CN105097601A - Wafer calibration device and semiconductor processing equipment - Google Patents
Wafer calibration device and semiconductor processing equipment Download PDFInfo
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- CN105097601A CN105097601A CN201410154937.4A CN201410154937A CN105097601A CN 105097601 A CN105097601 A CN 105097601A CN 201410154937 A CN201410154937 A CN 201410154937A CN 105097601 A CN105097601 A CN 105097601A
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Abstract
The invention provides a wafer calibration device and semiconductor processing equipment. The wafer calibration device comprises a vacuum chamber, a load bearing member, a rotating mechanism, a light source and a light receiving and processing device, wherein the load bearing member is arranged in the vacuum chamber, and comprises a load bearing surface used for bearing a wafer; the rotating mechanism is used for driving the load bearing member to rotate; the light source is arranged above the load bearing member and used for transmitting light towards the edge of the load bearing surface; the light receiving and processing device comprises a light receiving assembly, and is used for receiving the light, converting the light into electric signals and sending out the electric signals; and the light receiving assembly is arranged below the load bearing surface in the vacuum chamber, and is located close to the position of the load bearing surface. The wafer calibration device provided by the invention can shorten the length of a transition area, thereby not only being capable of reducing the implementation difficulty of software and the hardware cost, but also being capable of reducing requirements for the installation accuracy and the calibration accuracy, and thus being capable of reducing the production cost.
Description
Technical field
The present invention relates to semiconductor processing technology field, particularly, relate to a kind of wafer alignment device and semiconductor processing equipment.
Background technology
In the making technology of semiconductor, need pending wafer to be progressively sent in vacuum chamber from atmospheric environment such as etch, the technique of deposition etc.This just needs a wafer transmission system be made up of a series of air equipment and vacuum equipment.Such as, usually need to be undertaken transmitting, getting sheet and film releasing operation, to realize transmission and the handling of wafer by manipulator.In order to ensure the stability of technique, require that wafer can by precise delivery to assigned address, although the theoretical transmission precision of Current mechanical hand can reach technological requirement, but in the transmitting procedure of reality, often wafer is caused to offset relative to the finger centre of manipulator because of the various uncertain factor of such as mechanical oscillation, installation accuracy etc., thus cause after manipulator film releasing, location deviation between the physical location of wafer and assigned address.Therefore, in order to ensure that wafer accurately can arrive assigned address, just must detect the position of wafer, and calibrate when there is position deviation and eliminate this position deviation.
As depicted in figs. 1 and 2, it for detecting the position deviation of wafer in vacuum environment for existing a kind of wafer alignment device.Particularly, this wafer alignment device comprises vacuum chamber 1, light source 11, light receiver processing unit, rotation platform 15, three support columns 16 and rotating mechanisms.Wherein, rotation platform 15 is arranged in vacuum chamber 1; Three support columns 16 are arranged on rotation platform 15, in order to supporting wafers 2; Rotating mechanism comprises rotating shaft 14 and electric rotating machine 13, and wherein, electric rotating machine 13 is arranged on the below of vacuum chamber 1; The lower end of rotating shaft 14 is connected with electric rotating machine 13; The upper end of rotating shaft 14 is vertically run through the diapire of vacuum chamber 1 and extends to straight up in vacuum chamber 1, and is connected with rotation platform 15; Under the driving of electric rotating machine 13, rotating shaft 14 driven rotary platform 15 rotates.In addition, respectively on the roof and diapire of vacuum chamber 1, and be positioned at the position corresponding with wafer 2 edge be placed on support column 16 and be provided with the first through hole and the second through hole; Light source 11 is arranged on above the roof outside vacuum chamber 1, and is positioned at the position corresponding with this first through hole, in order to through the edge emission of light of the first through hole towards wafer 2; Light receiver processing unit is arranged on below the diapire outside vacuum chamber 1, and is positioned at the position corresponding with this second through hole; This light receiver processing unit comprises light receiver assembly 12 and processing unit, and this light for receiving light through the second through hole, and is converted to the signal of telecommunication and is sent to processing unit by light receiver assembly 12; This processing unit carries out data processing and calculating according to the signal of telecommunication, to obtain the position deviation of wafer relative to the pivot 141 of rotating shaft 14, such as, the center of wafer 2 relative to the eccentric throw r of pivot 141 and eccentric angle a, as shown in Figure 3.
