CN107866753B - Metal bond grinding wheel with random porous structure, device and preparation process - Google Patents
Metal bond grinding wheel with random porous structure, device and preparation process Download PDFInfo
- Publication number
- CN107866753B CN107866753B CN201711297789.1A CN201711297789A CN107866753B CN 107866753 B CN107866753 B CN 107866753B CN 201711297789 A CN201711297789 A CN 201711297789A CN 107866753 B CN107866753 B CN 107866753B
- Authority
- CN
- China
- Prior art keywords
- grinding wheel
- powder
- grinding
- porous structure
- metal bond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000227 grinding Methods 0.000 title claims abstract description 287
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 82
- 239000002184 metal Substances 0.000 title claims abstract description 82
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000000843 powder Substances 0.000 claims abstract description 106
- 239000002245 particle Substances 0.000 claims abstract description 30
- 239000011159 matrix material Substances 0.000 claims abstract description 20
- 239000000945 filler Substances 0.000 claims abstract description 13
- 238000000110 selective laser sintering Methods 0.000 claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 claims description 40
- 238000000149 argon plasma sintering Methods 0.000 claims description 26
- 238000003892 spreading Methods 0.000 claims description 23
- 230000007480 spreading Effects 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 19
- 230000008569 process Effects 0.000 claims description 16
- 239000007789 gas Substances 0.000 claims description 15
- 238000011084 recovery Methods 0.000 claims description 15
- 239000006061 abrasive grain Substances 0.000 claims description 14
- 238000000465 moulding Methods 0.000 claims description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 238000000746 purification Methods 0.000 claims description 7
- 238000004064 recycling Methods 0.000 claims description 7
- 229910052582 BN Inorganic materials 0.000 claims description 6
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 6
- 229910003460 diamond Inorganic materials 0.000 claims description 6
- 239000010432 diamond Substances 0.000 claims description 6
- 229910000906 Bronze Inorganic materials 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000010974 bronze Substances 0.000 claims description 5
- 239000010941 cobalt Substances 0.000 claims description 5
- 229910017052 cobalt Inorganic materials 0.000 claims description 5
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 5
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000428 dust Substances 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 4
- 239000007767 bonding agent Substances 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- 230000003993 interaction Effects 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 4
- 239000012298 atmosphere Substances 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 125000004122 cyclic group Chemical group 0.000 claims description 3
- 238000011049 filling Methods 0.000 claims description 3
- 238000002955 isolation Methods 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 230000008054 signal transmission Effects 0.000 claims description 2
- 238000009966 trimming Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 9
- 238000005520 cutting process Methods 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000005245 sintering Methods 0.000 description 5
- 238000003754 machining Methods 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910052684 Cerium Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910052779 Neodymium Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011960 computer-aided design Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/009—Tools not otherwise provided for
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention discloses a metal bond grinding wheel with a random porous structure, a device and a preparation process, wherein the metal bond grinding wheel comprises a grinding wheel matrix and a grinding wheel grinding main body sleeved on the outer side of the grinding wheel matrix, the grinding wheel grinding main body is provided with a random porous structure, the random porous structure is generated through three-dimensional modeling software, the grinding wheel grinding main body is manufactured through selective laser sintering, the ratio of the volume of the random porous structure to the volume of the grinding wheel grinding main body is 10% -50%, and the grinding wheel grinding main body comprises abrasive particles, metal powder and a filler. According to the metal bond grinding wheel provided by the embodiment of the invention, the porosity is high, so that the heat dissipation of a grinding area can be improved, the grinding burn is reduced, and the grinding surface quality is improved.
Description
Technical Field
The invention relates to the technical field of grinding processing and additive manufacturing, in particular to a metal bond grinding wheel with a random porous structure, a device for manufacturing the metal bond grinding wheel with the random porous structure and a preparation process of the metal bond grinding wheel with the random porous structure.
Background
Grinding is widely applied to precision and ultra-precision machining of key parts, such as rollers, four-stage rod bases, wafers, camshafts, gears and the like, as a cutting mode. Grinding is generally used as the final step in the part cutting process to obtain higher surface and form and position accuracy. The grinding wheel is the most applied grinding tool, and the performance of the grinding wheel is a key factor for guaranteeing the quality of the grinding process.
The structure of the grinding wheel directly influences the grinding performance of the grinding wheel, the structure of the grinding wheel is determined by the component proportion of air holes, abrasive particles and binding agents and the mutual contact state, the volume ratio of the air holes to the grinding wheel is called as porosity, the air holes of the grinding wheel have the function of containing abrasive dust and grinding liquid in the grinding process, and the improvement of the porosity of the grinding wheel is beneficial to the improvement of the cutting capacity and the cooling capacity of the grinding wheel.
In the related art, the manufacturing process of the metal bond grinding wheel mainly adopts a hot press molding method. In the hot pressing method, firstly, metal bond abrasive particles and a bonding agent are uniformly mixed according to a certain proportion, certain pressure and temperature are applied on the basis of natural accumulation and mixing, and finally molding is carried out. The structure of the grinding wheel manufactured by the process is determined by a plurality of factors which are mutually coupled and are dependent, such as the proportion of ingredients of the mixed material, the applied temperature and pressure, the pressed time and the like, the porosity of the grinding wheel is difficult to actively adjust, the porosity is lower, the grinding performance of the grinding wheel is affected, for example, the surface of the grinding wheel is easy to be blocked, the cooling performance is poor, the surface of a workpiece is easy to burn, the processing quality is affected and the like.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides the metal bond grinding wheel with the random porous structure, which has higher porosity, so that the heat dissipation of a grinding area can be improved, the grinding burn can be reduced, and the grinding surface quality can be improved.
The invention also provides a device for manufacturing the metal bond grinding wheel with the random porous structure.
The invention also provides a preparation process of the metal bond grinding wheel with the random porous structure.
According to the embodiment of the first aspect of the invention, the metal bond grinding wheel with the random porous structure comprises a grinding wheel matrix and a grinding wheel grinding main body sleeved on the outer side of the grinding wheel matrix, the grinding wheel grinding main body is provided with the random porous structure, the random porous structure is generated through three-dimensional modeling software, the grinding wheel grinding main body is manufactured through selective laser sintering, the ratio of the volume of the random porous structure to the volume of the grinding wheel grinding main body is 10% -50%, and the grinding wheel grinding main body comprises abrasive particles, metal powder and a filler.
According to the metal bond grinding wheel with the random porous structure, the grinding main body of the grinding wheel with the random porous structure is manufactured through selective laser sintering, the ratio of the volume of the random porous structure to the volume of the grinding main body of the grinding wheel is 10% -50%, the metal bond grinding wheel has high porosity and a chip containing space, and the closed grinding is changed into the open grinding, so that the blocking of the grinding wheel can be reduced, the wettability of grinding liquid is increased, the heat dissipation of a grinding area is improved, the grinding burn is reduced, and the grinding surface quality is improved. In addition, the random porous structure can be optimally designed according to the grinding conditions, so that the grinding efficiency and quality under specific grinding conditions are improved, and the optimal design of the customized grinding wheel is truly realized.
In addition, the metal bond grinding wheel with the random porous structure according to the embodiment of the invention can also have the following additional technical characteristics:
according to one embodiment of the present invention, the abrasive grains include at least one of diamond abrasive grains and cubic boron nitride abrasive grains, and the abrasive grain concentration is 10% to 200%.
According to one embodiment of the invention, the metal powder comprises at least one of bronze, cobalt, nickel, iron, aluminum.
According to one embodiment of the present invention, the filler is at least one of tungsten carbide, silicon carbide, and graphite.
According to one embodiment of the invention, the size of each hole in the random porous structure ranges from 0.02mm to 5mm.
An apparatus according to an embodiment of the second aspect of the present invention for manufacturing a metal bond grinding wheel having a random porous structure according to the embodiment of the first aspect of the present invention, the apparatus comprising: the gas purification device comprises a gas purification device main body and a circulating pipeline; a manufacturing apparatus body connected to the circulation line, the manufacturing apparatus body comprising: the working cavity is connected with the circulating pipeline and is internally provided with a powder spreading scraper; the laser scanning system is connected with the working cavity; the control system is in signal transmission with the powder spreading scraper blade to drive the powder spreading scraper blade to move left and right; the powder conveying device comprises a powder conveying box and a powder conveying piston for driving the powder conveying box; the powder recycling device comprises a powder recycling bin; and a man-machine interaction interface.
The device provided by the embodiment of the invention has the advantages of simple structure and high operation reliability, and can actively control the porosity of the metal bond grinding wheel, so that the metal bond grinding wheel can be optimally designed according to the grinding conditions, the proper porosity is ensured, the cutting and cooling capacities of the metal bond grinding wheel are improved, the grinding efficiency and quality under specific grinding conditions are improved, and the optimal design of the customized grinding wheel is truly realized.
Further, a laser sintering platform is arranged in the working cavity, a first notch and a second notch are formed in the laser sintering platform, the laser sintering platform is provided with a powder feeding piston and a forming piston, the powder feeding piston is arranged in the first notch and can move up and down, and the forming piston is arranged in the second notch and can move up and down; the powder feeding box is defined between the upper surface of the powder feeding piston and the first notch, and the powder spreading scraper is arranged on the upper surface of the laser sintering platform; and a forming matrix is arranged on the forming piston, and the metal bonding agent grinding wheel is formed on the forming matrix.
Still further, the laser scanning system includes: a laser for emitting a laser light source; and one end of the vibrating mirror system is connected with the laser, and the other end of the vibrating mirror system is opposite to the forming matrix.
