Abstract: We propose a power-efficient many-core server-on-chip system with 3D-stacked Wide I/O DRAM targeting cloud workloads in datacenters.
We demonstrate a methodology that includes full-system microarchitectural modeling and rapid virtual physical prototyping with emphasis on the thermal analysis.
We propose a power-efficient many-core server-on-chip system with 3D-stacked Wide I/O DRAM targeting cloud workloads in datacenters.
We propose a power-efficient many-core server-on-chip system with 3D-stacked Wide I/O DRAM targeting cloud workloads in datacenters.
Bibliographic details on Thermal characterization of cloud workloads on a power-efficient server-on-chip.
Apr 8, 2019 · Thermal characterization of cloud workloads on a power-efficient server-on-chip ; dc.source, Proceedings - IEEE International Conference on ...
We propose a power-efficient many-core server-on-chip system with 3D-stacked Wide I/O DRAM targeting cloud workloads in datacenters.
Thermal-benchmarking for cloud hosting green data centers
www.sciencedirect.com › article › abs › pii
This paper presents a generic approach to thermal-benchmarking and profiling of cloud hosting data center servers.
Missing: chip. | Show results with:chip.
Thermal characterization of cloud workloads on a power-efficient server-on-chip · Engineering, Computer Science. 2012 IEEE 30th International Conference on…
Analysis of modeling results gives the best machine-learning model that fits the thermal analysis of the cluster server. The rest of the docukmentation has ...
Missing: characterization | Show results with:characterization