When needing the position deviation of monitoring and testing wafer, the wafer 2 on it is transferred to the backed off after random vacuum chamber 1 on the top of support column 16 by manipulator (not shown) via the interface 10 of vacuum chamber 1; Electric rotating machine 13 drives rotation platform 15 to rotate a circle above around rotating shaft 14, in the process, light source 11 is through the vertical emission of light down of the first through hole, a part in this light can be irradiated on wafer 2, another part does not irradiate on wafer 2, and is received by light receiver assembly 12 through the second through hole.
Easy understand, owing to being subject to blocking of wafer 2, thus the light from light source can form area pellucida and dark space by the difference of light intensity at the projected image obtained after the process of light receiver processing unit, and the boundary of area pellucida and dark space is the edge projection of wafer 2, thus the positional information at wafer 2 edge can be obtained based on this projected image, and then the position deviation of wafer 2 can be gone out according to this positional information calculation.
Inevitably there is following problem in actual applications in above-mentioned wafer alignment device:
One, because light receiver processing unit is arranged on below the diapire outside vacuum chamber 1, vertical spacing between its light receiver assembly 12 and wafer surface is larger, and for the feature of non-parallel light, as long as there is vertical spacing between light receiver assembly 12 and wafer surface, the region of being blocked by wafer 3 is entered by the mode of diffraction or oblique fire with regard to having light, cause producing a transition region between area pellucida and dark space, and above-mentioned vertical spacing is larger, the length of this transition region is longer, and the contrast of Waffer edge is less.The existence of this transition region makes in follow-up data handling procedure, and needing has a common boundary to real light and shade searches for, that is, obtain the actual edge positional information of wafer, thus brings larger burden to the data processing of processing unit and calibration.And because the length of this transition region is longer, require higher to the degree of optimization of processing unit, this not only increases the difficulty of realization, but also adds hardware cost.
They are two years old, in theory, only have the absolute parallel with wafer surface of light receiver assembly 12, and the light that light source sends just can be avoided occurring transition region when being directional light, and this point will be realized just high requirement is proposed to the installation accuracy of wafer alignment device and calibration accuracy, thus add production cost.
Summary of the invention
The present invention is intended at least to solve one of technical problem existed in prior art, propose a kind of wafer alignment device and semiconductor processing equipment, it can shorten the length of transition region, thus not only can reduce software realize difficulty and hardware cost, but also can reduce installation accuracy and calibration accuracy requirement, and then production cost can be reduced.
A kind of wafer alignment device is provided for realizing object of the present invention, comprise vacuum chamber, bearing part, rotating mechanism, light source and light receiver processing unit, wherein, described bearing part is arranged in described vacuum chamber, and comprises the loading end for bearing wafer; Described rotating mechanism rotates for driving described bearing part; Described light source is arranged on above described bearing part, in order to the edge's emission of light towards described loading end; Described light receiver processing unit comprises light receiver assembly, for receiving described light, and this light is converted to the signal of telecommunication and sends; Described light receiver assembly is arranged on the below of described loading end in described vacuum chamber, and is positioned at the position near described loading end.
Preferably, described light source is positioned at the position of described vacuum chamber near described loading end, and described light source relative to described loading end height higher than film releasing height; Described film releasing highly for preset manipulator by above wafer transmission to the described loading end in described vacuum chamber time, described wafer is relative to the height of described loading end.
Preferably, described light source is not less than 0.5 times of described film releasing height relative to the height of described loading end.
Preferably, described light receiver processing unit also comprises processing unit, described processing unit is sent and the next signal of telecommunication by described light receiver assembly for receiving, and carries out data processing and calculating according to the described signal of telecommunication, to obtain the position deviation of described wafer relative to described loading end.
Preferably, described processing unit is arranged on the outside of described vacuum chamber.
Preferably, the vertical spacing between described light receiver assembly and described loading end is 2 ~ 10mm.
Preferably, the vertical spacing between described light receiver assembly and described loading end is 3mm.
Preferably, described light receiver assembly comprises lens, optical module and ccd sensor, and wherein said lens are used for the light from described light source to be converted to the directional light irradiated towards described optical components; Described optical components is used for the veiling glare in directional light described in filtering; Described ccd sensor is used for the light after filtering veiling glare to be converted to the signal of telecommunication, and is sent.
