Nothing Special   »   [go: up one dir, main page]

Kamgaing et al., 2014 - Google Patents

Investigation of a photodefinable glass substrate for millimeter-wave radios on package

Kamgaing et al., 2014

Document ID
5451757327898221795
Author
Kamgaing T
Elsherbini A
Frank T
Oster S
Rao V
Publication year
Publication venue
2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

External Links

Snippet

Photodefinable glass has been investigated for applications at mm-wave frequencies. Test structures including through-glass vias, transmission lines and microstrip patch antennas have been fabricated and fully characterized up to 67 GHz. Good correlation was obtained …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01Q—AERIALS
    • H01Q9/00—Electrically-short aerials having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant aerials
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced with unbalanced lines or devices
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01Q—AERIALS
    • H01Q1/00—Details of, or arrangements associated with, aerials
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01Q—AERIALS
    • H01Q21/00—Aerial arrays or systems
    • H01Q21/06—Arrays of individually energised active aerial units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01Q—AERIALS
    • H01Q21/00—Aerial arrays or systems
    • H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01Q—AERIALS
    • H01Q1/00—Details of, or arrangements associated with, aerials
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01Q—AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot aerials; Leaky-waveguide aerials; Equivalent structures causing radiation along the transmission path of a guided wave
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices

Similar Documents

Publication Publication Date Title
Lamminen et al. 60-GHz patch antennas and arrays on LTCC with embedded-cavity substrates
Lamminen et al. Patch antenna and antenna array on multilayer high-frequency PCB for D-band
Xu et al. Bandwidth enhancement for a 60 GHz substrate integrated waveguide fed cavity array antenna on LTCC
Kim et al. 60-GHz CPW-fed post-supported patch antenna using micromachining technology
US9196951B2 (en) Millimeter-wave radio frequency integrated circuit packages with integrated antennas
Kamgaing et al. Investigation of a photodefinable glass substrate for millimeter-wave radios on package
Zhang et al. A $ D $-Band Packaged Antenna on Organic Substrate With High Fault Tolerance for Mass Production
CN103165966A (en) Waveguide, interposer substrate including the same, module, and electronic apparatus
Gentile et al. Silicon-filled rectangular waveguides and frequency scanning antennas for mm-wave integrated systems
Watanabe et al. Leading-edge and ultra-thin 3D glass-polymer 5G modules with seamless antenna-to-transceiver signal transmissions
US8552813B2 (en) High frequency, high bandwidth, low loss microstrip to waveguide transition
Kamgaing et al. Low-profile fully integrated 60 GHz 18 element phased array on multilayer liquid crystal polymer flip chip package
Hosono et al. Development of millimeter-wave devices based on liquid crystal polymer (LCP) substrate
Morcillo et al. An Ultra-Thin, High-Power, and Multilayer Organic Antenna Array With T/R Functionality in the $ X $-Band
Khan et al. A V-band end-fire Yagi-Uda antenna on an ultra-thin glass packaging technology
Xue et al. A compact 27 GHz Antenna-in-Package (AiP) with RF transmitter and passive phased antenna array
Ishibashi et al. Integrated module structure of fan-out wafer level package for terahertz antenna
Aslam et al. Multi Glass-Wafer Stacked Technology for 3D Heterogeneously-Integrated Scalable 6G Arrays
Hu et al. Advanced development in packaging of antenna-integrated systems for millimeter-wave applications
Aftanasar et al. Fabricated multilayer SIW system using PCB manufacturing process
Ahmad et al. Design of planar waveguide transition and antenna array utilizing low-loss substrate for 79 GHz radar applications
Martínez-Vázquez et al. Highly integrated antennas and front-ends for 60 GHz WLAN applications
Jafarlou et al. Wideband LTCC transitions of flip-chip to waveguides/connectors for a highly dense phased array system-in-package at 60 GHz
Kim A stepped-impedance true time delay line using GaAs MMIC technology
Aboush et al. DC-50 GHz low loss thermally enhanced low cost LCP package process utilizing micro via technology