CN108110597B - Bonded sapphire heat dissipation structural member for high-power optical fiber laser beam combiner - Google Patents
Bonded sapphire heat dissipation structural member for high-power optical fiber laser beam combiner Download PDFInfo
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- CN108110597B CN108110597B CN201810108299.0A CN201810108299A CN108110597B CN 108110597 B CN108110597 B CN 108110597B CN 201810108299 A CN201810108299 A CN 201810108299A CN 108110597 B CN108110597 B CN 108110597B
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- sapphire
- heat dissipation
- fiber laser
- cover
- middle layer
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- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 162
- 239000010980 sapphire Substances 0.000 title claims abstract description 162
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 55
- 239000013307 optical fiber Substances 0.000 title abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 18
- 239000000835 fiber Substances 0.000 claims description 20
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 229910018516 Al—O Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 24
- 239000013078 crystal Substances 0.000 description 10
- 239000002585 base Substances 0.000 description 9
- 238000005253 cladding Methods 0.000 description 7
- 238000005086 pumping Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Lasers (AREA)
Abstract
The invention discloses a bonding sapphire heat dissipation structure for a high-power optical fiber laser beam combiner, which comprises a metal outer frame, wherein an intermediate layer sapphire, a top layer sapphire, a sapphire cover and a sapphire heat dissipation rod are arranged in the metal outer frame, the top end of a sapphire base is provided with the intermediate layer sapphire and the sapphire heat dissipation rod, the sapphire heat dissipation rod is positioned in the intermediate layer sapphire, the top end of the intermediate layer sapphire is provided with the top layer sapphire and the sapphire cover, and the sapphire cover is positioned above the sapphire heat dissipation rod. According to the invention, the thermal expansion coefficient of the sapphire is much smaller than that of metal, the structure can bear 2-3 kilowatt laser, and when bearing the kilowatt laser with higher power, the expansion of the sapphire bonding structure is relatively smaller and almost unchanged, so that the stability and reliability of the beam combiner are greatly improved.
Description
Technical Field
The invention relates to the technical field of heat dissipation of optical fiber laser beam combiners, in particular to a bonded sapphire heat dissipation structural member for a high-power optical fiber laser beam combiners.
Background
With the rapid development of fiber lasers and fiber amplifiers in recent years, high-power fiber lasers and fiber amplifiers are required in various fields such as laser weapons, material processing (laser marking, laser welding), optical sensing, laser radar, fiber communication and the like. And the realization of the high-power fiber laser and the fiber amplifier is not separated from a pumping beam combiner based on a cladding pumping technology. The cladding pumping technology is realized by double-cladding optical fibers, the double-cladding optical fibers are added with an inner cladding compared with common optical fibers, the cross section area and the numerical aperture are far larger than the core diameter, so that multimode optical fibers can be transmitted in the cladding, the multimode optical fibers have higher efficiency compared with single-mode optical coupling, and the high-power multimode pumping light is converted into high-power single-mode laser through the absorption, conversion and amplification of active optical fibers doped with rare earth elements.
Although the optical fiber laser and the optical fiber amplifier in China are in the period of rapid development, the high-power cladding pumping technology is late in start relative to European and American countries, and the development of the beam combiner is limited by a plurality of difficult problems which cannot be overcome. The biggest problem is the problem of safe heat dissipation of the kilowatt-level fiber laser. The current mature combiner development units in the world are IPG in the united states, OFS in the united states, ITF in canada, HIGHWAVE in france, and the like. In China, major manufacturers and developers of beam combiners have a series of high-tech production and development units such as Shanghai Miao, shanghai optical machine institute of the Chinese academy of sciences, and Xiyan optical machine institute of the Chinese academy of sciences.
