CN105810847B - The frit packaging system and method for laser assisted - Google Patents
The frit packaging system and method for laser assisted Download PDFInfo
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- CN105810847B CN105810847B CN201410854247.XA CN201410854247A CN105810847B CN 105810847 B CN105810847 B CN 105810847B CN 201410854247 A CN201410854247 A CN 201410854247A CN 105810847 B CN105810847 B CN 105810847B
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Abstract
The invention discloses the frit packaging system and method for a kind of laser assisted, which includes：Laser scanning module, for the frit in work stage to be scanned and encapsulated；Film thickness acquisition module, the film thickness for measuring the frit, and feed back to host module；Position information process module, for the location information of the film thickness measuring point on frit to be fed back to host module；Host module, according to the film thickness of the frit detected and corresponding position information, calculating and the matched laser power of measurement point institute, and information is fed back into laser scanning module.The present invention adds film thickness acquisition module, reduces the realization difficulty of film thickness measuring function, and due to the use of be original light path, make film thickness and measure the synchronous control realization of position to be more easy to.
Description
Technical field
The present invention relates to IC manufacturing field, more particularly to the frit packaging system of a kind of laser assisted and side
Method.
Background technology
In recent years, OLED (Organic Light Emitting Diode, Organic Light-Emitting Diode) is with its self-luminous, knot
Structure is simple, ultra-thin, fast response time, color contrast height, wide viewing angle, low-power consumption and the excellent spy such as can realize Flexible Displays
Property, it has also become an important development direction of FPD and lighting area.
Luminous organic material and electrode used by OLED display screen are to the vapor and oxygen in its ambient enviroment at present
Extreme sensitivity, and the dim spot caused by interaction makes it deteriorate, and seriously affect its service life.It needs to carry out extremely OLED thus
Harsh air-tight packaging.The frit packaging technology of laser assisted is with its excellent packaging air tightness, cryogenic selective and maturation
Technique has become the preferred packaging technology of current OLED glass-encapsulateds.
It is as low as possible that the frit of laser assisted is encapsulated in temperature requirement in encapsulation process, to reduce to OLED device not
Good influence.And the principle of laser assisted frit encapsulation is irradiated to frit by the laser of specific absorption wavelength, production
Heat effect, makes frit temperature be rapidly reached softening point or more.According to light absorption philosophy, " substance is to monochromatic light absorption
There are certain relationships for strong and weak and extinction material concentration and thickness ", temperature will present downward trend in the transmission of frit, i.e.,
Remoter from surface, thick film is thicker its temperature damping of frit is more severe, so can reach soft to make bottom glass material also
Change point, laser power needs to increase to a certain extent.But reinforcement laser power that can not be excessive, this is because laser power
When excessive, a series of problems can be caused, its package temperature will significantly rise first, to influence the property of OLED device
Can, and identical laser power has the frit of different-thickness the otherness of fuel factor, so as to cause thermal stress
The generation for the problems such as aggravating, causing crackle, warpage, reduces package quality.
In addition, OLED laser packages mainly use contour scan mode at present, sweep speed is relatively low, general sweep speed
For 20mm/s, yield is relatively low, and the sweep speed of plesiochronous scan mode, up to 3m/s, yield is relative to contour scan mode
For can greatly promote.But there are the limitations of sample frequency for pyrometer itself, are only used for the contour scan mode of low-speed motion
In, and yield higher, movement velocity cannot be used in faster in plesiochronous scan mode.
Invention content
The present invention provides a kind of the frit packaging system and method for laser assisted, to be adjusted in real time according to the film thickness of frit
Whole laser package power.
In order to solve the above technical problems, the present invention provides a kind of frit packaging system of laser assisted, including：Laser is swept
Module is retouched, for the frit in work stage to be scanned and encapsulated；Film thickness acquisition module, for measuring the frit
Film thickness, and feed back to host module；Position information process module, for the location information of the film thickness measuring point on frit is anti-
It is fed to host module；Host module calculates and the measurement point institute according to the film thickness of the frit detected and corresponding position information
Matched laser power, and information is fed back into laser scanning module.