As another technical scheme, the present invention also provides a kind of semiconductor processing equipment, and it comprises wafer alignment device, and for detecting the position deviation of described wafer, described wafer alignment device have employed above-mentioned wafer alignment device provided by the invention.
The present invention has following beneficial effect:
Wafer alignment device provided by the invention, it is by being arranged on the below of loading end in vacuum chamber by light receiver assembly, and the position be positioned near this loading end, the vertical spacing between light receiver assembly and loading end can be reduced, thus farthest can shorten the length of transition region, increase the contrast of Waffer edge, and then the burden of follow-up data processing procedure can be alleviated.This compared with prior art without the need to installation accuracy and the calibration accuracy of the degree of optimization and wafer alignment device that improve software, just can realize the length shortening transition region, thus can reduce equipment and production cost.
Semiconductor processing equipment provided by the invention, it is by adopting wafer alignment device provided by the invention, that not only can reduce software realizes difficulty and hardware cost, but also can reduce installation accuracy and calibration accuracy requirement, and then can reduce production cost.
Accompanying drawing explanation
Fig. 1 is the stereogram of existing wafer alignment device;
Fig. 2 is the structural representation of existing wafer alignment device;
Fig. 3 is centre deviation appears in the center of wafer schematic diagram relative to rotating shaft;
The cutaway view of the wafer alignment device that Fig. 4 A provides for first embodiment of the invention;
Fig. 4 B is the cutaway view along A-A line in Fig. 4 A;
The cutaway view of wafer alignment device when detecting wafer that Fig. 5 A provides for second embodiment of the invention;
The bearing part of wafer alignment device that Fig. 5 B provides for second embodiment of the invention and the vertical view of support claw; And
The cutaway view of the wafer alignment device that Fig. 5 C provides for second embodiment of the invention when loading and unloading wafer.
Embodiment
For making those skilled in the art understand technical scheme of the present invention better, below in conjunction with accompanying drawing, wafer alignment device provided by the invention and semiconductor processing equipment are described in detail.
The cutaway view of the wafer alignment device that Fig. 4 A provides for first embodiment of the invention.Fig. 4 B is the cutaway view along A-A line in Fig. 4 A.See also Fig. 4 A and 4B, wafer alignment device comprises vacuum chamber 20, bearing part, rotating mechanism, light source 23 and light receiver processing unit.Wherein, bearing part comprises rotation platform 22 and three support columns 21, and wherein, rotation platform 22 is arranged in vacuum chamber 20; Three support columns 21 are fixed on rotation platform 22, and spaced apart along its circumference; Further, the top of three support columns 21 forms the loading end 211 being used for bearing wafer S; Rotating mechanism rotates for driving rotation platform 22, thus drives the wafer S synchronous rotary on three support columns 21 and top thereof.
In the present embodiment, light source 23 is arranged in vacuum chamber 20, and above the top being positioned at three support columns 21, in order to the edge's emission of light towards loading end 211.Light receiver processing unit comprises light receiver assembly 24, and it is arranged on the below of loading end 211 in vacuum chamber 20, and is positioned at the position near loading end 211.This light for receiving light, and is converted to the signal of telecommunication and sends by light receiver assembly 24.
The present embodiment is by making bearing part above realization that rotate a circle detect the position deviation of wafer S-phase for loading end 211.Particularly, rotating mechanism comprises electric rotating machine 26 and rotating shaft 25, and wherein, electric rotating machine 26 is arranged on the below of vacuum chamber 20; The lower end of rotating shaft 25 is connected with the driving shaft of electric rotating machine 26; The upper end edge vertical direction of rotating shaft 25 runs through the diapire of vacuum chamber 20, and is connected with rotation platform 22, and is positioned at the position corresponding with the center of loading end 211.Under the driving of the second electric rotating machine 26, rotating shaft 25 driven rotary platform 22 around its central rotation, thus drives the wafer S synchronous rotary on three support columns 21 and top thereof.
And, between rotating shaft 25 and the diapire of vacuum chamber 20, be provided with seal 27, in order to seal gap therebetween, thus can ensure that vacuum chamber 20 is in vacuum state.
