CN105014070A - Selective laser sintering 3D printing method - Google Patents
Selective laser sintering 3D printing method Download PDFInfo
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- CN105014070A CN105014070A CN201410170857.8A CN201410170857A CN105014070A CN 105014070 A CN105014070 A CN 105014070A CN 201410170857 A CN201410170857 A CN 201410170857A CN 105014070 A CN105014070 A CN 105014070A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention provides a selective laser sintering 3D printing method. In the sintering process of each layer, the method comprises the following steps of carrying out selective sintering on a material powder layer through first lasers, determining redundant bonding of the sintering area and removing redundant bonding through second lasers in a gasification manner. A workpiece of a fine structure can be printed, 3D printing precision can be improved, and good surface evenness can be achieved.
Description
Technical field
The present invention relates to 3D and print field, in particular to selective laser sintering 3D Method of printing.
Background technology
3D printing technique is a kind of 3 D stereo forming technique of the workpiece manufacture that breaks traditions.A kind of 3D printing technique of correlation technique is Selective Laser Sintering, makes the energy with infrared laser, and the dusty material that uses as Modeling Material more.When sintering, first powder is preheating to slightly lower than the temperature of its fusing point, then powder is paved; Laser beam is sintered according to the cross section information of every one deck under the control of the computer selectively by galvanometer system, carries out lower one deck sintering again after one deck completes, and removes unnecessary powder, then just can obtain the workpiece sintered after all having sintered.Because all powder is all in slightly lower than the temperature of its fusing point, so complete rear surface in workpiece sintering to be easy to the unnecessary powder of adhesion, surface smoothness is declined.
In order to the surface smoothness improving workpiece just needs to carry out secondary operations to workpiece, and be difficult to reach gratifying effect for carrying out secondary operations to it again after sintering baroque workpiece.Be subject to the impact of selective laser sintering precision, be difficult to print the workpiece that some have fine structure by the method.
Summary of the invention
The object of the present invention is to provide a kind of selective laser sintering 3D Method of printing, to solve the above problems.
Provide a kind of selective laser sintering 3D Method of printing in an embodiment of the present invention, comprise the following steps in the sintering process of every one deck: use the first laser to sinter selectively in material powder last layer; Determine the unnecessary bonding sintering region; The second laser gasification is used to remove unnecessary bonding.
The present embodiment can print the workpiece with fine structure, can improve 3D printing precision, can also obtain good surface smoothness.
Accompanying drawing explanation
Fig. 1 shows the flow chart of the selective laser sintering 3D Method of printing according to the embodiment of the present invention;
Fig. 2-3 shows according to the sintering area schematic in each step of selective laser sintering 3D Method of printing of the embodiment of the present invention.
Detailed description of the invention
Also by reference to the accompanying drawings the present invention is described in further detail below by specific embodiment.
Fig. 1 shows the flow chart of the selective laser sintering 3D Method of printing according to the embodiment of the present invention, comprises the following steps in the sintering process of every one deck:
Step S10, uses the first laser to sinter selectively in material powder last layer;
Step S20, determines the unnecessary bonding sintering region;
Step S30, uses the second laser gasification to remove unnecessary bonding.
In correlation technique, after whole sintering process completes, removed the unnecessary bonding on surface by secondary operations, but for baroque workpiece, be difficult to the full surface of secondary operations complex part, some position does not probably reach, thus have impact on the surface smoothness of these positions.And in the present embodiment, often sinter one deck, immediately just by the unnecessary bonding gasification finish of this layer, for the whole surface that will contact complex part, this is easy to realize, thus the final complex part obtained also can obtain good surface smoothness.
In addition, the present embodiment can carry out fine finishining to the workpiece of preliminary sintering.Such as will make the workpiece that length is 100mm, require that the margin of tolerance controls at 50um, the product that correlation technique obtains can only manually be polished control accuracy, and the margin of tolerance may can only control at 100um.And the present embodiment utilizes the second laser to carry out fine finishining, product of can very finely successively polishing, thus the margin of tolerance is controlled within 50um.Therefore, the present embodiment can improve the precision that 3D prints.
Further, the present embodiment, because fine finishining layer by layer, so compared to correlation technique, can also make the product with more fine structure.
Preferably, described first laser is the continuous infrared laser of high power.This fast and easy completes sintering.Such as, the continuous infrared laser of high power moves by the deflection of light beam, sintering platform the selective sintering that (or in all professional domains personage's accreditation can realize light beam to carry out selective sintering method to material powder) realizes carrying out dusty material layering.Preferably, the selective sintering realizing dusty material being carried out to layering can also be moved by the deflection of light beam, sintering platform by high power pulse infrared laser.The continuous infrared laser of high power can be the high power red outer continuous laser that any kind laser instruments such as optical fiber laser, solid state laser, gas laser, semiconductor laser are launched.
Preferably, the wavelength of the continuous infrared laser of described high power is 780-2000nm (most preferred, 1080nm), and focal beam spot is less than 500um, and translational speed is 1-8m/s (most preferred, 4m/s), and the thickness of sinter layer is less than 5mm.Inventor, through great many of experiments, obtains these optimized parameters.
Preferably, step S10 comprises: computer passes through galvanometer system according to the continuous infrared laser of layering cross section information control 780-2000nm (such as 1080nm) high power, material powder last layer is focused to the hot spot that diameter is less than 500um sinter selectively, the thickness of sinter layer is less than 5mm.Inventor, through great many of experiments, obtains these optimized parameters.
Preferably.Inventor, through great many of experiments, obtains these optimized parameters.
Preferably, step S20 comprises: the image obtaining sintering region; Described image and the layering interfaces information being used for sintering are compared; Described unnecessary bonding is determined by comparison.Adopt Computer imaging analysis system can realize the present embodiment easily.
Preferably, CCD imaging system is adopted to obtain described unnecessary bonding.The present embodiment is simple.
Preferably, described second laser is pulsed optical fibre laser.This fast and easy completes gasification finish.Workpiece needs the material transient evaporation at the position of retrofit to remove by the present embodiment by high power pulsed laser, realize workpiece fine structure processing.High power pulse infrared laser can be the high power pulsed infrared laser that any kind laser instruments such as optical fiber laser, solid state laser, gas laser, semiconductor laser are launched.
Preferably, the peak power of described pulsed optical fibre laser is for being greater than 5kw (optimum, 10kw), and focal beam spot is less than 50um.Inventor, through great many of experiments, obtains these optimized parameters.
Preferably, step S30 comprises: computer controls peak power and passes through galvanometer system for the pulsed optical fibre laser being greater than 5kw (such as 10kw), described unnecessary bonding is focused to the hot spot that diameter is less than 50um, makes described unnecessary bonding be vaporized removal.Inventor, through great many of experiments, obtains these optimized parameters.
Preferably, in sintering space, be filled with inert gas as protective gas, and control its gaseous environment temperature.Powder of stainless steel can be chosen as agglomerated material.The present embodiment is simple.
Fig. 2-3 shows according to the sintering area schematic in each step of selective laser sintering 3D Method of printing of the embodiment of the present invention.In the present embodiment, the continuous infrared laser of described high power is exported by continuous wave optical fiber laser, and output wavelength is 1080nm power is 500W, and after focusing on, hot spot is less than 50um.
In the present embodiment, concrete implementation step is:
(1) the continuous infrared laser of 1080nm high power by galvanometer system under the control of the computer, in material powder last layer, be focused to according to layering cross section information the hot spot that diameter is less than 50um to sinter selectively, the speed of hot spot movement in material powder last layer can reach 4m/s, and the thickness of sinter layer is less than 50um;
(2) the continuous infrared laser of 1080nm high power described in step (1) to layer of material powder sintered complete after, CCD imaging system contrasts the sintering zone domain imaging of this layer and layering cross section information, and determining needs to carry high-precision position;
(3) as shown in Figure 2, high power connects the outer laser of pulse by pulsed optical fibre laser by galvanometer system under the control of the computer, high-precision position is carried according to needing of obtaining of step (2), be focused to the hot spot that diameter is less than 50um in this position, utilize the peak power of its 10kW to be removed by the material transient evaporation be sintered of out-of-flatness place;
(4) as shown in Figure 3 after step (3) completes, if need to carry out fine structure processing to workpiece at this sinter layer, then by galvanometer system under the control of the computer, on sinter layer, be focused to according to layering cross section information the hot spot that diameter is less than 50um and carry out gasification finish selectively;
(5) step (1) to (4) is performed and so forth until whole workpiece sintering completes.
This preferred embodiment is acted synergistically by high power continuous infrared laser, CCD imaging system, high power pulse infrared laser and realizes improving Selective Laser Sintering and manufacture the surface smoothness of workpiece and realize printing the workpiece of fine structure.
As can be seen from above description, the above embodiment of the present invention, compared with the selective laser sintering 3D printing technique of correlation technique, has following 2 advantages.
1, in the selective laser sintering 3D of correlation technique prints, because all powder is all in slightly lower than the temperature of its fusing point, so after workpiece sintering completes, be difficult to reach high accuracy, even surface is also easy to the unnecessary powder of adhesion, surface smoothness is declined, in order to the precision improving workpiece needs to carry out secondary operations to workpiece; State on the invention in embodiment after every one deck has sintered, all utilize pulse laser to subtract material process to sintering zone, improve precision and the surface smoothness of workpiece well, avoid the secondary operations to workpiece.
2, in the selective laser sintering 3D of correlation technique prints, be subject to the impact of selective laser sintering precision, be difficult to print the workpiece that some have fine structure; State on the invention in embodiment after every one deck has sintered, pulse laser can be utilized on workpiece to construct fine structure, the 3D realizing complicated fine structure workpiece prints.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a selective laser sintering 3D Method of printing, is characterized in that, comprises the following steps in the sintering process of every one deck:
The first laser is used to sinter selectively in material powder last layer;
Determine the unnecessary bonding sintering region;
The second laser gasification is used to remove unnecessary bonding.
2. selective laser sintering 3D Method of printing according to claim 1, is characterized in that, described first laser is the continuous infrared laser of high power.
3. selective laser sintering 3D Method of printing according to claim 2, is characterized in that, the wavelength of the continuous infrared laser of described high power is 780-2000nm, and focal beam spot is less than 500um, and translational speed is 1-8m/s, and the thickness of sinter layer is less than 5mm.
4. selective laser sintering 3D Method of printing according to claim 1, is characterized in that, uses the first laser to sinter selectively in material powder last layer and comprises:
Computer is according to the continuous infrared laser of layering cross section information control 780-2000nm high power by galvanometer system, and material powder last layer is focused to the hot spot that diameter is less than 500um and sinters selectively, the thickness of sinter layer is less than 5mm.
5. selective laser sintering 3D Method of printing according to claim 1, is characterized in that, determines that the unnecessary bonding sintering region comprises:
Obtain the image in sintering region;
Described image and the layering interfaces information being used for sintering are compared;
Described unnecessary bonding is determined by comparison.
6. selective laser sintering 3D Method of printing according to claim 6, is characterized in that, adopts CCD imaging system to obtain described unnecessary bonding.
7. selective laser sintering 3D Method of printing according to claim 1, is characterized in that, described second laser is pulsed optical fibre laser.
8. selective laser sintering 3D Method of printing according to claim 1, it is characterized in that, the peak power of described pulsed optical fibre laser is greater than 5kw, and focal beam spot is less than 500um.
9. selective laser sintering 3D Method of printing according to claim 1, it is characterized in that, use the second laser gasification to remove unnecessary bonding to comprise: the pulsed optical fibre laser that computer control peak power is greater than 5kw passes through galvanometer system, described unnecessary bonding is focused to the hot spot that diameter is less than 500um, makes described unnecessary bonding be vaporized removal.
10. the selective laser sintering 3D Method of printing according to any one of claim 1-9, is characterized in that, be filled with inert gas as protective gas in sintering space, and controls its gaseous environment temperature.
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| CN201410170857.8A CN105014070A (en) | 2014-04-25 | 2014-04-25 | Selective laser sintering 3D printing method |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105397088A (en) * | 2015-12-16 | 2016-03-16 | 吉林大学 | Laser sintering and 3DP comprehensive 3D printing processing system and printing method |
| CN105538728A (en) * | 2016-02-23 | 2016-05-04 | 中国科学院重庆绿色智能技术研究院 | Laser material increasing and decreasing combined manufacturing method and device |
| CN107671285A (en) * | 2017-08-31 | 2018-02-09 | 北京航星机器制造有限公司 | A kind of composite manufacturing method and device for increasing material based on removing surface and electric arc |
| CN107737928A (en) * | 2017-09-28 | 2018-02-27 | 武汉大学 | Metal 3D printing successively surface laser cleaning method |
| CN108339978A (en) * | 2017-12-29 | 2018-07-31 | 网云（武汉）三维科技股份有限公司 | A kind of equipment and sintering process of printing 3D metal materials |
| CN109047762A (en) * | 2018-08-31 | 2018-12-21 | 江苏大学 | A kind of increasing material manufacturing method that selective laser fusing is compound with laser cutting |
| CN112139506A (en) * | 2019-06-28 | 2020-12-29 | 广东汉邦激光科技有限公司 | Composite workpiece forming device and composite workpiece forming method |
| CN113211593A (en) * | 2021-05-24 | 2021-08-06 | 王祥宇 | Additive manufacturing method for powder printing, sintering and laser composite processing |
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| US20060118532A1 (en) * | 2004-12-07 | 2006-06-08 | 3D Systems, Inc. | Controlled cooling methods and apparatus for laser sintering part-cake |
| JP2007270227A (en) * | 2006-03-31 | 2007-10-18 | Matsushita Electric Ind Co Ltd | Method for producing optically formed body |
| CN102304712A (en) * | 2011-09-26 | 2012-01-04 | 苏州大学 | Laser cladding quick precision manufacturing method and device based on laser milling |
| CN103192080A (en) * | 2013-04-27 | 2013-07-10 | 余振新 | Selective laser sintering forming method |
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| US5431967A (en) * | 1989-09-05 | 1995-07-11 | Board Of Regents, The University Of Texas System | Selective laser sintering using nanocomposite materials |
| US20060118532A1 (en) * | 2004-12-07 | 2006-06-08 | 3D Systems, Inc. | Controlled cooling methods and apparatus for laser sintering part-cake |
| JP2007270227A (en) * | 2006-03-31 | 2007-10-18 | Matsushita Electric Ind Co Ltd | Method for producing optically formed body |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105397088A (en) * | 2015-12-16 | 2016-03-16 | 吉林大学 | Laser sintering and 3DP comprehensive 3D printing processing system and printing method |
| CN105538728A (en) * | 2016-02-23 | 2016-05-04 | 中国科学院重庆绿色智能技术研究院 | Laser material increasing and decreasing combined manufacturing method and device |
| CN107671285A (en) * | 2017-08-31 | 2018-02-09 | 北京航星机器制造有限公司 | A kind of composite manufacturing method and device for increasing material based on removing surface and electric arc |
| CN107737928A (en) * | 2017-09-28 | 2018-02-27 | 武汉大学 | Metal 3D printing successively surface laser cleaning method |
| CN108339978A (en) * | 2017-12-29 | 2018-07-31 | 网云（武汉）三维科技股份有限公司 | A kind of equipment and sintering process of printing 3D metal materials |
| CN109047762A (en) * | 2018-08-31 | 2018-12-21 | 江苏大学 | A kind of increasing material manufacturing method that selective laser fusing is compound with laser cutting |
| CN112139506A (en) * | 2019-06-28 | 2020-12-29 | 广东汉邦激光科技有限公司 | Composite workpiece forming device and composite workpiece forming method |
| CN113211593A (en) * | 2021-05-24 | 2021-08-06 | 王祥宇 | Additive manufacturing method for powder printing, sintering and laser composite processing |
| CN113211593B (en) * | 2021-05-24 | 2022-05-31 | 王祥宇 | Additive manufacturing method for powder printing, sintering and laser composite processing |
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