CN106304691A - HDI plate and manufacture method thereof - Google Patents
HDI plate and manufacture method thereof Download PDFInfo
- Publication number
- CN106304691A CN106304691A CN201510290996.9A CN201510290996A CN106304691A CN 106304691 A CN106304691 A CN 106304691A CN 201510290996 A CN201510290996 A CN 201510290996A CN 106304691 A CN106304691 A CN 106304691A
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- Prior art keywords
- blind hole
- layer sheet
- resin
- liquid resin
- time
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
Abstract
The present invention relates to a kind of HDI plate and manufacture method thereof.The manufacture method of above-mentioned HDI plate comprises the steps: to bore connection multi-layer sheet surface and the blind hole of multiple-plate internal cabling on multilayer boards；Multi-layer sheet is carried out for the first time electroless copper plating, makes blind hole electrically conduct multiple-plate internal cabling；Carry out the multi-layer sheet after first time electroless copper plating electroplating for the first time；Fill in liquid resin in blind hole after plating for the first time, and liquid resin is cured as solid resin；The solid resin polishing that will protrude above multi-layer sheet surface is evened out；The surface of the solid resin on multi-layer sheet is carried out second time electroless copper plating, makes solid resin be sealed in blind hole.Being filled in by liquid resin in blind hole, consent plumpness is high, the bad phenomenon such as bubble, be full of cracks, cavity occurs in therefore can avoiding hole.Solid resin polishing carries out second time electroless copper plating after evening out so that the thickness of the copper at aperture is essentially identical with the thickness of the copper on multi-layer sheet surface, improves the reliability of HDI plate.
Description
Technical field
The present invention relates to the technical field that HDI plate manufactures, particularly relate to a kind of HDI plate and manufacture method thereof.
Background technology
Along with the continuous renewal of electronics techniques, the structure of electronic chip and mounting means are also constantly changing
It is apt to and changes.Its development has substantially developed into the arrangement of employing ball-type matrix from the parts with plug-in unit foot
The highly dense integrated circuit modules of solder joint.
HDI (High Density Interconnector, high density interconnects) plate is a kind of integrated electricity of highly dense
Road, when manufacturing HDI plate, typically fills out copper by plating mode blind hole and makes the inside cabling between multi-layer sheet interconnect,
But during plating filling perforation, the plumpness of hole surface is not easily controlled, and the thickness of the copper at aperture is than multi-layer sheet table
The thickness of the copper in face is slightly higher, therefore causes the reliability of HDI plate to reduce.
Summary of the invention
Based on this, it is necessary to for the problems referred to above, it is provided that a kind of HDI plate with higher reliability and system thereof
Make method.
The manufacture method of a kind of HDI plate, comprises the steps:
Bore connection multi-layer sheet surface and the blind hole of multiple-plate internal cabling on multilayer boards；
Multi-layer sheet is carried out for the first time electroless copper plating, makes blind hole electrically conduct multiple-plate internal cabling；
Carry out the multi-layer sheet after first time electroless copper plating electroplating for the first time；
Fill in liquid resin in blind hole after plating for the first time, and liquid resin is cured as solid resin；
The solid resin polishing that will protrude above multi-layer sheet surface is evened out；And
The surface of the solid resin on multi-layer sheet is carried out second time electroless copper plating, makes solid resin be sealed in
In blind hole.
Wherein in an embodiment, carry out second timeization on the described surface to the solid resin on multi-layer sheet
Learn heavy copper, after making the step that solid resin is sealed in blind hole, also include multi-layer sheet carries out second time
The step of plating.
Wherein in an embodiment, in described blind hole after plating for the first time, fill in liquid resin, and
Being cured as in the step of solid resin by liquid resin, described liquid resinous mobility is 30%-41%.
Wherein in an embodiment, even out in the described solid resin polishing that will protrude above multi-layer sheet surface
Before step, and carry out second time electroless copper plating on the described surface to the solid resin on multi-layer sheet, make solid
Before the step that state resin is sealed in blind hole, also include removing multi-layer sheet remained on surface by removing glue technique
The step of impurity.