When detecting position deviation for loading end 211 of wafer S-phase, above-mentioned rotating mechanism drives strutting piece to rotate a circle above, opens light source 23 and light receiver processing unit simultaneously.In the process, because the position of light source 23 is corresponding with the edge of wafer S, thus the part (part corresponding to inside wafer S edge) in the light launched down by light source 23 can be subject to blocking of wafer S, and another part (part corresponding to outside wafer S edge) then can be crossed wafer S edge and directly arrive light receiver assembly 24.This makes in the projected image obtained after the process of light receiver processing unit, forms dark space corresponding to the part inside wafer S edge; Area pellucida is formed corresponding to the part outside wafer S edge; And namely the boundary of area pellucida and dark space corresponds to the edge of wafer S.Therefore, above by making strutting piece rotate a circle, the positional information at the whole edge of wafer can be collected by the way, thus the position deviation (such as eccentric throw and eccentric angle) of wafer relative to loading end can be gone out according to this positional information calculation.
Because light receiver assembly 24 is arranged on below the loading end 211 of bearing part, and the position be positioned near this loading end 211, this makes the vertical spacing D between light receiver assembly 24 and loading end 211 greatly reduce, thus farthest can shorten the length of transition region, increase the contrast at wafer S edge, and then the burden of follow-up data processing procedure can be alleviated.This compared with prior art without the need to installation accuracy and the calibration accuracy of the degree of optimization and wafer alignment device that improve software, just can realize the length shortening transition region, thus can reduce equipment and production cost.
Preferably, the span of above-mentioned vertical spacing D is at 2 ~ 10mm, and further preferably, this vertical spacing D is 3mm.Certainly, in actual applications, can vertical spacing D be set as the case may be, in fact, under guarantee light receiver assembly 24 can not disturb the prerequisite of the rotation of bearing part, vertical spacing D can be reduced as much as possible.
Preferably, because the vertical spacing between light source 23 and loading end 211 is negligible to the Imaging of light on light receiver assembly 24, and this vertical spacing is less, then obtain the prerequisite of identical light intensity at light receiver assembly 24 under, the light intensity needing light source 23 to export is less.For these reasons, light source 23 can be arranged on the position near loading end 211 in vacuum chamber, to reduce the vertical spacing between light source 23 and loading end 211, thus not only can by suitably reducing the light intensity that light source 23 exports, and extend useful life, the minimizing power loss of light source 23, but also the interference of extraneous light can be prevented, and then accuracy of detection can be improved.
It should be noted that, when loaded with wafers S, need via the interface 201 of vacuum chamber 20, wafer S to be delivered in vacuum chamber 20 by manipulator, and the position be positioned at above support column 21 top, this position is as the film releasing position of wafer S, and it can be described as film releasing height relative to the height of loading end 211.Then, manipulator is passed on the top of support column 21 by lower general who has surrendered's wafer S.Easy understand, light source 23 should, higher than above-mentioned film releasing height, to ensure that light source 23 can not disturb the transmitting moving of manipulator, thus avoid light source 23 and wafer S to collide relative to the height of loading end 211.Preferably, light source 23 is not less than 0.5 times of above-mentioned film releasing height relative to the height of loading end 211.
In the present embodiment, light receiver assembly 24 comprises lens, optical module and ccd sensor, and wherein, lens are used for the light from light source 23 being converted to the directional light irradiated towards optical components; Optical components is used for the veiling glare in this directional light of filtering; Ccd sensor is used for the light after filtering veiling glare to be converted to the signal of telecommunication, and is sent, thus realizes the collection to the light intensity information at Waffer edge place.Certainly, in actual applications, the structure of light receiver assembly can be designed as the case may be, such as, lens and/or optical module can be saved, and only adopt ccd sensor, as long as the collection of the light intensity information at Waffer edge place can be completed.
In addition, light receiver processing unit also comprises processing unit, and this processing unit for receiving the signal of telecommunication sent by light receiver assembly 24, and carries out data processing and calculating according to this signal of telecommunication, to obtain the position deviation of wafer S-phase for loading end 211.Processing unit can be the microprocessor of PLC, computer etc.Certainly, in actual applications, other modes can also be adopted to process the signal of telecommunication sent by light receiver assembly, and without the need to limiting.
