Nothing Special   »   [go: up one dir, main page]

ATE248388T1 - Verfahren zur erzeugung einer maske auf einer oberfläche - Google Patents

Verfahren zur erzeugung einer maske auf einer oberfläche

Info

Publication number
ATE248388T1
ATE248388T1 AT00935358T AT00935358T ATE248388T1 AT E248388 T1 ATE248388 T1 AT E248388T1 AT 00935358 T AT00935358 T AT 00935358T AT 00935358 T AT00935358 T AT 00935358T AT E248388 T1 ATE248388 T1 AT E248388T1
Authority
AT
Austria
Prior art keywords
mask
producing
droplets
pattern
coalesced
Prior art date
Application number
AT00935358T
Other languages
English (en)
Inventor
Stuart Speakman
Ian Andrew Gardner
Eric Bresler
Original Assignee
Patterning Technologies Ltd
Jetmask Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26243856&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE248388(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from GB9912437A external-priority patent/GB2350321A/en
Application filed by Patterning Technologies Ltd, Jetmask Ltd filed Critical Patterning Technologies Ltd
Application granted granted Critical
Publication of ATE248388T1 publication Critical patent/ATE248388T1/de

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/02Processes for applying liquids or other fluent materials performed by spraying
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M7/00After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
    • B41M7/0081After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using electromagnetic radiation or waves, e.g. ultraviolet radiation, electron beams
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G03F7/2016Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
    • G03F7/2018Masking pattern obtained by selective application of an ink or a toner, e.g. ink jet printing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1208Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283After-treatment of the printed patterns, e.g. sintering or curing methods
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/006Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013Inkjet printing, e.g. for printing insulating material or resist
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0094Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Ink Jet (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electron Beam Exposure (AREA)
AT00935358T 1999-05-27 2000-05-30 Verfahren zur erzeugung einer maske auf einer oberfläche ATE248388T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9912437A GB2350321A (en) 1999-05-27 1999-05-27 Method of forming a masking or spacer pattern on a substrate using inkjet droplet deposition
GB0005929A GB2352688A (en) 1999-05-27 2000-03-10 Method of forming a masking or spacer pattern on a substrate using inkjet droplet deposition
PCT/GB2000/002077 WO2001011426A1 (en) 1999-05-27 2000-05-30 Method of forming a masking pattern on a surface

Publications (1)

Publication Number Publication Date
ATE248388T1 true ATE248388T1 (de) 2003-09-15

Family

ID=26243856

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00935358T ATE248388T1 (de) 1999-05-27 2000-05-30 Verfahren zur erzeugung einer maske auf einer oberfläche

Country Status (9)

Country Link
US (1) US6849308B1 (de)
EP (1) EP1163552B2 (de)
JP (1) JP2003506886A (de)
AT (1) ATE248388T1 (de)
AU (1) AU5090400A (de)
CA (1) CA2375365A1 (de)
DE (1) DE60004798T3 (de)
IL (1) IL146601A0 (de)
WO (1) WO2001011426A1 (de)