Most of the current common beam combiners in the market use quartz tubes as radiating rods for beam combination. But can only be used for low power beam combiners below 20W due to the poor quartz thermal conductivity. The direct heat dissipation mode of 20-100W is mainly to adopt the sapphire heat dissipation stick, package optic fibre on the sapphire heat dissipation stick, the heat dissipation stick is fixed in the metal aluminum box, because the good heat conduction light transmissivity of sapphire material itself, this kind of mode has effectually improved the heat dissipation ability compared the quartz capsule, has reduced the surface temperature of optic fibre. But even this approach has two problems that limit further increases in fiber-carrying power: 1. the optical fiber welding end inevitably has the emission of light and heat, and the sapphire rod has limited length and single-sided light transmission and heat conduction, so that the heat emission capability of the sapphire rod is greatly limited, the part of functional energy cannot be effectively emitted, and finally heat energy can be formed to improve the temperature of the heat emission rod, so that the further improvement of the bearing power is limited; 2. under the condition that the power is further improved (more than 100W), the thermal expansion of the metal aluminum box is obvious, and the stability and the reliability of the whole beam combiner are poor.
Disclosure of Invention
The invention aims to provide a bonded sapphire heat dissipation structural member for a high-power optical fiber laser beam combiner, which aims to solve the problems in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a bonding sapphire heat dissipation structure for high-power fiber laser beam combiner, includes the metal frame, be provided with intermediate level sapphire, top layer sapphire, sapphire lid and sapphire heat dissipation stick in the metal frame, sapphire base top is provided with intermediate level sapphire and sapphire heat dissipation stick, and the sapphire heat dissipation stick is located the intermediate level sapphire, intermediate level sapphire top is provided with top layer sapphire and sapphire lid, and the sapphire lid is located sapphire heat dissipation stick top.
Preferably, the metal outer frame is an aluminum alloy frame.
Preferably, the middle layer sapphire and the sapphire base are combined with the top layer sapphire through the atomic force of Al-O ionic bonds.
Preferably, the surfaces of the sapphire base, the middle layer sapphire, the top layer sapphire, the sapphire cover and the sapphire heat dissipation bar are all arranged to be polishing structures.
Preferably, the length of the sapphire substrate is set to 75mm, the width of the sapphire substrate is set to 8.5m, and the height of the sapphire substrate is set to 2.5mm.
Preferably, the length of the middle layer sapphire is set to 75mm, the width of the middle layer sapphire is set to 2mm, and the height of the middle layer sapphire is set to 2.2mm.
Preferably, the length of the sapphire cover is set to 75mm, the width of the sapphire cover is set to 4.4mm, and the height of the sapphire cover is set to 2.2mm.
Preferably, the length of the sapphire heat dissipation bar is set to be 75mm, the width of the sapphire heat dissipation bar is set to be 2.3mm, and the height of the sapphire heat dissipation bar is set to be 2.3mm.
Compared with the prior art, the invention has the beneficial effects that: the invention 1. The inherent superiority of the bonding structure is adopted: the bonding structure is fixed by a chemical bonding mode, has good heat conduction and conduction, is acid-resistant, alkali-resistant and high-temperature-resistant, and has great superiority. 2. The heat dissipation effect is obviously improved: because the sapphire bonding structure has increased the radiating surface area of optic fibre compared with the sapphire stick, compare the single face heat dissipation of sapphire stick, the six heat dissipation ability of sapphire bonding structure is better, therefore the nearly effective effluvium of light and heat of optic fibre welding port. 3. Reliability is greatly improved: the structure can bear 2-3 kilowatt laser, the thermal expansion coefficient of the sapphire is much smaller than that of metal, and when bearing the kilowatt laser with higher power, the expansion of the sapphire bonding structure is relatively smaller and almost unchanged, so that the stability and the reliability of the beam combiner are greatly improved.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a cross-sectional view of the present invention.