Preferably, in the frit packaging system of the laser assisted, the laser scanning module includes：Laser
Light source controller, laser light source, the first beam-splitter, galvanometer, f-theta mirror, image detector, the third lens and third point
Tabula rasa；Wherein, the laser light source controller is used to control the power of laser light source, and the laser beam that laser light source is sent out is through first
Beam-splitter is irradiated to after reflexing to galvanometer and the focusing of flat field focus lamp on the frit on work stage surface, through swashing for frit reflection
Light encapsulation reflected light signal after the first beam-splitter, is incident to third beam-splitter and enters described image spy along backtracking
It surveys in device, the laser light source controller and image detector are connect with the host module.
Preferably, in the frit packaging system of the laser assisted, the film thickness acquisition module is set to sharp
In optical scanning module and include：Measure light source, the second beam-splitter and interference objective；Wherein, the second beam-splitter is arranged at first point
In light path between tabula rasa and third beam-splitter, the interference objective is arranged between the galvanometer and the f-theta mirror,
The measurement light that measurement light source is sent out reflexes to first beam-splitter, galvanometer and interference objective through the second beam-splitter and is irradiated to workpiece
On the frit on platform surface, the film thickness acquisition reflected light signal through frit reflection is along backtracking by the first beam-splitter, the
After two beam-splitters, it is incident to third beam-splitter and enters in image detector.
Preferably, in the frit packaging system of the laser assisted, the measurement light source uses wavelength for 380
The white light of~780nm.
Preferably, in the frit packaging system of the laser assisted, the laser light source, the first beam-splitter it
Between and measure light source, between the second beam-splitter include the lens for collimating and expanding
Preferably, in the frit packaging system of the laser assisted, the interference objective and flat field focus lamp
It connect with a servo drive and is moved between position of readiness and measurement position under the driving of servo drive,
Entered by servo drive driving interference objective when film thickness acquires and measure position and f-theta mirror is driven to return to position of readiness,
Position of readiness is returned to by servo drive driving interference objective in laser package and f-theta mirror is driven to enter working position
It sets.
Preferably, in the frit packaging system of the laser assisted, the interference objective is used with compensation
The Michaelson interference objective of eyeglass.
Preferably, in the frit packaging system of the laser assisted, the position information process module includes：
Portal frame length journey controller for controlling the movement of portal frame horizontal direction, and for controlling work stage horizontal direction and vertical fortune
Dynamic work stage length journey controller, the portal frame length journey controller and work stage length journey controller respectively with
The host module connection.
Preferably, in the frit packaging system of the laser assisted, the host module uses computer, institute
Computer is stated to connect with laser scanning module, film thickness acquisition module and position information process module respectively.
Preferably, in the frit packaging system of the laser assisted, the film thickness acquisition module uses triangle
Mensuration tests the film thickness of frit, and the film thickness acquisition module includes measuring light source and CCD, measures light source and sends out incident light,
The reflection of the upper surface of lower surface and lower glass substrate by top glass substrate, makes CCD detection reflected light signal to obtain glass
The height value of glass material both sides cavity, to calculate the film thickness of frit
Preferably, in the frit packaging system of the laser assisted, the upper and lower of the frit is both provided with
Glass substrate.
The present invention also provides a kind of frit packaging methods of laser assisted, including：Step 1：The off-line measurement new glass
The film thickness of material and laser power relationship；Step 2：The glass substrate for being loaded with frit is uploaded to work stage, to the frit into
Row film thickness measuring；Step 3：The location information of film thickness measuring point on position information process module feedback frit；Step 4：It is main
Machine module calculates the laser power adjustment sequential for completing entire frit according to the film thickness and corresponding position information of frit, and
Information is fed back into laser scanning module；Step 5：Laser scanning module carries out frit encapsulation according to the information received.
Preferably, in the frit packaging method of the laser assisted, the step 1 includes：Set laser
Sweep speed；Encapsulation is scanned to the frit of the same film thickness of straightway using different laser powers；To the glass after encapsulation
Glass material carries out sections observation, to determine laser power corresponding with the film thickness；Calculate the corresponding pass between film thickness and laser power
System.
Preferably, in the frit packaging method of the laser assisted, in the step 2, to glass substrate
It carries out carrying out the film thickness measuring while focusing and leveling.
The sweep speed of the laser set in the step 1 and the scanning speed carried out in step 5 in frit encapsulation process
It spends identical.