Families Citing this family (132)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69840914D1 (de) * 1997-10-14 2009-07-30 Patterning Technologies Ltd Methode zur Herstellung eines elektrischen Kondensators
US7323634B2 (en) * 1998-10-14 2008-01-29 Patterning Technologies Limited Method of forming an electronic device
US7189344B2 (en) * 2001-03-12 2007-03-13 Ivoclar Vivadent Ag Method for producing a synthetic material part
US6872320B2 (en) * 2001-04-19 2005-03-29 Xerox Corporation Method for printing etch masks using phase-change materials
EP1399269B1 (de) * 2001-06-01 2010-11-03 Ulvac, Inc. Wellengenerator für ein mikroabscheidungs-steuersystem
GB2381665B (en) * 2001-11-02 2005-06-22 Jetmask Ltd Method of forming a mask on a surface
GB2382798A (en) * 2001-12-04 2003-06-11 Qinetiq Ltd Inkjet printer which deposits at least two fluids on a substrate such that the fluids react chemically to form a product thereon
WO2003075623A2 (en) * 2002-03-04 2003-09-12 Printar Ltd. Digital application of protective soldermask to printed circuit boards
JP4274784B2 (ja) * 2002-05-28 2009-06-10 新光電気工業株式会社 配線形成システムおよびその方法
TW558913B (en) * 2002-10-25 2003-10-21 Ritdisplay Corp OLED device, method of packaging OLED device and a machine of packaging OLED device
AU2003290929A1 (en) 2002-11-15 2004-06-15 Markem Corporation Radiation-curable inks
JP2004181951A (ja) * 2002-11-20 2004-07-02 Konica Minolta Holdings Inc 画像記録装置及び画像記録方法
US7875321B2 (en) * 2002-12-11 2011-01-25 Agfa Graphics Nv Preparation of flexographic printing plates using ink jet recording
JP2004203025A (ja) * 2002-12-12 2004-07-22 Konica Minolta Holdings Inc 画像記録装置
JP4269672B2 (ja) * 2002-12-12 2009-05-27 コニカミノルタホールディングス株式会社 インクジェットプリンタ
US7212308B2 (en) * 2002-12-18 2007-05-01 Morgan Carol L Interactive photo kiosk
US20040164325A1 (en) * 2003-01-09 2004-08-26 Con-Trol-Cure, Inc. UV curing for ink jet printer
CN100472731C (zh) * 2003-02-06 2009-03-25 株式会社半导体能源研究所 半导体制造装置
US6932451B2 (en) 2003-02-18 2005-08-23 T.S.D. Llc System and method for forming a pattern on plain or holographic metallized film and hot stamp foil
GB0304761D0 (en) * 2003-03-01 2003-04-02 Integration Technology Ltd Ultraviolet curing
US7094503B2 (en) 2003-03-27 2006-08-22 Kodak Graphics Communications Canada Company Nanopastes for use as patterning compositions
US7217502B2 (en) 2003-03-27 2007-05-15 Eastman Kodak Company Nanopastes for use as patterning compositions
US6921626B2 (en) 2003-03-27 2005-07-26 Kodak Polychrome Graphics Llc Nanopastes as patterning compositions for electronic parts
US7081322B2 (en) 2003-03-27 2006-07-25 Kodak Graphics Communications Canada Company Nanopastes as ink-jet compositions for printing plates
JP4628109B2 (ja) * 2003-04-25 2011-02-09 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6969166B2 (en) 2003-05-29 2005-11-29 3M Innovative Properties Company Method for modifying the surface of a substrate
US20070128905A1 (en) * 2003-06-12 2007-06-07 Stuart Speakman Transparent conducting structures and methods of production thereof
CN1842745B (zh) * 2003-08-28 2013-03-27 株式会社半导体能源研究所 薄膜晶体管、薄膜晶体管的制造方法、以及显示器件的制造方法
CN100568457C (zh) 2003-10-02 2009-12-09 株式会社半导体能源研究所 半导体装置的制造方法
WO2005041310A1 (en) * 2003-10-28 2005-05-06 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing the same, and television receiver
US8101467B2 (en) 2003-10-28 2012-01-24 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and method for manufacturing the same, and liquid crystal television receiver
WO2005048222A1 (en) 2003-11-14 2005-05-26 Semiconductor Energy Laboratory Co., Ltd. Light emitting display device, method for manufacturing the same, and tv set
US7439086B2 (en) 2003-11-14 2008-10-21 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing liquid crystal display device
US9307648B2 (en) * 2004-01-21 2016-04-05 Microcontinuum, Inc. Roll-to-roll patterning of transparent and metallic layers