According to a third aspect of the present invention, there is provided a production process for producing a metal bond grinding wheel having a random porous structure according to the above-described first aspect of the present invention, comprising the steps of:
s1: mixing abrasive particles, metal powder and filler to form a mixed material;
S2: introducing the designed metal bond grinding wheel parameters with the random porous structure into a manufacturing device, adding the mixed materials into a powder feeding box, and setting laser sintering process parameters;
S3: closing an isolation door of a working cavity, opening a gas purifying device, and circularly filling at least one of nitrogen and argon into the working cavity;
S4: starting the laser;
s5: the control system controls the powder feeding piston to ascend for a certain distance, the powder spreading scraper blade moves from the leftmost end to the powder recovery box and then from the powder recovery box to the leftmost end, the laser selectively sinters the current powder spreading layer through the vibrating mirror system, the forming piston descends for a certain distance, and the redundant powder is fed into the powder recovery box;
s6: repeating the step S5 until the grinding wheel grinding main body is prepared;
s7: processing a grinding wheel matrix, and assembling a grinding wheel grinding main body and the grinding wheel matrix;
s8: the metal bond grinding wheel trims the sharpening.
According to the preparation process disclosed by the embodiment of the invention, the porosity of the metal bond grinding wheel can be actively controlled, so that the metal bond grinding wheel can be optimally designed according to the grinding conditions, the proper porosity is ensured, in the grinding process, the grinding wheel is not easy to block, the cooling effect is good, the workpiece is not easy to burn, the grinding force is small, the surface shape precision and the surface roughness of the ground workpiece are superior to those of the grinding wheel manufactured by the conventional process, the grinding efficiency and the grinding quality under the specific grinding conditions are improved, and the optimal design of the customized grinding wheel is truly realized. The preparation process provided by the embodiment of the invention is convenient to operate, is particularly suitable for small-batch customized production, and has good consistency of the quality of the grinding wheels in the same batch. In addition, the metal bond grinding wheel manufactured by the preparation process provided by the embodiment of the invention has lighter weight, and can reduce the manufacturing cost.
Further, the laser sintering parameters include:
setting the power of the laser to 10W-500W;
Setting the thickness of the powder layer to be between 0.02 and 0.5 mm;
setting the linear scanning speed between 100mm/s and 7000 mm/s;
Setting the linear forming speed between 10mm/s and 3000 mm/s;
The oxygen concentration of the working cavity is made to be less than 100ppm;
the dust removal rate of the molding atmosphere is more than 98% under the condition of cyclic purification.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic illustration of a metal bond grinding wheel having a random porous structure in accordance with an embodiment of the present invention;
FIG. 2 is a schematic view of the microstructure of a metal bond grinding wheel having a random porous structure in accordance with an embodiment of the invention;
FIG. 3 is a schematic illustration of a device for manufacturing a metal bond grinding wheel with a random porous structure according to an embodiment of the invention;
Fig. 4 is a schematic diagram of a working chamber for manufacturing a metal bond grinding wheel unit with a random porous structure according to an embodiment of the invention.
Reference numerals:
Metal bond grinding wheel 100;
a grinding wheel base 1;
a grinding wheel grinding body 2; a random porous structure 21;
An apparatus 200;
A gas cleaning device 210; a gas cleaning device main body 211; a circulation line 212;
Manufacturing an apparatus main body 220; a working chamber 221; a powder spreading scraper 2211; a laser sintering platform 2212; a laser scanning system 222; a laser 2221; a galvanometer system 2222; a control system 223; a powder conveying device 224; powder feeding box 2241; a powder feeding piston 2242; a powder recovery device 225; a human-machine interaction interface 226; a shaped piston 2213; and forming the matrix 2214.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.
In the description of the present invention, it should be understood that the terms "center," "upper," "lower," "left," "right," "horizontal," "top," "bottom," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Additive manufacturing technology is a class of processing methods that began to rise in the 80 s of the 20 th century, where selective laser sintering technology is a common process for machining complex-shaped parts. The selective laser sintering technology is to sinter the loose powder thin layer by high energy laser according to a computer aided design model, and form a high-density three-dimensional part with any complex shape by means of laying powder layer by layer and stacking layer by layer. The laser sintering process adopts a powder sintering molding mechanism, can manufacture nonmetallic, metal and even composite material parts, and has good molding precision and comprehensive mechanical properties. The selective laser sintering technology has the advantages of high material utilization rate, short manufacturing period and low cost, and is particularly suitable for the fields of complex parts and special customization.
Grinding is widely applied to precision and ultra-precision machining of key parts, such as rollers, four-stage rod bases, wafers, camshafts, gears and the like, as a cutting mode. Grinding is generally used as the final step in the part cutting process to obtain higher surface and form and position accuracy. The grinding wheel is the most applied grinding tool, and the performance and matching process of the grinding wheel are key factors for guaranteeing the quality of the grinding process.
A metal bond grinding wheel 100 having a random porous structure according to an embodiment of the first aspect of the present invention is described below with reference to fig. 1-2.