Preferably, in the frit packaging method of the laser assisted, in the step 1, according to Beer-Lambert
Law formula determines film thickness and the correspondence of laser power.
Preferably, in the frit packaging method of the laser assisted, in the step 2, using triangulation
Method tests the film thickness of frit.
Preferably, in the frit packaging method of the laser assisted, the step 2 includes：Measure light source hair
Go out incident light, the reflection of the upper surface of lower surface and lower glass substrate by top glass substrate makes CCD obtain the reflection of two beams flat
Traveling optical signal passes through formula Hccd=2 γ Zsin α can be obtained in glass substrate the height value Z1 of frit both sides cavity and
Z2, the average value by calculating Z1 and Z2 can be obtained the film thickness value of specific frit；In formula, Z is frit in glass substrate
The cavity height of both sides, HccdFor the change in location that CCD is arrived, α is the incidence angle of projecting light path, and γ is the times magnification of CCD camera lenses
Number.
Preferably, in the frit packaging method of the laser assisted, the step 2 includes：Work stage drives
Frit is moved to the measurement point of frit, and adjustment optical path keeps it vertical with frit holding；Glass is adjusted by work stage
The vertical position of glass material and angle make image detector be collected into the interference fringe information of measurement point, and feed back to host module；
Host module calculates the film thickness value of the measurement point.
Compared with prior art, the present invention has the following advantages：
1, the Thickness Variation for making laser power matched glass material makes packaging effect more preferably；
2, the present invention is not only applicable in the contour scanning laser encapsulation in the case of low-velocity scanning, is also applicable in high-velocity scanning feelings
In plesiochronous laser package method under condition；
3, present invention utilizes original laser scanning modules, and measure film thickness using light path, reduce control and realization
Difficulty；
4, the present invention adds film thickness acquisition module, reduces the realization difficulty of film thickness measuring function, and due to the use of
Be original light path, make film thickness and measure position synchronous control realization be more easy to.
5, the method for film thickness is measured in the present invention mainly before laser package starts, therefore can be with the height in encapsulation process
The method of temperature meter adjustment laser power uses simultaneously, reinforces packaging effect.
6, it proposes in Field by field focusing and leveling, synchronizes the strategy for measuring film thickness, while improving package quality, energy
Effectively avoid the reduction of yield.
Description of the drawings
Fig. 1 is the structural schematic diagram of the frit packaging system of laser assisted in the embodiment of the invention；
Fig. 2 is the flow diagram of the frit packaging method of laser assisted in the embodiment of the invention；
Fig. 3 is that measurement point location information is sat in the frit packaging system of laser assisted in the embodiment of the invention
Mark is intended to；
Fig. 4 is that the encapsulation of single glass material is shown in the frit packaging method of laser assisted in the embodiment of the invention
It is intended to；
Fig. 5 is laser power adjustment signal in the frit packaging method of laser assisted in the embodiment of the invention
Figure；
Fig. 6 is that the frit packaging method intermediate cam mensuration principle of laser assisted in the embodiment of the invention is shown
It is intended to；
Fig. 7 is to be segmented in the triangulation of the frit packaging method of laser assisted in the embodiment of the invention
Synchronous film thickness measuring schematic diagram；
Fig. 8 is the triangulation cathetus of the frit packaging method of laser assisted in the embodiment of the invention
Section instrumentation plan；
Fig. 9 is turning in the triangulation of the frit packaging method of laser assisted in the embodiment of the invention
Point instrumentation plan.
As shown in the figure：101- laser light sources controller, 102- laser light sources, the first lens of 103-, the first beam-splitters of 104-,
105- galvanometers, 106- f-thetas mirror, 107- image detectors, 108- the third lens, 109- third beam-splitters；
201- measures light source, the second lens of 202-, the second beam-splitters of 203-, 204- interference objectives；
301- portal frame length journey controller, 302- work stage length journey controller, 303- portal frames, 304- workpiece
Platform；400- host modules, 500- frits, 501- glass substrates.
Specific implementation mode
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention
Specific implementation mode be described in detail.It should be noted that attached drawing of the present invention is all made of simplified form and uses non-essence
Accurate ratio, only for the purpose of facilitating and clarifying the purpose of the embodiments of the invention.
As shown in Figure 1, the frit packaging system of the laser assisted of the present invention, including：
Laser scanning module, for the frit 500 in work stage 304 to be scanned and encapsulated；
Film thickness acquisition module, is set in laser scanning module, the film thickness for measuring the frit 500, and feeds back
To host module 400；
Position information process module, for the location information of the film thickness measuring point on frit 500 to be fed back to host mould
Block 400；
Host module 400 is calculated using computer according to the film thickness and corresponding position information of the frit 500 detected
With the matched laser power of measurement point institute, and information is fed back into laser scanning module.
Please continue to refer to Fig. 1, the laser scanning module includes：Laser light source controller 101, plays standard at laser light source 102
Directly, the first lens 103, the first beam-splitter 104, the galvanometer 105 for laser scanning, f-theta mirror 106, the figure of effect are expanded
The third lens 108 as detector 107, for imaging and third beam-splitter 109.Specifically, the laser light source controller
101 power for controlling laser light source 102, the laser beam that laser light source 102 is sent out is after the first lens 103 are collimated, expanded
The frit on 304 surface of work stage is irradiated to after the first beam-splitter 104 reflexes to galvanometer 105 and flat field focus lamp 106 focuses
On 500；The laser package reflected light signal reflected through frit 500 after the first beam-splitter 104, is incident to along backtracking
Third beam-splitter 109 and the third lens 108, and enter in described image detector 107.During this, described image detection
Device 107 is act as：Detection image, it is ensured that the scan path of laser beam is accurate, that is, ensures that light beam is beaten in scheduled scanning track
On.The laser light source controller 101 and image detector 107 are connect with the host module 400.Further, described
The third lens 108 use visual field magnifying glass, the f-theta mirror 106 that f-theta mirrors can be used.
Preferably, the film thickness acquisition module includes：Measure light source 201, the second lens 202,203 and of the second beam-splitter
Interference objective 204.Wherein, the second beam-splitter 203 is arranged in the light path between the first beam-splitter 104 and third beam-splitter 109,
The interference objective 204 is arranged between the galvanometer 105 and the f-theta mirror 106, measures the measurement that light source 201 is sent out
Light reflexes to first beam-splitter 104, galvanometer 105 by the second beam-splitter 203 after the second lens 202 are collimated, expanded and does
It relates to object lens 204 and is irradiated on the frit 500 on 304 surface of work stage；The film thickness acquisition reflected light letter reflected through frit 500
Number along backtracking after the first beam-splitter 104, the second beam-splitter 203, it is incident to third beam-splitter 109 and enters image
In detector 107, at this point, image detector 107 is for detecting film thickness.
Preferably, the measurement light source 201, the second lens 202 and the second beam-splitter 203 are located at laser light source 102 and figure
As the middle position for the light path that detector 107 is formed, this is because power used in laser light source 102 is larger, if by film
Thick acquisition module is set to before laser light source 102, and reflected light can cause film thickness acquisition module to be damaged；And it is located at
Image detector 107 is then facilitated to collect pertinent image information before image detector 107.
In addition, the interference objective 204 uses the Michaelson interference objective with compensation eyeglass, and frit 500
It is both provided with glass substrate 501 positioned at upper layer and lower layer.Since the presence of upper layer glass substrate 501 can cause aberration, cause to interfere
Striped can not occur, preferably, in order to eliminate this aberration, one and upper layer glass are added in the light path of interference objective 204
The compensation sheet glass (not shown) of 501 same thickness of glass substrate is as compensation.With continued reference to Fig. 1, the interference objective 204
Position is divided into position of readiness and measures position, in measurement process, is driven by servo drive (not shown) dry
It relates to object lens 204 and enters measurement position；During formal laser package, returned by servo drive driving interference objective 204
Position of readiness, can be to avoid during formal laser package, and high power laser causes to damage to interference objective 204.Accordingly,
In order to avoid being interfered to measurement, f-theta mirror 106 equally drives its return standby when measuring by servo drive
Position then enters operating position in normal laser package.