US20050170643A1 (en) 2004-01-29 2005-08-04 Semiconductor Energy Laboratory Co., Ltd. Forming method of contact hole, and manufacturing method of semiconductor device, liquid crystal display device and EL display device
US7271940B2 (en) * 2004-02-10 2007-09-18 Zebra Imaging, Inc. Deposition of photosensitive media for digital hologram recording
JP2005268693A (ja) * 2004-03-22 2005-09-29 Seiko Epson Corp パターン形成方法、回路基板および電子機器
DE102004015700A1 (de) * 2004-03-29 2005-11-03 Platsch Gmbh & Co.Kg Flächige UV-Lichtquelle
FR2869306B1 (fr) * 2004-04-23 2006-09-15 Commissariat Energie Atomique Procede de fabrication de structures periodiques bi-dimensionnelles, en milieu polymere
US7416977B2 (en) 2004-04-28 2008-08-26 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing display device, liquid crystal television, and EL television
GB2414214B (en) * 2004-05-19 2008-01-09 Intense Photonics Ltd Printing with laser activation
US20050276911A1 (en) * 2004-06-15 2005-12-15 Qiong Chen Printing of organometallic compounds to form conductive traces
US7547647B2 (en) 2004-07-06 2009-06-16 Hewlett-Packard Development Company, L.P. Method of making a structure
DE102004034417B4 (de) * 2004-07-15 2007-09-27 Schott Ag Verfahren zur Herstellung eines beschichteten Substrats mit gewölbter Oberfläche
DE102004034418B4 (de) * 2004-07-15 2009-06-25 Schott Ag Verfahren zur Herstellung struktuierter optischer Filterschichten auf Substraten
US7246954B2 (en) * 2004-08-09 2007-07-24 Avago Technologies Fiber Ip (Singapore) Ltd. Pte. Opto-electronic housing and optical assembly
JP4539222B2 (ja) * 2004-08-16 2010-09-08 富士フイルム株式会社 画像形成装置及び画像形成方法
JP4051631B2 (ja) * 2004-08-20 2008-02-27 セイコーエプソン株式会社 エッチング方法、微細構造体の製造方法、導電線の形成方法、薄膜トランジスタの製造方法及び電子機器の製造方法
KR100733920B1 (ko) 2004-09-17 2007-07-02 주식회사 엘지화학 에칭 레지스트용 잉크 조성물, 이를 이용한 에칭 레지스트패턴 형성 방법 및 미세 유로 형성 방법
IL164679A0 (en) * 2004-10-19 2005-12-18 Rafi Bronstein Scitex Vision L A method of inkjet printing with image quality control
US20060121182A1 (en) * 2004-12-03 2006-06-08 Motorola Inc. Method to facilitate the printing of electronic components
US7307297B2 (en) * 2005-02-10 2007-12-11 Japan Science And Technology Agency Organic photodiode and method for manufacturing the organic photodiode
US20060215138A1 (en) * 2005-03-22 2006-09-28 Matsushita Electric Industrial Co., Ltd. Laser beam pattern generator with a two-axis scan mirror
US7352501B2 (en) * 2005-03-31 2008-04-01 Xerox Corporation Electrophoretic caps prepared from encapsulated electrophoretic particles
JP4636501B2 (ja) * 2005-05-12 2011-02-23 株式会社沖データ 半導体装置、プリントヘッド及び画像形成装置
JP4404005B2 (ja) * 2005-05-13 2010-01-27 セイコーエプソン株式会社 液滴吐出装置、パターン形成方法、電気光学装置の製造方法
US20070026205A1 (en) * 2005-08-01 2007-02-01 Vapor Technologies Inc. Article having patterned decorative coating
US20070068898A1 (en) * 2005-09-29 2007-03-29 Lorenz Glen D Multi-level etching method and product
US7365022B2 (en) * 2006-01-20 2008-04-29 Palo Alto Research Center Incorporated Additive printed mask process and structures produced thereby
WO2007100849A2 (en) 2006-02-27 2007-09-07 Microcontinuum, Inc. Formation of pattern replicating tools
US7444253B2 (en) * 2006-05-09 2008-10-28 Formfactor, Inc. Air bridge structures and methods of making and using air bridge structures
DE102006022722B4 (de) * 2006-05-12 2010-06-17 Hueck Engraving Gmbh & Co. Kg Verfahren und Vorrichtung zur Oberflächenstrukturierung eines Pressbleches oder eines Endlosbandes
US7877895B2 (en) * 2006-06-26 2011-02-01 Tokyo Electron Limited Substrate processing apparatus
US7736936B2 (en) * 2006-08-29 2010-06-15 Semiconductor Energy Laboratory Co., Ltd. Method of forming display device that includes removing mask to form opening in insulating film
US9383505B2 (en) * 2006-11-15 2016-07-05 Kevin J. Hathaway High output LED based illuminator that replaces CCFLS for LCD backlights