The metal bond grinding wheel 100 comprises a grinding wheel base 1 and a grinding wheel grinding body 2, wherein the grinding wheel grinding body 2 is sleeved on the outer wall of the grinding wheel base 1, the grinding wheel grinding body 2 is formed into a revolving body, for example, a circular ring-shaped structure shown in the figure 1 can be formed by integral molding or piece-by-piece manufacturing and then splicing, the grinding wheel grinding body 2 is provided with a random porous structure 21, the random porous structure 21 is generated through three-dimensional modeling software, the grinding wheel grinding body 2 is manufactured through selective laser sintering, the ratio of the volume of the random porous structure 21 to the volume of the grinding wheel grinding body 2 is in the range of 10% -50%, the grinding wheel grinding body 2 comprises abrasive particles, metal powder and filler, namely, raw materials for manufacturing the grinding wheel grinding body 2 comprise abrasive particles, metal powder and filler.
It should be noted that "the grinding wheel grinding body 2 has the random porous structure 21" means that the grinding wheel grinding body 2 has a plurality of air holes, and the plurality of air holes are randomly distributed in the grinding wheel grinding body 2 and on the surface, wherein the plurality of air holes may be uniformly distributed in the grinding wheel grinding body 2 and on the surface, or may be non-uniformly distributed in the grinding wheel grinding body 2 and on the surface, and the random porous structure 21 may be generated by three-dimensional modeling software according to need, for example, may be generated by CAD software.
Wherein the ratio of the volume of the random porous structure 21 to the volume of the grinding wheel grinding body 2 is in the range of 10% to 50%, that is, the ratio between the sum of the volumes of the plurality of air holes on the grinding wheel grinding body 2 and the volume of the grinding wheel grinding body 2 is 10% or more and 50% or less, for example, 10%,15%,20%,22%,28%,30%,36%,45% or 50% or the like.
The grinding wheel grinding main body 2 is manufactured by selective laser sintering, namely, the grinding wheel grinding main body 2 is manufactured by selective laser sintering technology, firstly, the required porosity of the grinding wheel grinding main body 2 and the position, the size and the shape of air holes can be optimally designed according to grinding conditions, such as grinding wheel operation working conditions, grinding workpiece materials and the like, then, a three-dimensional modeling software is utilized to build a required three-dimensional model of the grinding wheel grinding main body 2 according to optimally designed parameters, a file format which can be identified by a selective area laser sintering device is exported after the modeling is completed, the file is imported into the selective area laser sintering device, and the grinding wheel grinding main body 2 with specific porosity is manufactured by the laser sintering device.
The grinding wheel base 1 may be formed by selective laser sintering, but may be formed by conventional machining methods, such as casting, forging, hot pressing, and the like.
According to the metal bond grinding wheel 100 with the random porous structure, the grinding wheel grinding main body 2 with the random porous structure 21 is manufactured through selective laser sintering, the ratio of the volume of the random porous structure 21 to the volume of the grinding wheel grinding main body 2 is 10% -50%, the metal bond grinding wheel 100 has high porosity and a chip containing space, and closed grinding is changed into open grinding, so that the blocking of the grinding wheel can be reduced, the wettability of grinding liquid is increased, the heat dissipation of a grinding area is improved, the grinding burn is reduced, and the grinding surface quality is improved. In addition, the random porous structure 21 can be optimally designed according to the grinding conditions, so that the grinding efficiency and quality under specific grinding conditions are improved, and the optimal design of the customized grinding wheel is truly realized.
Alternatively, the size of each hole in the random porous structure 21 may range from 0.02mm to 5mm, i.e., the size of each hole in the random porous structure 21 may be greater than or equal to 0.02mm and less than or equal to 5mm, e.g., the size of the holes may be 0.02mm, 0.06mm, 0.08mm, 0.12mm, 0.15mm, 0.20mm, 1.0mm, 2.0mm, 2.5mm, 3.0mm, or 5.0mm.
The abrasive grains include at least one of diamond abrasive grains and cubic boron nitride abrasive grains. Specifically, in some examples, the abrasive particles include only diamond abrasive particles; in some examples, the abrasive particles include only cubic boron nitride abrasive particles; in other examples, the abrasive particles include both diamond abrasive particles and cubic boron nitride abrasive particles. The concentration of the abrasive particles is 10% -200%, namely, the concentration of the abrasive particles is more than or equal to 10% and less than or equal to 200%. The abrasive grains may not have a coating layer, or may have a coating layer, and the adhesive strength between the abrasive grains and the adhesive agent can be improved by providing the abrasive grains with a coating layer. The abrasive particles range in size from 23 μm to 200 μm, i.e., the abrasive particles have a size greater than or equal to 23 μm and less than or equal to 200 μm.
The metal powder comprises at least one of bronze, cobalt, nickel, iron, and aluminum. Further, the metal powder also comprises elements such as silver, neodymium, lead, lanthanum, cerium, molybdenum, silicon, chromium and the like. The filler is at least one of tungsten carbide, silicon carbide and graphite.
