CN104767916A - Camera module - Google Patents
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- CN104767916A CN104767916A CN201510104496.1A CN201510104496A CN104767916A CN 104767916 A CN104767916 A CN 104767916A CN 201510104496 A CN201510104496 A CN 201510104496A CN 104767916 A CN104767916 A CN 104767916A
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- flexible pcb
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Abstract
A camera module comprises a flexible circuit board, a ceramic substrate, an electronic component, an image sensor, a light filter and a lens module. A first groove is formed in the middle of the surface, deviating from the flexible circuit board, of the ceramic substrate, a second groove is formed in the bottom of the first groove, and a through hole or a third groove is formed in the bottom of the second groove. The electronic component is accommodated in the through hole or the third groove, and glue application is conducted on the surface, deviating from the surface of the flexible circuit board, of the ceramic substrate, so that the electronic component is prevented from being bumped by a plastic pin during glue application on production line, chipping production is effectively avoided, and the imaging quality of the camera module is improved.
Description
Technical field
The present invention relates to camera technical field, particularly relate to a kind of camera module.
Background technology
In recent years, along with the development of multimedia technology, the range of application of camera module is more and more wider, is widely used in mobile phone, computer, the first-class electronic product of miniature video camera.
Camera module generally includes camera lens module, base, cutoff filter, imageing sensor (sensor), electronic component and circuit board, and wherein electronic component generally comprises electric capacity and resistance, mainly plays the auxiliary effect supplementing voltage.In traditional camera modular structure, imageing sensor and electronic component are all positioned on circuit board, and are contained in the inner chamber of base.When the size of imageing sensor is very large, the placing space of electronic component will be very little, and therefore the putting position of electronic component will near the periphery of circuit board, namely electronic component from the sidewall of base intracavity distance very close to.When drawing glue on a production line, plastic pin has the risk knocking electronic component, once bump against electronic component, then can produce a lot of chip, and this chip is difficult to eliminate, and can affect image quality time serious.
Summary of the invention
Based on this, be necessary for the problems referred to above, provide a kind of striker phenomenon of can effectively avoiding to eliminate the camera module of swarf.
A kind of camera module, comprising:
Flexible PCB, the back side that there is installed surface and be oppositely arranged with described installed surface;
Ceramic substrate, be arranged on described flexible PCB by anisotropic conductive film, described ceramic substrate offers the first groove back on the middle part on the surface of described flexible PCB, the bottom of described first groove offers the second groove, and the bottom of described second groove offers through hole or the 3rd groove;
Electronic component, is contained in described through hole or the 3rd groove, and is electrically connected with described flexible PCB;
Imageing sensor, is arranged at the bottom of described second groove, and is electrically connected with described flexible PCB;
Filter, is arranged at the bottom of described first groove; And
Camera lens module, is arranged on the surface of described ceramic substrate back on described flexible PCB.
Wherein in an embodiment, when through hole is offered in the bottom of described second groove, the lower surface of described electronic component is arranged on described flexible PCB by anisotropic conductive film.
Wherein in an embodiment, the fill gaps between described electronic component and described imageing sensor has viscose glue.
Wherein in an embodiment, the sidewall of described second groove is formed with step, the non-photo-sensing district that the photosurface of described imageing sensor comprises photosensitive area and arranges around described photosensitive area, described non-photo-sensing district is provided with multiple spaced first weld pad, described step is provided with the second weld pad with the relative light of described first weld pad, be connected with described first weld pad and the second weld pad respectively by the two ends of conductor wire and realize the electrical connection of described imageing sensor and described flexible PCB, the photosurface of described imageing sensor flushes setting with the table top of described step.
Wherein in an embodiment, when the bottom of described second groove offers the 3rd groove, described electronic component is arranged at the bottom of described 3rd groove, and the fill gaps between described electronic component and described imageing sensor has viscose glue.
Wherein in an embodiment, the quantity of the 3rd groove is multiple, and multiple described 3rd groove is spaced apart, and the height of sidewall between adjacent two the 3rd grooves is greater than the height of described electronic component.
Wherein in an embodiment, the non-photo-sensing district that the photosurface of described imageing sensor comprises photosensitive area and arranges around described photosensitive area, described non-photo-sensing district is provided with multiple spaced first weld pad, the bottom of described second groove is provided with second weld pad corresponding with described first weld pad, and being connected with described first weld pad and the second weld pad respectively by the two ends of conductor wire realizes the electrical connection of described imageing sensor and described flexible PCB.
Wherein in an embodiment, the elongated end that described flexible PCB comprises body and has the side of body to extend to form, described ceramic substrate is arranged on described body, and the elongated end of described flexible PCB is provided with connector.
Wherein in an embodiment, described camera lens module comprises camera lens support component and camera lens, and described lens assembling is in described camera lens support component.
Wherein in an embodiment, described camera lens support component is a plastics microscope base, a voice coil motor or a MEMS (micro electro mechanical system).
Above-mentioned camera module at least has the following advantages:
Because electronic component is contained in through hole or the 3rd groove, and to draw glue be on the surface of ceramic substrate back on flexible PCB, so can effectively avoid electronic component to be knocked by plastic pin when production line drawing glue, thus effectively avoid producing chip, improve the image quality of camera module.Simultaneously, because above-mentioned camera module is compared to traditional camera module, eliminate base, and directly ceramic substrate is sintered into the structure with the first groove, the second groove and the 3rd groove or through hole, imageing sensor is arranged at the bottom of the second groove, filter is arranged at the bottom of the first groove, therefore effectively can reduce the total height of camera module.In addition, above-mentioned camera module to draw on ceramic substrate after glue can directly by lens module group assembling on ceramic substrate, eliminate the process of assembling after once drawing glue, effectively can improve the evenness of camera module.
Accompanying drawing explanation
Fig. 1 is the cutaway view of camera module in an execution mode;
Fig. 2 is the cutaway view of camera module in another execution mode;
Fig. 3 is the partial schematic diagram of ceramic substrate and electronic component in another execution mode.
Embodiment
For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.Set forth a lot of detail in the following description so that fully understand the present invention.But the present invention can be much different from alternate manner described here to implement, those skilled in the art can when without prejudice to doing similar improvement when intension of the present invention, therefore the present invention is by the restriction of following public concrete enforcement.
Term as used herein " vertical ", " level ", "left", "right" and similar statement just for illustrative purposes, do not represent it is unique execution mode.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of term used in the description of the invention herein just in order to describe specific embodiment, is not intended to be restriction the present invention.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
Referring to Fig. 1, is camera module 100 in an execution mode.This camera module 100 comprises flexible PCB 110, ceramic substrate 120, electronic component 130, imageing sensor 140, filter 150, camera lens module 160 and connector 170.
The back side 112 that flexible PCB 110 has installed surface 111 and is oppositely arranged with installed surface 111.In the present embodiment, ceramic substrate 120, electronic component 130, imageing sensor 140, filter 150, camera lens module 160 and connector 170 are all positioned at the same side of installed surface 111.The elongated end that flexible PCB 110 comprises body and extends to form from the side of body, ceramic substrate 120 is arranged on body, and connector 170 is arranged at elongated end.
Ceramic substrate 120 is by anisotropic conductive film 180 (Anisotropic Conductive Film; ACF) be arranged on flexible PCB 110.The bottom that ceramic substrate 120 offers the second groove 122, second groove 122 back on the bottom that the middle part on the surface of flexible PCB 110 offers the first groove 121, first groove 121 offers through hole 123.The size of the first groove 121 is greater than the size of the second groove 122, and the size of the second groove 122 is greater than the size of through hole 123.
Electronic component 130 is contained in through hole 123, and the lower surface of electronic component 130 is directly electrically connected with flexible PCB 110 by anisotropic conductive film 180.Electronic component 130 is electric capacity and resistance mainly.
Imageing sensor 140 is arranged at the bottom of the second groove 122, and institute's image taking sensor 140 covers through hole 123, and the fill gaps between electronic component 130 and imageing sensor 140 has viscose glue 190.Viscose glue 190 is the non-conductive glue of insulation.Imageing sensor 140 is electrically connected with flexible PCB 110.Particularly, the sidewall of the second groove 122 is formed with step 1221, the photosurface of imageing sensor 140 comprises photosensitive area and the non-photo-sensing district around photosensitive area setting.Non-photo-sensing district is provided with multiple spaced first weld pad, step 1221 is provided with second weld pad corresponding with the first weld pad, being connected with the first weld pad and the second weld pad respectively by the two ends of conductor wire 124 realizes the electrical connection of imageing sensor 140 and flexible PCB 110.Conductor wire 124 can be gold thread, and certainly, in other embodiments, conductor wire 124 can also be the good metal wire of other electric conductivity.Preferably, the photosurface of imageing sensor 140 flushes setting with the table top of step 1221, and the distance of beating conductor wire shortens, and can reduce costs.
