CN104197220B - The LED lamp of integral type - Google Patents
The LED lamp of integral type Download PDFInfo
- Publication number
- CN104197220B CN104197220B CN201410453284.XA CN201410453284A CN104197220B CN 104197220 B CN104197220 B CN 104197220B CN 201410453284 A CN201410453284 A CN 201410453284A CN 104197220 B CN104197220 B CN 104197220B
- Authority
- CN
- China
- Prior art keywords
- radiator
- led lamp
- heat
- substrate
- several
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to the LED lamp of a kind of integral type, including: radiator, several LED chip and scatter plate.Radiator includes substrate and some radiating fins, and substrate has the first relative side and the second side, and the first side is provided with installation position and fixed bit, and radiating fin is arranged on the second side；Each LED chip correspondence is installed on an installation position.Scatter plate is fixedly installed on substrate by each fixed bit.The LED lamp of above-mentioned integral type is by being set directly at LED chip on radiator, and structure is simpler, it is achieved that integral structure, and radiating effect is preferable, can meet high-power LED light fixture and use.Additionally, relatively conventional in traditional LED lamp, need to set up heat abstractor at shell, the radiator of the LED lamp of above-mentioned integral type can directly use as shell, and has fabulous heat conduction and radiating effect, and manufacture difficulty is relatively low, and cost is relatively low.
Description
Technical field
The present invention relates to LED lamp heat sink field, particularly relate to the LED lamp of a kind of integral type.
Background technology
LED (Light Emitting Diode, light emitting diode), it can directly and efficiently convert electrical energy into
Visible ray, and having up to tens thousand of hours～the service life of 100,000 hours, thus be widely used in view,
The fields such as safety, special type and general lighting, market potential is beyond measure.
The basic structure of LED is the P N knot of a quasiconductor, when electric current flows through LED element, P N
The temperature of knot will rise, and the temperature in P N interface is referred to as the junction temperature of LED, is typically due to element chip equal
There is the least size, therefore, also the temperature of LED chip is called the junction temperature of LED chip.
The LED lamp using LED to make is referred to as the most frequently used with the advantage such as of fine quality, durable, energy-conservation
Lighting.
But, the drawback that LED lamp self exists is that LED lamp light efficiency is by the shadow of the junction temperature of LED
Ringing relatively big, higher junction temperature of chip will cause light efficiency to occur being decreased obviously, and influence whether making of LED lamp
Use the life-span.Owing to LED is when luminescence, the temperature of himself can constantly raise, in lasting illumination work
In, if the heat that LED produces can not exhale in time, it will cause the damage of LED, impact
The service life of LED.Therefore, the heat dissipation problem of LED is solved for promoting the performance of LED extremely
Close important.
For the problems referred to above, the heat energy produced during LED luminescence is typically directly delivered to aluminum by some LED lamp
Alloy or various metal shell dispel the heat, or by heat conductive silica gel transferring heat energy, thus when reducing LED illumination
The high temperature produced, reduces LED light and declines, extend LED illumination service life.
But, for the LED lamp that luminous power is bigger, due to radiating effect and the heat conduction of shell
The heat-conducting effect of silica gel is poor can not meet cooling requirements, therefore produces when can not well realize reducing LED illumination
Raw high temperature.If other heat abstractor of setting up again is on shell, then can increase manufacture difficulty, and cost is the most relatively
High.
Summary of the invention
Based on this, it is necessary to provide a kind of good heat dissipation effect, structure relatively simple and there is integral structure
The LED lamp of integral type.
A kind of LED lamp of integral type, comprising: radiator, several LED chip and scatter plate；
Described radiator includes substrate and some radiating fins, described substrate have the first relative side with
And second side, described first side is provided with several installation positions and several fixed bits, Ruo Gansuo
State radiating fin to be arranged on described second side；
Each described LED chip correspondence is installed on installation position described in；
Described scatter plate is fixedly installed on described substrate by each described fixed bit；
Described substrate is metal basal board.
In one of them embodiment, described fixed bit is screw, described scatter plate be spirally connected be fixedly installed on described
On each described fixed bit.
In one of them embodiment, described fixed bit is cylinder.
In one of them embodiment, described cylindrical height is 1 to 5 millimeter.
In one of them embodiment, described cylinder is copper post.
In one of them embodiment, described copper post is bolted in and is fixed on described substrate.
In one of them embodiment, described copper post is bolted in described scatter plate away from one end of described substrate, and
And described scatter plate contacts with described substrates into intimate.
In one of them embodiment, described substrate is aluminium base, and described radiating fin is copper sheet.
In one of them embodiment, some described radiating fins are arranged at intervals on described second side successively.
In one of them embodiment, described radiating fin offers several thermal vias.
The LED lamp of above-mentioned integral type is by being set directly at LED chip on radiator, and structure is relatively simple,
Achieving integral structure, radiating effect is preferable, can meet high-power LED light fixture and use.Additionally,
Relatively conventional in traditional LED lamp, need to set up heat abstractor, the LED of above-mentioned integral type at shell
The radiator of tool can directly use as shell, and has fabulous heat conduction and radiating effect, manufactures difficulty
Spending relatively low, cost is relatively low.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED lamp of an embodiment of the present invention；
Fig. 2 is the structural representation of the LED lamp with flat radiator of an embodiment of the present invention；
Fig. 3 is the structural representation of the flat radiator shown in Fig. 2；
Fig. 4 is the structural representation of the other direction of the flat radiator shown in Fig. 3；
Fig. 5 is the structural representation in the another direction of the flat radiator shown in Fig. 2；
Fig. 6 is the structural representation of the LED lamp with panel radiator of an embodiment of the present invention；
Fig. 7 is the structural representation of the aluminium base shown in Fig. 6；
Fig. 8 is the structural representation of the thermal column shown in Fig. 6；
Fig. 9 is the structural representation of the LED lamp of the integral type of an embodiment of the present invention；
Figure 10 is the structural representation of the scatter plate shown in Fig. 9.
Detailed description of the invention
Understandable for enabling the above-mentioned purpose of the present invention, feature and advantage to become apparent from, the most right
The detailed description of the invention of the present invention is described in detail.Elaborate in the following description a lot of detail with
It is easy to fully understand the present invention.But the present invention can come real to be a lot different from alternate manner described here
Executing, those skilled in the art can do similar improvement in the case of intension of the present invention, therefore this
Bright do not limited by following public specific embodiment.
Referring to Fig. 1, the LED lamp 10 of integral type includes radiator 70, several LED chip 80
And scatter plate 90.Several LED chip 80 and scatter plate 90 are installed on radiator 70, logical
Crossing and directly arrange on radiator 70 by LED chip 80, radiating effect is preferable, can meet high-power LED
Light fixture uses.Additionally, relatively conventional in traditional LED lamp, need to set up heat abstractor at shell, on
The radiator 70 stating LED lamp 10 can directly use as shell, and have fabulous heat conduction and dissipate
Thermal effect, manufacture difficulty is relatively low, and cost is relatively low.
It is specific embodiment part below.
Embodiment 1
Referring to Fig. 2, the LED lamp of integral type is the LED lamp 20 with flat radiator, its bag
Include flat radiator 400, several LED chip (Chip) 500 and scatter plate 200.Several
LED chip 500 and scatter plate 200 are respectively provided with on flat radiator 400.By by LED chip 500
Directly arranging on flat radiator 400, radiating effect is preferable, can meet high-power LED light fixture and make
With.Additionally, relatively conventional in traditional LED lamp, need to set up heat abstractor at shell, above-mentioned flat
The flat radiator 400 of the LED lamp 20 of formula radiator can directly use as shell, and has
Fabulous heat conduction and radiating effect, manufacture difficulty is relatively low, and cost is relatively low.
Referring to Fig. 3 to Fig. 5, it is the knot of three different directions of the flat radiator 400 shown in Fig. 2
Structure schematic diagram.Flat radiator 400 includes several heat-conducting substrates 410, two heat radiation wing plate 420, two
Individual fixing radiating fin 430, several main radiating fins 440 and several auxiliary radiating fins 450.Heat radiation
Wing plate 420, fixing radiating fin 430 and main radiating fin 440 are all fixedly installed on heat-conducting substrate 410,
Auxiliary radiating fin 450 is arranged on heat radiation wing plate 420.And for example, heat-conducting substrate 410, two heat radiation wing plate
420, two fixing radiating fins 430, several main radiating fins 440 and several auxiliary radiating fins 450
Be formed in one structure.Wherein, as shown in Figure 3, Figure 4, the flat design of heat-conducting substrate 410, such as,
Its thickness is 3 to 5 millimeters, as such, it is possible to effectively reduce the integral thickness of flat radiator 400, reaches
To overall flat effect.
Several heat-conducting substrates 410 are spaced successively and are fixedly installed on fixing radiating fin 430, main radiating fin
440 and heat radiation wing plate 420 a side, say, that the bearing of trend of several heat-conducting substrates 410 put down
OK, fixing radiating fin 430, main radiating fin 440 and the bearing of trend of heat radiation wing plate 420 and heat conduction base
The bearing of trend of plate 410 vertical, as such, it is possible to improve the hollow out degree of flat radiator 400, just
In being internally formed more heat-dissipating space at flat radiator 400, thus improve flat radiator 400
Cooling surface area, and then improve the radiating effect of flat radiator 400.
In order to increase the cooling surface area of flat radiator 400, meanwhile, it is beneficial to flow through both sides heat radiation wing plate
The cooler air of 420 is taken away heat-conducting substrate 410 and is passed to the heat of heat radiation wing plate 420, forms cross-ventilation and passes
Heat, such that it is able to improve the radiating effect of flat radiator 400 further, such as, refers to Fig. 3, dissipates
One side of hot wing plate 420 is fixedly installed on the end, one end of several heat-conducting substrates 410, and radiating wing
Plate 420 forms angle with the plane at several heat-conducting substrate 410 places, and such as, the angle of described angle is
30 degree to 90 degree.It is appreciated that a heat radiation wing plate 420 inclined direction of side away from heat-conducting substrate 410
Stretch into extraneous air, as such, it is possible to increase the cooling surface area of flat radiator 400, additionally, also profit
Take away heat-conducting substrate 410 in the cooler air flowing through both sides heat radiation wing plate 420 and pass to the wing plate 420 that dispels the heat
Heat, forms cross-ventilation heat transfer, such that it is able to improve the radiating effect of flat radiator 400 further.
And for example, heat radiation wing plate 420 is square platy structure, and and for example, heat radiation wing plate 420 is arc platy structure.
In order to increase the cooling surface area of flat radiator 400 further, such as, refer to Fig. 4, some
Individual auxiliary radiating fin 450 is spaced successively and is fixedly installed on heat radiation wing plate 420, several auxiliary radiating fins 450
Bearing of trend identical, and the prolonging of the bearing of trend of several auxiliary radiating fins 450 and heat-conducting substrate 410
Stretch the vertical of direction, as such, it is possible to increase the cooling surface area of flat radiator 400 further, thus
The radiating effect of flat radiator 400 can be improved further.
In order to preferably install flat radiator 400, such as, refer to Fig. 5, fixing radiating fin 430
A side be fixedly installed on the medium position of several heat-conducting substrates 410, fixing radiating fin 430
The bending of another side edge arranges buckle installation portion 431, and so, flat radiator 400 can pass through buckle
Installation portion 431 is directly installed on outside support, such that it is able to preferably install flat radiator 400.Example
As, it is arranged on floor body of wall.
In order to increase the cooling surface area of flat radiator 400 further, such as, refer to Fig. 5, main scattered
One side of hot fin 440 is fixedly installed on two side positions of several heat-conducting substrates 410, and several are main
The bearing of trend of radiating fin 440 is identical, and the bearing of trend of several main radiating fins 440 and heat conduction
The bearing of trend of substrate 410 vertical, as such, it is possible to increase the heat radiation of flat radiator 400 further
Surface area, such that it is able to improve the radiating effect of flat radiator 400 further.
In order to preferably install flat radiator 400, meanwhile, it is beneficial to optimize the knot of flat radiator 400
Structure, preferably improves radiating effect, such as, refers to Fig. 5, two fixing radiating fins 430, several
Main radiating fin 440 and several auxiliary radiating fins 450 form sector after being fixedly installed heat-conducting substrate 410
Structure, the height of i.e. two fixing radiating fins 430, the height of main radiating fin 440 and auxiliary radiating fin
The height of sheet 450 successively decreases successively, so, on the one hand can avoid main radiating fin 440 and auxiliary radiating fin
Sheet 450, to installing the interference that fixing radiating fin 430 produces, is pacified by which better fixing radiating fin 430
Fill flat radiator 400, at the same time it can also be play the effect of the structure optimizing flat radiator 400,
Preferably improve heat dispersion.
For more progressive the heat dispersion improving described flat radiator, such as, described flat heat radiation
Device is metal flat flat radiator, and and for example, described flat radiator is the flat radiator of alloy.
Such as, the flat radiator of an embodiment includes each component of following mass percent:
Silicon 0.4 part～0.5 part, ferrum 0.5 part～0.6 part, copper 0.05 part～0.3 part, 0.3 part～0.4 part of manganese, magnesium
2.1 parts～2.9 parts, chromium 0.18 part～0.28 part, 5.1 parts～6.1 parts of zinc, titanium 0.2 part～0.3 part and surplus
Aluminum.It is appreciated that zinc and the magnesium by using above-mentioned mass percent, strengthening effect can be formed significant
MgZn2 so that the thermal effectiveness of flat radiator is far better than a zinc bianry alloy, and tensile strength will
Can be greatly improved, and the ability of stress corrosion resistant and anti-strip corrosion also can increase, heat conductivity
Can be the biggest, the good heat dispersion performance of the most flat radiator.
Refer to Fig. 2, heat-conducting substrate 410 away from two heat radiation 420, two fixing radiating fins 430 of wing plate,
The one side of several main radiating fins 440 and several auxiliary radiating fins 450 arranges several installation positions
411, it is used for LED chip 500 is installed.
In order to preferably be arranged on LED chip and protect LED chip, such as, described installation position is hemisphere
Shape, described LED chip is arranged on the side of described heat-conducting substrate, and described LED chip is fixing accommodating
In described installation position, as such, it is possible to be preferably arranged on LED chip and protect LED chip.
In order to increase the radiating effect of heat-conducting substrate 410 further, such as, refer to Fig. 2, heat-conducting substrate
Arranging some through holes 412 on 410, through hole 412 can increase the cooling surface area of heat-conducting substrate 410, and
Heat-conducting substrate 410 is positioned at the relatively warm air of the side being provided with LED chip 500 can be swollen by own vol
Swollen via through holes 412 flows into and is provided with two heat radiation 420, two fixing radiating fins 430 of wing plate, several masters
Radiating fin 440 and the opposite side of several auxiliary radiating fins 450, so, by above-mentioned air
Circulation, can increase the radiating effect of heat-conducting substrate 410 further.
In order to further increase the radiating effect of heat-conducting substrate 410, take away LED chip 500 more quickly
The heat produced, such as, refers to Fig. 2, and through hole 412 is arranged in array, and installation position 411 is arranged in array.
And for example, each installation position 411 is arranged at the center of the rectangle that four through holes 412 surround.And for example, through hole 412
The spacing that aperture is installation position 411 20% to 40%.And for example, the aperture of through hole 412 is less than installation position
The spacing of 411.
Referring to Fig. 2, scatter plate 200 is fixedly installed on heat-conducting substrate 410, and LED chip 500
Between heat-conducting substrate 410 and scatter plate 200, the light that LED chip 500 is launched is through scatter plate 200
Expose to outside.
Above-mentioned have the LED lamp 20 of flat radiator by being set directly at flat by LED chip 500
On flat radiator 400, structure is simpler, it is achieved that integral structure, and radiating effect is preferable, Ke Yiman
Foot high-power LED light fixture uses.Additionally, relatively conventional in traditional LED lamp, need to increase at shell
If heat abstractor, the flat radiator 400 of the above-mentioned LED lamp 20 with flat radiator is permissible
Directly using as shell, and have fabulous heat conduction and radiating effect, manufacture difficulty is relatively low, and cost is relatively
Low.
Embodiment 2
Referring to Fig. 6 and Fig. 7, the LED lamp of integral type is the LED lamp 30 with panel radiator,
It includes panel radiator 700, several LED chip 800 and scatter plate 900.Several LED core
Sheet 800 and scatter plate 900 are respectively provided with on panel radiator 700.By LED chip 800 is directly set
Putting on panel radiator 700, radiating effect is preferable, can meet high-power LED light fixture and use.Additionally,
Relatively conventional in traditional LED lamp, need to set up heat abstractor, the LED of above-mentioned panel radiator at shell
The panel radiator 700 of light fixture 30 can directly use as shell, and has fabulous heat conduction and heat radiation
Effect, manufacture difficulty is relatively low, and cost is relatively low
Referring to Fig. 6, panel radiator 700 includes 710, two heat-dissipating fins 720 of an aluminium base, some
Individual fixing thermal column 730, several main thermal columns 740 and several auxiliary thermal columns 750.Heat-dissipating fin 720,
Fixing thermal column 730 and main thermal column 740 are all fixedly installed on aluminium base 710, auxiliary thermal column 750
It is arranged on heat-dissipating fin 720.
Several fixing thermal columns 730 are arranged in array on aluminium base 710, and such as, several are fixing scattered
Plume 730 is distributed and is arranged on aluminium base 710 in two rows, and the often line of fixing thermal column 730 in row
For straight line.Several main thermal columns 740 are arranged in array on aluminium base 710, and such as, several are main scattered
Plume 740 is arranged on aluminium base 710 in some rows, and often the line of main thermal column 740 in row is straight
Line.Several auxiliary thermal columns 750 are arranged in array on heat-dissipating fin 720, such as, and several auxiliary heat radiations
Post 750 is arranged on heat-dissipating fin 720 in some rows, and often the line of auxiliary thermal column 750 in row is straight line.
As such, it is possible to improve the hollow out degree of panel radiator 700, it is simple to be internally formed at panel radiator 700
More heat-dissipating space, thus improve the cooling surface area of panel radiator 700, and then improve plate type radiator
The radiating effect of device 700.
In order to increase the cooling surface area of panel radiator 700, meanwhile, it is beneficial to flow through both sides heat-dissipating fin 720
Cooler air take away aluminium base 710 and pass to the heat of heat-dissipating fin 720, form cross-ventilation heat transfer,
Such that it is able to improve the radiating effect of panel radiator 700 further, such as, refer to Fig. 6, heat-dissipating fin
One side of 720 is fixedly installed on a side of aluminium base 710, and heat-dissipating fin 720 and aluminium base 710
The plane at place forms angle, and such as, the angle of described angle is 30 degree to 90 degree.It is appreciated that scattered
Hot fin 720 stretches into extraneous air away from an inclined direction of side of aluminium base 710, as such, it is possible to increase
Add the cooling surface area of panel radiator 700, additionally, be additionally favorable for flowing through the colder of both sides heat-dissipating fin 720
Air is taken away aluminium base 710 and is passed to the heat of heat-dissipating fin 720, forms cross-ventilation heat transfer, thus can
To improve the radiating effect of panel radiator 700 further.And for example, heat-dissipating fin 720 is square lamellar knot
Structure, and for example, heat-dissipating fin 720 is arc-shaped flaky structure.
In order to increase the cooling surface area of panel radiator 700 further, such as, refer to Fig. 6, several
Auxiliary thermal column 750 is spaced successively and is fixedly installed on heat-dissipating fin 720, and for example, and several auxiliary thermal columns 750
Being arranged in array on heat-dissipating fin 720, and for example, several auxiliary thermal columns 750 arrange heat radiation in some rows
On fin 720, and often the line of auxiliary thermal column 750 in row is straight line.As such, it is possible to increase further
The cooling surface area of panel radiator 700, such that it is able to improve the heat radiation effect of panel radiator 700 further
Really.
For preferably mounting plate type radiator 700, such as, refer to Fig. 6, several fixing thermal columns 730
Being arranged in array on aluminium base 710, such as, several fixing thermal columns 730 are distributed and are arranged in two rows
On aluminium base 710, and often the line of fixing thermal column 730 in row is straight line.And for example, fixing thermal column
One end of 730 is fixedly installed on the medium position of several aluminium bases 710, fixes thermal column 730 another
The bending of end end arranges buckle installation portion 731, and so, panel radiator 700 can pass through buckle installation portion
731 are directly installed on outside support, such that it is able to preferably mounting plate type radiator 700.Such as, install
On floor body of wall.
In order to increase the cooling surface area of panel radiator 700 further, such as, Fig. 6, main heat radiation are referred to
One end of post 740 is fixedly installed on two side positions of several aluminium bases 710, and and for example, several are main scattered
Plume 740 is arranged in array on aluminium base 710, and such as, several main thermal columns 740 set in some rows
Put on aluminium base 710, and often the line of main thermal column 740 in row is straight line, as such, it is possible to enter one
Step increases the cooling surface area of panel radiator 700, such that it is able to improve panel radiator 700 further
Radiating effect.
For preferably mounting plate type radiator 700, meanwhile, it is beneficial to optimize the structure of panel radiator 700,
Preferably improve radiating effect, such as, refer to Fig. 6, two fixing thermal columns 730, several main heat radiations
Post 740 and several auxiliary thermal columns 750 are fixedly installed after aluminium base 710 and form bow-shaped structural, so,
On the one hand main thermal column 740 and auxiliary thermal column 750 can be avoided installing what fixing thermal column 730 produced
Interference, by which better fixing thermal column 730 mounting plate type radiator 700, at the same time it can also be play optimization
The effect of the structure of panel radiator 700, preferably improves heat dispersion.
In order to further improve the heat dispersion of described panel radiator, such as, described panel radiator
For metal plate type radiator, and for example, described panel radiator is alloy plate type radiator.
Such as, the panel radiator of an embodiment includes each component of following mass percent:
Silicon 0.7 part～0.5 part, ferrum 0.5 part～0.6 part, copper 0.05 part～0.3 part, 0.3 part～0.7 part of manganese, magnesium
2.1 parts～2.9 parts, chromium 0.18 part～0.28 part, 5.1 parts～6.1 parts of zinc, titanium 0.2 part～0.3 part and surplus
Aluminum.It is appreciated that zinc and the magnesium by using above-mentioned mass percent, strengthening effect can be formed significant
MgZn2 so that the thermal effectiveness of panel radiator is far better than a zinc bianry alloy, and tensile strength will
It is greatly improved, and the ability of stress corrosion resistant and anti-strip corrosion also can increase, heat-conductive characteristic
The biggest, i.e. the good heat dispersion performance of panel radiator.
And for example, described aluminium base is identical with described thermal column material or different setting, and for example, and described aluminum base
Plate is aluminium alloy base plate, and described thermal column is copper post.And for example, described thermal column specifically includes described fixing scattered
Plume, described main thermal column and described auxiliary thermal column.
In order to further enhance the radiating effect of described thermal column, such as, described thermal column is copper post, and for example,
Described copper post is hollow tubular structure, and for example, refers to Fig. 8, the sidewall of copper post 900a offers some
Individual louvre 910a.And for example, 2 times to 5 times of the thickness that height is described aluminium base of described copper post；Example
As described in the height of described copper post is 3.2 times of the thickness of aluminium base.And for example, described thermal column is that array is arranged.
As such, it is possible to increase the radiating effect strengthening described thermal column further.
Please refer to Fig. 6 and Fig. 7, aluminium base 710 away from two heat-dissipating fins 720, several fixing dissipate
The one side of plume 730, several main thermal columns 740 and several auxiliary thermal columns 750 arranges several peaces
Dress position 711, is used for installing LED chip 800.
In order to preferably install LED chip and protect LED chip, such as, described installation position is hemispherical,
Described LED chip is arranged on the side of described aluminium base, and described LED chip fixing be placed in described
In installation position, as such, it is possible to be preferably arranged on LED chip and protect LED chip.
In order to increase the radiating effect of aluminium base 710 further, such as, Fig. 7 is referred to, on aluminium base 710
Arranging some through holes 712, through hole 712 can increase the cooling surface area of aluminium base 710, and aluminium base
710 relatively warm air being positioned at the side being provided with LED chip 800 can expand via through holes by own vol
712 inflows are provided with two heat-dissipating fins 720, several fixing thermal columns 730, several main thermal columns 740
And the opposite side of several auxiliary thermal columns 750, so, by above-mentioned air's circulation, permissible
Increase the radiating effect of aluminium base 710 further.
In order to further increase the radiating effect of aluminium base 710, take away LED chip 800 more quickly and produce
Raw heat, such as, refers to Fig. 7, and through hole 712 is arranged in array, and installation position 711 is arranged in array.
And for example, each installation position 711 is arranged at the center of the rectangle that four through holes 712 surround.And for example, through hole 712
The spacing that aperture is installation position 711 30% to 70%.And for example, the aperture of through hole 712 is less than installation position
The spacing of 711.
Referring to Fig. 6, scatter plate 900 is fixedly installed on aluminium base 710, and LED chip 800 is positioned at
Between aluminium base 710 and scatter plate 900, the light that LED chip 800 is launched shines through scatter plate 900
It is incident upon outside.
Such as, described panel radiator is provided with several installation positions and several thermal columns；Described plate
Formula radiator includes that aluminium base and thermal column, described aluminium base have the first relative side and the second side
Face, described installation position is positioned on described first side, and described thermal column is arranged on described second side.Again
As, each described installation position correspondence installs LED chip described in；Described installation position is that array is arranged.Described
The radius of copper post is the 10% to 20% of the spacing of described installation position.And for example, described scatter plate is fixedly installed on
On described first side of described aluminium base, and the light that described LED chip is launched is through described scatter plate.
Above-mentioned have the LED lamp 30 of panel radiator by being set directly at board-like by LED chip 800
On radiator 700, structure is simpler, it is achieved that integral structure, and radiating effect is preferable, can meet big
The LED lamp of power uses.Additionally, relatively conventional in traditional LED lamp, needs are set up scattered at shell
Thermal, the panel radiator 700 of the above-mentioned LED lamp 30 with panel radiator can directly as
Shell uses, and has fabulous heat conduction and radiating effect, and manufacture difficulty is relatively low, and cost is relatively low.
Embodiment 3
Referring to Fig. 9, the LED lamp 50 of integral type includes radiator 100, several LED chip 200
And scatter plate 300.Several LED chip 200 and scatter plate 300 are respectively provided with on radiator 100.
By directly arranging on radiator 100 by LED chip 200, radiating effect is preferable, can meet high-power
LED lamp use.Additionally, relatively conventional in traditional LED lamp, need to set up heat radiation dress at shell
Putting, the radiator 100 of the LED lamp 20 of above-mentioned radiator can directly use as shell, and has
Fabulous heat conduction and radiating effect, manufacture difficulty is relatively low, and cost is relatively low.
Referring to Fig. 9, radiator 100 includes that several substrates 110, two heat radiation wing plate 120, two is solid
Determine radiating fin 130, several main radiating fins 140 and several auxiliary radiating fins 150.Heat radiation wing plate
120, fixing radiating fin 130 and main radiating fin 140 are all fixedly installed on substrate 110, auxiliary heat radiation
Fin 150 is arranged on heat radiation wing plate 120.
Several substrates 110 be spaced successively be fixedly installed on fixing radiating fin 130, main radiating fin 140 with
And a side of heat radiation wing plate 120, say, that the bearing of trend of several substrates 110 is parallel, fixing
The bearing of trend of radiating fin 130, main radiating fin 140 and heat radiation wing plate 120 and the extension of substrate 110
Direction vertical, as such, it is possible to improve the hollow out degree of radiator 100, it is simple to inside radiator 100
Form more heat-dissipating space, thus improve the cooling surface area of radiator 100, and then improve radiator 100
Radiating effect.
In order to increase the cooling surface area of radiator 100, meanwhile, it is beneficial to flow through both sides heat radiation wing plate 120
Cooler air is taken away substrate 110 and is passed to the heat of heat radiation wing plate 120, forms cross-ventilation heat transfer, thus
The radiating effect of radiator 100 can be improved further, such as, refer to Fig. 9, the one of heat radiation wing plate 120
Side is fixedly installed on the end, one end of several substrates 110, and dispel the heat wing plate 120 and several substrates
The plane at 110 places forms angle, and such as, the angle of described angle is 30 degree to 90 degree.It is appreciated that
Heat radiation wing plate 120 stretches into extraneous air away from an inclined direction of side of substrate 110, as such, it is possible to increase
Add the cooling surface area of radiator 100, additionally, be additionally favorable for flowing through the cooler air of both sides heat radiation wing plate 120
Take away substrate 110 and pass to the heat of heat radiation wing plate 120, form cross-ventilation heat transfer, such that it is able to enter one
Step improves the radiating effect of radiator 100.And for example, heat radiation wing plate 120 is square platy structure, and for example,
Heat radiation wing plate 120 is arc platy structure.
In order to increase the cooling surface area of radiator 100 further, such as, referring to Fig. 9, several are auxiliary scattered
Hot fin 150 is spaced successively and is fixedly installed on heat radiation wing plate 120, prolonging of several auxiliary radiating fins 150
Stretch direction identical, and the bearing of trend of the bearing of trend of several auxiliary radiating fins 150 and substrate 110
Vertically, as such, it is possible to increase the cooling surface area of radiator 100 further, such that it is able to improve further
The radiating effect of radiator 100.
In order to preferably install radiator 100, such as, refer to Fig. 9, the side of fixing radiating fin 130
While be fixedly installed on the medium position of several substrates 110, another side limit of fixing radiating fin 130
Edge bending arranges buckle installation portion 131, and so, radiator 100 directly can be pacified by buckle installation portion 131
It is contained on outside support, such that it is able to preferably install radiator 100.Such as, it is arranged on floor body of wall.
In order to increase the cooling surface area of radiator 100 further, such as, Fig. 9, main radiating fin are referred to
One side of 140 is fixedly installed on two side positions of several substrates 110, several main radiating fins 140
Bearing of trend identical, and the extension side of the bearing of trend of several main radiating fins 140 and substrate 110
To vertical, as such, it is possible to increase further the cooling surface area of radiator 100, such that it is able to further
Improve the radiating effect of radiator 100.
In order to preferably install radiator 100, meanwhile, it is beneficial to optimize the structure of radiator 100, preferably carries
High radiating effect, such as, refers to Fig. 9, two fixing radiating fins 130, several main radiating fins 140
And several auxiliary radiating fins 150 are fixedly installed formation sector structure after substrate 110, i.e. two fixing scattered
The height of the height of hot fin 130, the height of main radiating fin 140 and auxiliary radiating fin 150 is passed successively
Subtract, so, main radiating fin 140 and auxiliary radiating fin 150 on the one hand can be avoided installing fixing dissipating
The interference that hot fin 130 produces, installs radiator 100 by which better fixing radiating fin 130, meanwhile,
May also operate as optimizing the effect of the structure of radiator 100, preferably improve heat dispersion.
For more progressive the heat dispersion improving described radiator, such as, described radiator is heat dissipation metal
Device, and for example, described radiator is alloy heat-sink device.And for example, described substrate is metal basal board, and for example, and institute
Stating substrate is aluminium base, and and for example, described radiating fin is copper sheet, and for example, and described substrate and described radiating fin
Sheet material is identical or different setting.And for example, described radiating fin specifically includes described fixing radiating fin, institute
State main radiating fin and described auxiliary radiating fin, and for example, described fixing radiating fin, described main radiating fin
Sheet and described auxiliary radiating fin material is identical or different setting.And for example, dissipate described in some described radiating fins
Several thermal vias are offered on hot fin.And for example, between several described thermal vias, radiating wire is set.
And for example, described radiating wire forms network structure.
Such as, the radiator of an embodiment includes each component of following mass percent:
Silicon 0.4 part～0.5 part, ferrum 0.5 part～0.6 part, copper 0.05 part～0.3 part, 0.3 part～0.4 part of manganese, magnesium
2.1 parts～2.9 parts, chromium 0.18 part～0.28 part, 5.1 parts～6.1 parts of zinc, titanium 0.2 part～0.3 part and surplus
Aluminum.It is appreciated that zinc and the magnesium by using above-mentioned mass percent, strengthening effect can be formed significant
MgZn2 so that the thermal effectiveness of radiator will obtain far better than a zinc bianry alloy, tensile strength
Improving greatly, and the ability of stress corrosion resistant and anti-strip corrosion also can increase, heat-conductive characteristic is the most relatively
Greatly, i.e. the good heat dispersion performance of radiator.
Refer to Fig. 9, if substrate 110 is away from two heat radiation 120, two fixing radiating fins 130 of wing plate
The one side of dry main radiating fin 140 and several auxiliary radiating fins 150 arranges several installation positions 111
And fixed bit 113.Installation position 111 is used for installing LED chip 200, such as, each described LED core
Sheet is correspondingly arranged installation position described in.Fixed bit 113 is used for installing scatter plate 300.
In order to preferably be arranged on LED chip and protect LED chip, such as, described installation position is hemisphere
Shape, described LED chip is arranged on the side of described substrate, and described LED chip is fixed and is placed in institute
State in installation position, as such, it is possible to be preferably arranged on LED chip and protect LED chip.
In order to increase the radiating effect of substrate 110 further, such as, refer to Fig. 9, substrate 110 is arranged
Some through holes 112, through hole 112 can increase the cooling surface area of substrate 110, and substrate 110 is positioned at peace
Relatively warm air equipped with the side of LED chip 200 can expand via through holes 112 inflow peace by own vol
If equipped with two heat radiation 120, two fixing radiating fins 130 of wing plate, several main radiating fins 140 and
The opposite side of dry auxiliary radiating fin 150, so, by above-mentioned air's circulation, can enter one
Step increases the radiating effect of substrate 110.
In order to further increase the radiating effect of substrate 110, take away LED chip 200 more quickly and produce
Heat, such as, refer to Fig. 9, through hole 112 is arranged in array, and installation position 111 is arranged in array.Again
As, each installation position 111 is arranged at the center of the rectangle that four through holes 112 surround.And for example, through hole 112
The spacing that aperture is installation position 111 20% to 10%.And for example, the aperture of through hole 112 is less than installation position
The spacing of 111.
In order to further increase the radiating effect of substrate 110, such as, Fig. 9, two adjacent bases are referred to
Forming a radiating groove 115 between plate 110, radiating groove 115 is beneficial to cross-ventilation heat transfer, as such, it is possible to more enter
One step increases the radiating effect of substrate 110.
Please refer to Fig. 9 and Figure 10, scatter plate 300 is fixedly installed on substrate 110 by fixed bit 112
On, and LED chip 200 is between substrate 110 and scatter plate 300, and LED chip 200 is launched
Light expose to outside through scatter plate 300.Such as, the both sides of scatter plate 300 are provided with strip bulge
Portion 310, strip bulge portion 310 is fixedly installed on substrate 110, and for example, strip bulge portion 310 offers
There are several fixing holes 311, are used for fixing scatter plate 300 and substrate 110 are installed.
In order to preferably install fixing scatter plate, such as, described substrate has the first relative side and
Two side faces, described first side is provided with several installation positions and several fixed bits, some described scattered
Hot fin is arranged on described second side, and and for example, described fixed bit is screw, and described scatter plate is spirally connected solid
Surely being arranged on described each described fixed bit, and for example, described fixed bit is cylinder, described cylindrical height
Degree is 1 to 5 millimeter, and and for example, described cylinder is copper post, and described copper post is bolted in and is fixed on described substrate
On, and for example, described copper post is bolted in described scatter plate, and described scatter plate away from one end of described substrate
Contact with described substrates into intimate.
The LED lamp 50 of above-mentioned integral type by LED chip 200 is set directly on radiator 100,
Structure is simpler, it is achieved that integral structure, and radiating effect is preferable, can meet high-power LED light fixture
Use.Additionally, relatively conventional in traditional LED lamp, need to set up heat abstractor at shell, above-mentioned one
The radiator 100 of the LED lamp 50 of body formula can directly use as shell, and has fabulous heat conduction
And radiating effect, manufacture difficulty is relatively low, and cost is relatively low.
It should be noted that other embodiments of the present invention also include, the technical characteristic in the various embodiments described above
Be combined with each other formed, the LED lamp of integral type that is that can implement, as such, it is possible to reach radiating effect
Good, structure is relatively simple and integral type technique effect.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed,
But therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that, for this area
Those of ordinary skill for, without departing from the inventive concept of the premise, it is also possible to make some deformation and
Improving, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended
Claim is as the criterion.
Claims (10)
1. the LED lamp of an integral type, it is characterised in that including: radiator, several LED core
Sheet and scatter plate；
Described radiator includes substrate and some radiating fins, described substrate have the first relative side with
And second side, described first side is provided with several installation positions and several fixed bits, Ruo Gansuo
Stating radiating fin to be arranged on described second side, wherein, described radiator includes following mass percent
Each component: silicon 0.4 part～0.5 part, ferrum 0.5 part～0.6 part, copper 0.05 part～0.3 part, 0.3 part～0.4 part of manganese,
2.1 parts～2.9 parts of magnesium, chromium 0.18 part～0.28 part, 5.1 parts～6.1 parts of zinc, titanium 0.2 part～0.3 part and remaining
The aluminum of amount；
Each described LED chip correspondence is installed on installation position described in；
Described scatter plate is fixedly installed on described substrate by each described fixed bit；
Described substrate is metal basal board.
LED lamp the most according to claim 1, it is characterised in that described fixed bit is screw, institute
State scatter plate to be spirally connected and be fixedly installed on described each described fixed bit.
LED lamp the most according to claim 1, it is characterised in that described fixed bit is cylinder.
LED lamp the most according to claim 3, it is characterised in that described cylindrical height is 1
To 5 millimeters.
LED lamp the most according to claim 4, it is characterised in that described cylinder is copper post.
LED lamp the most according to claim 5, it is characterised in that described copper post is spirally connected and is fixed on
On described substrate.
LED lamp the most according to claim 6, it is characterised in that described copper post is away from described substrate
One end be bolted in described scatter plate, and described scatter plate contacts with described substrates into intimate.
8. according to the arbitrary described LED lamp of claim 1 to 7, it is characterised in that described substrate is aluminum
Substrate, described radiating fin is copper sheet.
LED lamp the most according to claim 8, it is characterised in that some described radiating fins are successively
It is arranged at intervals on described second side.
LED lamp the most according to claim 9, it is characterised in that offer on described radiating fin
There are several thermal vias.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410453284.XA CN104197220B (en) | 2014-09-05 | 2014-09-05 | The LED lamp of integral type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410453284.XA CN104197220B (en) | 2014-09-05 | 2014-09-05 | The LED lamp of integral type |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104197220A CN104197220A (en) | 2014-12-10 |
| CN104197220B true CN104197220B (en) | 2016-09-14 |
Family
ID=52082556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410453284.XA Active CN104197220B (en) | 2014-09-05 | 2014-09-05 | The LED lamp of integral type |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104197220B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107424752A (en) * | 2017-09-11 | 2017-12-01 | 淄博鹏太电力设备有限公司 | Transformer radiating system and transformer heat dissipating method |
| CN109882749A (en) * | 2019-03-05 | 2019-06-14 | 严伯勤 | A kind of LED street lamp bulb shell and its production technology |
| CN112178544A (en) * | 2020-11-02 | 2021-01-05 | 李辉林 | Tile mouth shot-light that dispels heat fast |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201228930Y (en) * | 2008-06-24 | 2009-04-29 | 鈤新科技股份有限公司 | Light uniform structure of LED lamp tube |
| CN101440938A (en) * | 2008-11-11 | 2009-05-27 | 杨华贵 | Composite structure of guardrail pipe |
| CN102943992A (en) * | 2012-11-13 | 2013-02-27 | 广州广日电气设备有限公司 | Light mixing lens module |
| JP5219436B2 (en) * | 2007-08-06 | 2013-06-26 | 浜井電球工業株式会社 | Dimmable LED lamp for bulb-type lighting |
| CN203309836U (en) * | 2013-04-25 | 2013-11-27 | 京东方科技集团股份有限公司 | LED light source, backlight source and liquid crystal display device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008186758A (en) * | 2007-01-31 | 2008-08-14 | Royal Lighting Co Ltd | Self-ballasted lighting led lamp |
-
2014
- 2014-09-05 CN CN201410453284.XA patent/CN104197220B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5219436B2 (en) * | 2007-08-06 | 2013-06-26 | 浜井電球工業株式会社 | Dimmable LED lamp for bulb-type lighting |
| CN201228930Y (en) * | 2008-06-24 | 2009-04-29 | 鈤新科技股份有限公司 | Light uniform structure of LED lamp tube |
| CN101440938A (en) * | 2008-11-11 | 2009-05-27 | 杨华贵 | Composite structure of guardrail pipe |
| CN102943992A (en) * | 2012-11-13 | 2013-02-27 | 广州广日电气设备有限公司 | Light mixing lens module |
| CN203309836U (en) * | 2013-04-25 | 2013-11-27 | 京东方科技集团股份有限公司 | LED light source, backlight source and liquid crystal display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104197220A (en) | 2014-12-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208937890U (en) | Radiator and projector | |
| TW201413163A (en) | Active heat dissipation LED illumination lamp | |
| KR101300013B1 (en) | Led lamp | |
| WO2012171150A1 (en) | Vertical convection radiator and vertical convection radiating cylinder lamp | |
| CN104197220B (en) | The LED lamp of integral type | |
| KR20130044275A (en) | Heat sink for led lamp | |
| CN105066078B (en) | A kind of LED lamp heat sink | |
| CN104180350B (en) | LED (Light Emitting Diode) lamp with flat type radiator | |
| CN104180351B (en) | LED lamp with plate type radiator | |
| CN104595770A (en) | Efficient heat-dissipation LED (Light-Emitting Diode) lamp | |
| CN209784927U (en) | Energy-saving cooling device for computer server | |
| CN201885190U (en) | High-power LED cooling module | |
| CN204254557U (en) | There is the LED lamp of flat heat spreader structures | |
| CN204254302U (en) | There is the LED lamp of panel radiator structure | |
| CN106051484A (en) | High-power heat dissipation LED lamp | |
| CN204042555U (en) | There is the LED lamp of integral structure | |
| CN104214573B (en) | Straight tube led lamp | |
| CN207298871U (en) | Heat sink and its high-power LED radiator device | |
| CN201748365U (en) | High-power LED heat radiator | |
| CN104214571B (en) | LED (light emitting diode) lamp | |
| CN202812996U (en) | Light-emitting diode (LED) lamp capable of dissipating heat easily | |
| CN107748610A (en) | A kind of industrial computer for carrying radiating | |
| CN207938593U (en) | A kind of assembled radiator | |
| CN103062737A (en) | LED radiator | |
| CN107255264A (en) | A kind of radiator structure of LED lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |