This paper will focus on recent results of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. We report on bonding quality, wafer-to-wafer ...
The data reported in this paper validates the Cu-Cu non thermocompression bonding as a good candidate for wafer stacking technology for 3D integration. Next ...
This paper will focus on recent results of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. We report on bonding quality, wafer-to-wafer ...
The bonding quality, wafer-to-wafer alignment accuracy and electrical connectivity, and the bonding strength evolution with post-bond annealing is reported ...
This work will give a way to improve bonding yield in the hybrid Cu-Cu non-thermal compression bonding process through monitoring and optimizing plasma process ...
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Recent developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. Radu, I., Landru, D., Gaudin, G., Riou, G., Tempesta, C ...
Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. In IEEE International Conference on 3D System Integration, 3DIC ...
The main physical mechanisms about Cu-Cu non thermal compression bonding are spontaneous adhesion of hydrophilic surfaces followed by Cu diffusion across the ...
Recent developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. Radu I., Landru D., Gaudin G., Riou G., Tempesta C., Letertre F ...
This work will give a way to improve bonding yield in the hybrid Cu-Cu non-thermal compression bonding process through monitoring and optimizing plasma process ...