CN105834612B - A kind of high-dimensional stability Sn Ag Cu solders suitable for Electronic Packaging - Google Patents
A kind of high-dimensional stability Sn Ag Cu solders suitable for Electronic Packaging Download PDFInfo
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- CN105834612B CN105834612B CN201610290805.3A CN201610290805A CN105834612B CN 105834612 B CN105834612 B CN 105834612B CN 201610290805 A CN201610290805 A CN 201610290805A CN 105834612 B CN105834612 B CN 105834612B
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- Prior art keywords
- solder
- solder joint
- dimensional stability
- electronic packaging
- solders
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of high-dimensional stability Sn Ag Cu solders suitable for Electronic Packaging, it is Sn, Ag, Cu and Be that it, which mainly forms metallic element,.The solder of the present invention, Sn Ag Cu solder alloys excellent melting characteristic, welding performance and mechanical property are maintained, the modulus of elasticity of welding point can be significantly improved again, make solder joint that there is higher obdurability, good stability of the dimension, encapsulated especially suitable for ultra-fine pitch electronic.The conductive and heat-conductive of prepared solder joint can be also improved, so that solder joint still has excellent synthesis military service performance when bearing electricity, calorifics and mechanical loading, meet the development trend of the miniaturization of hyundai electronicses component, precise treatment and high performance, improve the use reliability and service life of electronic product.By the one or more in further Al, Ni, V, high-temperature oxidation resistance, wetability, mobility, the stability at elevated temperature of solder are can further improve, refines solder alloy, improves the mechanical property of solder joint.
Description
Technical field
The present invention relates to a kind of solder, more particularly to a kind of high-dimensional stability Sn-Ag-Cu suitable for Electronic Packaging is welded
Material.
Background technology
Develop along with electronic product to thin, light, small and digitlization, multifunction direction, the miniaturization of electronic component,
The development trend of precise treatment and high performance will further speed up so that the number of welds for Electronic Packaging increases, size becomes
It is small, spacing is more and more narrow, and calorifics that it is born, electricity, mechanical loading more and more higher.Research shows, electronic device
Failure have 70% be as caused by the failure for encapsulating and assembling, wherein, solder joint failure is chief reason.
Solder joint can be used as electrical path in Electronic Packaging, and and can provides the same of mechanical connection between chip and substrate
Shi Tigao thermal conductivitys, it is used widely in electronics load, so welding spot reliability problem has very important research meaning
Justice.
The development of the ultra-fine pitch electronic encapsulation of High Density Integration is necessarily faced with the challenge of welding spot reliability decline, wherein,
Interconnection short circuit caused by being concentrated between chip bump and pad due to thermal stress between fillet lifting and salient point is electronic product
In relatively common failure mode.In order to avoid occurring, it is necessary to the dimensionally stable of accurate effective control solder joint for such case
Property and be on active service during electrical and thermal conductivity performance.
Sn-Ag-Cu solders have excellent mechanical property and solderability, but during its military service is found in application process
Dimensional stability is poor, can not meet to require using performance during ultra-fine spacing microelectronics Packaging.
The content of the invention
It is an object of the invention to provide a kind of high-dimensional stability Sn-Ag-Cu solders suitable for Electronic Packaging.
The technical solution used in the present invention is：
A kind of high-dimensional stability Sn-Ag-Cu solders suitable for Electronic Packaging, its mainly form metallic element for Sn,
Ag, Cu and Be.
As the further improvement of above-mentioned solder, the mass percent of Sn, Ag, Cu and Be in solder is：Ag ：2.0~
3.8%, Cu：0.4~0.7%, Be：0.01~1.0% and Sn of surplus.Further, the quality group of solder turns into：Ag ：
2.5~3.5%, Cu：0.3~0.7%, Be：0.15~0.5% and Sn of surplus.
At least one be also added with as the further improvement of above-mentioned solder, in solder in assistant metal element al, Ni, V
Kind.
As the further improvement of above-mentioned solder, mass percent of the assistant metal element in solder be 0.001~
0.5%。
As the further improvement of above-mentioned solder, Ag and Cu mass ratio are（5~6）：1.
As the further improvement of above-mentioned solder, Al：Ni：V mass ratio is（1~2）：（1~2）：1.Al：Ni：V matter
Amount is than being 2：1：1.
As the further improvement of above-mentioned solder, mass percent of the assistant metal element in solder is 0.1~0.4%.
A kind of circuit board with solder joint, the solder that solder joint uses are as described above.
The beneficial effects of the invention are as follows：
The solder of the present invention, maintains the excellent melting characteristic of Sn-Ag-Cu solder alloys, welding performance and mechanical property, again
The modulus of elasticity of welding point can be significantly improved, makes solder joint that there is higher obdurability, good stability of the dimension, especially suitable for
Ultra-fine pitch electronic encapsulation.The conductive and heat-conductive of prepared solder joint can be also improved so that solder joint bear electricity, calorifics and
Still there is excellent synthesis military service performance during mechanical loading, meet the miniaturization of hyundai electronicses component, precise treatment and high performance
Development trend, improve the use reliability and service life of electronic product.
By further adding the one or more in minor metallic element Al, Ni, V, the height of solder can further improve
Warm antioxygenic property, wettability, mobility, stability at elevated temperature, solder alloy is refined, improve the mechanical property of solder joint.
Brief description of the drawings
Fig. 1 is that comparative example, embodiment 2, embodiment 4 prepare the micro-organization chart of solder alloy；
Fig. 2 is comparative example, embodiment 1, embodiment 2, embodiment 3 prepare the resistivity ratio of solder alloy compared with figure；
Fig. 3 is that comparative example, embodiment 2, embodiment 4, embodiment 6, embodiment 7, embodiment 8 prepare the resistance of solder alloy
Rate compares figure；
The DSC curve for the solder alloy that Fig. 4 is comparative example, prepared by embodiment 4；
Fig. 5 is ultra-fine welding powder SEM figures prepared by embodiment 4；
Fig. 6 is the solder joint pictorial diagram prepared；
Fig. 7 is stretching sample schematic diagram and pictorial diagram；
Fig. 8 is comparative example, embodiment 2, embodiment 4, the tensile strength of solder joint comparison diagram of embodiment 8；
Fig. 9 is the wetting and spreading figure that solder joint is prepared using embodiment 1-11, comparative example solder.
Embodiment
A kind of high-dimensional stability Sn-Ag-Cu solders suitable for Electronic Packaging, its mainly form metallic element for Sn,
Ag, Cu and Be.Also include inevitable impurity in solder.
As the further improvement of above-mentioned solder, the mass percent of Sn, Ag, Cu and Be in solder is：Ag ：2.0~
3.8%, Cu：0.4~0.7%, Be：0.01~1.0% and Sn of surplus.Further, the quality group of solder turns into：Ag ：
2.5~3.5%, Cu：0.3~0.7%, Be：0.15~0.5% and Sn of surplus.More preferably, the quality group of solder turns into：Ag
：3.0~3.8%, Cu：0.5~0.7%, Be：0.15~0.5% and Sn of surplus.
At least one be also added with as the further improvement of above-mentioned solder, in solder in assistant metal element al, Ni, V
Kind.
As the further improvement of above-mentioned solder, mass percent of the assistant metal element in solder be 0.001~
0.5%。
As the further improvement of above-mentioned solder, Ag and Cu mass ratio are（5~6）：1.
As the further improvement of above-mentioned solder, Al：Ni：V mass ratio is（1~2）：（1~2）：1.Al：Ni：V matter
Amount is than being 2：1：1.
As the further improvement of above-mentioned solder, mass percent of the assistant metal element in solder is 0.1~0.4%.
A kind of circuit board with solder joint, the solder that solder joint uses are as described above.
The solder of the present invention can be prepared according to a conventional method, i.e., formed according to the alloy of solder, weigh corresponding metal
Melting is uniform under element or alloy, vacuum state or protection gas shielded, and secondary melt back is uniform afterwards, uses routine side as needed
Method manufactured Board, band, paper tinsel, thread or ultra-fine welding powder.
With reference to embodiment, technical scheme is further illustrated.
For the sake of convenient comparison, the solder of following examples and comparative example is prepared as follows：
1) corresponding raw metal is weighed by solder composition, in vacuum intermediate-frequency induction melting furnace, in argon atmosphere
In be warming up to 850~1000 DEG C of meltings, be incubated 0.5h；
2) 400~500 DEG C of remeltings 3 times are cooled to, to ensure that the structural constituent that alloy is made is uniform, subsequent air cooling, are made
Solder ingot blank；
3) as needed, solder ingot blank is used directly as solder, or the method using machinings such as pressure rolling, extruding
Manufactured Board, band, paper tinsel, gage solder, or using Close-Coupled Gas Atomization equipment be atomized into 15~25 μm, 20~38 μm of ultra-fine welding powders with
It is standby to use.
The Sn-3.0Ag-0.5Cu-0.1Be of embodiment 1
Solder each component percentage by weight is：Ag is 3.0%, Cu 0.5%, Be 0.1%, surplus Sn.
The Sn-3.0Ag-0.5Cu-0.2Be of embodiment 2
Solder each component percentage by weight is：Ag is 3.0%, Cu 0.5%, Be 0.2%, surplus Sn.
The Sn-3.0Ag-0.5Cu-0.5Be of embodiment 3
Solder each component percentage by weight is：Ag is 3.0%, Cu 0.5%, Be 0.5%, surplus Sn.
The Sn-3.0Ag-0.5Cu-0.2Be-0.2Al-0.1Ni-0.1V of embodiment 4
Solder each component percentage by weight is：Ag is 3.0%, Cu 0.5%, Be 0.2%, Al 0.2%, Ni 0.1%, V
For 0.1%, surplus Sn.For ultra-fine welding powder.
The Sn-3.8Ag-0.7Cu-0.2Be-0.2Al-0.1Ni-0.1V of embodiment 5
Solder each component percentage by weight is：Ag is 3.8%, Cu 0.7%, Be 0.2%, Al 0.2%, Ni 0.1%, V
For 0.1%, surplus Sn.
The Sn-2.0Ag-0.6Cu-0.2Be-0.2Al of embodiment 6
Solder each component percentage by weight is：Ag is 2.0%, Cu 0.6%, Be 0.2%, Al 0.2%, surplus Sn.
The Sn-2.5Ag-0.5Cu-0.2Be-0.1Ni of embodiment 7
Solder each component percentage by weight is：Ag is 2.5%, Cu 0.5%, Be 0.2%, Ni 0.1%, surplus Sn.
The Sn-3.5Ag-0.7Cu-0.2Be-0.1V of embodiment 8
Solder each component percentage by weight is：Ag is 3.5%, Cu 0.7%, Be 0.2%, V 0.1%, surplus Sn.
The Sn-3.8Ag-0.7Cu-0.2Be-0.2Al of embodiment 9
Solder each component percentage by weight is：Ag is 3.8%, Cu 0.7%, Be 0.2%, Al 0.2%, surplus Sn.
The Sn-3.8Ag-0.7Cu-0.2Be-0.1Al-0.05Ni of embodiment 10
Solder each component percentage by weight is：Ag is 3.8%, Cu 0.7%, Be 0.2%, Al 0.1%, Ni 0.05,
Surplus is Sn.
The Sn-3.8Ag-0.7Cu-0.2Be-0.1Al-0.05V of embodiment 11
Solder each component percentage by weight is：Ag is 3.8%, Cu 0.7%, Be 0.2%, Al 0.1%, V 0.05, remaining
Measure as Sn.
Comparative example Sn-3.0Ag-0.5Cu
Solder each component percentage by weight is：Ag is 3.0%, Cu 0.5%, surplus Sn.
Performance detection：
Comparative example, embodiment 2, embodiment 4 solder alloy micro-organization chart it is as shown in Figure 1.It can be seen that
The microscopic structure of solder alloy can be obviously improved by adding micro Be elements, can not only make β-Sn crystal grain refinements, moreover it is possible to by dendrite
Ag3Sn phases are evenly distributed in Sn matrixes from needle-like to granular transformation；On the matrix of addition Be elements, further add micro-
During secondary element Al, Ni, V, refining effect is more obvious, and the distribution more disperse of eutectic structure is uniform.
Fig. 2 is comparative example, embodiment 1, embodiment 2, embodiment 3 prepare the resistivity ratio of solder alloy compared with figure；Fig. 3 be than
The resistivity ratio that solder alloy is prepared compared with example, embodiment 2, embodiment 4, embodiment 6, embodiment 7, embodiment 8 is relatively schemed.From Fig. 2
With 3 in as can be seen that the present invention solder alloy, resistivity is lower, it is had more preferable electric conductivity during being aided with.
The DSC curve for the solder alloy that Fig. 4 is comparative example, prepared by embodiment 4.It can be seen that Be, Al, Ni, V
The addition of element can reduce the fusing point of solder alloy, it is more met the requirement of existing welding procedure and welding equipment, moreover it is possible to
Prevent from the component damage brought because welding temperature is too high or produce thermal stress causing solder joint failure；Moreover, the weldering of the present invention
Expect that the melting range of alloy is narrower so that mobility of the solder in welding process is more preferable, reduces possibility caused by segregation.
Fig. 5 is ultra-fine welding powder SEM figures prepared by embodiment 4.It can be seen that the solder of the present invention can be prepared
As ultra-fine welding powder, and the welding powder sphericity being prepared is high, and any surface finish, dimensional homogeneity is good, and such powder has
Excellent stability in use.
Fig. 6 is the solder joint pictorial diagram prepared.It can be seen that the good moldability of solder joint, surface-brightening, without obvious
Weld defect.
Fig. 7 is stretching sample schematic diagram and pictorial diagram.
Fig. 8 is comparative example, embodiment 2, embodiment 4, the tensile strength of solder joint comparison diagram of embodiment 8.It can be seen that
Solder joint prepared by the solder of the present invention has higher tensile strength, and solder alloy can be improved by illustrating the addition of Be elements
Mechanical property, especially when compound addition Al, Ni, V element, the mechanical property of solder joint can be further improved.
Fig. 9 is the wetting and spreading figure that solder joint is prepared using embodiment 1-11, comparative example solder（In figure, by left-to-right, 3 rows
Solder joint is respectively embodiment 1~4, and 5~8,9~11, comparative example）.It can be seen that the solder of the present invention is in Cu bases
Energy good wet on plate, pad surface is without serious oxidative phenomena, and solder joint is bright, dimensionally stable.Particularly in addition trace of Al
Afterwards, wettability has further raising.After adding trace of Al and Ni simultaneously, the mobility of wetability and solder in welding
It is improved.
Claims (6)
1. a kind of high-dimensional stability Sn-Ag-Cu solders suitable for Electronic Packaging, its mainly form metallic element for Sn, Ag,
Cu and Be, also added with assistant metal element；The mass percent of Sn, Ag, Cu, Be and assistant metal element in solder is：
Ag ：2.0~3.8%, Cu：0.4~0.7%, Be：0.01~1.0%, assistant metal element 0.001~0.5% and surplus
Sn；Assistant metal element is Al, Ni and V, Al：Ni：V mass ratio is（1~2）：（1~2）：1.
2. the high-dimensional stability Sn-Ag-Cu solders according to claim 1 suitable for Electronic Packaging, it is characterised in that：
Ag, Cu and Be weight/mass percentage composition are in solder：Ag ：2.5~3.5%, Cu：0.3~0.7%, Be：0.15~0.5%.
3. the high-dimensional stability Sn-Ag-Cu solders according to claim 1 or 2 suitable for Electronic Packaging, its feature exists
In：Ag and Cu mass ratio is（5~6）：1.
4. the high-dimensional stability Sn-Ag-Cu solders according to claim 1 suitable for Electronic Packaging, it is characterised in that：
Al：Ni：V mass ratio is 2：1：1.
5. the high-dimensional stability Sn-Ag-Cu solders suitable for Electronic Packaging according to claim 1 or 4, its feature exist
In：Mass percent of the assistant metal element in solder is 0.1~0.4%.
A kind of 6. circuit board with solder joint, it is characterised in that：The solder that solder joint uses such as Claims 1 to 5 any one institute
State.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610290805.3A CN105834612B (en) | 2016-05-04 | 2016-05-04 | A kind of high-dimensional stability Sn Ag Cu solders suitable for Electronic Packaging |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610290805.3A CN105834612B (en) | 2016-05-04 | 2016-05-04 | A kind of high-dimensional stability Sn Ag Cu solders suitable for Electronic Packaging |
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| CN105834612A CN105834612A (en) | 2016-08-10 |
| CN105834612B true CN105834612B (en) | 2018-02-23 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106624433A (en) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | Low-melting-point lead-free solder alloy |
| CN110303269A (en) * | 2019-07-02 | 2019-10-08 | 华侨大学 | For the Sn-Cu-Ti solder of low temperature brazing diamond and application |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1990161A (en) * | 2005-12-30 | 2007-07-04 | 上海飞轮有色冶炼厂 | Lead free solder alloy and its preparation method |
| CN101588889A (en) * | 2006-12-29 | 2009-11-25 | 日进素材产业株式会社 | Pb-free solder alloy |
| CN105149809A (en) * | 2015-10-10 | 2015-12-16 | 南京青锐风新材料科技有限公司 | Antioxidant suitable for SnAgCu or SnCu solder and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5245568B2 (en) * | 2008-06-23 | 2013-07-24 | 新日鉄住金マテリアルズ株式会社 | Electronic member having lead-free solder alloy, solder ball and solder bump |
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2016
- 2016-05-04 CN CN201610290805.3A patent/CN105834612B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1990161A (en) * | 2005-12-30 | 2007-07-04 | 上海飞轮有色冶炼厂 | Lead free solder alloy and its preparation method |
| CN101588889A (en) * | 2006-12-29 | 2009-11-25 | 日进素材产业株式会社 | Pb-free solder alloy |
| CN105149809A (en) * | 2015-10-10 | 2015-12-16 | 南京青锐风新材料科技有限公司 | Antioxidant suitable for SnAgCu or SnCu solder and preparation method thereof |
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| CN105834612A (en) | 2016-08-10 |
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