CN104492764A - Wafer cleaning system - Google Patents
Wafer cleaning system Download PDFInfo
- Publication number
- CN104492764A CN104492764A CN201410821743.5A CN201410821743A CN104492764A CN 104492764 A CN104492764 A CN 104492764A CN 201410821743 A CN201410821743 A CN 201410821743A CN 104492764 A CN104492764 A CN 104492764A
- Authority
- CN
- China
- Prior art keywords
- wafer
- cleaning system
- rotary pawl
- whirligig
- interior rotary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
- B08B5/023—Cleaning travelling work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a wafer cleaning system, and belongs to the technical field of semiconductors. The wafer cleaning system adopts the following technical scheme: the wafer cleaning system is characterized by comprising a wafer liquid spraying device, a wafer rotating device and a wafer blower device, wherein the wafer liquid spraying device is arranged above the wafer rotating device; the wafer blower device is arranged on one side of the wafer rotating device. By driving a wafer to rotate in the horizontal direction and in the vertical direction, an air blower is adopted to blow a cleaning solution sprayed on the wafer to wash off metal filings, and the effect of completely cleaning up the wafer is realized.
Description
Technical field
The present invention relates to a kind of wafer cleaning system, belong to technical field of semiconductors.
Background technology
In semiconductor fabrication process, the cleannes of crystal column surface are the key factors affecting semiconductor device reliability.Therefore, cleaning is wherein most important and one of technique the most frequently.In conventional semiconductor technology, such as: deposition, plasma etching, spin coating photoresist, photoetching, plating etc., all likely can introduce at crystal column surface and pollute and/or particle, cause the cleannes of crystal column surface to decline, make the semiconductor devices yield of manufacture low.In general, in the whole manufacturing process of semiconductor devices, the processing step up to 20% is cleaning.
Crystal column surface has the pollution of four large common types: subparticle; Organic remains; Inorganic residues; Need the oxide layer removed.The object of wafer cleaning is in order to the oxide layer removing the organic compound be attached on crystal column surface, metal impurities or subparticle, needs are removed, avoid micro ion and metal impurities to the pollution of semiconductor devices, thus improve performance and the qualification rate of semiconductor devices.
To sum up, need badly and a kind of new wafer cleaning device is provided, do not clean up to solve wafer, and then affect subsequent handling, produce cross pollution, the problem that product yield is low.
Summary of the invention
For solving the problems of the technologies described above, overcoming the deficiency that prior art exists, the invention provides a kind of wafer cleaning system.The present invention adopts following technical scheme: a kind of wafer cleaning system, it is characterized in that, comprise wafer liquid-jet device, wafer whirligig, wafer air-blast device, described wafer liquid-jet device arranges the top with described wafer whirligig, and described wafer air-blast device is arranged at the side of described wafer whirligig.
Preferably, described wafer liquid-jet device comprises sparge pipe, is provided with cleaning fluid in described sparge pipe.
Preferably, described wafer whirligig comprises horizontal rotating table, pedestal, interior rotary pawl, wafer, described pedestal is fixedly installed on described horizontal rotating table, and described interior rotary pawl is arranged at the inner side of described pedestal, and described interior rotary pawl and described wafer fit tightly.
Preferably, described interior rotary pawl is provided with draw-in groove, and described draw-in groove matches with the size of described wafer.
Preferably, described base interior is provided with driver, and described driver is connected with described interior rotary pawl; In driver drives, rotary pawl rotates in the horizontal direction, thus drives wafer to rotate thereupon.
Preferably, described horizontal rotating table lower end is provided with CD-ROM drive motor, is used for driving horizontal rotating table vertically to rotate, and band moving base and wafer rotate thereupon.
Preferably, described wafer air-blast device comprises air blast, is used for the metal fillings blown off on wafer.
The beneficial effect that the present invention reaches: by driving wafer to rotate along level and vertical both direction, the cleaning fluid that blower blows is sprayed onto on wafer washes metal fillings, thus is thoroughly cleaned up by wafer.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
The implication marked in figure: 1-sparge pipe, 2-cleaning fluid, 3-pedestal, rotary pawl in 4-, 5-wafer, 6-air blast, 7-horizontal rotating table, 8-CD-ROM drive motor.
Detailed description of the invention
Below in conjunction with accompanying drawing, the invention will be further described.Following examples only for technical scheme of the present invention is clearly described, and can not limit the scope of the invention with this.
As shown in Figure 1 be structural representation of the present invention, the invention provides a kind of wafer cleaning system, comprise wafer liquid-jet device, wafer whirligig, wafer air-blast device, described wafer liquid-jet device arranges the top with described wafer whirligig, and described wafer air-blast device is arranged at the side of described wafer whirligig.
Preferably, wafer liquid-jet device comprises sparge pipe 1, is provided with cleaning fluid 2 in sparge pipe 1.
Preferably, wafer whirligig comprises horizontal rotating table 7, pedestal 3, interior rotary pawl 4, wafer 5, and pedestal 3 is fixedly installed on horizontal rotating table 7, and interior rotary pawl 4 is arranged at the inner side of pedestal 3, and interior rotary pawl 4 fits tightly with wafer 5.
Preferably, interior rotary pawl 4 is provided with draw-in groove, and draw-in groove matches with the size of wafer 5.
Preferably, pedestal 3 inside is provided with driver, and driver is connected with interior rotary pawl 4; In driver drives, rotary pawl 4 rotates in the horizontal direction, thus drives wafer 5 to rotate thereupon.
Preferably, horizontal rotating table 7 lower end is provided with CD-ROM drive motor 8; CD-ROM drive motor 8 is used for driving horizontal rotating table 7 vertically to rotate, and band moving base 3 and wafer 5 rotate thereupon.
Preferably, wafer air-blast device comprises air blast 6, is used for blowing the metal fillings on wafer 5 off.
The present invention rotates along level and vertical both direction by driving wafer, and the cleaning fluid that blower blows is sprayed onto on wafer washes metal fillings, thus is thoroughly cleaned up by wafer.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the technology of the present invention principle; can also make some improvement and distortion, these improve and distortion also should be considered as protection scope of the present invention.
Claims (7)
1. a wafer cleaning system, it is characterized in that, comprise wafer liquid-jet device, wafer whirligig, wafer air-blast device, described wafer liquid-jet device arranges the top with described wafer whirligig, and described wafer air-blast device is arranged at the side of described wafer whirligig.
2. a kind of wafer cleaning system according to claim 1, is characterized in that, described wafer liquid-jet device comprises sparge pipe, is provided with cleaning fluid in described sparge pipe.
3. a kind of wafer cleaning system according to claim 1, it is characterized in that, described wafer whirligig comprises horizontal rotating table, pedestal, interior rotary pawl, wafer, described pedestal is fixedly installed on described horizontal rotating table, described interior rotary pawl is arranged at the inner side of described pedestal, and described interior rotary pawl and described wafer fit tightly.
4. a kind of wafer cleaning system according to claim 3, is characterized in that, described interior rotary pawl is provided with draw-in groove, and described draw-in groove matches with the size of described wafer.
5. a kind of wafer cleaning system according to claim 4, it is characterized in that, described base interior is provided with driver, and described driver is connected with described interior rotary pawl.
6. a kind of wafer cleaning system according to claim 5, is characterized in that, described horizontal rotating table lower end is provided with CD-ROM drive motor.
7. a kind of wafer cleaning system according to claim 1, is characterized in that, described wafer air-blast device comprises air blast.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410821743.5A CN104492764A (en) | 2014-12-26 | 2014-12-26 | Wafer cleaning system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410821743.5A CN104492764A (en) | 2014-12-26 | 2014-12-26 | Wafer cleaning system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104492764A true CN104492764A (en) | 2015-04-08 |
Family
ID=52934265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410821743.5A Pending CN104492764A (en) | 2014-12-26 | 2014-12-26 | Wafer cleaning system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104492764A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080127508A1 (en) * | 2006-11-21 | 2008-06-05 | Hiroki Ohno | Substrate processing apparatus and substrate processing method |
| JP2009260094A (en) * | 2008-04-18 | 2009-11-05 | Disco Abrasive Syst Ltd | Spinner cleaning device and working device |
| CN102226867A (en) * | 2011-05-26 | 2011-10-26 | 常州瑞择微电子科技有限公司 | Clamping apparatus for flushing photomask |
| CN103311156A (en) * | 2012-03-09 | 2013-09-18 | 东京毅力科创株式会社 | Liquid processing apparatus |
| CN204503678U (en) * | 2014-12-26 | 2015-07-29 | 苏州凯锝微电子有限公司 | A kind of wafer cleaning system |
-
2014
- 2014-12-26 CN CN201410821743.5A patent/CN104492764A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080127508A1 (en) * | 2006-11-21 | 2008-06-05 | Hiroki Ohno | Substrate processing apparatus and substrate processing method |
| JP2009260094A (en) * | 2008-04-18 | 2009-11-05 | Disco Abrasive Syst Ltd | Spinner cleaning device and working device |
| CN102226867A (en) * | 2011-05-26 | 2011-10-26 | 常州瑞择微电子科技有限公司 | Clamping apparatus for flushing photomask |
| CN103311156A (en) * | 2012-03-09 | 2013-09-18 | 东京毅力科创株式会社 | Liquid processing apparatus |
| CN204503678U (en) * | 2014-12-26 | 2015-07-29 | 苏州凯锝微电子有限公司 | A kind of wafer cleaning system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150408 |
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| RJ01 | Rejection of invention patent application after publication |