An apparatus 200 for manufacturing a metal bond grinding wheel 100 having a random porous structure according to an embodiment of the second aspect of the present invention is described with reference to fig. 3 to 4, the apparatus 200 comprising: a gas cleaning device 210 and a manufacturing apparatus main body 220.
Specifically, the gas cleaning device 210 includes a gas cleaning device main body 211 and a circulation line 212; the manufacturing apparatus main body 220 is connected to the circulation line 212, and a protective gas can be introduced into the manufacturing apparatus main body 220 through the circulation line 212, so that the mixture for manufacturing the grinding wheel can be prevented from being oxidized, and the quality of the manufactured grinding wheel can be ensured.
Referring to fig. 3 and 4, the manufacturing apparatus main body 220 includes: working chamber 221, laser scanning system 222, control system 223, powder delivery device 224, powder recovery device 225, and human-machine interface 226.
The working cavity 221 is connected with the circulating pipeline 212, and a powder spreading scraper 2211 is arranged in the working cavity 221; the laser scanning system 222 is connected with the working cavity 221; the control system 223 is in signal communication with the powder spreading blade 2211 to drive the powder spreading blade 2211 to move left and right; the powder transporting device 224 includes a powder feeding box 2241 and a powder feeding piston 2242 that drives the powder feeding box 2241 (e.g., moves up and down); the powder recovery device 225 includes a powder recovery tank. Thus, the cleaning gas (such as nitrogen, argon, etc.) is conveniently introduced into the working cavity 221 through the circulation pipeline 212, the mixed material can be prevented from being oxidized, the powder feeding piston 2242 can drive the material in the powder feeding box 2241 to move upwards to realize the feeding of the material, the control system 223 controls the powder spreading scraper 2211 to move left and right, and then the laser scanning system 222 performs selective sintering to prepare the grinding wheel grinding main body 2, and the redundant material is scraped into the powder recovery box by the powder spreading scraper 2211 for recycling.
According to the device 200 provided by the embodiment of the invention, the structure is simple, the operation reliability is high, the porosity of the metal bond grinding wheel 100 can be actively controlled, so that the metal bond grinding wheel 100 can be optimally designed according to the grinding conditions, the proper porosity is ensured, the cutting and cooling capacities of the metal bond grinding wheel 100 are improved, the grinding efficiency and quality under specific grinding conditions are improved, and the optimal design of the customized grinding wheel is truly realized.
Further, referring to fig. 4, a laser sintering platform 2212 is disposed in the working cavity 221, a first notch and a second notch are formed on the laser sintering platform 2212, a powder feeding piston 2242 and a forming piston 2213 are disposed on the laser sintering platform 2212, the powder feeding piston 2242 is disposed in the first notch, the powder feeding piston 2242 is movable up and down in the first notch, the forming piston 2213 is disposed in the second notch, and the forming piston 2213 is movable up and down in the second notch. The powder spreading scraper 2211 can move horizontally under the action of the control system 223, and the powder feeding piston 2242 and the forming piston 2213 can move up and down under the action of the control system 223. The material can be supplied by the up-and-down movement of the powder feeding piston 2242, and the excessive material can be scraped into the powder recycling bin for recycling by the up-and-down movement of the forming piston 2213.
Wherein, a powder feeding box 2241 is defined between the upper surface of the powder feeding piston 2242 and the first notch, and a powder spreading scraper 2211 is arranged on the upper surface of the laser sintering platform 2212; the molding piston 2213 is provided with a molding base 2214, and the metal bond grinding wheel 100 is formed on the molding base 2214. The powder spreading scraper 2211 is controlled by the control system 223 to scrape materials onto the molding substrate 2214, and the laser scanning system 222 is used for selectively sintering, so that the preparation of the grinding wheel is completed.
Still further, referring to fig. 4 in combination with fig. 3, the laser scanning system 222 includes: a laser 2221 and a galvanometer system 2222. The laser 2221 may be used to emit a laser light source, with one end of the galvanometer system 2222 connected to the laser 2221, and the other end of the galvanometer system 2222 opposite the molding substrate 2214. The galvanometer system 2222 is capable of receiving a laser light source emitted by the laser 2221 to effect sintering of the grinding wheel.
The galvanometer system 2222 is a high-precision and high-speed servo control system composed of a driving plate and a high-speed swing motor, and is mainly used for laser marking, laser inner engraving, stage lighting control, laser drilling and the like.
According to the third aspect of the invention, the preparation process of the metal bond grinding wheel 100 with the random porous structure comprises the following steps:
S1: and mixing the abrasive particles, the metal powder and the filler to form a mixed material, wherein the mixed material is the raw material for preparing the grinding wheel grinding main body 2. Specifically, the mixed material comprises abrasive particles, metal powder and a filler, wherein the abrasive particles comprise at least one of diamond abrasive particles and cubic boron nitride abrasive particles, and the concentration of the abrasive particles is 10% -200%; the metal powder comprises at least one of bronze, cobalt, nickel, iron and aluminum; the metal powder may be one or more of bronze, cobalt, nickel, iron, aluminum, etc., and may further comprise silver, neodymium, lead, lanthanum, cerium, molybdenum, silicon, chromium, etc. The filler is at least one of tungsten carbide, silicon carbide and graphite. The proportion of various substances is determined according to the requirement. Wherein the abrasive particles are provided with a coating, the abrasive particles are provided with the coating, the bonding strength of the abrasive particles and the bonding agent can be improved, and the abrasive particles are 23-200 mu m in size.