Preferably, due to 500 surface of frit is more coarse and film thickness is thicker, swashing for single wavelength is used
The such material result of radiant measurement is bad, therefore the measurement light source 201 is measured using white light, and the white light source is by one group
The different light composition of wavelength, when being interfered, each monochromatic optical wave will produce an interference fringe, and final interference fringe is institute
There are the superposition of interference fringe, superposition to form an envelope, corresponding peak position is exactly the position of zero light path, accurately
Determine the peak position, so that it may measure the height of tested frit 500.And the corresponding wavelength of white light is 380~780nm, glass
Expect that 500 effective absorbing wavelengths are 810nm or 940nm, and measure and use white light source output power smaller, therefore will not be to frit
500 cause to influence greatly.
The position information process module includes：The long short stroke of portal frame for controlling the movement of 303 horizontal direction of portal frame
Controller 301, and the work stage length journey controller 302 for controlling 304 horizontal direction of work stage and catenary motion, the dragon
Door frame length journey controller 301 and work stage length journey controller 302 are connect with the host module 400 respectively.Specifically
Ground, portal frame 303 are to drive the mechanism that horizontal direction moves during laser package of galvanometer 105, and have the work of slide glass function
Part platform 304 carries out vertical adjustment when measuring film thickness due to needing, and when measuring in order to ensure the constant of optical path, therefore
Its ability adjusted with X, Y, Rx, Ry, Z-direction, in measurement process, portal frame 303 is remained stationary as with galvanometer 105, by work
Part platform 304 drives glass substrate 501 to carry out 500 film thickness measuring of frit, and during formal laser package, work stage 304
It is motionless, drive galvanometer 105 to carry out laser package by portal frame 303.
Embodiment 1
The present embodiment considers for the more demanding scene of package quality, using Michelson interference measuring principle, can obtain
Related film thickness information, i.e. vertical position and angle of the present embodiment by adjusting frit 500 are taken, image detector 107 is made to receive
Collect interference fringe, be based on light wave principle of stacking, bright dark alternate striped is generated in interference field, according to from frit 500
Reflected interference fringe is different, and the frit for being measured point is obtained by 400 analyzing processing interference fringe of host module
500 film thickness information.
It is specific to please refer to Fig. 2, and combine Fig. 1, it is described more detail below the frit packaging method of laser assisted, including with
Lower step：
Step 1：The film thickness of the off-line measurement new glass material 500 and laser power relationship.
Specifically, since for the straightway encapsulation point of same operating mode, package quality is by sweep speed, scanning work(
The influence of three factors of rate and frit film thickness, therefore off-line measurement method is setting nominal scan speed, this sweep speed is therewith
Sweep speed afterwards used in formal laser package is identical；Then, using different laser powers to the same film thickness of straightway
Frit 500 be scanned encapsulation, and sections observation preferred package effect determines and the most matched laser power of this film thickness；
Then, pass through Beer-Lambert (Beer-Lambert) law formula：qz=q0·e-βZCalculate correspondence.
Q in formulazLaser power when for 500 film thickness of frit being Z；q0To swash needed for the melting of 500 initial surface of frit
Luminous power；β is frit absorption coefficient, is material self character coefficient；Z is corresponding frit film thickness.qzFor q0By Z layers of glass
The power obtained after the decaying of glass material obtains q after by off-line correctionzValue, practical is what bottom glass material 500 can melt
Most mesh power, therefore can different glass material film thickness value Z is counter pushes away q by input in calculating processz=q0·e-βZFormula obtains q0
As a result, due to q0It is linear relationship, i.e. q with laser light source output power P0=kP, wherein k are linear coefficient, in calculating process
In can be disappeared, therefore the it can be seen that corresponding laser light source output power of different film thickness.
Step 2：The glass substrate 501 for being loaded with frit 500 is uploaded to work stage 304, and film is carried out to the frit 500
Thickness measures.Preferably, carrying out the film thickness measuring while carrying out focusing and leveling to glass substrate 501.
Before being measured, drive interference objective 204 to measurement position by servo drive first.Proceed by measurement
When, it is driven by work stage 304 and carries out horizontal direction movement, adjusted galvanometer 105, make the light beam sent out after galvanometer 105 and glass base
501 surface of plate keeps vertical, and fixed galvanometer 105 keeps its rotational angle constant.Work stage 304 drives frit 500 to be moved to and waits for
When measuring point, the vertical position by adjusting work stage 304 and angle are collected using powerful CCD as image detector 107
To measurement point interference fringe information and feed back to computer, its film thickness value is calculated by computer；Complete all frit film thickness
After measurement, servo drive drives interference objective 204 to return to position of readiness, and when avoiding formally encapsulating, high power laser is to dry
Object lens 204 are related to cause to damage.
Further, it when measuring film thickness, measures light source 201 and opens, laser light source 102 is closed.Position is issued by computer
Signal carries out the movement of 304 horizontal direction position of work stage to work stage length journey controller 302, by workpiece when being moved to measurement point
302 feedback signal of director's short stroke control device is issued an order by computer to computer to the long short stroke control of work stage again
Device 302 carries out 304 vertical adjustment of work stage, and collecting interferometric fringe signal by image detector 107 feeds back to computer, by calculating
Machine calculates the film thickness information of measurement of correlation point, moves again to next point later and carries out film thickness measuring, until completing entire glass
Frit film thickness measuring on glass material 500.
Step 3：The location information of film thickness measuring point on position information process module feedback frit 500.Specifically, position
When setting information processing, the coordinate information by feeding back measurement point obtains, and coordinate system is as shown in figure 3, uploading glass substrate 501
When, determine coordinate zero-bit, X-direction and glass substrate 501 by two alignment marks (mark) on 501 bevel edge of glass substrate
Short side is parallel, and Y-direction is parallel with 501 long side of glass substrate, so that it is determined that the coordinate between glass substrate 501 and work stage 304
Position relationship so that the location information of the film thickness measuring point on position information process module feedback frit 500.
Step 4：Host module 400 calculates according to the film thickness and corresponding position information of frit 500 and completes entire frit
500 laser power adjusts sequential, and information is fed back to laser scanning module.
Specifically, laser power result has substantial connection in addition to being influenced by film thickness, and with position.Opsition dependent power is not
It is same laser scanning track on frit 500 to be divided into 4 regions：Start-stop area (including scanning sintering and scanning terminate
Area), linearity sector, electrode district and corner regions.Wherein, start-stop area power is respectively linear rise and decline process, therefore start-stop area
Thickness Variation in domain does not influence the power adjustment in this region；The changed power of linearity sector is only related with Thickness Variation, and rises
Only area is in order to ensure package quality, therefore needs overlapping scan, and in overlapping scan, it is linearity sector that start-stop area, which is calculated,；Electrode district refers to
The region of electrode is done in 500 lower position of frit, is generally only present in straightway, compared with straightway, power needs
Decline；Heat affecting is crossed in corner regions caused by order to eliminate tarnsition velocity variation, therefore compared with straightway, under power needs
Drop.
Fig. 4 is track schematic diagram when single glass material encapsulates, and scanning direction is clockwise, and Fig. 5 is its corresponding work(
Rate adjusts schematic diagram.Specifically, the A points in Fig. 4 are scanning sintering to B points region, and A point scan start points correspond to wink
When laser power be 0W, B points be initial power maximum point；C points are scanning terminator to D points region, and C points are to terminate power maximum
Point, D points are scanning terminating point, and correspondence transient laser power is 0W；E points are corner regions to F points region, and E points enter for turning
Point, F points are that turning is left a little；G points to H points region is electrode district；H points to I points region is straightway.Unit 410 are pair in Fig. 5
Laser power caused by the independent Thickness Variation of measurement point in Fig. 4 is answered to adjust schematic diagram, Unit 420 are to be measured in corresponding diagram 4
The laser power adjustment schematic diagram that the independent location information of point is brought, and Unit 430 are final under the above two collective effects
Laser power adjusts schematic diagram.
Step 5：Laser scanning module carries out frit 500 according to the information received and encapsulates.That is, by laser light
Source controller 101 carries out laser package control according to the power adjustment result being calculated in step 4.In encapsulation process, pass through
Computer control makes portal frame 303 move, it is made to be synchronized with laser power adjustment signal, to reach online regulation and control laser
The function of power.Specifically, it when laser package, measures light source 201 and closes, laser light source 102 is opened.Power is issued by computer
Adjust signal to laser light source controller 101, and synchronize issue position signal give portal frame length journey controller 301 carry out water
It puts down to position and is moved to encapsulation point, after completing encapsulation, by 301 feedback signal of portal frame length journey controller to computer, by
Computer assigns synchronizing signal to laser light source controller 101 and portal frame length journey controller 301 again, carries out next envelope
The encapsulation decorateeed.
