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NO963719L - Elektromekanisk föleranordning og fremgangsmåte for fremstilling av denne - Google Patents

Elektromekanisk föleranordning og fremgangsmåte for fremstilling av denne

Info

Publication number
NO963719L
NO963719L NO963719A NO963719A NO963719L NO 963719 L NO963719 L NO 963719L NO 963719 A NO963719 A NO 963719A NO 963719 A NO963719 A NO 963719A NO 963719 L NO963719 L NO 963719L
Authority
NO
Norway
Prior art keywords
manufacturing
same
sensor device
electromechanical sensor
grooves
Prior art date
Application number
NO963719A
Other languages
English (en)
Other versions
NO963719D0 (no
Inventor
Laurent Zimmermann
Original Assignee
Sagem Sa Joint Stock Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagem Sa Joint Stock Co filed Critical Sagem Sa Joint Stock Co
Publication of NO963719D0 publication Critical patent/NO963719D0/no
Publication of NO963719L publication Critical patent/NO963719L/no

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5705—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis
    • G01C19/5712—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
    • G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
    • G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
  • Gyroscopes (AREA)

Abstract

Den elektromekaniske føleranordning omfatter en aktiv skive (12) og en elektrisk forbindelsesskive (10) som er utstyrt med elektriske sammenkoblende spor. En mekanisk føler som er skåret fra den aktive skive omfatter et metallisert sammenkoblende sjikt (30). Sporene og det metalliserte sjikt blir så satt sammen med punktkontaktkuler og eventuelt med et bånd av elektrisk ledende loddemateriale. Anordningen kan benyttes til fremstilling av et gyrometer eller et akselerometer.
NO963719A 1995-09-07 1996-09-06 Elektromekanisk föleranordning og fremgangsmåte for fremstilling av denne NO963719L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9510479A FR2738705B1 (fr) 1995-09-07 1995-09-07 Dispositif capteur electromecanique et procede de fabrication d'un tel dispositif

Publications (2)

Publication Number Publication Date
NO963719D0 NO963719D0 (no) 1996-09-06
NO963719L true NO963719L (no) 1997-03-10

Family

ID=9482335

Family Applications (1)

Application Number Title Priority Date Filing Date
NO963719A NO963719L (no) 1995-09-07 1996-09-06 Elektromekanisk föleranordning og fremgangsmåte for fremstilling av denne

Country Status (4)

Country Link
DE (1) DE19636543A1 (no)
FR (1) FR2738705B1 (no)
GB (1) GB2304903A (no)
NO (1) NO963719L (no)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2320571B (en) * 1996-12-20 2000-09-27 Aisin Seiki Semiconductor micromachine and manufacturing method thereof
US6359333B1 (en) * 1998-03-31 2002-03-19 Honeywell International Inc. Wafer-pair having deposited layer sealed chambers
CA2365886A1 (en) * 1999-03-17 2000-09-21 Input/Output, Inc. Calibration of sensors
FI108986B (fi) 1999-07-01 2002-04-30 Emfitech Oy Menetelmä anturielementin valmistamiseksi ja anturielementti
JP4134853B2 (ja) * 2003-09-05 2008-08-20 株式会社デンソー 容量式力学量センサ装置
GB0421416D0 (en) * 2004-09-25 2004-10-27 Europ Technology For Business Gyroscopes and accelerometers
JP4380618B2 (ja) * 2005-10-21 2009-12-09 株式会社デンソー センサ装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4277814A (en) * 1979-09-04 1981-07-07 Ford Motor Company Semiconductor variable capacitance pressure transducer assembly
JPS58154254A (ja) * 1982-03-10 1983-09-13 Hitachi Ltd 半導体装置
US4829818A (en) * 1983-12-27 1989-05-16 Honeywell Inc. Flow sensor housing
JPS60150660A (ja) * 1984-01-17 1985-08-08 Mitsubishi Electric Corp 半導体装置
IT1203535B (it) * 1986-02-10 1989-02-15 Marelli Autronica Procedimento per la realizzazione del collegamento meccanico ed elettrico fra due corpi in particolare tra la membrana ed il sopporto di un sensore di pressione a film spesso e dispositivi realizzati con tale procedimento
JPH0736444B2 (ja) * 1986-12-19 1995-04-19 工業技術院長 触覚センサ
EP0415541B1 (en) * 1989-07-29 1994-10-05 Shimadzu Corporation Semiconductor-based radiation image detector and its manufacturing method
JPH0797056B2 (ja) * 1990-03-02 1995-10-18 株式会社富士電機総合研究所 分布型触覚センサ
US5164328A (en) * 1990-06-25 1992-11-17 Motorola, Inc. Method of bump bonding and sealing an accelerometer chip onto an integrated circuit chip
US5346857A (en) * 1992-09-28 1994-09-13 Motorola, Inc. Method for forming a flip-chip bond from a gold-tin eutectic

Also Published As

Publication number Publication date
FR2738705A1 (fr) 1997-03-14
FR2738705B1 (fr) 1997-11-07
GB9618781D0 (en) 1996-10-23
DE19636543A1 (de) 1997-03-13
GB2304903A (en) 1997-03-26
NO963719D0 (no) 1996-09-06

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