Zhang et al., 2018 - Google Patents
High-temperature reliability of low-temperature and pressureless micron Ag sintered joints for die attachment in high-power deviceZhang et al., 2018
View PDF- Document ID
- 10883245105503093590
- Author
- Zhang H
- Chen C
- Jiu J
- Nagao S
- Suganuma K
- Publication year
- Publication venue
- Journal of Materials Science: Materials in Electronics
External Links
Snippet
Micron Ag paste had a more affordable price, feasible large-scale synthesis, and longer storage life compared to nano Ag paste, thus it attracts much industrial interest for die attachment of high-power devices. However, the previous studies of high-temperature …
- 210000001503 Joints 0 title abstract description 30
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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