Preferably, above-mentioned processing unit can be arranged on the outside of vacuum chamber 20, and only light receiver assembly 24 is arranged on the inside of vacuum chamber 20, that is, the collecting work of light is only carried out in vacuum chamber 20, do not carry out the data processing work of light, this can reduce the number of leads between the equipment outside light receiver processing unit and vacuum chamber, such as, only retain the lead-in wire exported by the signal of telecommunication of light receiver assembly 24, thus not only can reduce the volume of vacuum chamber 20, and be convenient to the sealing of vacuum chamber 20.Certainly, in actual applications, light receiver processing unit can select each element it comprised to be arranged on inside or the outside of vacuum chamber as the case may be.
It should be noted that, in the present embodiment, the quantity of support column 21 is three, but the present invention is not limited thereto, in actual applications, the quantity of support column can also be four with more than four.In addition, the structure of bearing part is also not limited to the said structure that the present embodiment provides, every can stably supporting wafers, and the structure of getting sheet and film releasing that can realize manipulator all can adopt.
Also it should be noted that, in the present embodiment, rotating mechanism comprises rotating shaft 35 and electric rotating machine 36, but the present invention is not limited thereto, and in actual applications, rotating mechanism can adopt arbitrary structures, as long as it can drive bearing part to rotate.
The cutaway view of wafer alignment device when detecting wafer that Fig. 5 A provides for second embodiment of the invention.The bearing part of wafer alignment device that Fig. 5 B provides for second embodiment of the invention and the vertical view of support claw.The cutaway view of the wafer alignment device that Fig. 5 C provides for second embodiment of the invention when loading and unloading wafer.See also Fig. 5 A-5C, in the present embodiment, wafer alignment device comprises vacuum chamber 30, bearing part, four support claws 33, rotating mechanism, light source 31 and light receiver processing unit.Wherein, as shown in Figure 5 B, bearing part comprises brace table to the structure of bearing part and support claw, and this brace table is by be horizontally disposed with and symmetrical four load bearing arms 34 form, and the upper surface of four load bearing arms 34 forms the loading end 341 for bearing wafer S jointly; Four support claws 33 are arranged on the bottom in vacuum chamber 30, and are looped around around four load bearing arms 34, for the supporting wafers S when cooperative mechanical hand loading and unloading wafer S.
The present embodiment is by making bearing part above realization that rotate a circle detect the position deviation of wafer S-phase for loading end 341, and by make bearing part do handling that straight line elevating movement realizes wafer S.
Particularly, wafer alignment device also comprises elevating mechanism and hoistable platform 37, and wherein, rotating mechanism and light receiver assembly 32 carry by hoistable platform 37.Rotating mechanism comprises rotating shaft 35 and electric rotating machine 36, and wherein, on the diapire of vacuum chamber 30, and the position corresponding with the center of loading end 341 is provided with the first through hole 302 running through its thickness; Electric rotating machine 36 is arranged on hoistable platform 37; The upper end of rotating shaft 35 is connected with bearing part, and is positioned at the position corresponding with the center of loading end 341; The lower end edge vertical direction of rotating shaft 35 through the first through hole 302, and is connected with the driving shaft of electric rotating machine 36.Under the driving of electric rotating machine 36, rotating shaft 35 drives strutting piece around its central rotation.
And on the diapire of vacuum chamber 30, and the position corresponding with light source 31 is provided with the second through hole 303 running through bottom wall thickness; And, light receiver processing unit also comprises height adjustment assembly 40, the lower end of height adjustment assembly 40 is arranged on hoistable platform 37, the upper end edge vertical direction of height adjustment assembly 40 is through the second through hole 303, and be connected with light receiver assembly 32, height adjustment assembly 40 for the vertical spacing D between light regulating receiving unit 32 and loading end 341, as seen in figs. 5 a and 5 c.Preferably, this vertical spacing D can regulate in the scope of 2 ~ 10mm, and further preferably, vertical spacing D is 3mm.
In actual applications, the concrete structure of height adjustment assembly can be: it comprises the support bar for supporting light receiver assembly 32, and for this support bar is fixed on hoistable platform 37, and the adjusting bolt of the height of supporting bar top in the vertical direction can be regulated.
Elevating mechanism does straight line elevating movement for driving hoistable platform 37, thus drives the rotating mechanism on hoistable platform 37 and strutting piece synchronously to do straight line elevating movement.In actual applications, elevating mechanism can adopt electric rotating machine and rotary motion can be converted to the transmission mechanism of rectilinear motion, such as, and turbine and worm, screw-nut etc.; Or, linear motor direct drive hoistable platform also can be adopted to do straight line elevating movement.
In the process of loaded with wafers S, wafer S transfers on four support claws 33 by manipulator, and now the position of strutting piece is arranged on the position of height lower than the upper end level of support claw 33 of its loading end 341, as shown in Figure 5 C; After manipulator exits, elevating mechanism drives strutting piece to rise, until the height of its loading end 341 is higher than the upper end level of support claw 33, in the process, wafer S self-supporting pawl 33 is passed on loading end 341, as shown in Figure 5A, thus completes the loading of wafer S.Process and the above-mentioned loading process of unloading wafer S are similar, and are only that the motion sequencing of all parts is contrary, do not repeat them here.
When detecting position deviation for loading end 341 of wafer S-phase, rotating mechanism drives strutting piece to rotate a circle above, opens light source 31 and light receiver processing unit simultaneously.Because this testing process is identical with above-mentioned first embodiment, do not repeat them here.
Because light receiver assembly 32 is arranged on hoistable platform, light receiver assembly 32 can be made synchronously to do straight line elevating movement with hoistable platform 37, namely, strutting piece does not have relative motion when doing straight line elevating movement and between light receiver assembly 32, thus can ensure that the vertical spacing D between light receiver assembly 32 and loading end 341 is constant all the time, and then make before detecting, only need the height to light receiver assembly 32 to regulate once, thus be conducive to operating efficiency and convenience.
Certainly, in actual applications, light receiver assembly also can be arranged on the bottom of vacuum chamber 30 by height adjustment assembly 40, or on the bottom of saving height adjustment assembly 40 and being set directly at vacuum chamber 30 or hoistable platform 37.
Preferably, in order to ensure that vacuum chamber 30 keeps vacuum state, system first bellows 39 can be overlapped on rotating shaft 35, and on the support bar of height adjustment assembly 40, overlap system second bellows 41, first bellows 39 and the second bellows 41 is respectively used to seal the first through hole 302 and the second through hole 303.Easy understand, the internal diameter of this bellows should be not less than the diameter of through hole, to guarantee by the openings house of through hole therein.
It should be noted that, in the present embodiment, this brace table is by be horizontally disposed with and symmetrical four load bearing arms 34 form, but the present invention is not limited thereto, in actual applications, brace table can also adopt other any disk-like structures, such as adopt all-in-one-piece disk bearing wafer, in fact, the structure of bearing part is not limited to the structure that the present invention illustrates in the above-described embodiments, and it can free setting as the case may be.
Also it should be noted that, in the present embodiment, the quantity of four support claws 33 is four, but the present invention is not limited thereto, and in actual applications, the quantity of support claw can also be three, or more than five.And the structure of support claw is not limited to the structure that the present invention illustrates in the above-described embodiments, it can free setting as the case may be.
It should be noted that in addition, the wafer alignment device that the embodiment of the present invention provides is the situation being applied to the position deviation detecting wafer under vacuum conditions, that is, detect in wafer transmission to vacuum chamber.
It should be noted that further, in the technical scheme of above-mentioned first embodiment, because bearing part is the top common support wafer utilizing multiple support column, thus it is without the need to doing straight line elevating movement, and only rely on the lifting of manipulator can complete the handling of wafer, thus elevating mechanism and support claw can be saved, this not only can reduce the volume of vacuum chamber, but also the structure of vacuum chamber can be simplified, thus manufacturing cost can be reduced.But the structure of above-mentioned bearing part only can be applied in the situation of lower motor speed, and for the situation of higher motor speed, may occur that wafer drops or the situation such as slippage.
By comparison, in the technical scheme of above-mentioned second embodiment, bearing part adopts the disk shaped support platform supporting wafers that is made up of horizontally disposed multiple load bearing arm, and the bearing part of this structure can be avoided when higher motor speed, occurs that wafer drops or the situation such as slippage.But, because it has set up elevating mechanism and support claw, increase the volume of vacuum chamber to a certain extent.Therefore, in actual applications, the technical schemes of factor to first, second embodiment above-mentioned such as the taking up room of equipment, manufacturing cost can be considered select.
As another technical scheme, the embodiment of the present invention also provides a kind of semiconductor processing equipment, and it comprises wafer alignment device, and for detecting the position deviation of wafer, this wafer alignment device have employed the above-mentioned wafer alignment device that the embodiment of the present invention provides.
The semiconductor processing equipment that the embodiment of the present invention provides, its wafer alignment device provided by adopting the embodiment of the present invention, that not only can reduce software realizes difficulty and hardware cost, but also can reduce installation accuracy and calibration accuracy requirement, and then can reduce production cost.
Be understandable that, the illustrative embodiments that above execution mode is only used to principle of the present invention is described and adopts, but the present invention is not limited thereto.For those skilled in the art, without departing from the spirit and substance in the present invention, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (9)
1. a wafer alignment device, comprises vacuum chamber, bearing part, rotating mechanism, light source and light receiver processing unit, and wherein, described bearing part is arranged in described vacuum chamber, and comprises the loading end for bearing wafer; Described rotating mechanism rotates for driving described bearing part; Described light source is arranged on above described bearing part, in order to the edge's emission of light towards described loading end; Described light receiver processing unit comprises light receiver assembly, for receiving described light, and this light is converted to the signal of telecommunication and sends; It is characterized in that,
Described light receiver assembly is arranged on the below of described loading end in described vacuum chamber, and is positioned at the position near described loading end.
2. wafer alignment device according to claim 1, is characterized in that, described light source is positioned at the position of described vacuum chamber near described loading end, and
Described light source relative to described loading end height higher than film releasing height; Described film releasing highly for preset manipulator by above wafer transmission to the described loading end in described vacuum chamber time, described wafer is relative to the height of described loading end.
3. wafer alignment device according to claim 2, is characterized in that, described light source is not less than 0.5 times of described film releasing height relative to the height of described loading end.
4. wafer alignment device according to claim 1, it is characterized in that, described light receiver processing unit also comprises processing unit, described processing unit is sent and the next signal of telecommunication by described light receiver assembly for receiving, and carry out data processing and calculating according to the described signal of telecommunication, to obtain the position deviation of described wafer relative to described loading end.
5. wafer alignment device according to claim 4, is characterized in that, described processing unit is arranged on the outside of described vacuum chamber.
6. wafer alignment device according to claim 1, is characterized in that, the vertical spacing between described light receiver assembly and described loading end is 2 ~ 10mm.
7. wafer alignment device according to claim 6, is characterized in that, the vertical spacing between described light receiver assembly and described loading end is 3mm.
8. wafer alignment device according to claim 1, is characterized in that, described light receiver assembly comprises lens, optical module and ccd sensor, wherein
Described lens are used for the light from described light source to be converted to the directional light irradiated towards described optical components;
Described optical components is used for the veiling glare in directional light described in filtering;
Described ccd sensor is used for the light after filtering veiling glare to be converted to the signal of telecommunication, and is sent.
9. a semiconductor processing equipment, it comprises wafer alignment device, for detecting the position deviation of described wafer, it is characterized in that, described wafer alignment device adopts the wafer alignment device described in claim 1-8 any one.
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| CN201410154937.4A CN105097601A (en) | 2014-04-17 | 2014-04-17 | Wafer calibration device and semiconductor processing equipment |
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| CN108557419A (en) * | 2018-05-31 | 2018-09-21 | 君泰创新（北京）科技有限公司 | Elevator, process cavity equipment and its control method |
| CN109324303A (en) * | 2017-07-31 | 2019-02-12 | 东京毅力科创株式会社 | The method and cabinet calibrated to analyzer |
| CN110320757A (en) * | 2018-03-30 | 2019-10-11 | 华润微电子（重庆）有限公司 | Exposing wafer machine |
| CN112530850A (en) * | 2020-12-04 | 2021-03-19 | 北京北方华创微电子装备有限公司 | Calibration method for station position in process chamber and semiconductor process equipment |
| CN112526827A (en) * | 2019-09-19 | 2021-03-19 | 株式会社斯库林集团 | Exposure device |
| CN113035758A (en) * | 2020-12-31 | 2021-06-25 | 中科晶源微电子技术（北京）有限公司 | Chamber device, wafer conveying equipment and wafer processing method |
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| CN107958861A (en) * | 2017-12-07 | 2018-04-24 | 德淮半导体有限公司 | Equipment for manufacturing semiconductor device |
| CN110320757A (en) * | 2018-03-30 | 2019-10-11 | 华润微电子（重庆）有限公司 | Exposing wafer machine |
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