Wherein in an embodiment, the quantity of described blind hole is multiple, described to the solid-state tree on multi-layer sheet
The surface of fat carries out second time electroless copper plating, makes solid resin be sealed in the step in blind hole, for the second time
Electroless copper plating makes to electrically conduct between multiple described blind hole.
Wherein in an embodiment, in described blind hole after plating for the first time, fill in liquid resin, and will
Liquid resin is cured as in the step of solid resin, by drying mode, liquid resin is cured as solid resin.
Wherein in an embodiment, in described blind hole after plating for the first time, fill in liquid resin, and will
Liquid resin is cured as the step of solid resin, comprises the steps:
In negative pressure space, promote liquid resin by scraper, liquid resin is filled in blind hole；
Stand more than 5min；And
After standing, temperature-gradient method baking liquid resin, makes liquid resin be cured as solid resin.
Wherein in an embodiment, after described standing, temperature-gradient method baking liquid resin, makes liquid resin
It is cured as in the step of solid resin, 75 DEG C to 85 DEG C of lasting 20min to 40min, 95 DEG C to 105 DEG C afterwards
Continuing 20min to 40min, 115 DEG C to 125 DEG C continue 40min to 80min afterwards, and 145 DEG C extremely afterwards
155 DEG C continue 40min to 80min.
A kind of HDI plate, including multi-layer sheet, implant, the first layers of copper and the second layers of copper；
It is provided with internal cabling in described multi-layer sheet, described multi-layer sheet offers the described multiple-plate table of connection
Face and the blind hole of described internal cabling；
Described implant is filled in described blind hole；
Described first layers of copper between the inwall of described implant and described blind hole, described first layers of copper and institute
State internal cabling connection；
Described second layers of copper covers the opening of described blind hole, makes described implant be sealed in described blind hole.
Wherein in an embodiment, described implant is the liquid resin after solidification.
Above-mentioned HDI plate and manufacture method thereof, fill in liquid resin in blind hole, and consent plumpness is high, therefore
The bad phenomenon such as bubble, be full of cracks, cavity occur in can avoiding hole.Solid resin polishing carries out the after evening out
Secondary electroless copper plating so that the thickness of the copper at aperture is essentially identical with the thickness of the copper on multi-layer sheet surface, carries
The high reliability of HDI plate.Meanwhile, on the one hand electroless copper plating can make solid resin abundant for the second time
Tamp blind hole, on the other hand solid resin is sealed in blind hole, good water-proof effect, effectively reduces HDI
Plate is non-water-tight risk in the processing procedure of downstream or in use.
Accompanying drawing explanation
Fig. 1 is the flow chart of the manufacture method of an embodiment HDI plate；
Fig. 2 is the flow chart of step S400 of the manufacture method of HDI plate shown in Fig. 1；
Fig. 3 is the terrace cut slice figure of the HDI plate of the manufacture method manufacture of HDI plate shown in Fig. 2；
Fig. 4 is the schematic diagram of an embodiment HDI plate.
Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, HDI plate and manufacture method thereof are carried out more
Comprehensively describe.Accompanying drawing gives the first-selected embodiment of HDI plate and manufacture method thereof.But, HDI plate
And manufacture method can realize in many different forms, however it is not limited to embodiment described herein.
On the contrary, providing the purpose of these embodiments is to make the disclosure to HDI plate and manufacture method thereof more saturating
Thorough comprehensively.
Unless otherwise defined, all of technology used herein and scientific terminology and the technology belonging to the present invention
The implication that the technical staff in field is generally understood that is identical.Herein in HDI plate and the description of manufacture method thereof
Used in term be intended merely to describe specific embodiment purpose, it is not intended that in limit the present invention.
As it is shown in figure 1, the manufacture method of the HDI plate of an embodiment comprises the steps:
S100, bores connection multi-layer sheet surface and the blind hole of multiple-plate internal cabling on multilayer boards.This multilamellar
Plate is the intermediate products during processing HDI plate.The preferred 0.2mm to 0.4mm in aperture of blind hole.Blind hole is
The via type being connected with circuit board top layer cabling by circuit board internal layer cabling, blind hole does not penetrates through whole multi-layer sheet.
S200, carries out for the first time electroless copper plating to multi-layer sheet, makes blind hole electrically conduct multiple-plate internal cabling.
S300, carries out the multi-layer sheet after first time electroless copper plating electroplating for the first time.Plating for the first time can be
Imposite is electroplated, it is also possible to carry out parcel plating as required.
S400, fills in liquid resin in the blind hole after plating for the first time, and liquid resin is cured as solid-state
Resin.The plug socket resin that liquid resin can select product type to be SKY2000HR-9P.In an embodiment
In, by drying mode, liquid resin can be cured as solid resin.In one embodiment, liquid resin
Mobility be 30%-41%, after liquid resinous mobility is acupressure probe, the liquid resin flowed out outside plate accounts for
The percentage ratio of former liquid resin gross weight.If mobility is too low, liquid resin is not easy to fill up blind hole, mobility
Too high liquid resin is not easy to dry, and in drying course, change in volume is relatively big, easily produces space.
S500, the solid resin polishing that will protrude above multi-layer sheet surface is evened out.This step can pass through Plate grinder
Carry out nog plate, even the solid resin protruding from multi-layer sheet surface with realization polishing out.
S600, removes the impurity of multi-layer sheet remained on surface by removing glue technique.Removing glue technique may insure that multilamellar
Plate surface is clean, smooth, beneficially the manufacturing of subsequent handling, and can improve reliability and the essence of HDI plate
Density, removing glue technique is referred to the removing glue of PTH (Plating Through Hole, plated through-hole) production line
Technique, the impurity of residual is probably the solid resin slipped through the net.Certainly, at the HDI that some precision requirement are the highest
During plate generates, step S600 can be omitted.
S700, carries out second time electroless copper plating to the surface of the solid resin on multi-layer sheet, makes solid resin quilt
It is sealed in blind hole.
S800, carries out second time and electroplates multi-layer sheet.Second time plating can be imposite plating, it is also possible to root
Parcel plating is carried out according to needs.If the aperture of blind hole is the most smooth, second time plating can fill and lead up aperture.
In one embodiment, step S800 can be decided whether according to the needs of subsequent handling step.
The manufacture method of above-mentioned HDI plate, fills in liquid resin in blind hole, and consent plumpness is high, therefore may be used
So that the bad phenomenon such as bubble, be full of cracks, cavity to occur in avoiding hole.Solid resin polishing carries out second after evening out
Secondary electroless copper plating so that the thickness of the copper at aperture is essentially identical with the thickness of the copper on multi-layer sheet surface, improves
The reliability of HDI plate.Meanwhile, on the one hand electroless copper plating can make solid resin fully fill out for the second time
Real blind hole, is on the other hand sealed in solid resin in blind hole, good water-proof effect, effectively reduces HDI
Plate is non-water-tight risk in the processing procedure of downstream or in use.
General HDI plate is filled out in the technology of blind hole, is only filling perforation by the way of plating, electroplates filling perforation cost
High, the waste water of generation can increase environmental pollution, affects plating line production efficiency.Meanwhile, surface holes is full
Degree is not easily controlled, and at aperture, copper thickness rate table copper is slightly higher.Its manufacture method of HDI plate in the present embodiment is led to
Cross liquid resin and can solve the problems referred to above.The present embodiment uses liquid resin plug blind hole, can greatly reduce
Production cost, reduces the amount of waste water.Solid resin is beaten before carrying out second time electroless copper plating by the present embodiment
Mill is evened out so that the thickness of the copper at aperture is essentially identical with the thickness of the copper on multi-layer sheet surface, improves HDI
The reliability of plate.
Such as selective consent requirement, in the technology of blind hole filled out by general HDI plate, partial hole can be covered by dry film
Lid protection, so can easily cause folder film during plating filling perforation.In the present embodiment, the quantity of blind hole can be many
Individual, in step S700, electroless copper plating makes to electrically conduct between multiple blind hole for the second time.If needing selectivity
Consent, it is not necessary to the partial hole filled out can be carried out selective consent by dry film covering protection, remains in dry
Liquid resin or hard resin on film easily remove.
Concrete, referring also to Fig. 2, step S400 may include steps of:
S410, in negative pressure space, promotes liquid resin by scraper, is filled in blind hole by liquid resin.
Liquid resinous mode is promoted to be similar to welding resistance silk-screen mode by scraper.In one embodiment, step S410 exists
One confined space is implemented, needs before consent that space is carried out evacuation and form negative pressure, make pressure in space
Increase, it is simple to liquid resin is preferably inserted in hole, can be propelled longitudinally, after being repeated several times with scraper.
S420, stands more than 5min.In the present embodiment, time of repose is 15min.Standing can enter one
Step ensures that the liquid resin in blind hole has high plumpness, it is to avoid occur the bad phenomenon such as bubble, cavity in hole.
S430, after standing, temperature-gradient method baking liquid resin, makes liquid resin be cured as solid resin.?
In one embodiment, the temperature and time parameter of temperature-gradient method is 75 DEG C to 85 DEG C and continues 20min to 40min,
95 DEG C to 105 DEG C continue 20min to 40min afterwards, and 115 DEG C to 125 DEG C continue 40min to 80min afterwards,
145 DEG C to 155 DEG C continue 40min to 80min afterwards.In one more specifically embodiment, temperature-gradient method
Temperature and time parameter is 80 DEG C and continues 30min, and 100 DEG C continue 30min afterwards, and 120 DEG C continue afterwards
60min, 150 DEG C continue 60min afterwards.Start baking from low temperature, make the liquid resin in blind hole gradually solid
Change, for the liquid resinous process solidifying to form a transition, it is to avoid the solid resin in hole chaps.
Wherein in an embodiment, the baking box of temperature-gradient method baking can be arranged on the back segment of hole plugging equipment,
The baking box that multi-layer sheet toasts automatically into segmentation, makes technique form full automatic production procedure, reduces artificial behaviour
The cost made.
Refer to the terrace cut slice figure that Fig. 3, Fig. 3 are the blind hole using the manufacture method of above-mentioned HDI plate to be formed,
In hole, resin (at the A in Fig. 3 and at B) filled in effect is preferable, without be full of cracks, bubble or cavity, aperture
Smooth.After great many of experiments, it may be determined that the reliability of product is good, and above-mentioned manufacture method is applied six
On the above HDI plate of layer and HDI Rigid Flex, effect is good, and production cost is than traditional plating filling perforation method joint
The nearlyest 80%.
As shown in Figure 4, the HDI plate 100 of an embodiment includes multi-layer sheet 110, implant 120, first
Layers of copper 130 and the second layers of copper 140.Being provided with internal cabling 112 in multi-layer sheet 110, internal cabling 112 can
To be clipped between multiple substrates 114 of multi-layer sheet 110.Connection multi-layer sheet 110 is offered on multi-layer sheet 110
Surface and the blind hole of internal cabling 112, blind hole can run through one or more substrate 114, the end of blind hole
The layers of copper of the most internal cabling 112.Implant 120 is filled in blind hole.In one embodiment, fill
Thing 120 is the liquid resin after solidification.Being filled in by liquid resin in blind hole, consent plumpness is high, therefore may be used
So that the bad phenomenon such as bubble, be full of cracks, cavity to occur in avoiding hole.First layers of copper 130 is positioned at implant 120
And between the inwall of blind hole, the first layers of copper 130 connects with internal cabling 112.Second layers of copper 140 covers blind
The opening in hole, makes implant 120 be sealed in blind hole.Certainly, in one embodiment, the second layers of copper 140
Outside basic unit 150 can also be set.
The HDI plate 100 of the present embodiment can be manufactured by its manufacture method of above-mentioned HDI plate 100, by liquid
State resin is filled in blind hole, and consent plumpness is high, bubble, be full of cracks, cavity occurs in therefore can avoiding hole
Etc. bad phenomenon.Solid resin polishing carries out second time electroless copper plating after evening out so that the thickness of the copper at aperture
Spend essentially identical with the thickness of the copper on multi-layer sheet 110 surface, improve the reliability of HDI plate 100.With this
Meanwhile, on the one hand electroless copper plating can make solid resin fully tamp blind hole, on the other hand by solid-state for the second time
Resin seal in blind hole, good water-proof effect, effectively reduce HDI plate 100 and or make in the processing procedure of downstream
Non-water-tight risk in.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, the most right
The all possible combination of each technical characteristic in above-described embodiment is all described, but, if these skills
There is not contradiction in the combination of art feature, is all considered to be the scope that this specification is recorded.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed,
But can not therefore be construed as limiting the scope of the patent.It should be pointed out that, for this area
For those of ordinary skill, without departing from the inventive concept of the premise, it is also possible to make some deformation and change
Entering, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended power
Profit requires to be as the criterion.
Claims (10)
1. the manufacture method of a HDI plate, it is characterised in that comprise the steps:
Bore connection multi-layer sheet surface and the blind hole of multiple-plate internal cabling on multilayer boards；
Multi-layer sheet is carried out for the first time electroless copper plating, makes blind hole electrically conduct multiple-plate internal cabling；
Carry out the multi-layer sheet after first time electroless copper plating electroplating for the first time；
Fill in liquid resin in blind hole after plating for the first time, and liquid resin is cured as solid resin；
The solid resin polishing that will protrude above multi-layer sheet surface is evened out；And
The surface of the solid resin on multi-layer sheet is carried out second time electroless copper plating, makes solid resin be sealed in
In blind hole.
The manufacture method of HDI plate the most according to claim 1, it is characterised in that described to multilamellar
The surface of the solid resin on plate carries out second time electroless copper plating, makes the step that solid resin is sealed in blind hole
After Zhou, also include multi-layer sheet carries out the step that second time is electroplated.
The manufacture method of HDI plate the most according to claim 2, it is characterised in that described first
Fill in liquid resin in blind hole after secondary plating, and liquid resin is cured as in the step of solid resin, institute
Stating liquid resinous mobility is 30%-41%.
The manufacture method of HDI plate the most according to claim 1, it is characterised in that will protrude described
Before the step that solid resin polishing in multi-layer sheet surface is evened out, and described to the solid-state tree on multi-layer sheet
The surface of fat carries out second time electroless copper plating, before making the step that solid resin is sealed in blind hole, also wraps
Include the step of the impurity being removed multi-layer sheet remained on surface by removing glue technique.
The manufacture method of HDI plate the most according to claim 1, it is characterised in that the number of described blind hole
Amount is for multiple, and the described surface to the solid resin on multi-layer sheet carries out second time electroless copper plating, makes solid-state tree
Fat is sealed in the step in blind hole, and electroless copper plating makes to electrically conduct between multiple described blind hole for the second time.
6. according to the manufacture method of the HDI plate described in any one of claim 1 to 5, it is characterised in that institute
Fill in liquid resin in stating the blind hole after plating for the first time, and liquid resin is cured as the step of solid resin
In Zhou, by drying mode, liquid resin is cured as solid resin.
The manufacture method of HDI plate the most according to claim 6, it is characterised in that described for the first time
Fill in liquid resin in blind hole after plating, and liquid resin is cured as the step of solid resin, including such as
Lower step:
In negative pressure space, promote liquid resin by scraper, liquid resin is filled in blind hole；
Stand more than 5min；And
After standing, temperature-gradient method baking liquid resin, makes liquid resin be cured as solid resin.
The manufacture method of HDI plate the most according to claim 7, it is characterised in that after described standing
Temperature-gradient method baking liquid resin, makes liquid resin be cured as in the step of solid resin, holds for 75 DEG C to 85 DEG C
Continuous 20min to 40min, afterwards 95 DEG C to 105 DEG C lasting 20min to 40min, 115 DEG C to 125 DEG C afterwards
Continuing 40min to 80min, 145 DEG C to 155 DEG C continue 40min to 80min afterwards.
9. a HDI plate, it is characterised in that include multi-layer sheet, implant, the first layers of copper and the second layers of copper；
It is provided with internal cabling in described multi-layer sheet, described multi-layer sheet offers the described multiple-plate table of connection
Face and the blind hole of described internal cabling；
Described implant is filled in described blind hole；
Described first layers of copper between the inwall of described implant and described blind hole, described first layers of copper and institute
State internal cabling connection；
Described second layers of copper covers the opening of described blind hole, makes described implant be sealed in described blind hole.
HDI plate the most according to claim 9, it is characterised in that after described implant is solidification
Liquid resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510290996.9A CN106304691A (en) | 2015-05-29 | 2015-05-29 | HDI plate and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510290996.9A CN106304691A (en) | 2015-05-29 | 2015-05-29 | HDI plate and manufacture method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106304691A true CN106304691A (en) | 2017-01-04 |
Family
ID=57655162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510290996.9A Pending CN106304691A (en) | 2015-05-29 | 2015-05-29 | HDI plate and manufacture method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN106304691A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109068491A (en) * | 2018-09-30 | 2018-12-21 | 东莞联桥电子有限公司 | A kind of aluminium base board machining process |
| CN111278225A (en) * | 2020-03-10 | 2020-06-12 | 深南电路股份有限公司 | Circuit board hole plugging method and circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000001209A1 (en) * | 1998-06-26 | 2000-01-06 | Ibiden Co., Ltd. | Multilayer printed wiring board and production method thereof |
| CN1568135A (en) * | 2003-06-13 | 2005-01-19 | 华通电脑股份有限公司 | Manufacturing method for multilayer printed circuit board and inter-layer ducting structure formed thereby |
| WO2005107342A1 (en) * | 2004-04-29 | 2005-11-10 | Siemens Aktiengesellschaft | Method for the production of circuit boards and/or corresponding constructs |
| CN102244987A (en) * | 2011-04-21 | 2011-11-16 | 深圳市迅捷兴电路技术有限公司 | Method for resin plugging of holes of back plate with high thickness-to-diameter ratio |
| CN102762041A (en) * | 2012-07-12 | 2012-10-31 | 深圳崇达多层线路板有限公司 | Method for post-processing blind hole of circuit board |
-
2015
- 2015-05-29 CN CN201510290996.9A patent/CN106304691A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000001209A1 (en) * | 1998-06-26 | 2000-01-06 | Ibiden Co., Ltd. | Multilayer printed wiring board and production method thereof |
| CN1568135A (en) * | 2003-06-13 | 2005-01-19 | 华通电脑股份有限公司 | Manufacturing method for multilayer printed circuit board and inter-layer ducting structure formed thereby |
| WO2005107342A1 (en) * | 2004-04-29 | 2005-11-10 | Siemens Aktiengesellschaft | Method for the production of circuit boards and/or corresponding constructs |
| CN102244987A (en) * | 2011-04-21 | 2011-11-16 | 深圳市迅捷兴电路技术有限公司 | Method for resin plugging of holes of back plate with high thickness-to-diameter ratio |
| CN102762041A (en) * | 2012-07-12 | 2012-10-31 | 深圳崇达多层线路板有限公司 | Method for post-processing blind hole of circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109068491A (en) * | 2018-09-30 | 2018-12-21 | 东莞联桥电子有限公司 | A kind of aluminium base board machining process |
| CN111278225A (en) * | 2020-03-10 | 2020-06-12 | 深南电路股份有限公司 | Circuit board hole plugging method and circuit board |
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Application publication date: 20170104 |