In the figure: 1-a sapphire base; 2-interlayer sapphire; 3-top sapphire; 4-sapphire cap; 5-sapphire heat dissipation bars; 6-metal outer frame.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-2, in the embodiment of the present invention, a bonded sapphire heat dissipation structure for a high-power optical fiber laser beam combiner includes a metal outer frame 6, a middle layer sapphire 2, a top layer sapphire 3, a sapphire cover 4 and a sapphire heat dissipation rod 5 are disposed in the metal outer frame 6, the whole structures of the middle layer sapphire 2, the top layer sapphire 3, the sapphire cover 4 and the sapphire heat dissipation rod 5 are disposed in the metal outer frame 6, the middle layer sapphire 2 and the sapphire heat dissipation rod 5 are disposed at the top end of a sapphire base 1 by screw fixation, the sapphire heat dissipation rod 5 is disposed in the middle layer sapphire 2, the top end of the middle layer sapphire 2 is provided with the top layer sapphire 3 and the sapphire cover 4, the sapphire cover 4 is disposed above the sapphire heat dissipation rod 5, the metal outer frame 6 is an aluminum alloy frame, the surface of each of the middle layer sapphire 2, the surface of each of the top layer sapphire 3, the surface of each of the sapphire cover 4 and the surface of each of the sapphire heat dissipation bar 5 are all set to be of a polished structure, the length of each of the sapphire base 1, the width of each of the sapphire base 1, the height of each of the sapphire base 1, the length of each of the middle layer sapphire 2, the width of each of the middle layer sapphire 2, the height of each of the middle layer sapphire 2, the length of each of the sapphire cover 4, the width of each of the sapphire cover 4, the length of each of the sapphire heat dissipation bar 5, the length of each of the sapphire cover 4, the length of each of the sapphire heat dissipation bar 5, the width of each of the sapphire cover 4, and the height of each of the sapphire heat dissipation bar 5, the width of each of the sapphire cover 4, and the sapphire heat dissipation bar 5 are all set to be 75 mm.
The working principle of the invention is as follows: precise polishing processing is required to be carried out on the surface of the crystal before bonding the crystal, and the flatness of the bonding surface of the crystal is required to reach the atomic level; cleaning the surface of the crystal, cleaning the surface of the crystal before bonding, soaking the crystal for 3 hours by using 30% hydrochloric acid, then ultrasonically cleaning the crystal in deionized water for 20 minutes, wiping the crystal by using alcohol cotton dipped with absolute ethyl alcohol, and naturally airing the crystal; the bonding is carried out in a high-temperature high-vacuum furnace, an iridium clamp is adopted to fix the sapphire base 1, the middle-layer sapphire 2 and the top-layer sapphire 3 crystal, the pressure is applied along the direction vertical to the bottom surface, the pressure is 10N-100N, the high-temperature diffusion bonding is carried out, the temperature is 1750-1950 ℃, the vacuum degree is better than 1.0x10-2 Pa, the heat is preserved for 24-48h, and then the temperature is slowly reduced to the room temperature according to a certain program and then the room temperature is taken out; the bonding structure is fixed by a chemical bonding mode, so that the heat conduction and conduction performance is good, the acid, alkali and high temperature resistance is realized, and the bonding structure has great superiority; the sapphire bonding structure has the advantages that compared with the sapphire rod, the sapphire bonding structure has the advantages that the surface area for radiating the optical fiber is increased, and compared with the single-sided radiating of the sapphire rod, the six-sided radiating capacity of the sapphire bonding structure is better, so that light and heat of an optical fiber welding port can be almost effectively radiated; the thermal expansion coefficient of the sapphire is much smaller than that of the metal, and when the sapphire is subjected to the laser with higher power and kilowatt level, the expansion of the sapphire bonding structure is relatively small and almost unchanged, so that the stability and the reliability of the beam combiner are greatly improved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (7)
1. The utility model provides a bonding sapphire heat dissipation structure for high-power fiber laser beam combiner, includes metal frame (6), its characterized in that: the metal outer frame (6) is internally provided with a middle layer sapphire (2), a top layer sapphire (3), a sapphire cover (4) and a sapphire heat dissipation rod (5), the top end of the sapphire base (1) is provided with the middle layer sapphire (2) and the sapphire heat dissipation rod (5), the sapphire heat dissipation rod (5) is positioned in the middle layer sapphire (2), the top end of the middle layer sapphire (2) is provided with the top layer sapphire (3) and the sapphire cover (4), and the sapphire cover (4) is positioned above the sapphire heat dissipation rod (5); the middle layer sapphire (2) and the sapphire base (1) are combined with the top layer sapphire (3) through the atomic force of Al-O ionic bonds.
2. The bonded sapphire heat dissipation structure for a high power fiber laser combiner of claim 1, wherein: the metal outer frame (6) is arranged to be an aluminum alloy frame.
3. The bonded sapphire heat dissipation structure for a high power fiber laser combiner of claim 1, wherein: the surface of sapphire base (1), intermediate level sapphire (2), top layer sapphire (3), sapphire lid (4) and sapphire heat dissipation stick (5) all set up to polishing structure.
4. The bonded sapphire heat dissipation structure for a high power fiber laser combiner of claim 1, wherein: the length of the sapphire base (1) is set to be 75mm, the width of the sapphire base (1) is set to be 8.5m, and the height of the sapphire base (1) is set to be 2.5mm.
5. The bonded sapphire heat dissipation structure for a high power fiber laser combiner of claim 1, wherein: the length of the middle layer sapphire (2) is set to be 75mm, the width of the middle layer sapphire (2) is set to be 2mm, and the height of the middle layer sapphire (2) is set to be 2.2mm.
6. The bonded sapphire heat dissipation structure for a high power fiber laser combiner of claim 1, wherein: the length of the sapphire cover (4) is set to be 75mm, the width of the sapphire cover (4) is set to be 4.4mm, and the height of the sapphire cover (4) is set to be 2.2mm.
7. The bonded sapphire heat dissipation structure for a high power fiber laser combiner of claim 1, wherein: the length of the sapphire heat dissipation rod (5) is set to be 75mm, the width of the sapphire heat dissipation rod (5) is set to be 2.3mm, and the height of the sapphire heat dissipation rod (5) is set to be 2.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810108299.0A CN108110597B (en) | 2018-02-02 | 2018-02-02 | Bonded sapphire heat dissipation structural member for high-power optical fiber laser beam combiner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810108299.0A CN108110597B (en) | 2018-02-02 | 2018-02-02 | Bonded sapphire heat dissipation structural member for high-power optical fiber laser beam combiner |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108110597A CN108110597A (en) | 2018-06-01 |
| CN108110597B true CN108110597B (en) | 2024-01-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810108299.0A Active CN108110597B (en) | 2018-02-02 | 2018-02-02 | Bonded sapphire heat dissipation structural member for high-power optical fiber laser beam combiner |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104242026A (en) * | 2014-08-27 | 2014-12-24 | 清华大学 | Optical fiber wrapping layer light filter-out device and forming method thereof |
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| CN104901155A (en) * | 2015-06-17 | 2015-09-09 | 中国人民解放军国防科学技术大学 | High-power fiber laser pump light coupling and signal light beam expanding output apparatus |
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| CN205809346U (en) * | 2016-07-06 | 2016-12-14 | 莱特尔科技（深圳）有限公司 | A kind of fibre cladding power stripper |
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Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7295580B2 (en) * | 2003-05-15 | 2007-11-13 | Hrl Laboratories, Llc | Numerical aperture optimization using doped cladding layers |
| US7517159B1 (en) * | 2007-09-27 | 2009-04-14 | Reflex Photonics Inc. | Two substrate parallel optical sub-assembly |
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2018
- 2018-02-02 CN CN201810108299.0A patent/CN108110597B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104242026A (en) * | 2014-08-27 | 2014-12-24 | 清华大学 | Optical fiber wrapping layer light filter-out device and forming method thereof |
| CN204347293U (en) * | 2015-01-22 | 2015-05-20 | 迈岐光电科技(上海)有限公司 | A kind of optical-fiber bundling device with encapsulating structure |
| CN104901155A (en) * | 2015-06-17 | 2015-09-09 | 中国人民解放军国防科学技术大学 | High-power fiber laser pump light coupling and signal light beam expanding output apparatus |
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| CN205809346U (en) * | 2016-07-06 | 2016-12-14 | 莱特尔科技（深圳）有限公司 | A kind of fibre cladding power stripper |
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| CN108110597A (en) | 2018-06-01 |
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