DE102006056150A1 (de) * 2006-11-28 2008-05-29 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Vorrichtung zur Abstrahlung elektromagnetischer Strahlung und Anzeigevorrichtung
US8189042B2 (en) * 2006-12-15 2012-05-29 Pollack Laboratories, Inc. Vision analysis system for a process vessel
US7524015B2 (en) * 2006-12-20 2009-04-28 Palo Alto Research Center Incorporated Method of printing smooth micro-scale features
US7980000B2 (en) 2006-12-29 2011-07-19 Applied Materials, Inc. Vapor dryer having hydrophilic end effector
US8254657B2 (en) * 2007-01-08 2012-08-28 Pollack Laboratories, Inc. Image recognition and analysis system and software
US8017293B2 (en) * 2007-04-09 2011-09-13 Hewlett-Packard Development Company, L.P. Liquid toner-based pattern mask method and system
US8029964B1 (en) 2007-07-20 2011-10-04 Hewlett-Packard Development Company, L.P. Polymer-based pattern mask system and method having enhanced adhesion
KR20090038309A (ko) * 2007-10-15 2009-04-20 삼성전자주식회사 이차전지용 전극, 그 제조방법 및 이를 채용한 이차전지
JP5078725B2 (ja) * 2008-04-22 2012-11-21 ラピスセミコンダクタ株式会社 半導体装置
US8062693B2 (en) * 2008-09-22 2011-11-22 Sunpower Corporation Generation of contact masks for inkjet printing on solar cell substrates
US8318240B2 (en) 2008-11-17 2012-11-27 Solopower, Inc. Method and apparatus to remove a segment of a thin film solar cell structure for efficiency improvement
US8318239B2 (en) * 2008-11-17 2012-11-27 Solopower, Inc. Method and apparatus for detecting and passivating defects in thin film solar cells
US7979969B2 (en) 2008-11-17 2011-07-19 Solopower, Inc. Method of detecting and passivating a defect in a solar cell
WO2010077132A1 (en) 2008-12-31 2010-07-08 Draka Comteq B.V. Uvled apparatus for curing glass-fiber coatings
DE202009017825U1 (de) 2009-02-14 2010-09-23 Luxexcel Holding Bv Vorrichtung zur Lenkung von Lichtstrahlen
US8061810B2 (en) 2009-02-27 2011-11-22 Fujifilm Corporation Mitigation of fluid leaks
JP2010236088A (ja) * 2009-03-09 2010-10-21 Hitachi High-Technologies Corp マスク部材のクリーニング装置及びクリーニング方法並びに有機elディスプレイ
CN104298078A (zh) 2009-05-14 2015-01-21 4233999加拿大股份有限公司 利用发光二极管单片阵列来提供高分辨率图像的系统和方法
WO2011017740A1 (en) * 2009-08-11 2011-02-17 Newsouth Innovations Pty Limited A method for the selective delivery of material to a substrate
JPWO2011024720A1 (ja) * 2009-08-26 2013-01-31 積水化学工業株式会社 接続構造体の製造方法
DK2388239T3 (da) 2010-05-20 2017-04-24 Draka Comteq Bv Hærdningsapparat, der anvender vinklede UV-LED'er
US8871311B2 (en) 2010-06-03 2014-10-28 Draka Comteq, B.V. Curing method employing UV sources that emit differing ranges of UV radiation
TWI452896B (zh) * 2010-07-16 2014-09-11 Pixart Imaging Inc 影像擷取裝置與其操作模式之控制方法,及其應用之電子裝置
US9074293B2 (en) * 2010-07-28 2015-07-07 Moltex Co., Ltd. Porous electroformed shell for patterning and manufacturing method thereof
DK2418183T3 (en) 2010-08-10 2018-11-12 Draka Comteq Bv Method of curing coated glass fibers which provides increased UVLED intensity
US8677929B2 (en) * 2010-12-29 2014-03-25 Intevac, Inc. Method and apparatus for masking solar cell substrates for deposition
CN103534645A (zh) * 2011-05-04 2014-01-22 阿克伦大学 经由廉价软光刻抑制聚合物膜的反润湿
JP6335782B2 (ja) 2011-07-13 2018-05-30 ヌボトロニクス、インク. 電子的および機械的な構造を製作する方法
US9156999B2 (en) * 2011-07-28 2015-10-13 Hewlett-Packard Development Company, L.P. Liquid inkjettable materials for three-dimensional printing
DE102011111511A1 (de) * 2011-08-31 2013-02-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Erzeugen einer Honeycomb-Textur an einer Oberfläche eines Substrates
US8778202B2 (en) * 2011-09-23 2014-07-15 Kings Mountain International, Inc. Spreading ink over a press plate using a heater
ES2638597T3 (es) 2012-01-02 2017-10-23 Mutracx International B.V. Sistema de inyección de tinta para la impresión de un circuito impreso
BE1020757A3 (fr) * 2012-06-19 2014-04-01 Agc Glass Europe Methode de fabrication d'une feuille de verre depolie selectivement.
US9589797B2 (en) 2013-05-17 2017-03-07 Microcontinuum, Inc. Tools and methods for producing nanoantenna electronic devices
JP6104710B2 (ja) * 2013-05-27 2017-03-29 株式会社ミマキエンジニアリング アルミニウム材着色物の製造方法、及び着色方法
DE102013108582A1 (de) * 2013-08-08 2015-02-12 Sandvik Surface Solutions Division Of Sandvik Materials Technology Deutschland Gmbh Verfahren zum Erzeugen von Strukturen auf einer umlaufenden Oberfläche
CN103552244B (zh) * 2013-11-04 2016-06-08 北京工业大学 基于多激光器扫描系统的3d激光打印装置
DE102013112404B4 (de) * 2013-11-12 2023-03-16 ACTEGA Schmid Rhyner AG Erzeugung von polymeren Partikeln sowie rauer Beschichtungen mittels Ink-Jet-Druck
KR20150081101A (ko) * 2014-01-03 2015-07-13 삼성디스플레이 주식회사 박막 형성 장치 및 박막 형성 방법
US10471467B2 (en) * 2014-07-18 2019-11-12 North Inc. Lighting arrangement
JP2016029224A (ja) * 2014-07-25 2016-03-03 株式会社ミマキエンジニアリング 染色方法、マスク形成装置、及び着色物の製造方法
CN106715090A (zh) 2014-09-26 2017-05-24 惠普发展公司有限责任合伙企业 用于增材制造的光照
KR102444204B1 (ko) * 2015-02-10 2022-09-19 옵토멕 인코포레이티드 에어로졸의 비행 중 경화에 의해 3차원 구조를 제조하는 방법
JP6464251B2 (ja) * 2015-02-20 2019-02-06 オリンパス株式会社 照明ユニット及び内視鏡
US10180248B2 (en) 2015-09-02 2019-01-15 ProPhotonix Limited LED lamp with sensing capabilities
US10563309B1 (en) 2015-10-13 2020-02-18 Kings Mountain International, Inc. Method for creating a textured press plate
EP3374534B1 (de) * 2015-11-12 2021-05-26 Oerlikon Metco AG, Wohlen Verfahren zur maskierung eines bauteils welches mit einer thermischen spritzschicht beschichtet werden soll
EP3210947A1 (de) * 2016-02-29 2017-08-30 Agfa-Gevaert Verfahren zur herstellung eines geätzten glasartikels
EP3210946B1 (de) * 2016-02-29 2020-07-08 Agfa-Gevaert Verfahren zur herstellung eines ätzglasartikels
CN106252237B (zh) * 2016-06-15 2019-03-01 全讯射频科技(无锡)有限公司 一种薄膜封装的植球工艺
FR3052880B1 (fr) * 2016-06-21 2019-01-25 H.E.F. Systeme et methode de realisation d'un masque optique pour micro-texturation de surface, installation et methode de micro-texturation de surface
US9975372B2 (en) 2016-06-21 2018-05-22 Charles White Multi-dimensional art works and methods
EP3296368B1 (de) * 2016-09-14 2020-11-11 Agfa-Gevaert Ätzresistente tintenstrahltinten zur herstellung von leiterplatten
US10379438B2 (en) * 2017-02-01 2019-08-13 Molecular Imprints, Inc. Configuring optical layers in imprint lithography processes
CN110678332B (zh) * 2017-03-27 2021-11-26 富林特集团德国有限公司 制造图形凸纹结构的方法
JP6825956B2 (ja) * 2017-03-28 2021-02-03 株式会社Screenホールディングス 基板処理装置、基板処理方法および紫外線照射手段の選択方法
US11101248B2 (en) * 2017-08-18 2021-08-24 Creeled, Inc. Light emitting diodes, components and related methods
US11107857B2 (en) 2017-08-18 2021-08-31 Creeled, Inc. Light emitting diodes, components and related methods
BE1025599B9 (nl) 2017-09-28 2019-05-28 Unilin B V B A Werkwijze voor het vervaardigen van gestructureerde perselementen
US10739675B2 (en) * 2018-05-31 2020-08-11 Canon Kabushiki Kaisha Systems and methods for detection of and compensation for malfunctioning droplet dispensing nozzles
JP7367003B2 (ja) * 2018-09-05 2023-10-23 キャノン プロダクション プリンティング ホールディング べー.フェー. プライマーを使用したインクジェット印刷の方法
DE102019102247A1 (de) * 2019-01-30 2020-07-30 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Verfahren zum Bedrucken einer Oberfläche mit einem Druckmuster und dazugehörige Druckvorrichtung
CN111954386A (zh) * 2019-05-15 2020-11-17 中山新诺科技股份有限公司 一种阻焊线路一体曝光的ld多光谱曝光方法及系统
CN110077126B (zh) * 2019-05-31 2020-02-14 西北工业大学 人工智能辅助印刷电子技术自引导优化提升方法
EP4041560A1 (de) * 2020-09-28 2022-08-17 Hymmen GmbH Maschinen- und Anlagenbau Verfahren und vorrichtung zur herstellung einer grundschicht mit unterschiedlichen härtegraden und werkstück mit unterschiedlichen härtegraden
CN114760758B (zh) * 2022-03-17 2024-05-24 苏州悦谱半导体有限公司 一种基于cam的动态pcb线路补偿优化方法
US20240268037A1 (en) * 2023-02-03 2024-08-08 Takaroa Corporation, Inc. Organic substrate-based wearable platform and methods for on-body sensing and delivery of therapeutics

