CN104439751A - Novel low-melting-point lead-free solder - Google Patents
Novel low-melting-point lead-free solder Download PDFInfo
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- CN104439751A CN104439751A CN201410817065.5A CN201410817065A CN104439751A CN 104439751 A CN104439751 A CN 104439751A CN 201410817065 A CN201410817065 A CN 201410817065A CN 104439751 A CN104439751 A CN 104439751A
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- solder
- novel low
- melting
- free solder
- point lead
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses novel low-melting-point lead-free solder. The chemical material of the novel low-melting-point lead-free solder comprises, by mass, 0.3-3.5% of Ag, 0.3-.7% of Cu, 0.8-6.0% of Bi, 0.1-0.6% of Ni, 0.01-0.15% of rare earth metal, and the balance Sn. The novel low-melting-point lead-free solder is low in cost and has wet property, welding spot reliability, spreading property and heat shock resistance and other excellent performance. Above all, the novel low-melting-point lead-free solder is low in melting point, the difficulty of reflow soldering can be reduced, the novel low-melting-point lead-free solder is particularly suitable for the development tendency of light, thin, short and minimized electronic products currently, and energy conservation, emission reduction and energy consumption reduction are facilitated.
Description
Technical field
The present invention relates to solder, particularly relate to the novel low-melting point leadless solder of a kind of applicable wave-soldering and Reflow Soldering.This solder is not leaded, and fusing point is low, while minimizing welding energy, also meets the requirement of the welding performance of high-performance solder requirement, mechanical performance, electric property etc.
Background technology
Conventional solder is in the past tin lead system solder, because fusing point is low, solderability is excellent, and with low cost, be widely used in the past.Along with developing rapidly of electronic technology, the time that electronic product updates day by day shortens, thus produces a large amount of Electronic Wastes.From being disassembled the printed circuit board (PCB) removed the electronic product that abandons, be usually embedded in underground by chopping.If rainwater penetrates into the end, ground, touch by the electronic circuit board buried, the lead in tin-lead solder will be separated with ionic condition, enters river, lake etc., polluted source.If drunk for a long time containing plumbous water, lead will deposit in vivo, finally causes lead poisoning.Therefore, the U.S., Japan, European Union and China have successively promulgated the plumbous decree of taboo, forbid using in electronic product have kupper solder.So, need to greatly develop not containing plumbous solder, i.e. lead-free solder.
Current industry compares lead-free solder mainly Sn-Ag-Cu system and the Sn-Bi system of accreditation, especially with the former for representative.Because Sn-Ag-Cu serial alloy welding material easily obtains, technical problem is less, and good with the compatibility of conventional solder, the reliability of solder joint is high.But it is unpractical that application Sn-Ag-Cu serial alloy welding material replaces tin lead system solder completely, and removing cost factor, most importantly the fusing point of Sn-Ag-Cu system solder is higher than tin lead system solder, causes welding temperature to rise.
For wave-soldering, manage tin bath and reactiveness, guaranteed that the wetability of solder is just passable; But in Reflow Soldering, solder melt point rises huge on the impact of welding technological temperature.Suppose that the confined assembling temperature upper limit of components and parts is 260 DEG C, fusing point due to Sn-Ag-Cu system eutectic solder is 217 DEG C, the fusing point of Sn-Pb system eutectic solder is 183 DEG C, therefore the packaging technology setting of Sn-Ag-Cu system solder is narrower by 44% than traditional Sn-Pb system solder, means and uses Sn-Ag-Cu series lead-free solder alloy to propose challenge to a series of systematized engineerings such as the heat resistances of welding equipment, electronic devices and components and baseplate material.Along with light, thin, short, the littleization development trend of electronic product, the application percentage of Reflow Soldering welding improves day by day, uses the challenge of Sn-Ag-Cu series lead-free solder to become severeer.Meanwhile, the high energy consumption of lead-free solder welding process can cause being discharged into atmospheric carbon dioxide levels to be increased, and aggravation greenhouse effects, cause a series of environmental disruption.
In sum, the fusing point problem reducing lead-free solder becomes outstanding, and the research and development of novel low-melting point leadless solder need to be brought into schedule.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of novel low-melting point leadless solder, solves current lead-free solder fusing point higher, and during Reflow Soldering, difficulty is comparatively large, is not suitable for light, thin, short, the littleization development trend of electronic product, and the problem that energy consumption is higher.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
Novel low-melting point leadless solder, is characterized in that, the mass percent of the chemical composition of described novel low-melting point leadless solder is: the Ag of 0.3-3.5%, the Ni of the Bi of the Cu of 0.3-0.7%, 0.8-6.0%, 0.1-0.6%, the rare earth metal of 0.01%-0.15%, surplus is Sn.
In preferred technical scheme, the mass percent of Ag is 0.5-3.0%.
In preferred technical scheme, the mass percent of Cu is 0.4-0.6%.
In preferred technical scheme, the mass percent of Bi is 1.0-5.0%.
In preferred technical scheme, the mass percent of Ni is 0.3-0.6%.
In preferred technical scheme, described rare earth metal is the norium comprising Re and Ce.
Further in preferred technical scheme, the mass percent of described norium is 0.04-0.1%.
The invention has the beneficial effects as follows:
The novel low-melting point leadless solder that have employed technical solution of the present invention is not only with low cost, there is the performance that wetability, welding spot reliability, spreadability, thermal-shock resistance etc. are excellent, most importantly fusing point is lower, the difficulty of Reflow Soldering can not only be reduced like this, very applicable current electronic product is light, thin, short, littleization development trend, and is conducive to energy-saving and emission-reduction, reduction energy consumption.
The present invention is described in further detail below.
Detailed description of the invention
The novel low-melting point leadless solder of the one that this detailed description of the invention provides, the mass percent of its chemical composition is: the rare earth metal of the Ni of the Bi of the Cu of the Ag of 0.3-3.5%, 0.3-0.7%, 0.8-6.0%, 0.1-0.6%, 0.01%-0.15%, and surplus is Sn.
We find, Addition ofelements Bi in Sn-Ag-Cu series lead-free solder, can reduce the fusing point of solder, reduce surface tension; Meanwhile, Bi adds the reaction speed that also slow down Sn and Cu, makes the wetability of solder become better.But use Bi a large amount of in the alloy, the mechanical impact of alloy is comparatively large, easily produces inclined tin, makes the boundary layer of alloy unstable, finally causes the less reliable of solder joint.Therefore, the Bi content in alloy can not be too high, and 0.8-6.0% is a proper ratio, and in preferred technical scheme, 1.0-5.0% is a more suitable ratio.
In addition we also find, add the norium of Re and the Ce composition of a small amount of Ni and trace, can improve the mechanical property of solder: the plasticity of Ni is strong, adds the hot strength that a small amount of Ni can improve solder in Sn-Ag-Cu series lead-free solder; The norium of Re and Ce composition promotes to make the forming core in solder solidification process solder microstructure homogenization, reach the requirement improving solder mechanical property.But, in metal, Ni content adds the performance that membership affects the norium performance of Re and Ce composition, therefore, in alloy, the content of Ni is that 0.1-0.6% is comparatively suitable, and preferred content is 0.3-0.6%, the content of Re and Ce is that 0.01%-0.15% is comparatively suitable, and preferred content is 0.04-0.1%.
The novel low-melting point leadless solder that have employed specific embodiment of the invention technical scheme is not only with low cost, there is the performance that wetability, welding spot reliability, spreadability, thermal-shock resistance etc. are excellent, most importantly fusing point is lower, the difficulty of Reflow Soldering can not only be reduced like this, very applicable current electronic product is light, thin, short, littleization development trend, and is conducive to energy-saving and emission-reduction, reduction energy consumption.
In preferred technical scheme, the mass percent of Ag is 0.5-3.0%.
In preferred technical scheme, the mass percent of Cu is 0.4-0.6%.
We also to the welding effect of various new low-melting point leadless solder sample, are assessed by Performance Detection, are specially:
Each composition of novel low-melting point leadless solder is dissolved in the tin melting furnace of 300 DEG C, is incubated one hour, constantly stirs, make each component mix, cool, then test its performance.
In the present invention, the composition of solder is as shown in table 1, and table 2 is comparative examples of solder.
Table 1: the alloy composition of solder and fusing point thereof
Table 2: the alloy composition of comparative example solder and fusing point
In table 1 and table 2, the fusing point method of testing of listed novel low-melting point leadless solder is as described below: the solidus and the liquidus curve that use differential scanning instrument determination experiment solder used, and the weight of test sample is 15 grams, and heating rate is 5 DEG C/s.Consider electronic devices and components and the printed circuit board (PCB) heat resistance in welding process, the ceiling temperature of liquidus curve is set to 245 DEG C; Meanwhile, in order to not reduce the bond strength of solder joint, the temperature of solidus is set to 165 DEG C.
The wetability test of selected solder: method of testing is as described below, and the wetability experimental result of each solder is as shown in table 3.
Use the wetability of SAT-5100 Weldability detector test solder, immersion depth 2mm, impregnating speed 5mm/s, dip time 10s.
Spreadability is tested: test sprawling of solder according to Japanese Industrial Standards JIS-Z3197, experimental result is as described in Table 3.
Heat shock resistance is tested: repeated stock solder joint 1h between-40 DEG C-80 DEG C, and number of shocks when record solder joint destroys, experimental result is as shown in table 3.
Table 3: the performance test results of solder
| Wetting power/mN | Spreading ratio/% | Heat shock resistance number of times |
| Example 1 | 0.32 | 82.7 | 800 |
| Example 2 | 0.31 | 82.5 | 800 |
| Example 3 | 0.34 | 84.1 | 1000 |
| Example 4 | 0.36 | 83.4 | 900 |
| Example 5 | 0.35 | 83.1 | 1100 |
| Example 6 | 0.28 | 84.2 | 1000 |
| Example 7 | 0.30 | 83.6 | 900 |
| Example 8 | 0.34 | 84.1 | 1300 |
| Example 9 | 0.35 | 85.3 | 1100 |
| Example 10 | 0.31 | 83.2 | 1200 |
| Example 11 | 0.34 | 82.1 | 1000 |
| Example 12 | 0.27 | 83.5 | 1000 |
| Example 13 | 0.32 | 82.4 | 1300 |
| Example 14 | 0.38 | 84.7 | 1500 |
| Example 15 | 0.35 | 85.2 | 900 |
| Example 16 | 0.37 | 82.6 | 1100 |
| Example 17 | 0.31 | 83.5 | 1000 |
| Example 18 | 0.35 | 84.6 | 1300 |
| Example 19 | 0.34 | 83.5 | 1500 |
| Example 20 | 0.36 | 84.3 | 1200 |
| Comparative example 1 | 0.32 | 82.6 | 800 |
| Comparative example 2 | 0.31 | 83.5 | 900 |
| Comparative example 3 | 0.33 | 83.9 | 1000 |
| Comparative example 4 | 0.33 | 82.6 | 600 |
Can be known by table 1,2,3, the norium of Re and the Ce composition of appropriate Bi and a small amount of Ni and trace is added in Sn-Ag-Cu series lead-free solder, the fusing point of the novel low-melting point leadless solder obtained obviously reduces, the test performances such as spreading ratio, wetability, thermal-shock resistance are good, can be applied in the lower wave-soldering of temperature and Reflow Soldering welding.
Above content is in conjunction with concrete preferred embodiment further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, some simple deduction or replace can also be made, all should be considered as belonging to protection scope of the present invention.
Claims (7)
1. novel low-melting point leadless solder, is characterized in that, the mass percent of the chemical composition of described novel low-melting point leadless solder is: the Ag of 0.3-3.5%, the Ni of the Bi of the Cu of 0.3-0.7%, 0.8-6.0%, 0.1-0.6%, the rare earth metal of 0.01%-0.15%, surplus is Sn.
2. novel low-melting point leadless solder as claimed in claim 1, is characterized in that, the mass percent of Ag is 0.5-3.0%.
3. novel low-melting point leadless solder as claimed in claim 1, is characterized in that, the mass percent of Cu is 0.4-0.6%.
4. novel low-melting point leadless solder as claimed in claim 1, is characterized in that, the mass percent of Bi is 1.0-5.0%.
5. novel low-melting point leadless solder as claimed in claim 1, is characterized in that, the mass percent of Ni is 0.3-0.6%.
6. as the novel low-melting point leadless solder in claim 1 to 5 as described in any one, it is characterized in that, described rare earth metal is the norium comprising Re and Ce.
7. novel low-melting point leadless solder as claimed in claim 6, is characterized in that, the mass percent of described norium is 0.04-0.1%.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410817065.5A CN104439751A (en) | 2014-12-24 | 2014-12-24 | Novel low-melting-point lead-free solder |
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| CN201410817065.5A CN104439751A (en) | 2014-12-24 | 2014-12-24 | Novel low-melting-point lead-free solder |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105252164A (en) * | 2015-11-30 | 2016-01-20 | 苏州龙腾万里化工科技有限公司 | Antioxidant soldering tin bar |
| CN105290653A (en) * | 2015-11-30 | 2016-02-03 | 苏州龙腾万里化工科技有限公司 | Manufacturing method for rosin soldering tin bar |
| CN105290652A (en) * | 2015-11-30 | 2016-02-03 | 苏州龙腾万里化工科技有限公司 | Preparation method of silver-added soldering tin |
| CN105397329A (en) * | 2015-12-16 | 2016-03-16 | 仲恺农业工程学院 | Sn-Ag-Cu low-silver lead-free solder containing Nd, Re and In |
| CN108044254A (en) * | 2017-12-13 | 2018-05-18 | 柳州智臻智能机械有限公司 | A kind of electronic component welding solder alloy and preparation method thereof |
| CN109732237A (en) * | 2019-01-02 | 2019-05-10 | 昆明理工大学 | A kind of SnBiCuAgNiCe low temperature lead-free solder alloy |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105252164A (en) * | 2015-11-30 | 2016-01-20 | 苏州龙腾万里化工科技有限公司 | Antioxidant soldering tin bar |
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| CN105290652A (en) * | 2015-11-30 | 2016-02-03 | 苏州龙腾万里化工科技有限公司 | Preparation method of silver-added soldering tin |
| CN105397329A (en) * | 2015-12-16 | 2016-03-16 | 仲恺农业工程学院 | Sn-Ag-Cu low-silver lead-free solder containing Nd, Re and In |
| CN105397329B (en) * | 2015-12-16 | 2017-12-05 | 仲恺农业工程学院 | Sn-Ag-Cu low-silver lead-free solder containing Nd, Re and In |
| CN108044254A (en) * | 2017-12-13 | 2018-05-18 | 柳州智臻智能机械有限公司 | A kind of electronic component welding solder alloy and preparation method thereof |
| CN109732237A (en) * | 2019-01-02 | 2019-05-10 | 昆明理工大学 | A kind of SnBiCuAgNiCe low temperature lead-free solder alloy |
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Application publication date: 20150325 |