B - Flexible piezoelectric three-dimensional touch sensor array and preparation method thereof - Google Patents
Flexible piezoelectric three-dimensional touch sensor array and preparation method thereof Download PDFInfo
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- 238000002360 preparation method Methods 0.000 title abstract description 9
- 239000003990 capacitor Substances 0.000 claims abstract description 29
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 28
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 28
- 239000002086 nanomaterial Substances 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 239000002070 nanowire Substances 0.000 claims description 25
- 229920001721 polyimide Polymers 0.000 claims description 20
- 239000004642 Polyimide Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
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- 239000002105 nanoparticle Substances 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 5
- 238000002955 isolation Methods 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- -1 Polydimethylsiloxane Polymers 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 238000000678 plasma activation Methods 0.000 claims description 3
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- 238000007650 screen-printing Methods 0.000 claims description 3
- 238000004528 spin coating Methods 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000007738 vacuum evaporation Methods 0.000 claims description 3
- 230000035945 sensitivity Effects 0.000 abstract description 9
- 230000004044 response Effects 0.000 abstract description 5
- 235000013870 dimethyl polysiloxane Nutrition 0.000 abstract 3
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 abstract 3
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 abstract 3
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- 239000002033 PVDF binder Substances 0.000 description 3
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
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- Physics & Mathematics (AREA)
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- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
The invention discloses a flexible piezoelectric three-dimensional touch sensor array, which structurally comprises a PDMS hemispherical convex layer, an upper electrode layer, a nano-structure piezoelectric film layer, a lower electrode layer and a printed circuit board flexible substrate layer which are sequentially connected from top to bottom; the nano-structure piezoelectric film layer is a nano-structure ZnO piezoelectric film and is positioned between the upper electrode layer and the lower electrode layer which are distributed in an array pattern manner to form a plurality of piezoelectric sensitive units; the three-dimensional touch sensor array is composed of M multiplied by N mutually separated sensor units, each sensor unit comprises a PDMS hemispherical bulge and three piezoelectric sensitive capacitors, the PDMS hemispherical bulge transmits three-dimensional contact force to the three piezoelectric sensitive capacitors, and the magnitude of charges is generated through the three piezoelectric sensitive capacitors so as to measure external three-dimensional contact force. The invention also discloses a preparation method of the flexible piezoelectric three-dimensional touch sensor. The invention has the advantages of three-dimensional contact force measurement, high sensitivity, high flexibility and good dynamic response.
Description
Technical Field
The invention belongs to the technical field of touch sensors, and particularly relates to a flexible piezoelectric three-dimensional touch sensor array and a preparation method thereof.
Background
The touch sense is an important perception form of the robot for acquiring the environment information next to the vision sense, and the generalized touch sense includes a touch sense, a pressure sense, a force sense, a slide sense, a cold sense and the like, which is a force sense on the contact surface of the manipulator and the object in a narrow sense. Nowadays, as the touch sensor can detect or sense small changes of a series of physical characteristic quantities when the robot interacts with an object and an environment, not only can the contact position of the hand of the robot and the object and the distribution function of contact force be obtained, but also object information which cannot be obtained by vision, such as vibration characteristics, heat transfer characteristics, mechanical characteristics and the like, the touch sensor has a huge application prospect in the aspects of artificial limbs, machine skin, touch screens, wearable electronic devices and the like. The flexible touch sensor with the functions of flexibility and three-dimensional force detection has wide application prospects in the research fields of sports, medical treatment, biomechanics and the like.
In the past decades, people simulate touch sense by using various novel sensitive materials, novel sensitive mechanisms, novel device structures and the like, so that the sensitive characteristics of the touch sense are effectively improved, the application field of the touch sense is expanded, and the research of the touch sense sensing technology is promoted to make great progress. Tactile sensors are mainly classified into five types according to the working mechanism, including capacitive, piezoresistive, piezoelectric, optical and triboelectric tactile sensors. The piezoelectric touch sensor utilizes the piezoelectric effect of the sensitive material, when external force acts on the sensitive material, structural deformation occurs, positive and negative bound charges are caused on the surface of the sensor, and therefore external pressure information is sensed. Compared with piezoresistive and capacitive touch sensors, the piezoelectric touch sensor has the advantages of higher sensitivity, dynamic response, low energy consumption, self-power supply and the like, has no relation with a contact object in performance, has important value in developing a flexible touch sensor with rapid dynamic response, low energy consumption and self-power supply, and can be widely applied to the fields of man-machine interaction, robots, biomedical devices and the like.
Currently, three-dimensional tactile sensors are mainly based on piezoresistive and capacitive sensors. The silicon piezoresistive three-dimensional touch sensor has the advantages of stable performance, simple interface, easy integration and the like, but is easy to fragile, so that the silicon piezoresistive three-dimensional touch sensor is not matched with flexible wearable application. The conductive rubber type piezoresistive three-dimensional touch sensor and the flexible capacitive three-dimensional touch sensor have the characteristics of flexibility and bending, but have poor dynamic performance, and cannot realize quick response to contact with a sliding signal. To solve these problems, it is necessary to study a flexible three-dimensional tactile sensing array based on piezoelectric technology, and by means of the characteristic of quick response, quick judgment of the slip state and the slip state is realized. However, existing flexible piezoelectric tactile sensors mostly employ polyvinylidene fluoride (PVDF) or polyvinylidene fluoride copolymer (PVDF-TrFE) as the piezoelectric sensitive material. However, compared to inorganic piezoelectric materials, tactile sensors based on organic piezoelectric materials have good flexibility, but their low piezoelectric coefficients result in low sensitivity. Therefore, how to solve the contradiction between high flexibility and high sensitivity of the flexible piezoelectric tactile sensor, and develop the hot spot which has the advantages of high flexibility, high sensitivity, easy large-area manufacture, low cost processing and the like and is concerned by the industry.
Disclosure of Invention
The invention aims to overcome the defects and shortcomings in the prior art, and provides a flexible piezoelectric three-dimensional touch sensor array and a preparation method thereof, and the problems that the conventional flexible touch sensor cannot be high in flexibility and high in sensitivity are solved by adopting an inorganic nano piezoelectric material as a piezoelectric sensitive layer; a sensor array unit is formed by the hemispherical bulges and the three piezoelectric sensitive elements, and a simple preparation process is adopted, so that the three-dimensional touch sensor array with high sensitivity and high flexibility is realized.
In order to achieve the above purpose, the invention adopts the following technical scheme:
A flexible piezoelectric three-dimensional tactile sensor array comprising: a hemispherical convex layer 1, an upper electrode layer 2, a nano-structure piezoelectric film layer 3, a lower electrode layer 5 and a flexible printed circuit board substrate layer 6 which are connected in sequence from top to bottom; the three-dimensional touch sensor array is composed of M multiplied by N three-dimensional touch sensor units which are separated from each other;
the hemispherical convex layer 1 is a hemispherical patterned film with an MxN arranged surface and covers the MxN arranged upper electrode patterns; the lower electrode layer 5 is an array node of M multiplied by N, each array node is three circular lower electrodes under each upper electrode, namely, one upper electrode corresponds to three lower electrodes, three piezoelectric sensitive capacitors are formed together with the sandwich nano-structure piezoelectric film, and a hemispherical bulge is pressed on the three piezoelectric sensitive capacitors to form a three-dimensional touch sensor unit;
Each three-dimensional touch sensor unit comprises a hemispherical bulge and three piezoelectric sensitive capacitors, the hemispherical bulge transmits three-dimensional contact force to the three piezoelectric sensitive capacitors, and the magnitude and the direction of external contact force are measured by generating charges at two ends of the three piezoelectric sensitive capacitors.
As a preferable technical scheme, polyimide flexible films 4 are adopted among the piezoelectric sensitive capacitors as insulating isolation films and are positioned between the upper electrode layer and the flexible printed circuit board substrate layer, so that three piezoelectric sensitive capacitors in the three-dimensional touch sensor unit are electrically isolated from each other and from surrounding three-dimensional touch sensor units in an insulating way.
As an optimal technical scheme, in the three-dimensional touch sensor unit, three piezoelectric sensitive capacitors are uniformly distributed under the hemispherical protrusions, and three lower electrodes are inscribed in the projection circular surfaces of the hemispherical protrusions.
As an optimal technical scheme, the nano-structure piezoelectric film layer is a ZnO nanowire piezoelectric sensitive film, is grown on a lower electrode layer distributed in an array pattern mode, and is positioned between an upper electrode layer and a lower electrode layer to form M multiplied by N arranged piezoelectric sensitive units.
As a preferable technical scheme, the upper electrode layer is a nano-particle Ag film layer with the thickness of 100-200 nm; the lower electrode is a Zn film with the thickness of 1-2 mu m.
As a preferable technical scheme, the thickness of the polyimide flexible film is 2-3 μm.
As a preferred technical solution, the hemispherical convex layer is a flexible Polydimethylsiloxane (PDMS) material.
The preparation method of the flexible piezoelectric three-dimensional touch sensor array comprises the following steps:
(1) Depositing a Zn film on a substrate of a flexible printed circuit board by adopting vacuum evaporation, and etching to form each array node of M multiplied by N arrangement, wherein each array node is provided with three circular lower electrodes and outgoing lines;
(2) Spin-coating a polyimide film on the flexible substrate coated with the Zn film, and etching to remove the polyimide film on the surface of the round Zn film, so that the Zn film of the round part is exposed;
(3) Growing a ZnO nanowire piezoelectric sensitive film layer on the surface of the round Zn film;
(4) Forming a nano Ag film on the ZnO nanowire and the polyimide film by utilizing nano-particle Ag ink and adopting a screen printing technology, and forming an upper electrode of the sensor unit by heat treatment;
(5) Mixing PDMS prepolymer with curing agent, stirring, vacuumizing to remove bubbles, injecting into an aluminum alloy mold with hemispherical pit array for curing treatment, and preparing a PDMS hemispherical protruding layer;
(6) And (3) performing oxygen plasma activation on the lower surface of the PDMS hemispherical convex layer and the upper surface of the upper electrode bonding layer of the sensor unit prepared in the step (4), and aligning and bonding the two surfaces to prepare the three-dimensional touch sensor array.
In the step (3), a ZnO nanowire is grown on the surface of the Zn film by a hydrothermal vapor method to form a ZnO nanowire column serving as a piezoelectric sensitive film, the height of the ZnO nanowire is equal to or slightly lower than the thickness of a polyimide flexible film around the ZnO nanowire column by controlling process conditions, and the circular Zn film is ensured not to be completely converted into the ZnO nanowire.
Compared with the prior art, the invention has the following advantages and effects:
1. the flexible piezoelectric type three-dimensional touch sensor array adopts ZnO nano material as a piezoelectric sensitive layer, so that the problems of low sensitivity and low resolution of the conventional flexible touch sensor can be solved;
2. The flexible piezoelectric type three-dimensional touch sensor array can measure the size and the direction of three-dimensional contact force through the combination of the PDMS hemispherical protrusions and the three uniformly distributed piezoelectric capacitors, and has the advantages of simple structure and convenience in operation;
3. According to the flexible piezoelectric three-dimensional touch sensor array, the basal layer, the insulating isolation film, the ZnO piezoelectric sensitive layer with the nano structure and the hemispherical convex layer on the surface are all made of flexible materials, so that the curved surface loading is convenient, the problem that the conventional rigid touch sensor array is difficult to load on the curved surface can be solved, and the applicability of the sensor is effectively improved;
4. Compared with the existing flexible touch sensor, the flexible piezoelectric three-dimensional touch sensor array provided by the invention better solves the contradiction between high sensitivity and high flexibility, effectively improves the gain, signal-to-noise ratio and anti-interference capability of the sensor, and is more convenient to apply to various wearable intelligent electronic systems, robot sensing systems and biomedical devices.
Drawings
FIG. 1 is a schematic perspective exploded view of a flexible piezoelectric three-dimensional tactile sensor array of the present invention;
FIG. 2 is a schematic view of a PDMS hemispherical bump layer according to the present invention;
FIG. 3 is a plan view of an upper electrode layer of the present invention;
FIG. 4 is a plan view of a lower electrode layer of the present invention;
FIG. 5 is a schematic diagram of a sensor unit structure after the preparation of the lower electrode of the present invention;
FIG. 6 is a schematic diagram of a sensor unit structure after insulation isolation of the present invention;
FIG. 7 is a schematic diagram of the structure of a sensor unit after the ZnO nanowire piezoelectric film of the invention is grown;
FIG. 8 is a schematic diagram of a sensor unit structure after the upper electrode deposition of the present invention;
fig. 9 is a schematic structural diagram of a three-dimensional tactile sensor unit after the preparation of the PDMS hemispherical protrusion layer according to the present invention.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not limiting the invention.
Examples
As shown in fig. 1, a flexible piezoelectric three-dimensional tactile sensor array has a structure including: a PDMS hemispherical convex layer 1, an upper electrode layer 2, a nano-structure piezoelectric film layer 3, a lower electrode layer 5 and a flexible printed circuit board substrate layer 6 which are sequentially connected from top to bottom; the three-dimensional touch sensor array is composed of M×N three-dimensional touch sensor units separated from each other, and each three-dimensional touch sensor unit further comprises a polyimide flexible film 4 for insulating and isolating piezoelectric sensitive capacitors, as shown in fig. 6;
The present embodiment preferably has m=3, n=4, i.e. 3×4 for a total of 12 sensor units; the PDMS hemispherical convex layer 1 is a patterned PDMS film with a3×4 arranged PDMS hemispherical surface, and covers the 3×4 arranged upper electrode pattern, and the planar structures of the PDMS hemispherical convex layer 1 and the upper electrode layer 2 are shown in fig. 2 and 3 respectively.
The bottom electrode layer 5 (the planar structure of which is shown in fig. 4) is an array node arranged in m×n, each array node is three circular bottom electrodes (such as a first bottom electrode 51, a second bottom electrode 52, and a third bottom electrode 53 in fig. 5) directly below each top electrode, i.e. one top electrode corresponds to three bottom electrodes; as shown in fig. 6, a polyimide flexible film 4 is prepared on a flexible printed circuit board substrate, and the surfaces of three circular lower electrodes are exposed by an etching technique; as shown in fig. 7 and 8, one upper electrode corresponds to three circular lower electrodes, and forms three piezoelectric sensitive capacitors together with the sandwich nano-structure piezoelectric film; the PDMS hemispherical bulges are pressed on the three piezoelectric sensitive capacitors in a positive mode to form a three-dimensional touch sensor unit, and the three-dimensional structure of the sensor unit is shown in figure 9; specifically, three piezoelectric sensitive capacitors are uniformly distributed under the hemispherical protrusions, and three lower electrodes are inscribed in the projection round surfaces of the hemispherical protrusions.
In this embodiment, the three-dimensional tactile sensor unit includes a PDMS hemispherical protrusion and three piezoelectric sensitive capacitors, the hemispherical protrusion transmits a three-dimensional contact force to the three piezoelectric sensitive capacitors, and the magnitude and direction of the external contact force are measured by generating charges at both ends of the three piezoelectric sensitive capacitors.
As shown in fig. 1, the nano-structure piezoelectric thin film layer 3 is a ZnO nanowire piezoelectric sensitive film, and is grown on a lower electrode layer distributed in an array pattern, and is located between an upper electrode layer and a lower electrode layer, so as to form m×n arranged piezoelectric sensitive units.
In this embodiment, the polyimide flexible film 4 is used as an isolation film between the three piezoelectric sensitive capacitors in the three-dimensional tactile sensor unit, and is located between the upper electrode layer and the flexible printed circuit board substrate layer, so that the three piezoelectric sensitive capacitors are electrically isolated from each other in a particularly good manner, and are insulated from the surrounding three-dimensional tactile sensor units.
In this embodiment, the PDMS hemispherical bump layer is a flexible polydimethylsiloxane material; the upper electrode layer is a nano-particle Ag film layer with the thickness of 100-200 nm; the lower electrode is a Zn film with the thickness of 1-2 mu m; the thickness of the polyimide flexible film is 2-3 mu m.
In this embodiment, the method for manufacturing the flexible piezoelectric three-dimensional tactile sensor array includes the following steps:
(1) Depositing a layer of Zn film on a substrate of a flexible printed circuit board by adopting vacuum evaporation, and etching to form each array node of M multiplied by N arrangement, wherein each array node is provided with three circular lower electrodes and outgoing lines, as shown in figure 5;
(2) Spin-coating a polyimide film on the flexible substrate coated with the Zn film, and etching to remove the polyimide film on the surface of the round Zn film, so that the Zn film of the round part is exposed, as shown in FIG. 6;
(3) Growing ZnO nanowires on the surface of a Zn film by adopting a hydrothermal steam method, wherein the ZnO nanowires serve as piezoelectric films, the heights of the ZnO nanowires are equal to or slightly lower than the thickness of a polyimide film around the ZnO nanowires by controlling process conditions, the Zn films are not completely converted into the ZnO nanowires, the unconverted Zn films serve as lower electrodes of piezoelectric sensitive capacitance units, and the structure of the sensor units is shown in figure 7;
(4) Forming a nano Ag film on the ZnO nanowire and the polyimide film by using nano-particle Ag ink and adopting a screen printing technology, and forming an upper electrode of the sensor unit by heat treatment, as shown in FIG. 8;
(5) Mixing PDMS prepolymer and curing agent in a mass ratio of 10:1, stirring uniformly, vacuumizing to remove bubbles, injecting into an aluminum alloy mold with a hemispherical pit array, and placing in an incubator at 80 ℃ for 3 hours for curing treatment to prepare a hemispherical convex layer on the PDMS surface;
(6) Oxygen plasma activation is carried out on the lower surface of the PDMS hemispherical convex layer and the upper surface of the upper electrode bonding layer of the sensor unit prepared in the step (4), and the two surfaces are aligned and bonded to prepare the three-dimensional touch sensor array, and the complete sensor unit structure is shown in figure 9.
