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NL50072C - - Google Patents

Info

Publication number
NL50072C
NL50072C NL50072DA NL50072C NL 50072 C NL50072 C NL 50072C NL 50072D A NL50072D A NL 50072DA NL 50072 C NL50072 C NL 50072C
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL50072C publication Critical patent/NL50072C/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J41/00—Discharge tubes for measuring pressure of introduced gas or for detecting presence of gas; Discharge tubes for evacuation by diffusion of ions
    • H01J41/02—Discharge tubes for measuring pressure of introduced gas or for detecting presence of gas
    • H01J41/06—Discharge tubes for measuring pressure of introduced gas or for detecting presence of gas with ionisation by means of cold cathodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J41/00—Discharge tubes for measuring pressure of introduced gas or for detecting presence of gas; Discharge tubes for evacuation by diffusion of ions
    • H01J41/12—Discharge tubes for evacuating by diffusion of ions, e.g. ion pumps, getter ion pumps
    • H01J41/18—Discharge tubes for evacuating by diffusion of ions, e.g. ion pumps, getter ion pumps with ionisation by means of cold cathodes
    • H01J41/20—Discharge tubes for evacuating by diffusion of ions, e.g. ion pumps, getter ion pumps with ionisation by means of cold cathodes using gettering substances

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
NL50072D 1935-12-28 NL50072C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2146025X 1935-12-28

Publications (1)

Publication Number Publication Date
NL50072C true NL50072C (en)

Family

ID=7987134

Family Applications (1)

Application Number Title Priority Date Filing Date
NL50072D NL50072C (en) 1935-12-28

Country Status (2)

Country Link
US (1) US2146025A (en)
NL (1) NL50072C (en)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2615822A (en) * 1946-02-21 1952-10-28 William C Huebner Method of making sheet or web material
US2499289A (en) * 1947-07-02 1950-02-28 John G Backus Ion generator
US2499288A (en) * 1947-07-02 1950-02-28 John G Backus Vacuum analyzer
US2976174A (en) * 1955-03-22 1961-03-21 Burroughs Corp Oriented magnetic cores
US2993638A (en) * 1957-07-24 1961-07-25 Varian Associates Electrical vacuum pump apparatus and method
US3046936A (en) * 1958-06-04 1962-07-31 Nat Res Corp Improvement in vacuum coating apparatus comprising an ion trap for the electron gun thereof
US3256687A (en) * 1958-07-31 1966-06-21 Avco Mfg Corp Hydromagnetically operated gas accelerator propulsion device
NL243654A (en) * 1958-09-25
US3093298A (en) * 1960-06-21 1963-06-11 Gen Electric Ionic pump
NL266745A (en) * 1960-07-08
US3133874A (en) * 1960-12-05 1964-05-19 Robert W Morris Production of thin film metallic patterns
US3216652A (en) * 1962-09-10 1965-11-09 Hughes Aircraft Co Ionic vacuum pump
GB1053215A (en) * 1963-04-15
US3391071A (en) * 1963-07-22 1968-07-02 Bell Telephone Labor Inc Method of sputtering highly pure refractory metals in an anodically biased chamber
GB1054660A (en) * 1963-09-16
US3282816A (en) * 1963-09-16 1966-11-01 Ibm Process of cathode sputtering from a cylindrical cathode
US3305473A (en) * 1964-08-20 1967-02-21 Cons Vacuum Corp Triode sputtering apparatus for depositing uniform coatings
FR1502647A (en) * 1965-12-17 1968-02-07
US3420767A (en) * 1966-03-03 1969-01-07 Control Data Corp Cathode sputtering apparatus for producing plural coatings in a confined high frequency generated discharge
US3410775A (en) * 1966-04-14 1968-11-12 Bell Telephone Labor Inc Electrostatic control of electron movement in cathode sputtering
US3528902A (en) * 1966-10-04 1970-09-15 Matsushita Electric Ind Co Ltd Method of producing thin films by sputtering
JPS516357B1 (en) * 1966-12-15 1976-02-27
US3669861A (en) * 1967-08-28 1972-06-13 Texas Instruments Inc R. f. discharge cleaning to improve adhesion
US4166018A (en) * 1974-01-31 1979-08-28 Airco, Inc. Sputtering process and apparatus
US4025410A (en) * 1975-08-25 1977-05-24 Western Electric Company, Inc. Sputtering apparatus and methods using a magnetic field
DE2655942A1 (en) * 1976-12-10 1978-06-15 Tokuda Seisakusho Kawasaki Kk Metals deposited by cathodic sputtering - in appts. using magnetic field to increase sputtering rate
US4472259A (en) * 1981-10-29 1984-09-18 Materials Research Corporation Focusing magnetron sputtering apparatus
US4525262A (en) * 1982-01-26 1985-06-25 Materials Research Corporation Magnetron reactive bias sputtering method and apparatus
US4422896A (en) * 1982-01-26 1983-12-27 Materials Research Corporation Magnetically enhanced plasma process and apparatus
US4728862A (en) * 1982-06-08 1988-03-01 The United States Of America As Represented By The United States Department Of Energy A method for achieving ignition of a low voltage gas discharge device
US4581118A (en) * 1983-01-26 1986-04-08 Materials Research Corporation Shaped field magnetron electrode
US4629548A (en) * 1985-04-03 1986-12-16 Varian Associates, Inc. Planar penning magnetron sputtering device
US4812217A (en) * 1987-04-27 1989-03-14 American Telephone And Telegraph Company, At&T Bell Laboratories Method and apparatus for feeding and coating articles in a controlled atmosphere
US4885070A (en) * 1988-02-12 1989-12-05 Leybold Aktiengesellschaft Method and apparatus for the application of materials
US4842703A (en) * 1988-02-23 1989-06-27 Eaton Corporation Magnetron cathode and method for sputter coating
US4810347A (en) * 1988-03-21 1989-03-07 Eaton Corporation Penning type cathode for sputter coating
US5234560A (en) * 1989-08-14 1993-08-10 Hauzer Holdings Bv Method and device for sputtering of films
US5047394A (en) * 1989-09-12 1991-09-10 University Of Houston System Sputtering method
US5437778A (en) * 1990-07-10 1995-08-01 Telic Technologies Corporation Slotted cylindrical hollow cathode/magnetron sputtering device
US5073245A (en) * 1990-07-10 1991-12-17 Hedgcoth Virgle L Slotted cylindrical hollow cathode/magnetron sputtering device
CA2065581C (en) * 1991-04-22 2002-03-12 Andal Corp. Plasma enhancement apparatus and method for physical vapor deposition
US5334302A (en) * 1991-11-15 1994-08-02 Tokyo Electron Limited Magnetron sputtering apparatus and sputtering gun for use in the same
US5597459A (en) * 1995-02-08 1997-01-28 Nobler Technologies, Inc. Magnetron cathode sputtering method and apparatus
US5993598A (en) * 1996-07-30 1999-11-30 The Dow Chemical Company Magnetron
US5900284A (en) * 1996-07-30 1999-05-04 The Dow Chemical Company Plasma generating device and method
US6055929A (en) * 1997-09-24 2000-05-02 The Dow Chemical Company Magnetron
US6352626B1 (en) 1999-04-19 2002-03-05 Von Zweck Heimart Sputter ion source for boron and other targets
US7023128B2 (en) * 2001-04-20 2006-04-04 Applied Process Technologies, Inc. Dipole ion source
EP1390964B1 (en) 2001-04-20 2011-12-07 General Plasma, Inc. Dipole ion source
US7294283B2 (en) * 2001-04-20 2007-11-13 Applied Process Technologies, Inc. Penning discharge plasma source
US7932678B2 (en) * 2003-09-12 2011-04-26 General Plasma, Inc. Magnetic mirror plasma source and method using same

Also Published As

Publication number Publication date
US2146025A (en) 1939-02-07

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