Embodiment 2
The scene consideration that the present embodiment optimizes for yield, thus it is same by triangulation when carrying out field-by-field leveling and focusing
Pacing measures the film thickness value of frit 500, avoids the reduction of overall productivity.
The center of the triangulation is：Since the reflectivity of frit 500 itself is very low, can not be effectively collected in
Signal is reflected, therefore is pushed away herein using the height for measuring frit both sides cavity by calculating the average value of left and right cavity height
Calculation obtains the height of frit 500.
As shown in fig. 6, light source sends out incident light, the lower surface by upper layer glass substrate 501 and lower layer's glass substrate 501
Upper surface reflection, so that CCD is obtained two beam reflected parallel optical signals, pass through formula HccdZ1 can be obtained in=2 γ Zsin α
With the height value of Z2, Z is 501 internal cavity height of glass substrate, H in formulaccdFor the change in location that CCD detection arrives, wherein α is to throw
The incidence angle of shadow light path, γ are the amplification factor of CCD camera lenses.It is worth to specific frit eventually by being averaged for Z1 and Z2 is calculated
501 film thickness value.
For optimization yield the considerations of, for OLED encapsulation frit 500 be all identical size array arrangement and by
The characteristic that field focusing and leveling is carried out according to single glass material 500 one by one, therefore propose the mode of segment sync film thickness measuring.Such as figure
Shown in 7, the straightway of frit 500 collects whole section of film thickness value using linear light source mode, due to the length of the straightway of frit 500
Orthogonal both direction is presented in side and short side, therefore film thickness measuring is also required to correspondingly, there are two orthogonal optical path, and it is same
Its corresponding measuring device of the straightway in one direction is as shown in Figure 8；And corner takes the mode measured, measuring device is such as
Shown in Fig. 9, optical path is along 500 diagonal of frit, totally 4 groups of measuring devices.When measuring film thickness, it is carried out at the same time all straight
The measurement of line segment and corner point.It can be synchronized when focus by field using this mode and carry out film thickness measuring, avoid the drop of yield
It is low.
In conclusion compared with prior art, the invention has the advantages that：
1, the Thickness Variation for making laser power matched glass material makes packaging effect more preferably；
2, the present invention is not only applicable in the contour scanning laser encapsulation in the case of low-velocity scanning, is also applicable in high-velocity scanning feelings
In plesiochronous laser package method under condition；
3, present invention utilizes original laser scanning modules, and measure film thickness using light path, reduce control and realization
Difficulty；
4, the present invention adds the function of on-line measurement frit film thickness, reduces the realization difficulty of film thickness measuring function,
And due to the use of be original light path, make film thickness and measure position synchronous control realization be more easy to.
5, the method for film thickness is measured in the present invention mainly before laser package starts, therefore can be with the height in encapsulation process
The method of temperature meter adjustment laser power uses simultaneously, reinforces packaging effect.
6, it proposes in Field by field focusing and leveling, synchronizes the strategy for measuring film thickness, while improving package quality, energy
Effectively avoid the reduction of yield.
Obviously, those skilled in the art can carry out invention spirit of the various modification and variations without departing from the present invention
And range.If in this way, these modifications and changes of the present invention belong to the claims in the present invention and its equivalent technologies range it
Interior, then the present invention is also intended to including these modification and variations.
Claims (8)
1. a kind of frit packaging system of laser assisted, including：
Laser scanning module, for the frit in work stage to be scanned and encapsulated；
Film thickness acquisition module, the film thickness for measuring the frit, and feed back to host module；
Position information process module, for the location information of the film thickness measuring point on frit to be fed back to host module；
Host module calculates matched sharp with measurement point institute according to the film thickness of the frit detected and corresponding position information
Luminous power, and information is fed back into laser scanning module；
The laser scanning module includes：Laser light source controller, laser light source, the first beam-splitter, galvanometer, f-theta mirror,
Image detector, the third lens and third beam-splitter；Wherein, the laser light source controller is used to control the work(of laser light source
Rate, the laser beam that laser light source is sent out are irradiated to work stage table after the first beam-splitter reflexes to galvanometer and flat field focus lamp focuses
On the frit in face, through the laser package reflected light signal of frit reflection along backtracking after the first beam-splitter, it is incident
To third beam-splitter and enter in described image detector, the laser light source controller and image detector with the master
Machine module connects.
2. the frit packaging system of laser assisted as described in claim 1, which is characterized in that the film thickness acquisition module is set
It is placed in laser scanning module and includes：Measure light source, the second beam-splitter and interference objective；Wherein, the second beam-splitter setting exists
In light path between first beam-splitter and third beam-splitter, the interference objective is arranged in the galvanometer and the f-theta mirror
Between, it measures the measurement light that light source is sent out and reflexes to first beam-splitter, galvanometer and interference objective through the second beam-splitter and shine
It is mapped on the frit on work stage surface, the film thickness acquisition reflected light signal through frit reflection passes through first point along backtracking
After tabula rasa, the second beam-splitter, it is incident to third beam-splitter and enters in image detector.
3. the frit packaging system of laser assisted as claimed in claim 2, which is characterized in that the laser light source, first
Include the lens for collimating and expanding between beam-splitter and between measurement light source, the second beam-splitter.
4. the frit packaging system of laser assisted as claimed in claim 2, which is characterized in that the interference objective and flat field
Focus lamp is connect with a servo drive and under the driving of servo drive between position of readiness and measurement position
It is mobile, entered by servo drive driving interference objective when film thickness is acquired and measures position and the return of f-theta mirror is driven to wait for
Seat in the plane is set, and returns to position of readiness by servo drive driving interference objective in laser package and f-theta mirror is driven to enter
Operating position.
5. the frit packaging system of laser assisted as claimed in claim 2, which is characterized in that the interference objective uses band
There is the Michaelson interference objective of compensation eyeglass.
6. the frit packaging system of laser assisted as described in claim 1, which is characterized in that the position information process mould
Block includes：Portal frame length journey controller for controlling the movement of portal frame horizontal direction, and for controlling work stage horizontal direction
And the work stage length journey controller of catenary motion, the portal frame length journey controller and the long short stroke control of work stage
Device is connect with the host module respectively.
7. the frit packaging system of laser assisted as described in claim 1, which is characterized in that the film thickness acquisition module is adopted
The film thickness of frit is tested with triangulation, the film thickness acquisition module includes measuring light source and CCD, measure light source send out into
Light is penetrated, the reflection of the upper surface of lower surface and lower glass substrate by top glass substrate makes CCD detection reflected light signal to obtain
The height value for taking frit both sides cavity, to calculate the film thickness of frit.
8. the frit packaging system of laser assisted as described in claim 1, which is characterized in that the film thickness acquisition module packet
Four groups of straight line region measurement light sources and linearity sector CCD, four groups of turning region measurement light sources and corner regions CCD are included, is respectively used to survey simultaneously
Measure the film thickness of linearity sector and corner regions.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410854247.XA CN105810847B (en) | 2014-12-31 | 2014-12-31 | The frit packaging system and method for laser assisted |
| CN201810130530.6A CN108461657B (en) | 2014-12-31 | 2014-12-31 | Laser-assisted frit encapsulation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410854247.XA CN105810847B (en) | 2014-12-31 | 2014-12-31 | The frit packaging system and method for laser assisted |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810130530.6A Division CN108461657B (en) | 2014-12-31 | 2014-12-31 | Laser-assisted frit encapsulation method |
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| CN105810847A CN105810847A (en) | 2016-07-27 |
| CN105810847B true CN105810847B (en) | 2018-07-20 |
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| CN201810130530.6A Active CN108461657B (en) | 2014-12-31 | 2014-12-31 | Laser-assisted frit encapsulation method |
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| CN201810130530.6A Active CN108461657B (en) | 2014-12-31 | 2014-12-31 | Laser-assisted frit encapsulation method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107775187A (en) * | 2016-08-31 | 2018-03-09 | 上海微电子装备（集团）股份有限公司 | A kind of laser package apparatus and method |
| CN107482135B (en) | 2017-08-21 | 2019-04-26 | 京东方科技集团股份有限公司 | A kind of colloid agglomerating plant and colloid sintering method |
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Also Published As
| Publication number | Publication date |
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| CN108461657B (en) | 2019-12-20 |
| CN108461657A (en) | 2018-08-28 |
| CN105810847A (en) | 2016-07-27 |
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