The foregoing examples illustrate only a few embodiments of the invention and are described in detail herein without thereby limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the protection scope of the present invention is subject to the claims.
Claims (5)
1. A flexible piezoelectric three-dimensional tactile sensor array, comprising: the device comprises a hemispherical convex layer (1), an upper electrode layer (2), a nano-structure piezoelectric film layer (3), a lower electrode layer (5) and a flexible printed circuit board substrate layer (6) which are sequentially connected from top to bottom; the three-dimensional touch sensor array is composed of M multiplied by N three-dimensional touch sensor units which are separated from each other;
The hemispherical convex layer (1) is a hemispherical patterned film with an MxN arranged surface and covers an MxN arranged upper electrode pattern; the lower electrode layer (5) is an array node of M multiplied by N, each array node is three circular lower electrodes right below each upper electrode, namely one upper electrode corresponds to three lower electrodes, three piezoelectric sensitive capacitors are formed together with the sandwich nano-structure piezoelectric film, and a hemispherical bulge is pressed on the three piezoelectric sensitive capacitors to form a three-dimensional touch sensor unit;
Each three-dimensional touch sensor unit comprises a hemispherical bulge and three piezoelectric sensitive capacitors, the hemispherical bulge transmits three-dimensional contact force to the three piezoelectric sensitive capacitors, and the magnitude and the direction of external contact force are measured by generating charges at two ends of the three piezoelectric sensitive capacitors;
Polyimide flexible films (4) are adopted among the piezoelectric sensitive capacitors as insulating isolation films and are positioned between the upper electrode layers and the substrate layers of the flexible printed circuit board, so that three piezoelectric sensitive capacitors in the three-dimensional touch sensor units are electrically isolated from each other and from surrounding three-dimensional touch sensor units in an insulating way;
the nano-structure piezoelectric film layer is a ZnO nanowire piezoelectric sensitive film, is grown on a lower electrode layer which is distributed in an array pattern manner, and is positioned between an upper electrode layer and a lower electrode layer to form M multiplied by N piezoelectric sensitive units;
The upper electrode layer is a nano-particle Ag film layer with the thickness of 100-200 nm; the lower electrode is a Zn film with the thickness of 1-2 mu m;
the thickness of the polyimide flexible film is 2-3 mu m.
2. The flexible piezoelectric three-dimensional tactile sensor array of claim 1 wherein: in the three-dimensional touch sensor unit, three piezoelectric sensitive capacitors are uniformly distributed under the hemispherical protrusions, and three lower electrodes are inscribed in the projected circular surfaces of the hemispherical protrusions.
3. The flexible piezoelectric three-dimensional tactile sensor array of claim 1 wherein: the hemispherical relief layer is a flexible Polydimethylsiloxane (PDMS) material.
4. A method of manufacturing a flexible piezoelectric three-dimensional tactile sensor array according to any one of claims 1 to 3, comprising the steps of:
(1) Depositing a Zn film on a substrate of a flexible printed circuit board by adopting vacuum evaporation, and etching to form each array node of M multiplied by N arrangement, wherein each array node is provided with three circular lower electrodes and outgoing lines;
(2) Spin-coating a polyimide flexible film on the flexible substrate coated with the Zn film, and etching to remove the polyimide flexible film on the surface of the round Zn film, so that the Zn film of the round part is exposed;
(3) Growing a ZnO nanowire piezoelectric sensitive film layer on the surface of the round Zn film;
(4) Forming a nano Ag film on the ZnO nanowire and the polyimide flexible film by utilizing nano-particle Ag ink and adopting a screen printing technology, and forming an upper electrode of the sensor unit by heat treatment;
(5) Mixing PDMS prepolymer with curing agent, stirring, vacuumizing to remove bubbles, injecting into an aluminum alloy mold with hemispherical pit array for curing treatment, and preparing a PDMS hemispherical protruding layer;
(6) And (3) performing oxygen plasma activation on the lower surface of the PDMS hemispherical convex layer and the upper surface of the upper electrode bonding layer of the sensor unit prepared in the step (4), and aligning and bonding the two surfaces to prepare the three-dimensional touch sensor array.
5. The method for manufacturing the piezoelectric three-dimensional tactile sensor array according to claim 4, wherein: in the step (3), the ZnO nanowire piezoelectric sensitive film layer grows ZnO nanowires on the surface of the Zn film by adopting a hydrothermal steam method, so that ZnO nanowire columns are formed to serve as the piezoelectric sensitive film, the height of the ZnO nanowires is equal to or slightly lower than the thickness of the polyimide flexible film around the ZnO nanowires by controlling the process conditions, and the circular Zn film is ensured not to be completely converted into the ZnO nanowires.
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