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3795443A (en) * 1968-08-26 1974-03-05 Xerox Corp Xerographic development
US4929400A (en) * 1986-04-28 1990-05-29 California Institute Of Technology Production of monodisperse, polymeric microspheres
DE3728337A1 (de) 1987-08-25 1989-03-16 Goerlitz Computerbau Gmbh Verfahren zur herstellung von geaetzten leiterplatten
DE3740149A1 (de) 1987-11-26 1989-06-08 Herbert Dr Strohwald Verfahren zum herstellen eines leitermusters auf einem substrat
US5132248A (en) 1988-05-31 1992-07-21 The United States Of America As Represented By The United States Department Of Energy Direct write with microelectronic circuit fabrication
JPH0365345A (ja) 1989-08-03 1991-03-20 Matsushita Electric Ind Co Ltd インクジェット記録装置
DE4228344C2 (de) * 1992-08-26 1999-06-10 Inst Chemo U Biosensorik E V Verfahren zur Photoresistbeschichtung von mikromechanisch dreidimensional strukturierten Bauteilen in der Mikrostrukturtechnik sowie Vorrichtung zur Durchführung des Verfahrens
DE4329338A1 (de) * 1993-08-31 1995-03-02 Olympus Optical Co Verfahren und Vorrichtung zum Bilden eines Fotolackmusters
IL106899A (en) * 1993-09-03 1995-08-31 Adler Uri Method and apparatus for the production of photopolymeric printing plates
GB9403682D0 (en) 1994-02-25 1994-04-13 Univ Edinburgh Direct printing of etch masks under computer control
US5560543A (en) * 1994-09-19 1996-10-01 Board Of Regents, The University Of Texas System Heat-resistant broad-bandwidth liquid droplet generators
JP2865578B2 (ja) 1994-10-25 1999-03-08 富士通株式会社 レジストパターンの作成方法、その方法により得られるプリント配線板及びその作成装置
JP3529476B2 (ja) 1995-03-02 2004-05-24 株式会社東芝 カラーフィルタ及び液晶表示装置の製造方法
US5820932A (en) * 1995-11-30 1998-10-13 Sun Chemical Corporation Process for the production of lithographic printing plates
JPH09219019A (ja) 1996-02-13 1997-08-19 Nippon Sheet Glass Co Ltd 磁気ディスクにおけるテクスチャーの形成方法
GB9611582D0 (en) * 1996-06-04 1996-08-07 Thin Film Technology Consultan 3D printing and forming of structures
FR2764844B1 (fr) * 1997-06-23 1999-08-06 Gemplus Card Int Reticulation d'encre u.v.
GB2376565B (en) * 1997-10-14 2003-02-05 Patterning Technologies Ltd Method of forming an electronic device
GB2369087B (en) 1997-10-14 2002-10-02 Patterning Technologies Ltd Method of forming a circuit element on a surface
DE69840914D1 (de) 1997-10-14 2009-07-30 Patterning Technologies Ltd Methode zur Herstellung eines elektrischen Kondensators
JP4003273B2 (ja) * 1998-01-19 2007-11-07 セイコーエプソン株式会社 パターン形成方法および基板製造装置
AU4186699A (en) 1998-05-20 1999-12-06 Intermec Ip Corp. Method and apparatus for making electrical traces, circuits and devices
WO2001081648A1 (en) * 2000-04-20 2001-11-01 Vanderbilt University Method and system for thick-film deposition of ceramic materials

Also Published As

Publication number Publication date
DE60004798D1 (de) 2003-10-02
EP1163552B1 (de) 2003-08-27
CA2375365A1 (en) 2001-02-15
EP1163552A1 (de) 2001-12-19
AU5090400A (en) 2001-03-05
JP2003506886A (ja) 2003-02-18
DE60004798T3 (de) 2007-08-16
US6849308B1 (en) 2005-02-01
WO2001011426A1 (en) 2001-02-15
DE60004798T2 (de) 2004-07-08
IL146601A0 (en) 2002-07-25
EP1163552B2 (de) 2007-03-14

Similar Documents

Publication Publication Date Title
ATE248388T1 (de) Verfahren zur erzeugung einer maske auf einer oberfläche
WO1999019900A3 (en) Method of forming an electronic device
ATE217580T1 (de) Dreidimensionales drucken und herstellen von strukturen
DE69910614D1 (de) Verfahren zur herstellung einer verbundbeschichtung auf einem substrat
DE60025072D1 (de) Verfahren zur Nachbehandlung einer abgeschiedenen, kohlenstoffhaltigen Schicht auf einem Substrat
DE69613437D1 (de) Verfahren zur Herstellung einer Struktur mit einer mittels Anschlägen auf Abstand von einem Substrat gehaltenen Nutzschicht, sowie Verfahren zur Loslösung einer solchen Schicht
DE3585047D1 (de) Verfahren zur herstellung von feinen photolackstrichen auf einer traegeroberflaeche.
DE60330344D1 (de) Ein verfahren zur herstellung von transparenten und leitfähigen nano-beschichtungen und nano-pulverbeschichtungen
DE69819445D1 (de) Verfahren zur Herstellung eines Musters auf einem Substrat
DE59701935D1 (de) Verfahren zur herstellung einer prägefolie
DE60013777D1 (de) Verfahren zur herstellung von addressierten ligandmatrizen auf einer oberfläche
DE69911746D1 (de) Verfahren zur herstellung eines mit einer überzugschicht beschichteten schneidelements.
ATE250511T1 (de) Siebdruck-reflexionstransfer und verfahren zu dessen herstellung
DE69802250D1 (de) Verfahren zur herstellung einer leitschicht auf einem substrat
ATE193065T1 (de) Verfahren zur herstellung einer beschichtung auf der oberfläche von plastifizierschnecken für spritzgiessmaschinen
ATA158491A (de) Dispersion zur herstellung einer farbschicht für ein zigaretten-hüllpapier, zigarette mit diesem hüllpapier und verfahren zur herstellung einer farbschicht auf einem zigaretten-hüllpapier
DE69302569D1 (de) Verfahren zur beschichtung eines piezoelektrischen substrats mit einem halbleitermaterial und verfahren zur herstellung eines tröpfchenausstosssystems mit dem beschichtungsverfahren
DE60118049D1 (de) Verfahren zur Herstellung von Mehrschichtlackierungen unter Verwendung eines Pulverklarlackes auf einer wässrigen Basisschicht
DE60023120D1 (de) Sprühbeschichtungsverfahren
DE69005961D1 (de) Verfahren zur Herstellung einer defektfreien Oberfläche auf einem porösen keramischen Substrat.
ATE419928T1 (de) Herstellung familialer, nichtmodularer, pluraler farbmuster auf ein bewegendes substrat
DE69704010D1 (de) Verfahren zur Beschichtung eines Substrates aus einer Superlegierung auf Nickel- oder Kobaltbasis
DE69114823D1 (de) Verfahren zur Abscheidung einer Zinkoxidschicht auf ein Substrat.
ATE197096T1 (de) Verfahren zum herstellen einer siebdruckform sowie siebdruckgewebe aus einer beschichteten siebbahn
DE69019869D1 (de) Verfahren zur Plattierung einer metallischen Schicht zwischen funktionellen Bahnen auf einem Substrat.

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties