Liu et al., 1992 - Google Patents
A RHEED study of the surface reconstructions of Si (001) during gas source MBE using disilaneLiu et al., 1992
- Document ID
- 2684909594190023628
- Author
- Liu W
- Mokler S
- Ohtani N
- Roberts C
- Joyce B
- Publication year
- Publication venue
- Surface science
External Links
Snippet
The growth of Si (001) from a gas-source molecular beam epitaxy system (Si-GSMBE) using disilane (Si2H6) was investigated using RHEED. Substrates were prepared by two commonly used etching techniques, one producing a surface oxide and the other a …
- 238000002128 reflection high energy electron diffraction 0 title abstract description 22
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Liu et al. | A RHEED study of the surface reconstructions of Si (001) during gas source MBE using disilane | |
US5961877A (en) | Wet chemical etchants | |
Chen et al. | Structure of CdTe (111) B grown by MBE on misoriented Si (001) | |
Leon et al. | Stable and metastable InGaAs/GaAs island shapes and surfactantlike suppression of the wetting transformation | |
Okada et al. | Low dislocation density GaAs on Si heteroepitaxy with atomic hydrogen irradiation for optoelectronic integration | |
Kusunoki et al. | SiC film formation on Si (001) by reaction with C2H2 beams | |
Fehrenbacher et al. | Interaction of SiH4 with Si (100) 2× 1 and with Si (111) 7× 7 at 690 K: A comparative scanning tunneling microscopy study | |
Hatayama et al. | Time-resolved reflection high-energy electron diffraction analysis in initial stage of 3C-SiC growth on Si (001) by gas source molecular beam epitaxy | |
Ding et al. | In/GaAs reaction: effect of an intervening oxide layer | |
Hu et al. | Real time investigation of nucleation and growth of silicon on silicon dioxide using silane and disilane in a rapid thermal processing system | |
Nayak et al. | In situ RHEED and AFM investigation of growth front morphology evolution of Si (001) grown by UHV-CVD | |
Loo et al. | Structural and optical properties of Ge islands grown in an industrial chemical vapor deposition reactor | |
Pacheco et al. | Epitaxial silicon growth using supersonic jets of disilane: A model study of energetic jet deposition | |
Sporken et al. | Selective epitaxy of cadmium telluride on silicon by MBE | |
Horn-von Hoegen et al. | Adsorbate induced change of equilibrium surface during crystal growth: Si on Si (111)/H | |
Ohkuri et al. | Multiatomic step formation on GaAs (001) vicinal surfaces during thermal treatment | |
He et al. | Synthesis of dislocation free Si y (Sn x C1− x) 1− y alloys by molecular beam deposition and solid phase epitaxy | |
Lim et al. | Facet evolution in selective epitaxial growth of Si by cold-wall ultrahigh vacuum chemical vapor deposition | |
Tung et al. | A transmission electron microscopic study of the topography of clean Si (111) surfaces | |
Lazarenko et al. | Preparation of a silicon surface for subsequent growth of dilute nitride alloys by molecular-beam epitaxy | |
Schroeder et al. | Effects of atomic hydrogen on the selective area growth of Si and Si 1− x Ge x thin films on Si and SiO 2 surfaces: Inhibition, nucleation, and growth | |
Uesugi et al. | Scanning tunneling microscopy study of solid‐phase epitaxy processes of argon ion bombarded silicon surface and recovery of crystallinity by annealing | |
Kinosky et al. | HF/alcohol preparation of wafers for the reduction of haze in low temperature Si epitaxy by remote plasma chemical vapor deposition | |
Wu et al. | Reflection high‐energy electron diffraction analysis of iron silicide growth on Si (110) | |
Chang et al. | Strain relaxation and defect reduction in InxGa1− xAs/GaAs by lateral oxidation of an underlying AlGaAs layer |