Schuettler et al., 2010 - Google Patents
A device for vacuum drying, inert gas backfilling and solder sealing of hermetic implant packagesSchuettler et al., 2010
- Document ID
- 15980220940405542075
- Author
- Schuettler M
- Huegle M
- Ordonez J
- Wilde J
- Stieglitz T
- Publication year
- Publication venue
- 2010 Annual International Conference of the IEEE Engineering in Medicine and Biology
External Links
Snippet
Modern implanted devices utilize microelectronics that have to be protected from the body fluids in order to maintain their functionality over decades. Moisture protection of implants is addressed by enclosing the electronic circuits into gas-tight packages. In this paper we …
- 239000007943 implant 0 title abstract description 38
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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