S2: the designed parameters of the metal bond grinding wheel with the random porous structure are led into a manufacturing device (namely, the device 200 for manufacturing the metal bond grinding wheel with the random porous structure), mixed materials are added into the powder feeding box, laser sintering process parameters are set, and specifically, the laser sintering process parameters can be set through a human-computer interaction interface.
In the design process of metal bond grinding wheel parameters, firstly, determining the porosity (namely the ratio of the volume of a random porous structure to the volume of the grinding wheel grinding main body 2) of the grinding wheel grinding main body 2 according to the running working conditions (such as the presence or absence of grinding fluid, rough grinding or fine grinding and the like), the material properties of a grinding workpiece and other requirements of the grinding wheel, and randomly generating the position and the size of air holes in calculation software according to the porosity of the grinding wheel; the outline of the grinding wheel grinding main body 2 is designed in a computer by utilizing three-dimensional modeling software, modeling of the grinding wheel grinding main body 2 with a random porous structure is completed according to the position and the size of the randomly generated porous holes in the computer software, a file format which can be identified by the selective area laser sintering equipment is exported after the modeling is completed, and the file is imported into the device 200.
S3: closing an isolation door of the working cavity, opening a gas purifying device, and circularly filling at least one of nitrogen and argon into the working cavity to prevent the mixture from being oxidized;
S4: starting a laser;
S5: the control system controls the powder feeding piston to ascend for a certain distance (the ascending distance can be set according to the requirement), the powder spreading scraper blade moves from the leftmost end to the powder recovery box (for example, the left end of the powder recovery box) and then moves from the powder recovery box to the leftmost end, the laser selectively sinters the current powder spreading layer through the vibrating mirror system, the forming piston descends for a certain distance, and redundant powder is fed into the powder recovery box;
s6: repeating the step S5 until the preparation of the grinding wheel grinding main body 2 is completed;
S7: processing a grinding wheel matrix 1, assembling a grinding wheel grinding body 2 and the grinding wheel matrix 1, wherein the grinding wheel grinding body 2 and the grinding wheel matrix 1 can be connected in a bonding mode;
S8: the metal bond grinding wheel trims the sharpening. The preparation of the metal bond grinding wheel with the random porous structure can be completed through the steps.
Further, the laser sintering parameters include: setting the power of the laser to 10W-500W; setting the thickness of the powder layer to be between 0.02 and 0.5 mm; setting the linear scanning speed between 100mm/s and 7000 mm/s; setting the linear forming speed between 10mm/s and 3000 mm/s; the oxygen concentration of the working cavity is made to be less than 100ppm; the dust removal rate of the molding atmosphere is more than 98% under the condition of cyclic purification. And (3) introducing protective gas and keeping for a period of time to prevent sintering oxidation and meet the requirement of dust removal rate. Therefore, by reasonably setting the laser sintering parameters, the quality of the metal bond grinding wheel 100 with the random porous structure is guaranteed.
Where ppm is the unit of solute concentration, ppm is an abbreviation for English parts per million, meaning that a part per million (in parts per million), or parts per million, is expressed as a percentage (%) of 1 kilogram solute in a solution of 1ppm, i.e., one million kilograms, with ppm being the same as the percentage (%) except that the percentage is greater than the percentage, which is expressed as a percentage by mass of solute relative to the mass of the total solution, also referred to as the percentage concentration.
According to the preparation process disclosed by the embodiment of the invention, the porosity of the metal bond grinding wheel 100 can be actively controlled, so that the metal bond grinding wheel 100 can be optimally designed according to the grinding conditions, the proper porosity is ensured, in the grinding process, the grinding wheel is not easy to be blocked, the cooling effect is good, the workpiece is not easy to burn, the grinding force is small, the surface shape precision and the surface roughness of the ground workpiece are superior to those of the grinding wheel manufactured by the conventional process, the grinding efficiency and the grinding quality under the specific grinding conditions are improved, and the optimal design of the customized grinding wheel is truly realized. The preparation process provided by the embodiment of the invention is convenient to operate, is particularly suitable for small-batch customized production, and has good consistency of the quality of the grinding wheels in the same batch. In addition, the metal bond grinding wheel 100 manufactured by the manufacturing process of the embodiment of the invention has lighter weight, and can reduce the manufacturing cost.
Other constructions and operations of the metal bond grinding wheel 100 having a random porous structure according to embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail herein.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.
Claims (8)
1. The preparation process of the metal bond grinding wheel with the random porous structure is characterized by comprising the following steps of:
s1: mixing abrasive particles, metal powder and filler to form a mixed material;
S2: introducing the designed metal bond grinding wheel parameters with the random porous structure into a manufacturing device, adding the mixed materials into a powder feeding box, and setting laser sintering process parameters;
S3: closing an isolation door of a working cavity, opening a gas purifying device, and circularly filling at least one of nitrogen and argon into the working cavity;
S4: starting a laser;
s5: the control system controls the powder feeding piston to ascend for a certain distance, the powder spreading scraper blade moves from the leftmost end to the powder recovery box and then from the powder recovery box to the leftmost end, the laser selectively sinters the current powder spreading layer through the vibrating mirror system, the forming piston descends for a certain distance, and the redundant powder is fed into the powder recovery box;
s6: repeating the step S5 until the grinding wheel grinding main body is prepared;
s7: processing a grinding wheel matrix, and assembling a grinding wheel grinding main body and the grinding wheel matrix;
s8: trimming and sharpening the metal bond grinding wheel;
The metal bond grinding wheel with the random porous structure comprises a grinding wheel matrix and a grinding wheel grinding main body sleeved on the outer side of the grinding wheel matrix, wherein the grinding wheel grinding main body is provided with the random porous structure, the random porous structure is generated through three-dimensional modeling software, the grinding wheel grinding main body is manufactured through selective laser sintering, the ratio of the volume of the random porous structure to the volume of the grinding wheel grinding main body is 10% -50%, and the grinding wheel grinding main body comprises abrasive particles, metal powder and a filler;
the device for manufacturing the metal bond grinding wheel with the random porous structure comprises the following components:
The gas purification device comprises a gas purification device main body and a circulating pipeline;
A manufacturing apparatus body connected to the circulation line, the manufacturing apparatus body comprising:
The working cavity is connected with the circulating pipeline and is internally provided with a powder spreading scraper;
the laser scanning system is connected with the working cavity;
The control system is in signal transmission with the powder spreading scraper blade to drive the powder spreading scraper blade to move left and right;
The powder conveying device comprises a powder conveying box and a powder conveying piston for driving the powder conveying box;
The powder recycling device comprises a powder recycling bin; and
A human-computer interaction interface;
the laser scanning system includes:
And the laser is used for emitting a laser light source.
2. The process for producing a metal bond grinding wheel having a random porous structure according to claim 1, wherein the abrasive grains include at least one of diamond abrasive grains and cubic boron nitride abrasive grains, and the abrasive grain concentration is 10% to 200%.
3. The process for preparing a metal bond grinding wheel having a random porous structure according to claim 1, wherein the metal powder comprises at least one of bronze, cobalt, nickel, iron, and aluminum.
4. The process for preparing a metal bond grinding wheel with a random porous structure according to claim 1, wherein the filler is at least one of tungsten carbide, silicon carbide and graphite.
5. The process for preparing a metal bond grinding wheel with a random porous structure according to claim 1, wherein the size range of each hole in the random porous structure is 0.02 mm-5mm.
6. The process for preparing the metal bond grinding wheel with the random porous structure according to claim 1, wherein a laser sintering platform is arranged in the working cavity, a first notch and a second notch are formed in the laser sintering platform, the powder feeding piston and a forming piston are arranged on the laser sintering platform, the powder feeding piston is arranged in the first notch and can move up and down, and the forming piston is arranged in the second notch and can move up and down;
the powder feeding box is defined between the upper surface of the powder feeding piston and the first notch, and the powder spreading scraper is arranged on the upper surface of the laser sintering platform;
And a forming matrix is arranged on the forming piston, and the metal bonding agent grinding wheel is formed on the forming matrix.
7. The process for preparing a metal bond grinding wheel having a random porous structure according to claim 1, wherein the laser scanning system comprises:
and one end of the vibrating mirror system is connected with the laser, and the other end of the vibrating mirror system is opposite to the forming matrix.
8. The process for preparing a metal bond grinding wheel having a random porous structure according to claim 1, wherein the laser sintering parameters include:
setting the power of the laser to 10W-500W;
Setting the thickness of the powder layer to be between 0.02 and 0.5 mm;
setting the linear scanning speed between 100mm/s and 7000 mm/s;
Setting the linear forming speed between 10mm/s and 3000 mm/s;
The oxygen concentration of the working cavity is made to be less than 100ppm;
the dust removal rate of the molding atmosphere is more than 98% under the condition of cyclic purification.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711297789.1A CN107866753B (en) | 2017-12-08 | 2017-12-08 | Metal bond grinding wheel with random porous structure, device and preparation process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711297789.1A CN107866753B (en) | 2017-12-08 | 2017-12-08 | Metal bond grinding wheel with random porous structure, device and preparation process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107866753A CN107866753A (en) | 2018-04-03 |
| CN107866753B true CN107866753B (en) | 2024-07-26 |
Family
ID=61755243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711297789.1A Active CN107866753B (en) | 2017-12-08 | 2017-12-08 | Metal bond grinding wheel with random porous structure, device and preparation process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107866753B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108326764A (en) * | 2018-05-03 | 2018-07-27 | 西安增材制造国家研究院有限公司 | Spray lubricating fluid grinding wheel and the grinding attachment including the grinding wheel in electroplating surface abrasive material |
| CN109822452B (en) * | 2019-03-29 | 2020-04-03 | 深圳市宏通新材料有限公司 | Porous metal-based diamond grinding and polishing plate |
| WO2023130059A1 (en) | 2021-12-30 | 2023-07-06 | Saint-Gobain Abrasives, Inc. | Abrasive articles and methods for forming same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201300207Y (en) * | 2008-10-30 | 2009-09-02 | 华中科技大学 | Selective laser melting rapid molding device for metal parts |
| CN208132742U (en) * | 2017-12-08 | 2018-11-23 | 清华大学 | With random cellular structure metals binding agent sand wheel |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3052603B2 (en) * | 1992-09-17 | 2000-06-19 | 三菱マテリアル株式会社 | Porous metal bond whetstone |
| US7195544B2 (en) * | 2004-03-23 | 2007-03-27 | Cabot Microelectronics Corporation | CMP porous pad with component-filled pores |
| US7883398B2 (en) * | 2005-08-11 | 2011-02-08 | Saint-Gobain Abrasives, Inc. | Abrasive tool |
| GB201411676D0 (en) * | 2014-07-01 | 2014-08-13 | Element Six Abrasives Sa | Superhard constructions & methods of making same |
| CN105415216B (en) * | 2015-12-01 | 2018-03-09 | 湖南大学 | A kind of preparation method of the 3D printing skive of abrasive particle regular array |
| CN105563352A (en) * | 2015-12-24 | 2016-05-11 | 中南大学 | Metal bond-containing arachnoid plane diamond grinding wheel and 3D printing production process thereof |
-
2017
- 2017-12-08 CN CN201711297789.1A patent/CN107866753B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201300207Y (en) * | 2008-10-30 | 2009-09-02 | 华中科技大学 | Selective laser melting rapid molding device for metal parts |
| CN208132742U (en) * | 2017-12-08 | 2018-11-23 | 清华大学 | With random cellular structure metals binding agent sand wheel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107866753A (en) | 2018-04-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106041767B (en) | A kind of resinoid bond super-hard abrasive tool and its manufacturing method and application with interior cooling micro-structure | |
| CN107774996B (en) | Integrated forming method for part of multi-material gradient lattice structure | |
| CN107866753B (en) | Metal bond grinding wheel with random porous structure, device and preparation process | |
| KR101076353B1 (en) | Metal powder for metal-laser sintering and metal-laser sintering process using the same | |
| KR100586360B1 (en) | Metal powder composition for use in selective laser sintering | |
| AU2003245820B2 (en) | Method for producing highly porous metallic moulded bodies close to the desired final contours | |
| CN104711442B (en) | A kind of 3D prints the method manufacturing hard alloy | |
| CN106735186B (en) | A kind of method that 3D printing-isostatic cool pressing prepares titanium alloy multi-stage gear | |
| CN109261967B (en) | Electron beam partition scanning forming method for porous tungsten material | |
| CN103695681B (en) | The shaped device of a kind of aluminum-base silicon carbide particulate reinforced composite and component thereof and method | |
| CN106825568A (en) | A kind of 3D printing manufacture method of metal matrix diamond composites and its parts | |
| WO2004048062A1 (en) | Method for producing tire vulcanizing mold and tire vulcanizing mold | |
| CN103406841B (en) | Realize the device and method of abrasive material and the collaborative ordered arrangement of hollow ball three-dimensional | |
| CN113118459B (en) | Method for preparing blade through low-temperature laser cladding and metal-based composite powder for 3D printing | |
| CN109848871B (en) | Multi-block diamond grinding tool and manufacturing method thereof | |
| JPH05117051A (en) | Ceramic body and its preparation | |
| CN110640147B (en) | Cutter and manufacturing method thereof | |
| TWI239874B (en) | Metal powder composition for use in selective laser sintering, method of making same, and three-dimensional object shaped from same | |
| CN101670433A (en) | Method for manufacturing metal mold by laser indirect forming | |
| CN1522834A (en) | Method for manufacturing metal or ceramic bond superhard grinding tool | |
| JP2005048234A (en) | Metallic powder for metal light beam fabrication | |
| CN208132742U (en) | With random cellular structure metals binding agent sand wheel | |
| KR100650409B1 (en) | Manufacturing method of complex-shaped workpiece using powder injection molding and workpiece therefrom | |
| CN107825305A (en) | Consolidated metal binding agent sand wheel, device and preparation technology with inner flow passage structure | |
| CN208132744U (en) | Consolidated metal binding agent sand wheel and its manufacturing device with inner flow passage structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |