CN107708296A - A kind of metal-based circuit board of high heat conduction and preparation method thereof - Google Patents
A kind of metal-based circuit board of high heat conduction and preparation method thereof Download PDFInfo
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- CN107708296A CN107708296A CN201710979512.0A CN201710979512A CN107708296A CN 107708296 A CN107708296 A CN 107708296A CN 201710979512 A CN201710979512 A CN 201710979512A CN 107708296 A CN107708296 A CN 107708296A
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- heat conduction
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 130
- 239000002184 metal Substances 0.000 title claims abstract description 130
- 238000002360 preparation method Methods 0.000 title abstract description 4
- 239000000758 substrate Substances 0.000 claims abstract description 54
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 48
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 48
- 238000009413 insulation Methods 0.000 claims abstract description 44
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910017083 AlN Inorganic materials 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 53
- 239000010949 copper Substances 0.000 claims description 45
- 229910052802 copper Inorganic materials 0.000 claims description 43
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 17
- 239000000843 powder Substances 0.000 claims description 15
- 239000010936 titanium Substances 0.000 claims description 15
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 14
- 229910052719 titanium Inorganic materials 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 13
- 238000005507 spraying Methods 0.000 claims description 13
- 238000007750 plasma spraying Methods 0.000 claims description 10
- 238000005422 blasting Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000004411 aluminium Substances 0.000 claims description 7
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 claims description 7
- 238000005498 polishing Methods 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 4
- 239000003344 environmental pollutant Substances 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 4
- 231100000719 pollutant Toxicity 0.000 claims description 4
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 239000002002 slurry Substances 0.000 claims description 3
- 238000003854 Surface Print Methods 0.000 claims 1
- 230000004888 barrier function Effects 0.000 abstract description 7
- 230000015556 catabolic process Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000000356 contaminant Substances 0.000 description 4
- 238000003672 processing method Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012671 ceramic insulating material Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention discloses a kind of metal-based circuit board of high heat conduction and preparation method thereof.The metal-based circuit board includes metal substrate, nitridation aluminum insulation layer, conductive metal layer.Nitridation aluminum insulation layer is arranged on the upper surface of metal substrate.Conductive metal layer is arranged on the upper surface of nitridation aluminum insulation layer.The metal-based circuit board is used as insulating barrier using aluminium nitride film, can greatly improve the heat conductivility of circuit board, while the breakdown voltage that guarantee is higher, is greatly improved the service life and reliability of electronic component.
Description
Technical field
The present invention relates to printed-board technology field, more particularly to a kind of metal-based circuit board of high heat conduction and its making
Method.
Background technology
With the rapid development of modern electronics industry, the volume of electronic product is less and less, and power density is increasing, dissipates
Heat turns into the key factor for determining electronic product service life.Printed circuit board (PCB) (PCB) needed for electronic component surface mount
Mechanically supported and electronic component is secured, while assume responsibility for the effect of heat dissipation channel.So PCB heat conductivility to close weight
Will.
With the semiconductor power devices such as rectification and inverter circuit and the integrated miniaturization of module, and it is high-power
LED generally use, current density also carry out bigger, cooling requirements also more and more higher.Traditional glass class printed circuit board (PCB), such as
FR4 plates, can not meet the needs of radiating.Therefore, metal base printed circuit board is due to good heat dispersion acquisition
Quick application, it is made up of the three-decker of uniqueness, i.e. circuit layer, insulating barrier and metal-based layer.Power component table
Face is mounted on circuit layer, and caused heat is transmitted to metal-based layer by insulating barrier when device is run, then by Metal Substrate
Layer transfers heat away from, so as to realize the radiating to device.
However, even if radiating preferable metal substrate at present, its insulating barrier main component is still epoxy resin, is simply added
Ceramic powders have been added to increase its heat dispersion, its thermal conductivity factor is generally less than 2W/m.K, for the application environment of high power density
For, be still radiating bottleneck.In addition, with the development of semiconductor devices, high pressure applications (several kilovolts) also come it is also more,
Common aluminium base is pressure-resistant only several hectovolts, it is pressure-resistant in order to improve its, can only increase thickness of insulating layer, but so caused by directly
Consequence is exactly pcb board heat conductivility is deteriorated.
The content of the invention
In view of the shortcomings of the prior art, the present invention proposes a kind of metal-based circuit board of high heat conduction and preparation method thereof,
The metal-based circuit board, as insulating barrier, can greatly improve the heat conductivility of circuit board, while ensure higher using AlN films
Breakdown voltage, overcome existing metal-base circuit plate insulating layer in terms of the radiating and insulation on contradiction.
To achieve these goals, technical solution of the present invention is as follows：
A kind of metal-based circuit board of high heat conduction, including metal substrate, nitridation aluminum insulation layer, conductive metal layer.Aluminium nitride
Insulating barrier is arranged on the upper surface of metal substrate.Conductive metal layer is arranged on the upper surface of nitridation aluminum insulation layer.
Further, nitridation aluminum insulation layer is sprayed on the upper surface of conductive metal layer.Nitrogenize the thickness range of aluminum insulation layer
For 0.2-3mm.
Further, conductive metal layer includes conductive layer, and the seed metal layer for electroplated conductive layer.Seed metal layer
It is arranged on nitridation aluminum insulation layer.Conductive layer is arranged in seed metal layer.
Further, the bottom surface of metal substrate is provided with radiating fin or the flank of tooth.
Further, metal substrate is aluminium base or copper base.
Further, conductive metal layer is copper conductive layer or copper silver conductive layer.
Further, seed metal layer includes titanium layer, the first layers of copper；First layers of copper is arranged on titanium layer.Conductive layer includes
Nickel dam, the second layers of copper；Nickel dam is arranged in the first layers of copper；Second layers of copper is arranged on nickel dam.
A kind of metal-base circuit board manufacturing method of high heat conduction, comprises the following steps：
Step 1：Metallic substrate surfaces are pre-processed；
Step 2：Using nanometer powder plasma spraying method, it is exhausted to spray aluminium nitride to pretreated metallic substrate surfaces
Edge layer；
Step 3：Conductive metal layer is printed in aluminium nitride surface of insulating layer, is then sintered.
A kind of metal-base circuit board manufacturing method of high heat conduction, comprises the following steps：
Step 1：Metal substrate is subjected to surface clean, the blasting treatment of fine grain is then carried out, removes oxide-film and table
Face pollutant；
Step 2：Using nanometer powder plasma spraying method, to the metallic substrate surfaces spraying aluminium nitride insulation after processing
Layer；Then the aluminium nitride surface of insulating layer after spraying is carried out polishing processing using precision grinder；
Step 3：Titanium layer and first is formed on the aluminium nitride surface of insulating layer after polishing and cleaning with magnetron sputtering technique
Layers of copper；With photolithographicallpatterned in the first layers of copper circuit forming surface pattern；Nickel dam is formed on the first layers of copper surface using electro-plating method
With the second layers of copper；Photoresist and titanium layer and the first layers of copper are removed.
A kind of metal-base circuit board manufacturing method of high heat conduction, comprises the following steps：
Step 1：Metal substrate is subjected to surface clean, the blasting treatment of fine grain is then carried out, removes oxide-film and table
Face pollutant；
Step 2：Using nanometer powder plasma spraying method, to the metallic substrate surfaces spraying aluminium nitride insulation after processing
Layer；
Step 3：Layer of metal slurry is uniformly painted in aluminium nitride surface of insulating layer, is then sintered.
Beneficial effects of the present invention：
(1) metal-based circuit board can greatly improve the heat conductivility of circuit board using aluminium nitride film as insulating barrier,
Ensure higher breakdown voltage simultaneously, be greatly improved the service life and reliability of electronic component.
(2) the metal-base circuit board manufacturing method can be realized directly on semi-conductor power module or LED radiator
Circuit production, so as to save the circuit substrate among device and radiator, greatly improve under high power density application occasion
Radiating effect.
Brief description of the drawings
Fig. 1 is first embodiment of the invention cross-sectional view.
Fig. 2 is second embodiment of the invention cross-sectional view.
Fig. 3 is third embodiment of the invention cross-sectional view.
Fig. 4 is fourth embodiment of the invention cross-sectional view.
Wherein, Fig. 1 to Fig. 4 reference is：Metal substrate 1, nitridation aluminum insulation layer 2, conductive metal layer 3；Titanium layer 31,
First layers of copper 32, nickel dam 33, the second layers of copper 34.
Embodiment
With reference to the accompanying drawings and examples, the present invention is expanded on further.
Embodiment one：
As shown in figure 1, a kind of metal-based circuit board of high heat conduction, including metal substrate 1, it is arranged on the upper table of metal substrate 1
The nitridation aluminum insulation layer 2 in face, and it is arranged on the conductive metal layer 3 of nitridation aluminum insulation layer 2 upper surface.
Conductive metal layer 3 is formed by the circuit pattern being pre-designed.It is preferred that the thickness of nitridation aluminum insulation layer 2 is 0.2-
3mm。
It is preferred that metal substrate 1 is aluminium base or copper base.Metal substrate 1 or by other any high thermal conductivity coefficient low-resistances
Anti- metal or the alloy powder of nonmetallic materials are made.
It is preferred that conductive metal layer 3 is copper conductive layer or copper silver conductive layer.
Aluminium nitride (AlN) is a kind of ceramic insulating material, and its dielectric strength is very high, can reach 20KV/mm；And its heat conduction
Performance is also very good, and common AlN thermal conductivity factor can reach 20W/m.K, and the thermal conductivity factor of good AlN materials can reach
More than 150W/m.K.
The processing method of the metal-based circuit board of the present embodiment is：
The first step, metallic substrate surfaces are pre-processed：Metal substrate 1 is subjected to surface clean, then carries out particulate
The blasting treatment in footpath, removes oxide-film and surface contaminant；
Second step, using nanometer powder plasma spraying method, to 1 surface spraying of metal substrate, one layer of nitridation after processing
Aluminum insulation layer 2；Then surface after spraying is carried out to polish processing using precision grinder；
3rd step, according to default circuit pattern, the surface of nitridation aluminum insulation layer 2 after polishing and cleaning is multiple with copper silver
Condensation material prints one layer of conductive metal layer 3, then sinters, so as to form the Metal Substrate electricity of the high heat conduction with required circuit pattern
Road plate.
Embodiment two：
As shown in Fig. 2 a kind of metal-based circuit board of high heat conduction, including metal substrate 1, it is arranged on the upper table of metal substrate 1
The nitridation aluminum insulation layer 2 in face, and it is arranged on the conductive metal layer 3 of nitridation aluminum insulation layer 2 upper surface.
Conductive metal layer 3 is formed by the circuit pattern being pre-designed.It is preferred that the thickness of nitridation aluminum insulation layer 2 is 0.2-
3mm。
Conductive metal layer 3 includes conductive layer, and the seed metal layer for electroplated conductive layer.Seed metal layer is arranged on nitrogen
Change on aluminum insulation layer 2.Conductive layer is arranged in seed metal layer.
Seed metal layer includes titanium (Ti) layer 31, the first bronze medal (Cu) layer 32.First layers of copper 32 is arranged on titanium layer 31.
Conductive layer includes nickel (Ni) layer 33, the second bronze medal (Cu) layer 34.Nickel dam 33 is arranged in the first layers of copper 32；Second layers of copper
34 are arranged on nickel dam 33.
It is preferred that metal substrate 1 is aluminium base or copper base.Metal substrate 1 or by other any high thermal conductivity coefficient low-resistances
Anti- metal or the alloy powder of nonmetallic materials are made.
It is preferred that conductive metal layer 3 is copper conductive layer or copper silver conductive layer.
The processing method of the metal-based circuit board of the present embodiment is：
The first step, metal substrate 1 is subjected to surface clean, then carry out fine grain blasting treatment, remove oxide-film and
Surface contaminant；
Second step, using nanometer powder plasma spraying method, to 1 surface spraying of metal substrate, one layer of nitridation after processing
Aluminum insulation layer 2；Then the surface of nitridation aluminum insulation layer 2 after spraying is carried out polishing processing using precision grinder；
3rd step, the surface of nitridation aluminum insulation layer 2 after polishing and cleaning, one layer of thin titanium is formed with magnetron sputtering technique
Layer 31 and one layer thin of the first layers of copper 32, the layers of copper 32 of titanium layer 31 and first are used as the seed metal of next step plated conductive
Layer；Then required circuit pattern is formed on the surface of the first layers of copper 32 with photolithographicallpatterned, has photoresist on the surface of the first layers of copper 32
Enter corresponding electroplate liquid in the case of mask, one layer of nickel dam 33 and one layer of second layers of copper 34 formed on surface using electro-plating method,
Used as circuit conductive；Finally photoresist and the layers of copper 32 of titanium layer 31 and first are removed, there is required circuit pattern so as to be formed
High heat conduction metal-based circuit board.
Embodiment three：
As shown in figure 3, a kind of metal-based circuit board of high heat conduction, including metal substrate 1, it is arranged on the upper table of metal substrate 1
The nitridation aluminum insulation layer 2 in face, and it is uniformly covered on the conductive metal layer 3 of nitridation aluminum insulation layer 2 upper surface.
Conductive metal layer 3 is formed by the circuit pattern being pre-designed.It is preferred that the thickness of nitridation aluminum insulation layer 2 is 0.2-
3mm。
It is preferred that metal substrate 1 is aluminium base or copper base.Metal substrate 1 or by other any high thermal conductivity coefficient low-resistances
Anti- metal or the alloy powder of nonmetallic materials are made.
It is preferred that conductive metal layer 3 is copper conductive layer or copper silver conductive layer.
The processing method of the metal-based circuit board of the present embodiment is：
The first step, metal substrate 1 is subjected to surface clean, then carry out fine grain blasting treatment, remove oxide-film and
Surface contaminant；
Second step, using nanometer powder plasma spraying method, to 1 surface spraying of metal substrate, one layer of nitridation after processing
Aluminum insulation layer 2；
3rd step, layer of metal slurry is uniformly painted on nitridation aluminum insulation layer 2 surface, is then sintered, so as to form no electricity
The high heat conduction metal-based circuit board of road figure.
Hereafter, corresponding circuitous pattern can be formed using caustic solution during use.
Example IV：
As shown in figure 4, a kind of metal-based circuit board of high heat conduction, including metal substrate 1, it is arranged on the upper table of metal substrate 1
The nitridation aluminum insulation layer 2 in face, and it is arranged on the conductive metal layer 3 of nitridation aluminum insulation layer 2 upper surface.The bottom surface of metal substrate 1 is set
It is equipped with radiating fin or the flank of tooth.
Conductive metal layer 3 is formed by the circuit pattern being pre-designed.It is preferred that the thickness of nitridation aluminum insulation layer 2 is 0.2-
3mm。
It is preferred that metal substrate 1 is aluminium base or copper base.Metal substrate 1 or by other any high thermal conductivity coefficient low-resistances
Anti- metal or the alloy powder of nonmetallic materials are made.
It is preferred that conductive metal layer 3 is copper conductive layer or copper silver conductive layer.
The processing method of the metal-based circuit board of the present embodiment is：
The first step, metal substrate 1 is subjected to surface clean, then carry out fine grain blasting treatment, remove oxide-film and
Surface contaminant；
Second step, using nanometer powder plasma spraying method, to 1 surface spraying of metal substrate, one layer of nitridation after processing
Aluminum insulation layer 2；
3rd step, conductive metal layer 3 is laid on nitridation aluminum insulation layer 2 surface, and conductive metal layer 3 is pressed into required circuit
It is arranged into corresponding circuit；Pave 3 laggard stove of conductive metal layer to be sintered, led so as to form the height with required circuit pattern
The Metal Substrate radiator of heat.
Above-described is only the preferred embodiment of the present invention, and the invention is not restricted to above example.It is appreciated that this
The other improvement and change that art personnel directly export or associated without departing from the basic idea of the present invention
It is considered as being included within protection scope of the present invention.
Claims (10)
- A kind of 1. metal-based circuit board of high heat conduction, it is characterised in that：Including metal substrate (1), nitridation aluminum insulation layer (2), conductive metal layer (3)；The nitridation aluminum insulation layer (2) is arranged on the upper surface of metal substrate (1)；The conductive metal layer (3) is arranged on the upper surface of nitridation aluminum insulation layer (2).
- 2. the metal-based circuit board of high heat conduction according to claim 1, it is characterised in that：The nitridation aluminum insulation layer (2) is sprayed on the upper surface of conductive metal layer (3)；The thickness of the nitridation aluminum insulation layer (2) is 0.2-3mm.
- 3. the metal-based circuit board of high heat conduction according to claim 1, it is characterised in that：The conductive metal layer (3) includes conductive layer, and for electroplating the seed metal layer of the conductive layer；The seed metal layer is arranged on nitridation aluminum insulation layer (2)；The conductive layer is arranged in the seed metal layer.
- 4. the metal-based circuit board of high heat conduction according to claim 1, it is characterised in that：The bottom surface of the metal substrate (1) is provided with radiating fin or the flank of tooth.
- 5. the metal-based circuit board of high heat conduction according to claim 1, it is characterised in that：The metal substrate (1) is aluminium base or copper base.
- 6. the metal-based circuit board of high heat conduction according to claim 1, it is characterised in that：The conductive metal layer (3) is copper conductive layer or copper silver conductive layer.
- 7. the metal-based circuit board of high heat conduction according to claim 3, it is characterised in that：The seed metal layer includes titanium layer (31), the first layers of copper (32)；First layers of copper (32) is arranged on titanium layer (31)；The conductive layer includes nickel dam (33), the second layers of copper (34)；The nickel dam (33) is arranged in the first layers of copper (32)；It is described Second layers of copper (34) is arranged on nickel dam (33).
- A kind of 8. metal-base circuit board manufacturing method of high heat conduction, it is characterised in that：Comprise the following steps：Step 1：Metal substrate (1) surface is pre-processed；Step 2：It is exhausted to pretreated metal substrate (1) surface spraying aluminium nitride using nanometer powder plasma spraying method Edge layer (2)；Step 3：In nitridation aluminum insulation layer (2) surface printing conductive metal layer (3), then sinter.
- A kind of 9. metal-base circuit board manufacturing method of high heat conduction, it is characterised in that：Comprise the following steps：Step 1：Metal substrate (1) is subjected to surface clean, the blasting treatment of fine grain is then carried out, removes oxide-film and surface Pollutant；Step 2：Using nanometer powder plasma spraying method, insulated to metal substrate (1) surface spraying aluminium nitride after processing Layer (2)；Then nitridation aluminum insulation layer (2) surface after spraying is carried out polishing processing using precision grinder；Step 3：Titanium layer (31) and are formed on nitridation aluminum insulation layer (2) surface after polishing and cleaning with magnetron sputtering technique One layers of copper (32)；With photolithographicallpatterned in the first layers of copper (32) circuit forming surface pattern；Using electro-plating method in the first layers of copper (32) surface forms nickel dam (33) and the second layers of copper (34)；Photoresist and titanium layer (31) and the first layers of copper (32) are removed.
- A kind of 10. metal-base circuit board manufacturing method of high heat conduction, it is characterised in that：Comprise the following steps：Step 1：Metal substrate (1) is subjected to surface clean, the blasting treatment of fine grain is then carried out, removes oxide-film and surface Pollutant；Step 2：Using nanometer powder plasma spraying method, insulated to metal substrate (1) surface spraying aluminium nitride after processing Layer (2)；Step 3：Layer of metal slurry is uniformly painted on nitridation aluminum insulation layer (2) surface, is then sintered.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710979512.0A CN107708296A (en) | 2017-10-19 | 2017-10-19 | A kind of metal-based circuit board of high heat conduction and preparation method thereof |
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| CN201710979512.0A CN107708296A (en) | 2017-10-19 | 2017-10-19 | A kind of metal-based circuit board of high heat conduction and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108901145A (en) * | 2018-07-19 | 2018-11-27 | 惠州市鸿业新型材料有限公司 | A kind of multilager base plate manufacturing method of surfaces nitrided insulating heat-conductive structure |
| TWI822346B (en) * | 2022-09-20 | 2023-11-11 | 健策精密工業股份有限公司 | Electronic device and method of manufacturing the same |
| US11924961B2 (en) | 2022-03-11 | 2024-03-05 | Unimicron Technology Corp. | Circuit board and method of manufacturing the same |
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