AU6863696A - Method and apparatus for low energy electron enhanced etching of substrates - Google Patents
Method and apparatus for low energy electron enhanced etching of substratesInfo
- Publication number
- AU6863696A AU6863696A AU68636/96A AU6863696A AU6863696A AU 6863696 A AU6863696 A AU 6863696A AU 68636/96 A AU68636/96 A AU 68636/96A AU 6863696 A AU6863696 A AU 6863696A AU 6863696 A AU6863696 A AU 6863696A
- Authority
- AU
- Australia
- Prior art keywords
- substrates
- low energy
- energy electron
- enhanced etching
- electron enhanced
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000005530 etching Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02019—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32018—Glow discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32018—Glow discharge
- H01J37/32027—DC powered
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32321—Discharge generated by other radiation
- H01J37/3233—Discharge generated by other radiation using charged particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
- H01L21/30612—Etching of AIIIBV compounds
- H01L21/30621—Vapour phase etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US286295P | 1995-08-28 | 1995-08-28 | |
US283795P | 1995-08-28 | 1995-08-28 | |
US286195P | 1995-08-28 | 1995-08-28 | |
US002862 | 1995-08-28 | ||
US002837 | 1995-08-28 | ||
US002861 | 1995-08-28 | ||
US2062996P | 1996-06-27 | 1996-06-27 | |
US020629 | 1996-06-27 | ||
US2236496P | 1996-07-24 | 1996-07-24 | |
US022364 | 1996-07-24 | ||
PCT/US1996/013915 WO1997008362A1 (en) | 1995-08-28 | 1996-08-28 | Method and apparatus for low energy electron enhanced etching of substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
AU6863696A true AU6863696A (en) | 1997-03-19 |
Family
ID=27532981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU68636/96A Abandoned AU6863696A (en) | 1995-08-28 | 1996-08-28 | Method and apparatus for low energy electron enhanced etching of substrates |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU6863696A (en) |
WO (1) | WO1997008362A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5917285A (en) * | 1996-07-24 | 1999-06-29 | Georgia Tech Research Corporation | Apparatus and method for reducing operating voltage in gas discharge devices |
US6033587A (en) | 1996-09-20 | 2000-03-07 | Georgia Tech Research Corporation | Method and apparatus for low energy electron enhanced etching and cleaning of substrates in the positive column of a plasma |
CA2353479C (en) * | 1998-12-03 | 2008-02-12 | Georgia Tech Research Corporation | Method and apparatus for low energy electron enhanced etching and cleaning of substrates |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4450787A (en) * | 1982-06-03 | 1984-05-29 | Rca Corporation | Glow discharge plasma deposition of thin films |
US4496881A (en) * | 1982-09-29 | 1985-01-29 | Tetra Pak Developpement Sa | Method of cold cathode replenishment in electron beam apparatus and replenishable cold cathode assembly |
US4874459A (en) * | 1988-10-17 | 1989-10-17 | The Regents Of The University Of California | Low damage-producing, anisotropic, chemically enhanced etching method and apparatus |
US5039376A (en) * | 1989-09-19 | 1991-08-13 | Stefan Zukotynski | Method and apparatus for the plasma etching, substrate cleaning, or deposition of materials by D.C. glow discharge |
JPH04326725A (en) * | 1991-04-26 | 1992-11-16 | Tokyo Electron Ltd | Plasma apparatus |
US5457298A (en) * | 1993-07-27 | 1995-10-10 | Tulip Memory Systems, Inc. | Coldwall hollow-cathode plasma device for support of gas discharges |
-
1996
- 1996-08-28 AU AU68636/96A patent/AU6863696A/en not_active Abandoned
- 1996-08-28 WO PCT/US1996/013915 patent/WO1997008362A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO1997008362A1 (en) | 1997-03-06 |
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