Filter 150 is arranged at the bottom of the first groove 121.Because the size of the first groove 121 is greater than the size of the second groove 122, when therefore filter 150 is arranged at the bottom of the first groove 121, filter 150 covers the second groove 122.Filter 150 can be cutoff filter particularly.
Camera lens module 160 is arranged on the surface of ceramic substrate 120 back on flexible PCB 110.Particularly, the mode can drawing glue by plastic pin draws glue on the surface of ceramic substrate 120 back on flexible PCB 110, then camera lens module 160 is attached at this and can completes assembling on the surface.Camera lens module 160 comprises camera lens support component 161 and camera lens 162, and camera lens 162 is assembled in camera lens support component 161.Particularly, camera lens support component 161 can be a plastics microscope base, a voice coil motor or a MEMS (micro electro mechanical system).
Above-mentioned camera module 100 at least has the following advantages:
Because electronic component 130 is contained in through hole 123, and to draw glue be on the surface of ceramic substrate 120 back on flexible PCB 110, so can effectively avoid electronic component 130 to be knocked by plastic pin when production line drawing glue, thus effectively avoid producing chip, improve the image quality of camera module 100.Simultaneously, because above-mentioned camera module 100 is compared to traditional camera module 100, eliminate base, and directly ceramic substrate 120 is sintered into the structure with the first groove 121, second groove 122 and through hole 123, imageing sensor 140 is arranged at the bottom of the second groove 122, filter 150 is arranged at the bottom of the first groove 121, therefore effectively can reduce the total height of camera module 100.In addition, directly camera lens module 160 can be assembled on ceramic substrate 120 after above-mentioned camera module 100 draws glue on ceramic substrate 120, eliminate the process of assembling after once drawing glue, effectively can improve the evenness of camera module 100.
Referring to Fig. 2, is the camera module 200 in another execution mode.This camera module 200 comprises flexible PCB 210, ceramic substrate 220, electronic component 230, imageing sensor 240, filter 250, camera lens module 260 and connector 270.
The back side 212 that flexible PCB 210 has installed surface 211 and is oppositely arranged with installed surface 211.In the present embodiment, ceramic substrate 220, electronic component 230, imageing sensor 240, filter 250, camera lens module 260 and connector 270 are all positioned at the same side of installed surface 211.The elongated end that flexible PCB 210 comprises body and extends to form from the side of body, ceramic substrate 220 is arranged on body, and connector 270 is arranged at elongated end.
Ceramic substrate 220 is by anisotropic conductive film 280 (Anisotropic Conductive Film; ACF) be arranged on flexible PCB 210.The bottom that ceramic substrate 220 offers the second groove 222, second groove 222 back on the bottom that the middle part on the surface of flexible PCB 210 offers the first groove 221, first groove 221 offers the 3rd groove 223.The size of the first groove 221 is greater than the size of the second groove 222, and the size of the second groove 222 is greater than the size of the 3rd groove 223.
Electronic component 230 is contained in the 3rd groove 223, and is electrically connected with flexible PCB 210.Such as, by connecting up in the 3rd groove 223, electronic component 230 can be electrically connected with flexible PCB 210.Or, offer through hole (not shown) in the bottom of the 3rd groove 223, go between to electronic component 230 from flexible PCB 210, realize the electrical connection of electronic component 230 and flexible PCB 210.Particularly, electronic component 230 is arranged at the bottom of the 3rd groove 223, and the fill gaps between electronic component 230 and imageing sensor 240 has viscose glue 290.The quantity of the 3rd groove 223 is multiple, and multiple 3rd groove 223 is spaced apart, and the height of sidewall between adjacent two the 3rd grooves 223 is greater than the height of electronic component 230, and this sidewall may be used for supporting imageing sensor 240.Refer to Fig. 3, in other execution mode, the quantity of the 3rd groove 223 can also be one, and electronic component 230 is contained in the 3rd groove 223.
Imageing sensor 240 is arranged at the bottom of the second groove 222, and institute's image taking sensor 240 covers the 3rd groove 223, and the fill gaps between electronic component 230 and imageing sensor 240 has viscose glue 290.Viscose glue 290 is the non-conductive glue of insulation.Imageing sensor 240 is electrically connected with flexible PCB 210.Particularly, the photosurface of imageing sensor 240 comprises photosensitive area and the non-photo-sensing district around photosensitive area setting, non-photo-sensing district is provided with multiple spaced first weld pad, the bottom part ring of the second groove 222 is provided with second weld pad corresponding with the first weld pad around the surrounding of imageing sensor 240, and being connected with the first weld pad and the second weld pad respectively by the two ends of conductor wire 224 realizes the electrical connection of imageing sensor 240 and flexible PCB 210.Particularly, conductor wire 224 can be gold thread, certainly, can also be the good metal wire of other electric conductivities.
Filter 250 is arranged at the bottom of the first groove 221.Because the size of the first groove 221 is greater than the size of the second groove 222, when therefore filter 250 is arranged at the bottom of the first groove 221, filter 250 covers the second groove 222.Filter 250 can be cutoff filter particularly.
Camera lens module 260 is arranged on the surface of ceramic substrate 220 back on flexible PCB 210.Particularly, the mode can drawing glue by plastic pin draws glue on the surface of ceramic substrate 220 back on flexible PCB 210, then camera lens module 260 is attached at this and can completes assembling on the surface.Camera lens module 260 comprises camera lens support component 261 and camera lens 262, and camera lens 262 is assembled in camera lens support component 261.Particularly, camera lens support component 261 can be a plastics microscope base, a voice coil motor or a MEMS (micro electro mechanical system).
Above-mentioned camera module 200 at least has the following advantages:
Because electronic component 230 is contained in the 3rd groove 223, and to draw glue be on the surface of ceramic substrate 220 back on flexible PCB 210, so can effectively avoid electronic component 230 to be knocked by plastic pin when production line drawing glue, thus effectively avoid producing chip, improve the image quality of camera module 200.Simultaneously, because above-mentioned camera module 200 is compared to traditional camera module 200, eliminate base, and directly ceramic substrate 220 is sintered into the structure with the first groove 221, second groove 222 and the 3rd groove 223, imageing sensor 240 is arranged at the bottom of the second groove 222, filter 250 is arranged at the bottom of the first groove 221, therefore effectively can reduce the total height of camera module 200.In addition, directly camera lens module 260 can be assembled on ceramic substrate 220 after above-mentioned camera module 200 draws glue on ceramic substrate 220, eliminate the process of assembling after once drawing glue, effectively can improve the evenness of camera module 200.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a camera module, is characterized in that, comprising:
Flexible PCB, the back side that there is installed surface and be oppositely arranged with described installed surface;
Ceramic substrate, be arranged on described flexible PCB by anisotropic conductive film, described ceramic substrate offers the first groove back on the middle part on the surface of described flexible PCB, the bottom of described first groove offers the second groove, and the bottom of described second groove offers through hole or the 3rd groove;
Electronic component, is contained in described through hole or the 3rd groove, and is electrically connected with described flexible PCB;
Imageing sensor, is arranged at the bottom of described second groove, and is electrically connected with described flexible PCB;
Filter, is arranged at the bottom of described first groove; And
Camera lens module, is arranged on the surface of described ceramic substrate back on described flexible PCB.
2. camera module according to claim 1, is characterized in that, when through hole is offered in the bottom of described second groove, the lower surface of described electronic component is arranged on described flexible PCB by anisotropic conductive film.
3. camera module according to claim 2, is characterized in that, the fill gaps between described electronic component and described imageing sensor has viscose glue.
4. camera module according to claim 2, it is characterized in that, the sidewall of described second groove is formed with step, the non-photo-sensing district that the photosurface of described imageing sensor comprises photosensitive area and arranges around described photosensitive area, described non-photo-sensing district is provided with multiple spaced first weld pad, described step is provided with second weld pad corresponding with described first weld pad, be connected with described first weld pad and the second weld pad respectively by the two ends of conductor wire and realize the electrical connection of described imageing sensor and described flexible PCB, the photosurface of described imageing sensor flushes setting with the table top of described step.
5. camera module according to claim 1, it is characterized in that, when the bottom of described second groove offers the 3rd groove, described electronic component is arranged at the bottom of described 3rd groove, and the fill gaps between described electronic component and described imageing sensor has viscose glue.
6. camera module according to claim 5, is characterized in that, the quantity of the 3rd groove is multiple, and multiple described 3rd groove is spaced apart, and the height of sidewall between adjacent two the 3rd grooves is greater than the height of described electronic component.
7. camera module according to claim 5, it is characterized in that, the non-photo-sensing district that the photosurface of described imageing sensor comprises photosensitive area and arranges around described photosensitive area, described non-photo-sensing district is provided with multiple spaced first weld pad, the bottom of described second groove is provided with second weld pad corresponding with described first weld pad, and being connected with described first weld pad and the second weld pad respectively by the two ends of conductor wire realizes the electrical connection of described imageing sensor and described flexible PCB.
8. camera module according to claim 1, it is characterized in that, the elongated end that described flexible PCB comprises body and has the side of body to extend to form, described ceramic substrate is arranged on described body, and the elongated end of described flexible PCB is provided with connector.
9. camera module according to claim 1, is characterized in that, described camera lens module comprises camera lens support component and camera lens, and described lens assembling is in described camera lens support component.
10. camera module according to claim 9, is characterized in that, described camera lens support component is a plastics microscope base, a voice coil motor or a MEMS (micro electro mechanical system).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510104496.1A CN104767916A (en) | 2015-03-10 | 2015-03-10 | Camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510104496.1A CN104767916A (en) | 2015-03-10 | 2015-03-10 | Camera module |
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| CN104767916A true CN104767916A (en) | 2015-07-08 |
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| CN201510104496.1A Pending CN104767916A (en) | 2015-03-10 | 2015-03-10 | Camera module |
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Cited By (9)
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| CN105635547A (en) * | 2016-03-21 | 2016-06-01 | 信利光电股份有限公司 | Camera module and electronic device |
| CN109040621A (en) * | 2018-09-20 | 2018-12-18 | 武汉高德智感科技有限公司 | A kind of infrared mould group with reinforcement heat sinking function |
| WO2019029332A1 (en) * | 2017-08-07 | 2019-02-14 | 宁波舜宇光电信息有限公司 | Camera module and manufacturing method therefor, and corresponding intelligent terminal |
| CN109905584A (en) * | 2019-03-28 | 2019-06-18 | 昆山丘钛微电子科技有限公司 | Camera module and terminal |
| CN110445957A (en) * | 2018-05-03 | 2019-11-12 | 鹏鼎控股(深圳)股份有限公司 | The electronic device of camera mould group and the application camera mould group |
| CN111131684A (en) * | 2020-01-15 | 2020-05-08 | 昆山丘钛微电子科技有限公司 | Lens, camera module and manufacturing method of camera module |
| CN111405156A (en) * | 2020-03-20 | 2020-07-10 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN111970421A (en) * | 2020-08-17 | 2020-11-20 | Oppo（重庆）智能科技有限公司 | Camera motor, camera module and electronic device |
| CN112449082A (en) * | 2019-08-15 | 2021-03-05 | 宁波舜宇光电信息有限公司 | Preparation method of photosensitive assembly, photosensitive assembly and camera module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105635547A (en) * | 2016-03-21 | 2016-06-01 | 信利光电股份有限公司 | Camera module and electronic device |
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| CN109905584A (en) * | 2019-03-28 | 2019-06-18 | 昆山丘钛微电子科技有限公司 | Camera module and terminal |
| CN112449082A (en) * | 2019-08-15 | 2021-03-05 | 宁波舜宇光电信息有限公司 | Preparation method of photosensitive assembly, photosensitive assembly and camera module |
| CN112449082B (en) * | 2019-08-15 | 2024-10-29 | 宁波舜宇光电信息有限公司 | Preparation method of photosensitive assembly, photosensitive assembly and camera module |
| CN111131684A (en) * | 2020-01-15 | 2020-05-08 | 昆山丘钛微电子科技有限公司 | Lens, camera module and manufacturing method of camera module |
| CN111405156A (en) * | 2020-03-20 | 2020-07-10 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN111970421A (en) * | 2020-08-17 | 2020-11-20 | Oppo（重庆）智能科技有限公司 | Camera motor, camera module and electronic device |
| CN111970421B (en) * | 2020-08-17 | 2022-03-22 | Oppo广东移动通信有限公司 | Camera motor, camera module and electronic device |
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Application publication date: 20150708 |